CN211457784U

CN211457784U - Cooling device for VBE system

Info

Publication number: CN211457784U
Application number: CN201921846241.2U
Authority: CN
Inventors: 张朝辉; 苏杰和; 王晨涛; 王慧泉; 陈成; 凌永兴; 张晶菲; 王盛霖
Original assignee: Guangzhou Bureau of Extra High Voltage Power Transmission Co
Current assignee: Guangzhou Bureau of Extra High Voltage Power Transmission Co
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-09-08
Anticipated expiration: 2029-10-30

Abstract

The utility model discloses a heat sink for VBE system, the MOS pipe surface mounting who establishes on the light emission board has the radiator, the radiator is concatenated by the water course, the water course of three adjacent light emission boards concatenates, the head and the tail of water course forms water intake pipe and outlet pipe way respectively, screen cabinet bottom is equipped with the heat dissipation case, water intake pipe and outlet pipe way run through the bottom entering heat dissipation case of screen cabinet, and be connected to into water collecting pipe and play water collecting pipe respectively, the one end of water collecting pipe and the one end of play water collecting pipe are connected, the other end of water collecting pipe is connected to the output of pump package through the cooling tube, the other end of play water collecting pipe is connected to the input of pump package through the cooling tube, the both sides tank wall of heat dissipation case is equipped with the ventilation hole, the tank wall of heat dissipation. The utility model has the advantages that: the radiator directly reaches the inside of the light emission plate and directly generates a large amount of heat 'fierce' MOS tubes, and the problem of heating of the light emission plate is fundamentally solved.

Description

Cooling device for VBE system

Technical Field

The utility model relates to a high voltage direct current transmission control system field especially relates to a heat sink for VBE system.

Background

The VBE system (Valve Base Electronics) is a control system of a high-voltage direct-current transmission converter Valve system, and is called a Valve control system for short. In high-voltage direct-current transmission, a VBE system plays a role of a bridge between a direct-current pole control system and a converter valve, pole control signals are issued through the VBE system, feedback of monitoring signals of the converter valve is achieved, and finally the control function of the converter valve is achieved, so that control of high-voltage direct-current transmission is achieved. In the existing VBE system, each set of system has 3 screen cabinets, each screen cabinet has 2 VBE layer frames, and as shown in FIG. 1, A1-A6 are 6 VBE layer frames in one set of VBE system. Each shelf is composed of 2 CPU boards, 6 light emitting boards, 12 light receiving boards, 1 programming board and 2 RPU boards.

The prior VBE system mainly has the following problems:

(1) poor radiating effect of VBE system

At the beginning of design, the VBE system screen cabinet is only provided with the cooling fans at the front and the back of the screen cabinet, the guide plates are arranged between the internal shelves of the screen cabinet to guide the wind to flow for cooling, and other cooling equipment is not arranged between the internal shelves of the screen cabinet, so that the cooling effect of the whole system is limited.

(2) The light emitting plate has high failure rate, and the operation of a direct current power grid is seriously influenced.

Statistics shows that the board card with the highest fault rate in the VBE system is the light emitting board, the service life of parts in a high-temperature running state is shortened mainly due to the fault reason, although redundancy of three and two is adopted in the design process, once a single light emitting board card fails, equipment loses redundancy, running risks are increased, and therefore the board card needs to be replaced in time. However, the risk of replacing the light emitting plate in live working is high, and the light emitting plate is generally replaced by reducing direct current power or stopping direct current power, so that the transmission of the direct current power is seriously affected by the fault of the light emitting plate.

Therefore, the optical transmitting panel in the VBE system has frequent faults, which not only brings great trouble to the direct current transmission operation and maintenance, but also causes great influence to the stable operation of the direct current transmission.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a heat sink for VBE system mainly solves the problem that light emission board calorific capacity is huge and leads to direct current electric wire netting trouble in the VBE system.

