CN211540808U

CN211540808U - Grinding polisher

Info

Publication number: CN211540808U
Application number: CN201922216099.XU
Authority: CN
Inventors: 李俊
Original assignee: Shenzhen Aotem Automation Equipment Co ltd
Current assignee: Shenzhen Aotem Automation Equipment Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-09-22
Anticipated expiration: 2029-12-11

Abstract

The utility model discloses a grinding and polishing machine, include: the positioning block can fix materials; the photographing device can photograph the materials on the positioning blocks; the grinding device comprises a grinding disc, a polishing disc and a driving device, and the driving device can drive the grinding disc and the polishing disc to rotate; the manipulator, the locating piece can be fixed the output of manipulator, the manipulator can drive the locating piece moves along first direction, and drives the locating piece moves along the second direction, the abrasive disc with the polishing dish is followed the first direction is arranged, the locating piece can be followed the second direction is close to the polishing dish. The utility model discloses can make level and smooth, the accurate observation face of size, guarantee the accuracy of analysis result.

Description

Grinding polisher

Technical Field

The utility model belongs to the technical field of the section grinding and specifically relates to a grinding and polishing machine is related to.

Background

Slice analysis is a technical means for carrying out destructive tests on samples, is one of the most common and important analysis methods in the electronic manufacturing industry, and the quality of the preparation quality of the slice sample at the early stage directly influences the accuracy of observation and analysis of a failure part. The conventional grinding process of circuit board slices is manually and manually ground, so that an ideal observation surface is difficult to prepare, and the final analysis result is directly influenced when the circuit board slices are observed and analyzed under a microscope, so that the conventional grinding process of the circuit board slices is to be improved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a grinding and polishing machine can make level and smooth, the accurate observation face of size, guarantees the accuracy of analysis result.

In a first aspect, an embodiment of the present invention provides a grinding and polishing machine, including: the positioning block can fix materials; the photographing device can photograph the materials on the positioning blocks; the grinding device comprises a grinding disc, a polishing disc and a driving device, and the driving device can drive the grinding disc and the polishing disc to rotate; the manipulator, the locating piece can be fixed the output of manipulator, the manipulator can drive the locating piece moves along first direction, and drives the locating piece moves along the second direction, the abrasive disc with the polishing dish is followed the first direction is arranged, the locating piece can be followed the second direction is close to the polishing dish.

The utility model discloses grinding and polishing machine has following beneficial effect at least: through setting up the device of shooing, can shoot the circuit board section, thereby confirm the viewing surface for software, confirm that the grinding size provides the basis, through setting up the locating piece, the sliced location benchmark of circuit board when being favorable to shooing, carry out accurate coincidence conversion with the location benchmark of circuit board section on the output of manipulator, prevent that the circuit board section from bringing into the error in the transfer process, through setting up grinding device, can accomplish the sliced grinding and the polishing of circuit board, make level and smooth, the accurate viewing surface of size.

According to the utility model discloses a grinding and polishing machine of other embodiments still includes the fixing base, the fixing base is provided with two, one the fixing base is fixed on the output of manipulator, another the fixing base is relative the device of shooing is fixed, be provided with the slot on the fixing base, the fixing base can with locating piece locking is fixed in the slot.

According to the utility model discloses a grinding and polishing machine of other embodiments, the locating piece includes first grip block and second grip block, be provided with the storage tank on the second grip block, the two sides opening of storage tank, first grip block with the second grip block is tight with the material clamp in the storage tank.

According to the utility model discloses a grinding and polishing machine of other embodiments, grinding device still includes the polishing solution case, the polishing solution case pass through the pipe with the polishing surface intercommunication of polishing dish.

According to the utility model discloses a grinding and polishing machine of other embodiments, grinding device still includes the catch tray, be provided with the collecting vat on the catch tray, the polishing dish is arranged in the collecting vat.

According to other embodiments of the present invention, the polishing disc is rotatable about a first axis, and the drive device includes a first motor capable of driving the polishing disc to rotate.

According to the utility model discloses a grinding and polishing machine of other embodiments, the abrasive disc includes coarse grinding dish and finish grinding dish, the coarse grinding dish the finish grinding dish with the polishing dish is followed the first direction is arranged.

