CN211522322U - Etching case business turn over material structure - Google Patents
Etching case business turn over material structure Download PDFInfo
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- CN211522322U CN211522322U CN201922460839.4U CN201922460839U CN211522322U CN 211522322 U CN211522322 U CN 211522322U CN 201922460839 U CN201922460839 U CN 201922460839U CN 211522322 U CN211522322 U CN 211522322U
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Abstract
The utility model discloses an etching case business turn over material structure, including the etching case, be provided with circuit board and etching solution in the etching case, be provided with inlet, air inlet, liquid outlet and gas outlet on the lateral wall of etching case, inlet and liquid outlet set up in the relative both sides of etching case, the air inlet set up in the top of inlet, the gas outlet set up in the top of liquid outlet. The utility model discloses when accomplishing etching process business turn over material, utilize business turn over liquid and business turn over gas natural formation's liquid flow to erode the circuit board, ensured the even of etching, compare in prior art, need not to rock the etching box, the structure is succinct more and the energy consumption is lower.
Description
Technical Field
The utility model relates to an etching technique especially relates to an etching case business turn over material structure.
Background
Etching is an important process in the production process of circuit boards, and is divided into acid etching and alkaline etching according to the nature of the used chemical agents. The alkaline etching process comprises the following reactions:
(1) adding ammonia water into the copper chloride solution to perform a complex reaction:
CuCl2+4NH3→Cu(NH3)4Cl2,
(2) during the etching process, copper over the substrate is [ Cu (NH)3)4〕2+Complex ion oxidation, etching reaction thereof:
Cu(NH3)4Cl2+Cu→2Cu(NH3)2Cl,
(3) generated during etching [ Cu (NH) ]3)2〕1+Has no etching ability, and can be quickly oxidized by oxygen in the air in the presence of excessive ammonia water and chloride ions to generate [ Cu (NH) having etching ability3)4〕2+Complex ions, the regeneration reaction of which is as follows:
2Cu(NH3)2Cl+2NH4Cl+2NH3+1/2O2→2Cu(NH3)4Cl+H2O,
therefore, ammonia and ammonium chloride, also called sub-solution, are required to be continuously added during etching. The excess bath solution is continuously drained while the seed solution is added, and the concentration of copper ions in the chemical solution can be maintained to ensure the etching rate.
In the etching process, the etching solution needs to flow uniformly on the surface of the circuit board to keep etching sufficient and uniform, and the existing etching equipment is usually realized by shaking an etching box, for example, patent CN201821444721.1 discloses an etching equipment which drives the etching box to reciprocate through a flywheel, so that the etching solution shakes and washes the circuit board, but this way easily causes the etching solution to splash out, and since the weight of the etching box itself is large, the power requirement of the flywheel is also high, which causes high energy consumption. In addition, the circuit board is fixed in the shaking process, and the etching box body is easy to collide with the circuit board, so that the circuit board is damaged.
Therefore, how to provide an etching apparatus that can make the etching solution flush the circuit board uniformly without shaking the box body becomes a problem to be solved by those skilled in the art.
Disclosure of Invention
An object of the utility model is to provide a can make etching solution erode etching case business turn over material structure of circuit board uniformly.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to the utility model discloses an aspect provides an etching case business turn over material structure, including the etching case, be provided with circuit board and etching solution in the etching case, be provided with inlet, air inlet, liquid outlet and gas outlet on the lateral wall of etching case, inlet and liquid outlet set up in the relative both sides of etching case, the air inlet set up in the top of inlet, the gas outlet set up in the top of liquid outlet.
In one embodiment, the liquid inlet of the feeding and discharging structure is provided with a plurality of liquid inlets, and each liquid inlet is provided with a liquid inlet pipe.
In an embodiment, a liquid inlet pipe extending into the etching box is arranged at the liquid inlet of the feeding and discharging structure, and a pipe orifice of the liquid inlet pipe faces the circuit board.
In one embodiment, a booster pump is arranged outside the liquid inlet of the feeding and discharging structure, and the booster pump is connected with the liquid inlet pipe.
In one embodiment, an air inlet pipeline is arranged at the air inlet of the feeding and discharging structure, and a flat-mouth-shaped air outlet is arranged at the tail end of the air inlet pipeline.
In one embodiment, the air outlet of the feeding and discharging structure is inclined downwards and faces the liquid level of the etching liquid.
In one embodiment, the air inlet pipeline of the feeding and discharging structure is connected with a compressor.
In one embodiment, a liquid outlet pipe is connected outside the liquid outlet of the feeding and discharging structure, and the liquid outlet pipe is an arc pipe with an upward opening.
In an embodiment, the air outlet of the feeding and discharging structure is connected with a waste gas collecting pipeline, and an exhaust fan is arranged in the waste gas collecting pipeline.
The embodiment of the utility model provides a beneficial effect is: when the etching process is finished, the circuit board is flushed by liquid flow formed naturally by liquid inlet and outlet and gas inlet and outlet, so that the etching uniformity is ensured, and compared with the prior art, the etching box does not need to shake, so that the structure is simpler and the energy consumption is lower.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
The above features and advantages of the present invention will be better understood upon reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
wherein: 1-etching box; 2, a booster pump; 3-a compressor; 4-an air inlet duct; 4 a-an air outlet; 5-a liquid outlet pipe; 6-an exhaust gas collection duct; 7-liquid inlet pipe.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be understood as imposing any limitation on the scope of the present invention.
