CN211509429U - Fixing device for semiconductor device component - Google Patents
Fixing device for semiconductor device component Download PDFInfo
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- CN211509429U CN211509429U CN201921582666.7U CN201921582666U CN211509429U CN 211509429 U CN211509429 U CN 211509429U CN 201921582666 U CN201921582666 U CN 201921582666U CN 211509429 U CN211509429 U CN 211509429U
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- fixing
- diode
- movably connected
- semiconductor device
- movable support
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Abstract
The utility model relates to a diode technical field just discloses a fixing device who makes part by semiconductor device, which comprises a circuit board, the top swing joint of circuit board has the fixing base, the top swing joint of fixing base has the dead lever, the inside horizontal swing joint of dead lever has the backup pad, the inside swing joint of backup pad has the movable support, movable support fixing chuck, fixing chuck's below swing joint has the draw-in groove, fixing chuck's left side swing joint has the diode, the below swing joint of diode has the lead wire. This fixing device who makes part by semiconductor device through the activity of movable support in the backup pad, can adjust a suitable position with fixed chuck, and the rethread is adjusted the gim peg and is fixed the diode, then the diode can not take place the change of position at the during operation, has increased the life of diode, reduces the number of times of change maintenance, brings the facility for the life.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a fixing device who makes part by semiconductor device.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, which is widely used in daily life, and the semiconductor refers to a material with controllable conductivity ranging from the insulator to the conductor, and the importance of the semiconductor is very great from the viewpoint of technological or economic development, and most of the core units of electronic products are very closely related to the semiconductor, for example, a diode is a device made of the semiconductor.
The diode is applied to various electronic components, enriches our daily life, brings great convenience to our life, is generally connected to a circuit board, but is easy to shift, so that poor contact can be caused, the diode cannot work normally, the service life of the diode is shortened, and the cost is increased.
In order to solve the above problems, a fixing device for a semiconductor device component, that is, a diode fixing device, is proposed, which can fix the diode without position deviation through the fixing of three fixing chucks, and brings great convenience to daily maintenance.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a be not enough to prior art, the utility model provides a fixing device who makes part by semiconductor device possesses can all with the heat dissipation, fixed diode's position, the skew of position does not take place in the working process, has increased the life of diode, has practiced thrift use cost's advantage, when having solved diode connection on the circuit board, takes place the skew easily, can lead to contact failure like this, can not normally work, shortens the life of diode, has increased use cost's problem.
(II) technical scheme
For realize the aforesaid can all with the heat dissipation, the skew of position does not take place in the position is traded to fixed diode, has increased the life of diode, has practiced thrift use cost's purpose, the utility model provides a following technical scheme: the utility model provides a fixing device who makes part by semiconductor device, includes the circuit board, the top swing joint of circuit board has the fixing base, the top swing joint of fixing base has the dead lever, the inside horizontal swing joint of dead lever has the backup pad, the inside swing joint of backup pad has the movable support, the left side swing joint of movable support has fixing chuck, fixing chuck's below swing joint has the draw-in groove, fixing chuck's left side swing joint has the diode, the below swing joint of diode has the lead wire, the fixed orifices has been seted up to the inside of backup pad, the inside fixedly connected with internal thread of fixed orifices, the inside swing joint of fixed orifices has the gim peg, the fixed surface of gim peg is connected with the external screw thread, fixing chuck's outside swing joint has the fin.
Preferably, the movable support is located inside the supporting plate, the movable support can move, and the supporting plate is perpendicular to the fixing rod.
Preferably, the number of the fixing seats is three, three fixing rods are movably connected to the upper portion of the fixing seats and distributed in a triangular mode, and the fixing rods are perpendicular to the upper portion of the circuit board.
Preferably, the diode is located in the middle of the fixed chuck.
Preferably, the internal thread in the fixing hole can correspond to the external thread outside the fixing bolt.
Preferably, the diode is cylindrical, and the two leads below the diode are perpendicular to the circuit board.
Preferably, the fixing hole is positioned inside the supporting plate and penetrates through the movable bracket.
(III) advantageous effects
Compared with the prior art, the utility model provides a fixing device of part is made by semiconductor device possesses following beneficial effect:
1. the fixing device of the semiconductor device component can adjust the fixing chuck to a proper position through the movement of the movable support in the supporting plate, and then fix the diode through the adjusting fixing bolt, so that the diode cannot change position during working, and the service life of the diode is prolonged.
2. This fixing device who makes part by semiconductor device through the fin outside the fixed chuck, can go out the heat dispersion that diode in the work produced, can lengthen the life of diode, reduces the number of times of change maintenance, has practiced thrift use cost, brings the facility for the life.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a top view of the main structure of the present invention;
FIG. 3 is an enlarged view of the point A of the structure of FIG. 1 of the present invention;
fig. 4 is an enlarged view of the point B of the structure of fig. 1 of the present invention.
