CN211522344U

CN211522344U - Electroplating equipment capable of reducing oxidation of circuit board

Info

Publication number: CN211522344U
Application number: CN201921203044.9U
Authority: CN
Inventors: 黄寿银
Original assignee: Wenzhou Brilliant Electroplating Co ltd
Current assignee: Wenzhou Brilliant Electroplating Co ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-09-18
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses an electroplating device of reducible circuit board oxidation, including the equipment body, conducting rod and link, internal first washing pond and the electroplating bath of being provided with of equipment, the right side of electroplating bath is provided with the second and washs the pond, be provided with the shell body on the equipment body, and the interior top of shell body is provided with the air heater, the conducting rod runs through the front and back both sides face of mount, the mount upper end is provided with the motor, and the motor setting is in the front side of pneumatic cylinder, the motor is connected with chain drive, and chain drive is connected with the cylinder, the link is connected with the inside wall of electroplating bath through the spout. This electroplating device of reducible circuit board oxidation can dry the circuit board after electroplating, need shift to other drying equipment after avoiding former circuit board to electroplate and dry it for the circuit board is very easily by the oxidation, has avoided shifting the circuit board after electroplating, reduces the possibility that the circuit board was oxidized.

Description

Electroplating equipment capable of reducing oxidation of circuit board

Technical Field

The utility model relates to an electroplating device technical field specifically is an electroplating device of reducible circuit board oxidation.

Background

The circuit board is at the in-process of production, need carry out electroplating treatment to the circuit board, electroplate to its surface and form a layer of metal film, thereby improve its electric conductivity, wearability and corrosion resistance etc. need use electroplating equipment, common electroplating equipment exists and electroplates inhomogeneously, influence the electroplating quality of its circuit board, the practicality is poor, the product after electroplating in addition needs to be dried, but general electroplating equipment does not have the stoving effect, need to dry the product after its electroplating in addition on drying equipment, the moist circuit board surface is very easily oxidized at this in-process, greatly reduced the qualification rate of product.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplating device of reducible circuit board oxidation to there is electroplating inhomogeneously in the common electroplating device who proposes in solving above-mentioned background art, influence the electroplating quality of its circuit board, the practicality is poor, the product after electroplating need dry in addition, but general electroplating device does not have the stoving effect, need dry the product after it electroplates in addition on drying equipment, the circuit board surface of this in-process moist very easily by oxidation, the problem of the qualification rate of greatly reduced product.

In order to achieve the above object, the utility model provides a following technical scheme: an electroplating device capable of reducing oxidation of a circuit board comprises a device body, a conductive rod and a connecting frame, wherein a first cleaning pool and an electroplating pool are arranged in the device body, the first cleaning pool is arranged on the left side of the electroplating pool, a second cleaning pool is arranged on the right side of the electroplating pool, the second cleaning pool is arranged in the device body, an outer shell is arranged on the device body, a hot air blower is arranged at the inner top end of the outer shell, the conductive rod penetrates through the front side wall and the rear side wall of a fixing frame, the fixing frame is arranged at the lower end of a hydraulic cylinder, a motor is arranged at the upper end of the fixing frame and is arranged on the front side of the hydraulic cylinder, the motor is connected with a chain transmission device, the chain transmission device is connected with a roller, meanwhile, the front side wall of the roller, which penetrates through the fixing frame, is rotatably connected onto the inner rear side, and the sliding chutes are arranged on the inner left and right side walls of the electroplating tank.

Preferably, be provided with supporting seat and current conducting plate on the equipment body, and the supporting seat sets up the inboard at the current conducting plate, the outside of current conducting plate is provided with the slide rail, and the slide rail setting is on the equipment body, the slide rail sets up the inboard at the outer casing, and is provided with the slide on the slide rail, and the interior top of slide is provided with the pneumatic cylinder simultaneously.

Preferably, the air heaters are arranged in two groups, and the air heaters are symmetrically arranged about the central line of the outer shell.

Preferably, the hydraulic cylinder and the fixing frame form a telescopic mechanism, and the fixing frame is provided with 2 conducting rods.

Preferably, the motor, the chain transmission device and the roller form a rotating mechanism, and the roller is porous.

Preferably, the cylinder is including hydraulic telescoping rod, fixed plate and mounting groove, and hydraulic telescoping rod rotates to be connected on the inside wall of cylinder, and hydraulic telescoping rod's the inner is provided with the fixed plate, and the inner of fixed plate is provided with the mounting groove, and the mounting groove is equidistant to be distributed on the fixed plate simultaneously.

Preferably, the connecting frame comprises an electrolytic plate, the electrolytic plate is arranged on the inner side wall of the connecting frame, and the connecting frame is in sliding connection with the inner side wall of the electroplating pool through the sliding groove.