According to the utility model discloses a grinding and polishing machine of other embodiments, grinding device still includes the cutting disc, the cutting disc the grinding disc with the polishing disc is followed the first direction is arranged.

According to other embodiments of the present invention, the grinding and polishing machine, the photographing device is a photographing microscope.

According to the utility model discloses a grinding and polishing machine of other embodiments, the manipulator includes X axle motion module and Y axle motion module, Y axle motion module sets up on the output of X axle motion module, locating piece detachably fixes on the output of Y axle motion module.

Drawings

FIG. 1 is an isometric view of a first embodiment of a grinder/polisher;

FIG. 2 is a schematic view of the interior of the grinder/polisher of FIG. 1;

FIG. 3 is a top view of the polishing assembly of FIG. 1;

3 FIG. 3 4 3 is 3 a 3 cross 3- 3 sectional 3 view 3 taken 3 along 3 section 3 A 3- 3 A 3 of 3 FIG. 3 3 3; 3

Fig. 5 is an exploded view of the positioning assembly of fig. 1.

Detailed Description

The conception and the resulting technical effects of the present invention will be described clearly and completely with reference to the following embodiments, so that the objects, features and effects of the present invention can be fully understood. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention.

In the description of the embodiments of the present invention, if an orientation description is referred to, for example, the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, only for convenience of description and simplification of description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the embodiments of the present invention, if a feature is referred to as being "disposed", "fixed", "connected", or "mounted" on another feature, it can be directly disposed, fixed, or connected to the other feature or indirectly disposed, fixed, connected, or mounted on the other feature. In the description of the embodiments of the present invention, if "a plurality" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.

Referring to fig. 1 and 2, fig. 1 is an isometric view of a grinding and polishing machine of a first embodiment, fig. 2 is a schematic view of the inside of the grinding and polishing machine of fig. 1, the grinding and polishing machine of this embodiment includes a rack 100, a grinding assembly 200, a manipulator 300, a positioning assembly 400 and a photographing device 500, the rack 100 includes a first mounting plate 110 and a second mounting plate 120, the photographing device 500 is disposed on the first mounting plate 110, the grinding assembly 200 is disposed on the second mounting plate 120, the positioning assembly 400 includes a positioning block 410 and a fixing block 420, the positioning block 410 can fix a circuit board slice, the photographing device 500 can photograph the circuit board slice fixed on the positioning block 410, and the manipulator 300 drives the circuit board slice to complete the manufacturing of an observation surface.

The grinding assembly 200 comprises a cutting assembly 210, a rough grinding assembly 220, a fine grinding assembly 230, a polishing assembly 240 and a driving device 250, wherein the cutting assembly 210 comprises a cutting disc 211, the rough grinding assembly 220 comprises a rough grinding disc 221, the fine grinding assembly 230 comprises a fine grinding disc 231, the polishing assembly 240 comprises a polishing disc 241, and the driving device 250 can drive the cutting disc 211, the rough grinding disc 221, the fine grinding disc 231 and the polishing disc 241 to rotate so as to complete the cutting, rough grinding, fine grinding and polishing processes of the circuit board slice.

3 referring 3 to 3 fig. 32 3 to 3 4 3, 3 fig. 3 3 3 is 3 a 3 plan 3 view 3 of 3 the 3 polishing 3 assembly 3 240 3 of 3 fig. 31 3, 3 and 3 fig. 3 4 3 is 3 a 3 sectional 3 view 3 taken 3 along 3 a 3- 3 a 3 of 3 fig. 3 3 3, 3 and 3 the 3 structure 3 in 3 which 3 the 3 driving 3 unit 3 250 3 drives 3 the 3 polishing 3 disk 3 241 3 to 3 rotate 3 will 3 be 3 described 3 in 3 detail 3 below 3. 3 The polishing assembly 240 comprises a polishing disk 241, a protective cover 242, a collecting disk 243, a rotating shaft 244, a belt pulley 245, a bearing 246, a fixed shaft 247 and a polishing solution tank 248, the fixed shaft 247 is locked and fixed on the second mounting plate 120, the belt pulley 245 is rotatably connected with the fixed shaft 247 through the bearing 246, the belt pulley 245 can rotate around the Y axis, the rotating shaft 244 is locked on the end face of the belt pulley 245 in the positive direction of the Y axis through screws, the polishing disk 241 is fixedly connected with the rotating shaft 244 in a threaded manner, the driving device 250 comprises a first motor, and the output end of the first motor drives the belt pulley 245 to rotate through a belt, so that the polishing disk 241.

