CN211515412U - N for sapphire wafer2Purging device - Google Patents
N for sapphire wafer2Purging device Download PDFInfo
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- CN211515412U CN211515412U CN201922045193.3U CN201922045193U CN211515412U CN 211515412 U CN211515412 U CN 211515412U CN 201922045193 U CN201922045193 U CN 201922045193U CN 211515412 U CN211515412 U CN 211515412U
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Abstract
The utility model discloses a N for sapphire wafer2The blowing device comprises a bracket, a fixed frame, a fixed platform and a blowing head; the fixing frame is L-shaped, one end of the fixing frame is provided with a fixing hole, and the other end of the fixing frame is provided with an up-down adjusting hole; the fixed platform comprises a square plate, a left adjusting hole and a right adjusting hole which are matched with the fixed holes are formed in the square plate, a connecting rod is installed at one end of the square plate, and a connecting hole II is formed in the connecting rod; n is arranged on the blowing head2The blowing head is also provided with a first connecting hole matched with the second connecting hole, and the blowing head rotates to adjust the N by penetrating through the first connecting hole and the second connecting hole through screws2The purge angle of (c). The utility model discloses a N2The air is blown and cleaned,particles slightly adhered to the surface of the wafer are blown off, and exhaust gas with the particles is exhausted through an exhaust system at the bottom of the protective cover, so that the effects of cleaning the surface of the wafer and protecting the surrounding environment are achieved, and the product yield is improved.
Description
Technical Field
The utility model relates to a N for sapphire wafer2Sweep the device, belong to sapphire wafer field.
Background
PSS (Patterned Sapphire Substrate) is a Sapphire Substrate having a microscopic pattern formed on the surface of the Sapphire Substrate. On one hand, the patterned substrate can effectively reduce the dislocation density of an epitaxial structure layer, improve the crystal quality and uniformity of an epitaxial material and further improve the internal quantum efficiency of the light-emitting diode; on the other hand, the graph structure increases the light scattering, changes the optical circuit of the light emitting diode and improves the light emitting probability.
The PSS process comprises cleaning/brushing, gluing, photoetching, developing, etching and the like, and appearance detection is carried out on an appearance automatic detection machine after the incoming material product is brushed or developed. At present, the product yield is affected by the large particles on the surface of the product due to secondary pollution.
Disclosure of Invention
To the problems existing in the prior art, the utility model provides a N for sapphire wafer2The purging device reduces the number of surface particles during automatic product appearance detection and improves the yield of finished products.
In order to achieve the above object, the present invention provides an N for sapphire wafer2The blowing device comprises a bracket, a fixed frame which is arranged at the upper part of the bracket and can be adjusted in height along the upper part of the bracket, a fixed platform which is arranged at the top of the fixed frame and can be adjusted left and right along the top of the fixed frame, and a blowing head which is arranged on the fixed platform;
the fixing frame is L-shaped, one end of the fixing frame is provided with a fixing hole, and the other end of the fixing frame is provided with an up-down adjusting hole; the fixed platform comprises a square plate, a left adjusting hole and a right adjusting hole which are matched with the fixed holes are formed in the square plate, a connecting rod is installed at one end of the square plate, and a connecting hole II is formed in the connecting rod;
n is arranged on the blowing head2The connector and the purging head are also provided with a first connecting hole matched with a second connecting hole which is penetrated through the first connecting hole and the second connecting hole by screws,make the blowing head rotate and adjust N2The purge angle of (c).
As an improvement, the number of the fixing frames is two, and the two fixing frames are symmetrically arranged at two ends of the upper part of the bracket.
As an improvement, the upper and lower adjusting holes and the left and right adjusting holes are all oblong holes.
As an improvement, a gas gathering cavity with a small outside and a large inside is arranged inside the blowing head, and the gas gathering cavity and N are arranged2The interfaces are communicated.
As an improvement, the automatic appearance detection machine further comprises a protective cover arranged on the upper portion of the automatic appearance detection machine table, the protective cover is a circular cover, and a position avoidance area is arranged on the protective cover.
As the improvement, the bottom of outward appearance automated inspection board is equipped with the blast pipe.