Compared with the prior art, the beneficial effects of the utility model are that: the electroplating equipment can reduce the oxidation of the circuit board,

(1) the first cleaning pool and the second cleaning pool are arranged, so that the circuit board before electroplating can be cleaned, the surface cleanliness of the circuit board is ensured, impurities such as dust and the like are prevented from being left on the surface of the circuit board, the electroplating quality of the circuit board is prevented from being influenced, in addition, the electroplated metal can be placed on the electrolytic plate, and after the metal is electrolyzed, the connecting frame can be pulled out from the sliding groove, and the electroplated metal can be replaced;

(2) the hot air blower can dry the electroplated circuit board, so that the original circuit board is prevented from being transferred to another drying device to be dried after being electroplated, the circuit board is easy to oxidize, the electroplated circuit board is prevented from being transferred, and the possibility of oxidation of the circuit board is reduced;

(3) the accessible motor drives the cylinder and rotates, and the cylinder stirs electrolyte for the electrolytic ion in the electrolyte distributes evenly, ensures its circuit board and fully evenly electroplates, improves the electroplating quality of its circuit board.

Drawings

Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the left side structure of the connection between the apparatus body and the slide base;

FIG. 3 is a front view of the connecting frame of the present invention;

FIG. 4 is a schematic view of the left side view structure of the connection between the hydraulic cylinder and the fixing frame of the present invention;

FIG. 5 is a schematic view of the structure of the hydraulic cylinder and the fixing frame in front view;

fig. 6 is a schematic view of the right side sectional structure of the roller of the present invention.

In the figure: 1. the device comprises a device body, 2, a first cleaning pool, 3, an electroplating pool, 4, a second cleaning pool, 5, an outer shell, 6, a hot air blower, 7, a hydraulic cylinder, 8, a fixing frame, 9, a conducting rod, 10, a motor, 11, a chain transmission device, 12, a roller, 1201, a hydraulic telescopic rod, 1202, a fixing plate, 1203, a mounting groove, 13, a supporting seat, 14, a conducting plate, 15, a sliding rail, 16, a sliding seat, 17, a connecting frame, 1701, an electrolytic plate, 18 and a sliding groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides an electroplating device of reducible circuit board oxidation, as shown in figure 1, be provided with first washing pond 2 and electroplating bath 3 in the equipment body 1, and first washing pond 2 sets up the left side at electroplating bath 3, electroplating bath 3's right side is provided with second washing pond 4, and second washing pond 4 sets up in the equipment body 1, be provided with shell body 5 on the equipment body 1, and the interior top of shell body 5 is provided with air heater 6, air heater 6 is provided with two sets ofly, and air heater 6 sets up about 5 central lines of shell body symmetry, air heater 6 can dry the product after the electroplating, it is by oxidation to reduce moist product.

As shown in fig. 1, 3, 4, 5 and 6, the conductive rods 9 penetrate through the front and rear sides of the fixing frame 8, the fixing frame 8 is disposed at the lower end of the hydraulic cylinder 7, the hydraulic cylinder 7 and the fixing frame 8 constitute a telescopic mechanism, 2 conductive rods 9 are disposed on the fixing frame 8, the conductive rods 9 contact with the conductive plates 14, the conductive plates 14 are connected with a power supply to electrolyze the circuit board, the motor 10 is disposed at the upper end of the fixing frame 8, the motor 10 is disposed at the front side of the hydraulic cylinder 7, the motor 10 is connected with the chain transmission device 11, the chain transmission device 11 is connected with the roller 12, the rear end of the roller 12 penetrates through the front side wall of the fixing frame 8 to be rotatably connected to the inner rear side wall of the fixing frame 8, the motor 10, the chain transmission device 11 and the roller 12 constitute a rotating mechanism, the roller 12 is disposed in a porous shape, so that the distribution of electrolytic ions in the electrolyte is more uniform, the roller 12 comprises a hydraulic telescopic rod 1201, a fixing plate 1202 and a mounting groove 1203, the hydraulic telescopic rod 1201 is rotatably connected to the inner side wall of the roller 12, the fixing plate 1202 is arranged at the inner end of the hydraulic telescopic rod 1201, the mounting groove 1203 is arranged at the inner end of the fixing plate 1202, the mounting grooves 1203 are equidistantly distributed on the fixing plate 1202, the circuit board is placed in the mounting groove 1203 for clamping, circuit boards with different sizes can be clamped and electroplated, the connecting frame 17 is connected with the inner side wall of the electroplating tank 3 through a sliding groove 18, the sliding groove 18 is arranged on the inner left side wall and the inner right side wall of the electroplating tank 3, the connecting frame 17 comprises an electrolytic plate 1701, the electrolytic plate 1701 is arranged on the inner side wall of the connecting frame 17, the connecting frame 17 is in sliding connection with the inner side wall of the electroplating tank 3 through the sliding groove 18, the, the electrolytic plate 1701 is connected to a power source to electrolyze the plated metal, and a metal film is formed on the surface of the wiring board to protect the wiring board.

As shown in fig. 1 and 2, a support base 13 and a conductive plate 14 are provided on the device body 1, the support base 13 is provided on the inner side of the conductive plate 14, a slide rail 15 is provided on the outer side of the conductive plate 14, the slide rail 15 is provided on the device body 1, the slide rail 15 is provided on the inner side of the outer housing 5, a slide carriage 16 is provided on the slide rail 15, and a hydraulic cylinder 7 is provided at the inner top end of the slide carriage 16.

