CN211479659U - Heat dissipation type magnetic ring subassembly - Google Patents

Heat dissipation type magnetic ring subassembly Download PDF

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Publication number
CN211479659U
CN211479659U CN201922375118.3U CN201922375118U CN211479659U CN 211479659 U CN211479659 U CN 211479659U CN 201922375118 U CN201922375118 U CN 201922375118U CN 211479659 U CN211479659 U CN 211479659U
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China
Prior art keywords
shell
electronic component
resonant cavity
heat dissipation
heat
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Active
Application number
CN201922375118.3U
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Chinese (zh)
Inventor
顾旭亚
刘建清
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Changzhou Zunzheng Machinery Equipment Co ltd
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Changzhou Zunzheng Machinery Equipment Co ltd
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Abstract

The utility model relates to a heat dissipation type magnetic ring subassembly has the shell and fixes the mounting panel in the shell bottom, has the resonant cavity in the shell, and the resonant cavity lower extreme is equipped with buzzing piece, and electronic component unit mount has seted up the sound emitting hole in the shell wall of resonant cavity below in the shell of resonant cavity top, arranges the louvre that has to the slope of mounting panel direction setting on the shell lateral wall at electronic component subassembly place, is equipped with the heat conduction pad between electronic component subassembly bottom and the mounting panel internal surface, and the mounting panel surface has the heat dissipation muscle. The utility model discloses a set up the louvre on the shell lateral wall, the inside and outside air convection state of formation in the shell, the inside heat of the cover shell of being convenient for passes through the louvre and discharges, utilizes the heat conduction pad to transmit electronic component subassembly during operation heat to mounting panel simultaneously, realizes giving off fast through the heat dissipation muscle, has ensured that the electronic component subassembly is in operation in the suitable ambient temperature, has prolonged electronic component's life.