In order to solve the technical problem, the technical scheme of the utility model as follows:

the utility model provides a heat sink for VBE system, the MOS pipe surface mounting who establishes on the light emission board has the radiator, the radiator is concatenated by the water course, adjacent three the water course of light emission board is concatenated, the head and the tail of water course forms water intake pipe and outlet pipe way respectively, and screen cabinet bottom is equipped with the heat dissipation case, water intake pipe and outlet pipe way run through the bottom of screen cabinet gets into the heat dissipation case to be connected to into the collecting pipe and go out the water collecting pipe respectively, the one end of the collecting pipe of intaking and the one end of going out the water collecting pipe are connected, the other end of the collecting pipe of intaking is connected to the output of pump package through the cooling tube, the other end of going out the water collecting pipe is connected to through the cooling tube the input of pump package, the both sides tank wall of heat dissipation case is equipped with the ventilation hole, and.

In some embodiments, the heat sink is a metal patch or a thermally conductive silicone sheet.

In some embodiments, the interior of the radiator employs a continuous S-shaped water channel.

In some embodiments, the outer surface of the heat spreader is coated with an insulating paste.

In some embodiments, the heat dissipation tube is a finned coil or a copper coil.

In some embodiments, the pump group comprises at least two water pumps, the output ends of the two water pumps are connected in parallel and then connected to the water inlet collecting pipe, and the input ends of the two water pumps are connected in parallel and then connected to the water outlet collecting pipe.

In some embodiments, there are at least two fans.

The utility model has the advantages that:

1. inside the direct light emission board of radiator, directly hurry the production a large amount of thermal "the soul murder" MOS pipe, fundamentally solves the light emission board problem of generating heat, compares the only screen cabinet fan of the primary system of VBE and dispels the heat, and the VBE system uses the utility model discloses back radiating efficiency obtains fundamental improvement. Simultaneously, can prolong light emission board life through the effective cooling of each subassembly, reduce this type spare part purchase number of times and quantity by a wide margin, save the expenditure, can effectively reduce DC transmission system annual power failure hours, reinforcing DC transmission stability, reinforcing resident and industrial power consumption stability.

2. The continuous S-shaped water channel is adopted in the radiator, so that the contact area between the water channel and the radiator is increased, and the radiating effect is improved.

3. The cooling tube is fin coil pipe or copper coil pipe, has increased the area of contact between cooling tube and the air, promotes the radiating effect.

4. The number of the fans and the number of the water pumps are more than two, so that the redundancy of the fans and the water pumps is enhanced, and the operation stability of a VBE system is enhanced.

Drawings

FIG. 1 is a front view of a VBE system;

FIG. 2 is a perspective view of the cooling device for VBE system of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2 taken along line B;

FIG. 4 is a perspective view of the light emitting panel of the present invention;

FIG. 5 is an enlarged view of a portion of FIG. 4 taken along line A;

FIG. 6 is a perspective view of the internal structure of the heat dissipation case of the present invention;

fig. 7 is a perspective view of the pump unit and the heat dissipation pipe of the present invention.

Wherein: 1-cabinet, 101-light emission plate, 102-shelf, 2-MOS tube, 3-radiator, 4-water channel, 5-water inlet pipeline, 6-water outlet pipeline, 7-heat dissipation box, 8-water inlet manifold, 9-water outlet manifold, 10-heat dissipation tube, 11-pump group, 111-output end, 112-input end, 12-ventilation hole and 13-fan.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, so to speak, as communicating between the two elements. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art. The technical solution of the present invention will be further explained with reference to the accompanying drawings and examples.

During the normal operation of the VBE system, it is found that the temperature near the light-emitting plate 101 outside the layer frame 102 is above 50 ℃ through infrared temperature measurement, and even some temperature measurement points are as high as 70 ℃, the heat generation of the light-emitting plate 101 in the layer frame 102 of the VBE system is the largest, and more specifically, the heat generation of the MOS tube 2 on the light-emitting plate 101 is the largest, so that the loss of internal components is accelerated and the failure rate is high after the light-emitting plate 101 operates for a long time.