In the figure: 1-circuit board, 2-fixed seat, 3-fixed rod, 4-supporting plate, 5-movable support, 6-fixed chuck, 7-clamping groove, 8-diode, 9-lead, 10-fixed hole, 11-internal thread, 12-fixed bolt, 13-external thread and 14-radiating fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a fixing device for a semiconductor device component comprises a circuit board 1, a fixed base 2 movably connected to the upper side of the circuit board 1, a fixed rod 3 movably connected to the upper side of the fixed base 2, a supporting plate 4 movably connected to the inner side of the fixed rod 3, a movable support 5 movably connected to the inner side of the supporting plate 4, the movable support 5 located inside the supporting plate 4, the movable support 5 capable of moving, the supporting plate 4 perpendicular to the fixed rod 3, a fixed chuck 6 movably connected to the left side of the movable support 5, a clamping slot 7 movably connected to the lower side of the fixed chuck 6, the clamping slot 7 for reinforcing a diode 8, a diode 8 movably connected to the left side of the fixed chuck 6, the diode 8 located in the middle of the fixed chuck 6, a cylindrical lead 9 movably connected to the lower side of the diode 8, the diode 8 being in a shape, fixed orifices 10 have been seted up to the inside of backup pad 4, fixed orifices 10 are located the inside of backup pad 4, run through movable support 5, the inside fixedly connected with internal thread 11 of fixed orifices 10, the inside swing joint of fixed orifices 10 has gim peg 12, the fixed surface of gim peg 12 is connected with external screw thread 13, fixing base 2 has threely, top swing joint has three dead lever 3, be triangular distribution, dead lever 3 perpendicular to circuit board 1's top, internal thread 11 in the fixed orifices 10 can correspond with the outer external screw thread 13 of gim peg 12, a position for fixing movable support 5, the outside swing joint of fixing chuck 6 has fin 14, be used for making the heat dissipation of diode 8.
The working process and principle are that the fixed seat 2 is fixed on the circuit board 1 and used for connecting the fixed rod 3, the supporting plate 4 is transversely movably connected inside the fixed rod 3, the supporting plate 4 cannot move, the movable support 5 inside the supporting plate 4 can move, the movable support 5 can be adjusted to a corresponding position, the fixed bolt 12 is connected with the supporting plate 4 and the movable support 5 in the fixed hole 10, the fixed bolt 12 is screwed, the position of the fixed chuck 6 on the movable support 5 can be fixed, the diode 8 can be fixed, and heat generated when the diode 8 works can be dissipated from the radiating fin 14.
To sum up, this fixing device for making parts by semiconductor device through the activity of movable support 5 in backup pad 4, can adjust fixing chuck 6 to a suitable position, and then fix diode 8 through adjusting gim peg 12, then diode 8 can not take place the change of position at the during operation, has increased diode 8's life, this fixing device for making parts by semiconductor device through fixing chuck 6 outer fin 14, can disperse the heat that diode 8 in service produced, can lengthen diode 8's life, reduce the number of times of change maintenance, use cost has been practiced thrift, bring the facility for life.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A fixing device of a component made of a semiconductor device, comprising a circuit board (1), characterized in that: the upper portion of the circuit board (1) is movably connected with a fixing seat (2), the upper portion of the fixing seat (2) is movably connected with a fixing rod (3), the inner portion of the fixing rod (3) is transversely movably connected with a supporting plate (4), the inner portion of the supporting plate (4) is movably connected with a movable support (5), the left side of the movable support (5) is movably connected with a fixing chuck (6), the lower portion of the fixing chuck (6) is movably connected with a clamping groove (7), the left side of the fixing chuck (6) is movably connected with a diode (8), the lower portion of the diode (8) is movably connected with a lead (9), a fixing hole (10) is formed in the supporting plate (4), an internal thread (11) is fixedly connected in the fixing hole (10), a fixing bolt (12) is movably connected in the fixing hole (10), and an external thread (13) is fixedly connected to the surface of the fixing, the outer side of the fixed chuck (6) is movably connected with a radiating fin (14).
2. A holding device of a part made of a semiconductor device according to claim 1, wherein: the movable support (5) is located inside the supporting plate (4), the movable support (5) can move, and the supporting plate (4) is perpendicular to the fixing rod (3).
3. A holding device of a part made of a semiconductor device according to claim 1, wherein: the fixing seats (2) are three, three fixing rods (3) are movably connected to the upper portion of the fixing seats and distributed in a triangular mode, and the fixing rods (3) are perpendicular to the upper portion of the circuit board (1).
4. A holding device of a part made of a semiconductor device according to claim 1, wherein: the diode (8) is located in the middle of the fixed chuck (6).
5. A holding device of a part made of a semiconductor device according to claim 1, wherein: the internal thread (11) in the fixing hole (10) can correspond to the external thread (13) outside the fixing bolt (12).
6. A holding device of a part made of a semiconductor device according to claim 1, wherein: the diode (8) is cylindrical, and the two leads (9) below the diode (8) are perpendicular to the circuit board (1).
7. A holding device of a part made of a semiconductor device according to claim 1, wherein: the fixing hole (10) is positioned in the support plate (4) and penetrates through the movable support (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921582666.7U CN211509429U (en) | 2019-09-23 | 2019-09-23 | Fixing device for semiconductor device component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921582666.7U CN211509429U (en) | 2019-09-23 | 2019-09-23 | Fixing device for semiconductor device component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211509429U true CN211509429U (en) | 2020-09-15 |
Family
ID=72405589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921582666.7U Active CN211509429U (en) | 2019-09-23 | 2019-09-23 | Fixing device for semiconductor device component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211509429U (en) |
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2019
- 2019-09-23 CN CN201921582666.7U patent/CN211509429U/en active Active
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