In order to enable the polishing disc 241 to continuously polish, a polishing solution tank 248 is provided, polishing solution is contained in the polishing solution tank 248, the polishing solution tank 248 is communicated with the polishing surface of the polishing disc 241 through a conduit, the polishing solution is guided to the polishing surface of the polishing disc 241 through the conduit, one end of the conduit close to the polishing disc 241 is connected with a universal cooling liquid pipe, so that the polishing solution is guided to the polishing surface of the polishing disc 241, and the polishing solution can be selected from conventional alumina polishing solution.

In order to collect the used polishing solution well, a collecting tray 243 is provided, a collecting groove 263 is provided in the collecting tray 243, the polishing tray 241 is disposed in the collecting groove 263, the polishing solution is collected in the collecting groove 263 by the collecting tray 243 after flowing out from the polishing tray 241, and the collected polishing solution can be guided to a waste solution recycling tank through an outlet 264.

In order to prevent polishing solution and sweeps from splashing out, a protective cover 242 is arranged, the protective cover 242 is circumferentially provided with a surrounding edge 262, and meanwhile, a through hole 261 is formed in the middle of the protective cover 242, so that circuit board slices can conveniently enter polishing.

In this embodiment, the driving device 250 further comprises a second motor, a third motor and a fourth motor, the second motor drives the polishing disc 231 to rotate, the structure of the second motor driving the polishing disc 231 to rotate is the same as that of the first motor driving the polishing disc 241 to rotate, similarly, the third motor drives the coarse polishing disc 221 to rotate, and the fourth motor drives the cutting disc 211 to rotate.

The cutting disc 211, the coarse grinding disc 221, the fine grinding disc 231 and the polishing disc 241 are respectively provided with a motor for independent driving, the cutting disc 211, the coarse grinding disc 221, the fine grinding disc 231 and the polishing disc 241 can select proper rotating speed according to the processing requirement of the cutting disc 211, the coarse grinding disc 221, the fine grinding disc 231 and the polishing disc 241, and the problems that the same driving is shared and the rotating speed needs to be adjusted frequently do not exist. In addition, because the cutting disc 211, the rough grinding disc 221, the fine grinding disc 231 and the polishing disc 241 do not work simultaneously, energy is saved and the energy utilization rate is improved by arranging independent driving.

In another embodiment, the driving device 250 may be provided with only one motor, and the motor may drive the cutting disc 211, the coarse grinding disc 221, the fine grinding disc 231 and the polishing disc 241 simultaneously through meshed gears, and at this time, the cutting disc 211, the coarse grinding disc 221, the fine grinding disc 231 and the polishing disc 241 may also be driven to rotate.

The robot 300 includes an X-axis motion module 310 and a Y-axis motion module 320, the Y-axis motion module 320 is fixed on the output end of the X-axis motion module 310, the X-axis motion module 310 can drive the Y-axis motion module 320 to move along a first direction (the first direction is the X-axis direction), the output end of the Y-axis motion module 320 can move along a second direction (the second direction is the Y-axis direction), and the cutting assembly 210, the rough grinding assembly 220, the fine grinding assembly 230, and the polishing assembly 240 are arranged along the X-axis direction.

In this embodiment, the X-axis motion module 310 includes a combination of a motor and a lead screw nut, the motor drives the lead screw to rotate, the nut is in threaded fit with the lead screw, the nut serves as an output end, the Y-axis motion module 320 is fixed on the nut, the structure of the Y-axis motion module 320 is the same as that of the X-axis motion module 310, and the positioning block 410 can be fixed on the output end of the Y-axis motion module 320.

In other embodiments, the X-axis motion module 310 and the Y-axis motion module 320 may be linear motors.

