CN211508946U

CN211508946U - MCU type motor control chip with wide input voltage

Info

Publication number: CN211508946U
Application number: CN202020462998.8U
Authority: CN
Inventors: 李小强
Original assignee: Shenzhen Fangwei Semiconductor Co ltd
Current assignee: Shenzhen Fangwei Semiconductor Co ltd
Priority date: 2020-04-02
Filing date: 2020-04-02
Publication date: 2020-09-15
Anticipated expiration: 2030-04-02

Abstract

The utility model provides a wide input voltage's MCU type machine control chip, include: the first wafer is used for realizing MCU; the second wafer is used for realizing grid drive; the third wafer is used for realizing power supply conversion; a plurality of internal connections for implementing connections between wafers; and a plurality of external connections for connecting the chip to the outside. The three functions of the controller, the power conversion and the power conversion can be well integrated on one chip.

Description

MCU type motor control chip with wide input voltage

Technical Field

The utility model relates to an integrated circuit especially relates to motor control chip.

Background

With the continuous development of motor technology from brush-to-brushless, from ac to dc. The demand for motor control chips is increasing due to the fact that the motors themselves are supplied with power ranging from a few volts to hundreds of volts and over kilovolts.

A complete motor control system typically includes a motor and a control panel that cooperates with the motor. The core of the Control board is an MCU (Micro Control Unit). Motor control boards that mate with motors typically have three main chips: firstly, an MCU controller; a Power Converter chip; and thirdly, a gate drive (Gatedriver) chip. The combined implementation of the three chips brings very large area consumption and cost pressure to the pcba (printed Circuit Board assembly).

In order to reduce the number of main chips on the control board as much as possible, there are two main chip combination implementations of 1+ 1. One is that: the MCU and the power supply conversion part are designed in an SOC (System on Chip) mode, and the gate drive is packaged into a Chip; the problems with this approach are: since the MCU and the power conversion part have great difference in the chip implementation process, integrating the two parts in the SOC manner results in great cost pressure.

The other is as follows: the power conversion and the grid drive are designed in an SOC mode, and the MCU is packaged into a chip, so that the method has the following problems: since the gate driving voltage and the power conversion input voltage are different, there is a larger difference in the manufacturing process than the first method in integrating the two in the SOC manner, which results in a higher cost and pressure and difficulty in process compatibility.

In addition, in order to support different application scenarios, the voltages supported by the power conversion and the gate driving are different, there are a difference between the low power conversion and the high voltage conversion, and a difference between the low voltage gate driving and the high voltage gate driving, under the condition that the MCU controller is not changed, a plurality of different SOCs integrating two major parts of the power conversion and the gate driving may be required to meet actual needs of different application scenarios.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a wide input voltage's MCU type machine control chip, can be well with three kinds of functions integration of controller, power conversion and power conversion on a chip.

The utility model provides a technical scheme that its technical problem adopted includes: provided is an MCU type motor control chip of a wide input voltage, including:

the first wafer is used for realizing MCU;

the second wafer is used for realizing grid drive;

the third wafer is used for realizing power supply conversion;

a plurality of internal connections for implementing connections between wafers; and

and the plurality of external connections are used for realizing the connection between the chip and the outside.

In some embodiments, the number of internal connections includes: the power supply of the third wafer is converted into a first power supply provided for the MCU of the first wafer; the power of the third wafer is converted to provide a second power supply for the gate drive of the second wafer; and a control signal between the MCU of the first wafer and the gate drive of the second wafer.

In some embodiments, the control signal comprises multiple paths of PWM signals.

In some embodiments, the voltage supplied by the first power supply is any combination of 5V, 3.3V, 1.8V, and 1.2V; the voltage supplied by the second power supply is 8V to 25V.

In some embodiments, the number of external connections includes: a power input as an input to the power conversion of the third wafer; and a motor control interface as an output of the gate drive of the second wafer.

In some embodiments, the number of external connections further comprises: and the MCU is used as a communication interface for connecting the MCU of the first wafer with the outside.

In some embodiments, the number of external connections further comprises: an external power supply as an output of the power conversion of the third wafer.

In some embodiments, the voltage supplied by the external power source is adjustable in voltage range.