The working principle is as follows: when the electroplating equipment capable of reducing the oxidation of the circuit board is used, a power supply is switched on, the roller 12 is opened, the length of the hydraulic telescopic rod 1201 is adjusted according to the length of the circuit board, the circuit board is placed in the placing groove 1203, the hydraulic telescopic rod 1201 is utilized to push the fixing plate 1202 to clamp the circuit board, the sliding seat 16 moves on the sliding rail 15, when the position is right above the first cleaning pool 2, the hydraulic cylinder 7 pushes the fixing frame 8, the circuit board is soaked in the first cleaning pool 2, the surface of the circuit board is cleaned, the subsequent surface electroplating quality is guaranteed, after the circuit board is cleaned, the hydraulic cylinder 7 is utilized to lift the circuit board, the sliding seat 16 moves on the sliding rail 15 to be right above the electroplating pool 3, the hydraulic cylinder 7 pushes the fixing frame 8, the conducting rod 9 is placed on the supporting seat 13, two sides of the conducting rod 9 are in contact with the conducting plate 14, the circuit board is soaked in the electrolyte, the, starting the motor 10, the motor 10 drives the chain transmission device 11 to rotate, the chain transmission device 11 drives the roller 12 to uniformly stir the electrolyte, so that electrolytic ions in the electrolyte are uniformly distributed and are fully and uniformly plated on the circuit board, after electrolysis, the circuit board is lifted by using the hydraulic cylinder 7 and is dried by the hot air blower 6, the wet circuit board is reduced from being oxidized, the circuit board after electroplating is collected, the next circuit board is electroplated and is cleaned by the second cleaning pool 4, the slide base 16 reciprocates on the slide rail 15 to electroplate the circuit board, the circuit board is cleaned by the first cleaning pool 2 from left to right and moves from right to left, the circuit board is cleaned by the second cleaning pool 4, the time is saved, the production efficiency is improved, and after the electroplating metal on the electrolytic plate 1701 is electrolyzed, the connecting frame 17 is pulled out from the chute 18, the replacement of plated metals is well known to those skilled in the art and is not described in detail herein.

The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the scope of the invention.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a reducible circuit board oxidation's electroplating device, includes equipment body (1), conducting rod (9) and link (17), its characterized in that: be provided with first washing pond (2) and electroplating bath (3) in the equipment body (1), and first washing pond (2) sets up the left side in electroplating bath (3), the right side of electroplating bath (3) is provided with second washing pond (4), and second washing pond (4) set up in the equipment body (1), be provided with shell body (5) on the equipment body (1), and the interior top of shell body (5) is provided with air heater (6), conducting rod (9) run through the front and back both sides face of mount (8), and mount (8) set up the lower extreme at pneumatic cylinder (7), mount (8) upper end is provided with motor (10), and motor (10) set up the front side at pneumatic cylinder (7), motor (10) are connected with chain drive (11), and mount (11) are connected with cylinder (12), and the preceding lateral wall that the rear end of cylinder (12) runs through (8) rotates simultaneously and connects in mount (8) The connecting frame (17) is connected with the inner side wall of the electroplating pool (3) through a chute (18), and the chute (18) is arranged on the inner left and right side walls of the electroplating pool (3).

2. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: be provided with supporting seat (13) and current conducting plate (14) on the equipment body (1), and supporting seat (13) set up the inboard at current conducting plate (14), the outside of current conducting plate (14) is provided with slide rail (15), and slide rail (15) set up on the equipment body (1), slide rail (15) set up the inboard in outer casing (5), and are provided with slide (16) on slide rail (15), and the interior top of slide (16) is provided with pneumatic cylinder (7) simultaneously.

3. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: the hot air blowers (6) are arranged in two groups, and the hot air blowers (6) are symmetrically arranged relative to the center line of the outer shell (5).

4. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: the hydraulic cylinder (7) and the fixing frame (8) form a telescopic mechanism, and 2 conducting rods (9) are arranged on the fixing frame (8).

5. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: the motor (10), the chain transmission device (11) and the roller (12) form a rotating mechanism, and the roller (12) is porous.

6. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: the roller (12) comprises a hydraulic telescopic rod (1201), a fixing plate (1202) and a mounting groove (1203), the hydraulic telescopic rod (1201) is rotatably connected to the inner side wall of the roller (12), the fixing plate (1202) is arranged at the inner end of the hydraulic telescopic rod (1201), the mounting groove (1203) is arranged at the inner end of the fixing plate (1202), and meanwhile the mounting groove (1203) is equidistantly distributed on the fixing plate (1202).

7. An electroplating apparatus for reducing oxidation of a circuit board according to claim 1, wherein: the connecting frame (17) comprises an electrolytic plate (1701), the electrolytic plate (1701) is arranged on the inner side wall of the connecting frame (17), and meanwhile the connecting frame (17) is in sliding connection with the inner side wall of the electroplating pool (3) through the sliding groove (18).