Description

Heat dissipation type magnetic ring subassembly
Technical Field
The utility model relates to a heat dissipation type magnetic ring subassembly.
Background
Generally, the commonly used magnetic ring material is strontium ferrite, and the existing magnetic ring components mainly include piezoelectric type and electromagnetic type. The electronic component assembly of the electromagnetic magnetic ring assembly comprises an oscillator, an electromagnetic coil, a magnet, a vibrating diaphragm and the like, the electronic component assembly is arranged in a shell, after a power supply is switched on, an audio signal current generated by the oscillator passes through the electromagnetic coil to enable the electromagnetic coil to generate a magnetic field, and the vibrating diaphragm periodically vibrates and produces sound under the interaction of the electromagnetic coil and the magnet. In the working process of electronic components such as an electromagnetic coil, a magnet and the like, excessive heat can be accumulated in the shell, so that the electronic components are in a working state in a high-temperature environment slowly, the performance of the electronic components is greatly influenced in the long term, and the service life of the electronic components is shortened.
Disclosure of Invention
The to-be-solved technical problem of the utility model is: in order to overcome the defects in the prior art, the utility model provides a heat dissipation type magnetic ring subassembly with better radiating effect.
The utility model provides a technical scheme that its technical problem adopted is: a heat dissipation type magnetic ring component comprises a shell and a mounting plate fixed to the bottom of the shell, wherein a resonant cavity is formed in the shell, a buzzer is arranged at the lower end of the resonant cavity, an electronic component is mounted in the shell below the resonant cavity, a sound emitting hole is formed in the wall of the shell above the resonant cavity, heat dissipation holes are formed in the side wall of the shell where the electronic component is located, the heat dissipation holes are obliquely formed in the direction towards the mounting plate, a heat conduction pad is arranged between the bottom of the electronic component and the inner surface of the mounting plate, and heat dissipation ribs are.
The radiating holes are symmetrically arranged on the side wall of the shell relative to the center of the shell, and at least two radiating holes are arranged on the side wall of the shell at each side.
The radiating ribs are distributed on the outer surface of the mounting plate in a grid shape.
The utility model has the advantages that: the utility model discloses a set up the louvre on the shell lateral wall, the state of air convection inside and outside the shell internal formation, the inside heat of the cover shell of being convenient for passes through louvre discharge shell, utilizes the heat conduction pad to transmit electronic component subassembly during operation heat to mounting panel simultaneously, realizes giving off fast through the heat dissipation muscle, ensures from this that the electronic component subassembly is in operation in the suitable ambient temperature, extension electronic component's life.
Drawings
The present invention will be further described with reference to the accompanying drawings and embodiments.
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1. the heat dissipation device comprises a shell, 2 parts of a mounting plate, 3 parts of a resonant cavity, 4 parts of a buzzer, 5 parts of an electronic component assembly, 6 parts of a sound emission hole, 7 parts of heat dissipation holes, 8 parts of a heat conduction pad and 9 parts of heat dissipation ribs.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
As shown in fig. 1, the heat dissipation type magnetic ring assembly includes a housing 1 and a mounting plate 2 fixed at the bottom of the housing 1, a resonant cavity 3 is provided in the housing 1, a buzzer 4 is provided at the lower end of the resonant cavity 3, an electronic component 5 is installed in the housing 1 below the resonant cavity 3, and a sound emitting hole 6 is provided on the wall of the housing 1 above the resonant cavity 3.
The side wall of the shell 1 where the electronic component assembly 5 is located is provided with radiating holes 7 which are symmetrically arranged relative to the center of the shell 1, the side wall of the shell 1 on each side is provided with three radiating holes 7, the radiating holes 7 are obliquely arranged towards the direction of the mounting plate 2, and the obliquely arranged radiating holes 7 can prevent external water drops from entering the shell 1.
A heat conducting pad 8 is arranged between the bottom of the electronic component assembly 5 and the inner surface of the mounting plate 2, heat radiating ribs 9 are arranged on the outer surface of the mounting plate 2, and the heat radiating ribs 9 are distributed on the outer surface of the mounting plate 2 in a grid shape.
The utility model discloses a set up louvre 7 on 1 lateral wall of shell, at the inside state of forming inside and outside air convection of shell 1, the inside heat of the cover shell of being convenient for passes through louvre 7 discharge shell 1, utilize heat conduction pad 8 to transmit electronic component subassembly 5 during operation heat to mounting panel 2 simultaneously, realize giving off fast through heat dissipation muscle 9, better heat dispersion has, ensured from this that electronic component subassembly 5 is in operation in a suitable ambient temperature, extension electronic component's life.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (3)

1. The utility model provides a heat dissipation type magnetic ring subassembly, has shell (1) and fixes mounting panel (2) in shell (1) bottom, has resonant cavity (3) in shell (1), and resonant cavity (3) lower extreme is equipped with buzzing piece (4), and electronic component subassembly (5) are installed in shell (1) of resonant cavity (3) below, have seted up on shell (1) wall of resonant cavity (3) top and have sent out sound hole (6), characterized by: the radiating holes (7) are arranged on the side wall of the shell (1) where the electronic component assembly (5) is located, the radiating holes (7) are obliquely arranged towards the direction of the mounting plate (2), a heat conducting pad (8) is arranged between the bottom of the electronic component assembly (5) and the inner surface of the mounting plate (2), and radiating ribs (9) are arranged on the outer surface of the mounting plate (2).
2. The heat dissipating magnet ring assembly of claim 1 further comprising: the radiating holes (7) are symmetrically arranged on the side wall of the shell (1) relative to the center of the shell (1), and at least two radiating holes (7) are arranged on the side wall of the shell (1) on each side.
3. The heat dissipating magnet ring assembly of claim 1 further comprising: the radiating ribs (9) are distributed on the outer surface of the mounting plate (2) in a grid shape.
CN201922375118.3U 2019-11-18 2019-12-25 Heat dissipation type magnetic ring subassembly Active CN211479659U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921993630 2019-11-18
CN2019219936308 2019-11-18

Publications (1)

Publication Number Publication Date
CN211479659U true CN211479659U (en) 2020-09-11

Family

ID=72361129

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922375118.3U Active CN211479659U (en) 2019-11-18 2019-12-25 Heat dissipation type magnetic ring subassembly

Country Status (1)

Country Link
CN (1) CN211479659U (en)

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