In some embodiments, the power conversion of the third wafer supports wide voltage range input, supporting any combination of AC-DC conversion, DC-DC conversion, and LDO conversion.

In some embodiments, the chip is in a SIP package, supporting control of PMSM motors, BLDC motors, stepper motors, and servo motors.

Compared with the prior art, the utility model discloses a wide input voltage's MCU type motor control chip realizes MCU, grid drive and power conversion's functional design respectively through the wafer with three difference ingeniously, can be well with three kinds of functions integration of controller, power conversion and power conversion on a chip.

Drawings

Fig. 1 illustrates a block diagram of the MCU type motor control chip with wide input voltage according to the present invention.

Wherein the reference numerals are as follows: the power supply of the third wafer 31, the first power supply 32, the second power supply 4, the communication interface 5, the motor control interface 6 and the external power supply 7 are realized by the first wafer 12 control signal 2 of the MCU, the second wafer 3 realizing the power conversion of the chip 1 and the first wafer 12.

Detailed Description

For the purpose of illustrating the structure and features of the present invention in detail, the following preferred embodiments are described in conjunction with the accompanying drawings.

Referring to fig. 1, fig. 1 illustrates a block diagram of a MCU type motor control chip with wide input voltage according to the present invention. The utility model provides a wide input voltage's MCU type Motor control chip 10, chip 10 support to PMSM Motor (permanent magnet synchronous Motor), BLDC Motor (Brushless direct current Motor), step Motor, the control of multiple type motors such as servo Motor, can wide application in household electrical appliances, industrial control, unmanned aerial vehicle and so on field.

The chip 10 includes three wafers that are packaged together by using an SIP (System In a Package) technology and respectively realize three functions: a first wafer 1 for implementing MCU, a second wafer 2 for implementing gate driving, and a third wafer 3 for implementing power conversion.

The chip 10 also includes several internal connections for making connections between the

wafers

1, 2, 3, not embodied on the pins of the package: present between the first wafer 1 and the second wafer 2: a control signal 12; present between the first wafer 1 and the third wafer 3: a first power supply 31; present between the second wafer 2 and the third wafer 3: a second power supply 32.

The chip 10 also includes a number of external connections embodied on the pins of the package for enabling the chip 10 to connect externally: between the first wafer 1 and the outside: a communication interface 4; present between the second wafer 2 and the outside: a motor control interface 5; and between the third wafer 3 and the outside: a power input 6 and an external power supply 7.

Specifically, the MCU of the first wafer 1 can generate a control signal 12 of a multi-channel PWM (Pulse Width Modulation) waveform and provide the control signal to the gate driver of the second wafer 2.

The power supply for the first wafer 1 is from the first power supply 31 provided by the power conversion of the third wafer 3.

The first wafer 1 communicates with the outside through a communication interface 4. By way of example, the communication interface 4 comprises: SPI (Serial peripheral interface), I2C (Inter-Integrated Circuit), USB (Universal Serial bus), UART (Universal Asynchronous Receiver/Transmitter), SWD (Serial Wire debug), and the like.

Specifically, the gate driving of the second wafer 2 can perform necessary processing on the control signal 12 to obtain an appropriate voltage and current waveform, output the voltage and current waveform to the outside of the chip 10 via the motor control interface 5, and control power devices, such as: MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and IGBT (insulated Gate Bipolar Transistor) to further control the rotation of the motor.

The power supply of the second wafer 2 is from the second power supply 32 provided by the power conversion of the third wafer 3.

Specifically, the power conversion of the third circle 3 can convert the input power 6 into a plurality of voltage outputs: a first power supply 31 to the first wafer 1, a second power supply 32 to the second wafer 2, and an external power supply 7 to external circuitry (not shown).

The power conversion of the third circle 3 supports a wide voltage range input, supports any combination of AC-DC conversion, DC-DC conversion and LDO conversion, that is: the internal design of the power conversion of the third wafer 3 involves any one or more of the techniques, for example: AC-DC conversion, DC-DC conversion, LDO conversion.

For example, the voltage of the first power supply 31 required for the power conversion output of the third wafer 3 to the MCU of the first wafer 1 is any combination of 5V, 3.3V, 1.8V and 1.2V, that is: 5V/3.3V/1.8V/1.2V, etc.; the voltage of the second power supply 32 required for the gate driving output to the second wafer 2 by the power conversion of the third wafer 3 is 8V to 25V; the voltage of the external power supply 7 required for the power conversion output of the third wafer 3 to the circuit external to the chip 10 is adjustable in voltage range.