As shown in figure 1, the embodiment of the utility model discloses etching case business turn over material structure, including etching case 1, be provided with circuit board and etching solution in the etching case 1, for showing clearly in the picture, hidden etching solution, etching case's upper cover plate and other irrelevant structures. Be provided with inlet, air inlet, liquid outlet and gas outlet on the lateral wall of etching case 1, inlet and liquid outlet set up in the relative both sides of etching case 1, and the air inlet sets up in the top of inlet, and the gas outlet sets up in the top of liquid outlet. Through relative inlet and the liquid outlet that sets up for etching solution flows towards the circuit board direction, reaches the purpose that erodees the circuit board, thereby can make the etching more even. The air inlet and the air outlet can also form air flow in the same direction, so that the etching solution is driven to flow.
For batch etching, the circuit boards may be placed vertically in an etching chamber as shown in the figure, and the side faces the liquid inlet, so that the etching liquid can flow through between the circuit boards. Preferably, the inlet is provided with a plurality ofly, and every inlet all is provided with feed liquor pipe 7, and feed liquor pipe 7 stretches into the inside of etching case 1, and the mouth of pipe is towards the circuit board. Thereby forming a plurality of liquid flows to ensure that each circuit board can be uniformly washed. In order to accelerate the liquid inlet flow velocity, a booster pump 2 can be arranged outside the liquid inlet, and the booster pump 2 is connected with a liquid inlet pipe 7.
Because sufficient oxygen is needed in the etching process, an air inlet for supplementing air is further arranged, an air inlet pipeline 4 is arranged at the air inlet, and a flat-mouth-shaped air outlet 4a is arranged at the tail end of the air inlet pipeline 4. The air outlet 4a is inclined downward and faces the surface of the etching solution. The intake duct 4 is connected to the compressor 3. The air compressed by the compressor 3 is blown from the air outlet 4a to the liquid surface in the direction of the circuit board at a high speed, thereby also assisting the flow of the etching solution.
A liquid outlet pipe 5 is connected outside the liquid outlet, and the liquid outlet pipe 5 is an arc pipe with an upward opening. The liquid level in the etching box 1 is controlled by the liquid outlet pipe 5, and when the liquid level in the etching box 1 is higher than the pipe orifice of the liquid outlet pipe 5, the liquid is automatically discharged from the liquid outlet pipe. And so set up drain pipe 5 into the arc pipe that the opening faces upwards because the liquid level height in etching case 1 all keeps at the mouth of pipe height of drain pipe 5 always to can utilize the etching liquid to reach the effect of liquid seal, can not have gas to discharge from in the drain pipe 5.
And set up the gas outlet and be connected with waste gas collecting pipe 6 above the liquid outlet, waste gas collecting pipe 6 and exhaust treatment device intercommunication to handle gases such as the ammonia that volatilizees among the etching process, be provided with the exhaust fan (not shown in the figure) in the waste gas collecting pipe 6.
To sum up, the utility model discloses when accomplishing etching process business turn over material, utilize business turn over liquid and business turn over gas nature to form's liquid flow to erode the circuit board, ensured the even of etching, compare in prior art, need not to rock the etching box, the structure is succinct more and the energy consumption is lower.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.
Claims (9)
1. The utility model provides an etching case business turn over material structure, includes etching case (1), be provided with circuit board and etching solution in etching case (1), its characterized in that: the etching device is characterized in that a liquid inlet, an air inlet, a liquid outlet and a gas outlet are arranged on the side wall of the etching box (1), the liquid inlet and the liquid outlet are arranged on two opposite sides of the etching box (1), the air inlet is arranged above the liquid inlet, and the gas outlet is arranged above the liquid outlet.
2. The etching chamber feed and discharge structure according to claim 1, wherein: the liquid inlet is provided with a plurality of liquid inlets, and each liquid inlet is provided with a liquid inlet pipe (7).
3. The etching chamber feed and discharge structure according to claim 2, wherein: the liquid inlet pipe (7) extends into the etching box (1), and the pipe orifice of the liquid inlet pipe (7) faces the circuit board.
4. The etching chamber feed and discharge structure according to claim 3, wherein: a booster pump (2) is arranged outside the liquid inlet, and the booster pump (2) is connected with the liquid inlet pipe (7).
5. The etching chamber feed and discharge structure according to claim 1, wherein: an air inlet pipeline (4) is arranged at the air inlet, and a flat-mouth-shaped air outlet (4a) is arranged at the tail end of the air inlet pipeline (4).
6. The etching chamber feed and discharge structure according to claim 5, wherein: the air outlet (4a) inclines downwards and faces the liquid level of the etching liquid.
7. The etching chamber feed and discharge structure according to claim 6, wherein: the air inlet pipeline (4) is connected with the compressor (3).
8. The etching chamber feed and discharge structure according to claim 1, wherein: the liquid outlet is externally connected with a liquid outlet pipe (5), and the liquid outlet pipe (5) is an arc-shaped pipe with an upward opening.
9. The etching chamber feed and discharge structure according to claim 1, wherein: the gas outlet is connected with a waste gas collecting pipeline (6), and an exhaust fan is arranged in the waste gas collecting pipeline (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922460839.4U CN211522322U (en) | 2019-12-31 | 2019-12-31 | Etching case business turn over material structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922460839.4U CN211522322U (en) | 2019-12-31 | 2019-12-31 | Etching case business turn over material structure |
Publications (1)
Publication Number | Publication Date |
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CN211522322U true CN211522322U (en) | 2020-09-18 |
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CN201922460839.4U Active CN211522322U (en) | 2019-12-31 | 2019-12-31 | Etching case business turn over material structure |
Country Status (1)
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2019
- 2019-12-31 CN CN201922460839.4U patent/CN211522322U/en active Active
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