Referring to fig. 2 and 5, fig. 5 is an exploded view of the positioning assembly 400 in fig. 1, the positioning block 410 includes a first clamping block 411 and a second clamping block 412, an accommodating groove 413 is formed in the second clamping block 412, openings are formed in both the positive Z-axis side and the negative Y-axis side of the accommodating groove 413, the first clamping block 411 is disposed on the positive Z-axis side of the second clamping block 412, after a circuit board slice is placed in the accommodating groove 413, the first clamping block 411 is fixed to the second clamping block 412 by locking with a screw, so that the circuit board slice is clamped in the accommodating groove 413, and the circuit board slice extends out from the negative Y-axis side of the accommodating groove 413, thereby facilitating grinding.

The fixing base 420 is provided with two blocks, one fixing base 420 is locked and fixed on the output end of the Y-axis movement module 320, the other fixing base 420 is locked and fixed on the first mounting plate 110, a slot 422 is arranged on the fixing base 420, one end of the second clamping block 412 in the positive direction of the Y axis is arranged in the slot 422, and after a screw passes through the threaded hole 421, the first clamping block 411 is abutted in the slot 422.

Through the arrangement of the positioning block 410, after the photographing device 500 photographs the circuit board slices on the positioning block 410, the circuit board slices and the positioning block 410 are directly transferred to the output end of the Y-axis movement module 320 together, and the circuit board slices are clamped and fixed on the positioning block 410, so that the circuit board slices and the positioning block 410 do not move relatively, the reference of the positioning block 410 is facilitated for the manipulator 300, the processing reference of the manipulator 300 is converted with the photographing measurement reference of the photographing device 500, and the accurate processing of the circuit board slices is realized.

The photographing apparatus 500 of the present embodiment is a photographing microscope.

The processing procedure of the grinding and polishing machine of the embodiment is as follows: the camera microscope photographs the circuit board slices, the observation surface position of the circuit board slices is selected through software on the computer, the cutting position, the rough grinding removal amount, the fine grinding removal amount and the polishing removal amount are determined by the software according to the observation surface position, the positioning block 410 carries the circuit board slices to be transferred to the Y-axis movement module 320, the cutting, the rough grinding, the fine grinding and the polishing of the circuit board slices are sequentially completed, and finally the slices are manufactured.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims

1. A grinder/polisher, comprising:

the positioning block can fix materials;

the photographing device can photograph the materials on the positioning blocks;

the grinding device comprises a grinding disc, a polishing disc and a driving device, and the driving device can drive the grinding disc and the polishing disc to rotate;

the manipulator, the locating piece can be fixed the output of manipulator, the manipulator can drive the locating piece moves along first direction, and drives the locating piece moves along the second direction, the abrasive disc with the polishing dish is followed the first direction is arranged, the locating piece can be followed the second direction is close to the polishing dish.

2. The grinding and polishing machine of claim 1, further comprising two fixing seats, one of the two fixing seats is fixed at the output end of the manipulator, the other fixing seat is fixed relative to the photographing device, a slot is formed in the fixing seat, and the fixing seat can lock and fix the positioning block in the slot.

3. The grinder-polisher in accordance with claim 1, wherein the positioning block comprises a first clamping block and a second clamping block, the second clamping block is provided with a receiving slot, two sides of the receiving slot are open, and the first clamping block and the second clamping block clamp the material in the receiving slot.

4. The grinder/polisher in accordance with claim 1 wherein the grinding means further comprises a slurry tank in communication with the polishing surface of the polishing pad via a conduit.

5. The grinder/polisher in accordance with claim 4 wherein the grinding means further comprises a collection tray having a collection trough disposed thereon, the polishing tray being disposed in the collection trough.

6. The grinder/polisher in accordance with claim 1 wherein the drive means comprises a first motor capable of driving the polishing disk in rotation.

7. The grinder-polisher in accordance with claim 1 wherein the grinding disks comprise a coarse grinding disk and a fine grinding disk, the coarse grinding disk, the fine grinding disk and the polishing disk being arranged in the first direction.

8. The grinder/polisher in accordance with claim 1 wherein the grinding means further comprises a cutting disk, the grinding disk and the polishing disk are arranged in the first direction.

9. The grinder/polisher in accordance with claim 1 wherein the means for photographing is a photographic microscope.

10. The grinder/polisher in accordance with claim 1 wherein the robot includes an X-axis motion module and a Y-axis motion module, the Y-axis motion module is disposed at an output end of the X-axis motion module, and the positioning block is detachably secured at an output end of the Y-axis motion module.