By adopting the system architecture of the chip 10, various chip models suitable for various application scenarios can be manufactured, and the following is further described by two embodiments.

Example one

The working voltage of the first wafer 1 for implementing the MCU is 3.3V.

The withstand voltage of the second wafer 2 for realizing the gate driving is 700V at the maximum.

The third wafer 3 for realizing power conversion supports 110V-220V alternating current high voltage input, and 3.3V direct current required for realizing the first wafer 1 of the MCU, 8V-25V direct current required for realizing the second wafer 2 of the gate drive and 5V direct current required by an external circuit can be obtained through conversion processing of a plurality of processing units of AC-DC/DC-DC/LDO.

Example two

The working voltage of the first wafer 1 for realizing the MCU is 3.3V/1.2V.

The withstand voltage of the second wafer 2 for realizing gate driving is 200V.

The third wafer 3 for realizing power conversion supports direct current input of less than 60V, and through conversion processing of a plurality of processing units of the DC-DC/LDO, 3.3V/1.2V direct current required for realizing the first wafer 1 of the MCU, 8V-25V direct current required for realizing the second wafer 2 driven by the grid electrode and 5V direct current required by an external circuit can be obtained.

Compared with the prior art, the utility model discloses a wide input voltage's MCU type machine control chip designs through separating into three

wafer

1, 2, 3 with MCU, grid drive and three major functions of power conversion ingeniously, adopts SIP encapsulation integration in a chip again in unison, and the beneficial effect who brings includes, but is not limited to:

1. flexibility: due to the fact that the MCU, the grid drive and the power supply conversion are different in application scene, one MCU needs to be matched with different power supply conversion and different grid drives, the three MCU, the grid drive and the power supply conversion are separately designed into three

wafers

1, 2 and 3, and flexibility of chip design can be greatly improved.

2. The cost advantage is as follows: although there is an overlap between the MCU, the gate driver and the power conversion in the manufacturing process itself, the manufacturing process is very different in more high voltage parts, so that the separate design can maximize the cost advantage.

3. Area advantage: MCU, grid drive and power conversion separate design, SIP encapsulation, it is a chip 10 to appear outward, therefore can save occupied area and volume on PCBA greatly, bring very big value to various application scenes.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and is not intended to limit the present invention. All such modifications and variations are intended to be included herein within the scope of this disclosure and the present invention.

Claims

1. An MCU type motor control chip of wide input voltage, comprising:

the first wafer is used for realizing MCU;

the second wafer is used for realizing grid drive;

the third wafer is used for realizing power supply conversion;

2. The chip of claim 1, wherein the plurality of internal connections comprises: the power supply of the third wafer is converted into a first power supply provided for the MCU of the first wafer; the power of the third wafer is converted to provide a second power supply for the gate drive of the second wafer; and a control signal between the MCU of the first wafer and the gate drive of the second wafer.

3. The chip of claim 2, wherein the control signal comprises multiple PWM signals.

4. The chip of claim 2, wherein the voltage supplied by the first power supply is any combination of 5V, 3.3V, 1.8V, and 1.2V; the voltage supplied by the second power supply is 8-25V.

5. The chip of claim 1, wherein the number of external connections comprises: a power input as an input to the power conversion of the third wafer; and a motor control interface as an output of the gate drive of the second wafer.

6. The chip of claim 5, wherein the number of external connections further comprises: and the MCU is used as a communication interface for connecting the MCU of the first wafer with the outside.

7. The chip of claim 5, wherein the number of external connections further comprises: an external power supply as an output of the power conversion of the third wafer.

8. The chip of claim 7, wherein the voltage supplied by the external power source is adjustable in voltage range.

9. The chip of claim 1, wherein the power conversion of the third wafer supports wide voltage range input, supports any combination of AC-DC conversion, DC-DC conversion, and LDO conversion.

10. The chip of any one of claims 1 to 9, wherein the chip is packaged in a SIP to support control of PMSM motors, BLDC motors, stepper motors and servo motors.