Compared with the prior art, the utility model discloses an it carries out altitude mixture control on support upper portion to install the mount, and fixed platform installs the regulation of controlling the distance on the mount, and the rotation between blowing head and fixed platform is connected, can realize blowing the accurate control of angle between blowing head and wafer, and rethread N2And purging to blow off particles slightly adhered to the surface of the wafer, and discharging the waste gas with the particles through an exhaust system at the bottom of the protective cover, so that the effects of cleaning the surface of the wafer and protecting the surrounding environment are achieved, and the product yield is improved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the middle fixing frame of the present invention;
fig. 3 is a side view of the middle fixing frame of the present invention;
fig. 4 is a top view of the fixing platform of the present invention;
FIG. 5 is a schematic structural view of a blowing head according to the present invention;
FIG. 6 is a schematic structural view of a protection groove of the present invention;
in the figure: 1. the air-sweeping device comprises a blowing head 11, an air collecting cavity 12, a first connecting hole 2, a fixing platform 21, a connecting rod 22, a second connecting hole 23, a left-right adjusting hole 3, a fixing frame 31, a fixing hole 32, a left-right adjusting hole 22, a left-right adjusting hole 3, a fixing frame 31, a fixing hole,Up-down adjusting hole, 4, support, 5, N2Interface, 6, keep away the position district, 7, safety cover, 8, blast pipe, 9, set screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below. It should be understood, however, that the description herein of specific embodiments is only intended to illustrate the invention and not to limit the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the terms used herein in the specification of the present invention are for the purpose of describing particular embodiments only and are not intended to limit the present invention.
As shown in fig. 1-6, an N for sapphire wafer2The blowing device comprises a bracket 4, a fixed frame 3 which is arranged at the upper part of the bracket 4 and can be adjusted in height along the upper part of the bracket 4, a fixed platform 2 which is arranged at the top of the fixed frame 3 and can be adjusted left and right along the top of the fixed frame 3, and a blowing head 1 which is arranged on the fixed platform 2;
the fixing frame 3 is L-shaped, one end of the fixing frame 3 is provided with a fixing hole 31, and the other end of the fixing frame 3 is provided with an up-down adjusting hole 32; the fixed platform 2 comprises a square plate, a left adjusting hole 23 and a right adjusting hole 23 which are matched with the fixed holes 31 are formed in the square plate, a connecting rod 21 is installed at one end of the square plate, and a connecting hole II 22 is formed in the connecting rod 21;
n is arranged on the blowing head 12The connector 5 and the blowing head 1 are also provided with a first connecting hole 12 matched with a second connecting hole 22, and the blowing head 1 rotates to adjust N by penetrating through the first connecting hole 12 and the second connecting hole 22 through screws2The purge angle of (c).
As the improvement of the embodiment, the two fixing frames 3 are symmetrically arranged at the two ends of the upper part of the bracket 4, so that the whole structure is more stable and the supporting effect is good.
As a modification of the embodiment, as shown in fig. 3 and 4, the up-down adjusting hole 32 and the left-right adjusting hole 23 are both oblong holes, and screws move in the oblong holes to change the mounting position, thereby achieving the purpose of adjusting the mounting height or the left-right mounting distance.
As an improvement of the embodiment, as shown in FIG. 5, an air gathering cavity 11 with a small outside and a big inside is arranged inside the blowing head 1, and the air gathering cavity 11 and N are arranged2 Interface 5 looks UNICOM, preferred, adopt the diameter to gather the gas structure for the big round hole in little, can improve the air current pressure that blows off from gathering in the gas chamber 11.
As an improvement of the embodiment, as shown in fig. 1 and 6, the automatic appearance inspection machine further includes a protection cover 7 installed on the upper portion of the automatic appearance inspection machine, the protection cover 7 is a circular cover, the protection cover 7 is provided with an avoiding area 6 for the wafer calibration device to capture images and pick and place wafers, and the bottom of the automatic appearance inspection machine is provided with an exhaust pipe 8 for connecting the exhaust device.
When in use, the connecting screw between the fixing frame 3 and the bracket 4 is loosened, and the N can be manually adjusted by moving the up-down adjusting hole 32 on the fixing frame 32The blowing head moves up and down along with the fixed platform 2, so that the installation height of the blowing head 1 is adjusted, and after the blowing head moves in place, the blowing head is matched with a nut to fix a connecting screw; then the fixing screw 9 between the fixing platform 2 and the fixing frame 3 is loosened, and the N can be manually adjusted by moving the left and right adjusting holes 23 on the fixing platform 22The blowing head moves left and right along with the fixed platform 2, so that the left and right installation distance of the blowing head 1 is adjusted, and after the blowing head moves in place, the nut is installed on the fixed screw 9; when the blowing angle between the blowing head 1 and the fixed platform 2 needs to be adjusted, the screws on the first connecting hole 12 and the second connecting hole 22 are loosened, and the screws are fixed by nuts after the blowing head 1 is rotated in place. The installation height adjustment, the left-right distance adjustment and the rotation angle adjustment are not in strict sequence and can be flexibly selected according to requirements.
In addition, N of the cleaning head 12The air blowing port is linear, and can be matched with an Aligner (device for automatically correcting the flat edge of the wafer) to automatically correct the flat edge of the wafer, so that the complete surface of the wafer can be blown. N is a radical of2Dirty gas blown across the wafer surface is exhausted from the inside of the machine through the exhaust pipe 8 at the bottom of the protective cover 7, so that the dirty gas is prevented from being exhaustedThe internal environment of the machine station causes pollution.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the present invention.
Claims (6)
1. N for sapphire wafer2The blowing device is characterized by comprising a support (4), a fixing frame (3) which is arranged on the upper part of the support (4) and can be adjusted in height along the upper part of the support (4), a fixing platform (2) which is arranged on the top of the fixing frame (3) and can be adjusted left and right along the top of the fixing frame (3), and a blowing head (1) which is arranged on the fixing platform (2);
the fixing frame (3) is L-shaped, one end of the fixing frame (3) is provided with a fixing hole (31), and the other end of the fixing frame is provided with an up-down adjusting hole (32); the fixed platform (2) comprises a square plate, a left adjusting hole and a right adjusting hole (23) which are matched with the fixed holes (31) are formed in the square plate, a connecting rod (21) is installed at one end of the square plate, and a connecting hole II (22) is formed in the connecting rod (21);
n is arranged on the blowing head (1)2The connector (5) and the blowing head (1) are also provided with a first connecting hole (12) matched with a second connecting hole (22), and the blowing head (1) is rotated to adjust N by penetrating through the first connecting hole (12) and the second connecting hole (22) through screws2The purge angle of (c).
2. N for sapphire wafer according to claim 12The purging device is characterized in that the number of the fixing frames (3) is two, and the two fixing frames (3) are symmetrically arranged at two ends of the upper part of the support (4).
3. N for sapphire wafer according to claim 12The purging device is characterized in that the upper and lower adjusting holes (32) and the left and right adjusting holes (23) are all oblong holes.
4. N for sapphire wafer according to claim 12A purging device, characterized in thatThe interior of the blowing head (1) is provided with a gas gathering cavity (11) with a small outside and a big inside, and the gas gathering cavity (11) and the N are arranged2The interfaces (5) are communicated.
5. N for sapphire wafer according to claim 12Purging device, its characterized in that still including installing safety cover (7) on outward appearance automated inspection board upper portion, safety cover (7) are round cover, are equipped with on safety cover (7) and keep away position district (6).
6. N for sapphire wafer according to claim 52The purging device is characterized in that an exhaust pipe (8) is arranged at the bottom of the automatic appearance detection machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922045193.3U CN211515412U (en) | 2019-11-25 | 2019-11-25 | N for sapphire wafer2Purging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922045193.3U CN211515412U (en) | 2019-11-25 | 2019-11-25 | N for sapphire wafer2Purging device |
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| Publication Number | Publication Date |
|---|---|
| CN211515412U true CN211515412U (en) | 2020-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922045193.3U Active CN211515412U (en) | 2019-11-25 | 2019-11-25 | N for sapphire wafer2Purging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112792050A (en) * | 2021-02-01 | 2021-05-14 | 江西中烟工业有限责任公司 | Cleaning device and cleaning method for window of discharge hopper of tobacco feeding machine |
-
2019
- 2019-11-25 CN CN201922045193.3U patent/CN211515412U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112271132B (en) * | 2020-10-28 | 2022-03-04 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112792050A (en) * | 2021-02-01 | 2021-05-14 | 江西中烟工业有限责任公司 | Cleaning device and cleaning method for window of discharge hopper of tobacco feeding machine |
| CN112792050B (en) * | 2021-02-01 | 2022-04-29 | 江西中烟工业有限责任公司 | Cleaning device and cleaning method for window of discharge hopper of tobacco feeding machine |
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Effective date of registration: 20221230 Address after: No. 98, Yangshan Road, Xuzhou Economic and Technological Development Zone, Xuzhou, Jiangsu 221000 Patentee after: Xuzhou Meixing Photoelectric Technology Co.,Ltd. Address before: No. 98, Yangshan Road, Xuzhou Economic and Technological Development Zone, Jiangsu 221000 Patentee before: XUZHOU GAPSS OE TECHNOLOGY Co.,Ltd. |