According to fig. 2-7, in the present embodiment, a heat sink for VBE system is proposed, a surface of an MOS tube 2 disposed on a light emitting plate 101 is provided with a heat sink 3, the heat sink 3 is connected in series by a water channel 4, three adjacent water channels 4 of the light emitting plate 1 are connected in series, a head and a tail of the water channel 4 respectively form a water inlet pipe 5 and a water outlet pipe 6, a heat dissipating box 7 is disposed at a bottom of the cabinet 1, the water inlet pipe 5 and the water outlet pipe 6 penetrate through the bottom of the cabinet 1 to enter the heat dissipating box 7 and are respectively connected to a water inlet manifold 8 and a water outlet manifold 9, one end of the water inlet manifold 8 is connected to one end of the water outlet manifold 9, the other end of the water inlet manifold 8 is connected to an output end 111 of a pump group 11 through a heat dissipating pipe 10, the other end of the water outlet manifold 9 is connected to an input end 112 of the, the two side box walls of the heat dissipation box 7 are provided with ventilation holes 12, and the front surface of the box wall of the heat dissipation box 7 is provided with a fan 13. Inside radiator 3 direct light emission board 101, the "genuine" MOS pipe 2 of a large amount of heats of production is run straight, fundamentally solves light emission board 101 and generates heat the problem, compares original system and only has the screen cabinet fan to dispel the heat, and radiating efficiency obtains fundamental improvement. Meanwhile, through effective cooling, the service life of the light emission plate 101 can be prolonged, the number of times and the number of the spare parts for the type are greatly reduced, the expenditure is saved, the annual power failure hours of a direct current transmission system can be effectively reduced, the direct current transmission stability is enhanced, and the stability of resident and industrial power utilization is enhanced.

As shown in fig. 2 and 3, two shelves 102 are mounted on the cabinet 1, each shelf 102 has six light emitting panels 101, and each light emitting panel 101 has six MOS transistors 2. Since every three light emitting panels 101 operate together as a group, the water inlet pipe 5 enters from the upper part of the first light emitting panel 101 on the left, then the water channel 4 connects six radiators 3 mounted on the MOS tubes 2 in series, and finally the water channel 4 penetrates from the lower part of the first light emitting panel 101 on the left, and similarly, the water channel 4 continues to enter the second and third light emitting panels 101, and then the heat absorbed from the MOS tubes 2 is taken away through the water outlet pipe 6, and by combining with fig. 3 and 4, and pointing by the arrow in the figure, it can be clearly known how the water channel 4 connects the adjacent three light emitting panels 101 in series; similarly, the water channels 4 of the fourth to sixth light-emitting panels 101 from the left in fig. 3 are also arranged in the same way as the water channels 4 of the first three light-emitting panels 101, and finally, each shelf 102 extends to form two water inlet pipelines 5 and two water outlet pipelines 6, and the two shelves 102 have four water inlet pipelines 5 and four water outlet pipelines 6 (eight in total) entering the heat dissipation box 7, so that water flows in the heat dissipation box 7 for heat dissipation and circulation, and the four water inlet pipelines 5 and the four water outlet pipelines 6 enter the interior of the cabinet 1 through the front portion of the cabinet 1 and then enter the heat dissipation box 7 from the interior of the cabinet 1. Of course, the arrangement of the water channel 4 can be changed flexibly, such as starting from the third light emitting plate 101 from the left and then penetrating the first light emitting plate 101 from the left. The directions of the water inlet pipeline 5 and the water outlet pipeline 6 inside the cabinet 1 are not important, and therefore, they are not described in detail. When one of the three light emitting panels 101 is out of order, the other two panels can also work normally, and the reason for adopting the cooling strategy of grouping every three light emitting panels 101 is that, assuming that the water passages 4 of the six light emitting panels 101 are connected in series at one time, the temperature of the water flow at the third or fourth light emitting panel 101 is likely to be high in an extreme state, and the temperature of the light emitting panel 101 to be passed next may not be well lowered.

It can be seen from fig. 4, fig. 5 that is equipped with one row of six continuous MOS pipe 2 on the board 101 of sending out light, six MOS pipe 2 becomes the relation of concatenating each other through connection of radiator 3 and water course 4, combines the relation of concatenating of three blocks of boards 101 of sending out light again, can learn the utility model discloses a water course 4 has undertaken 3 x 6 the heat dissipation responsibility of 18 MOS pipe 2, and the temperature in the water course 4 rises very fast, and too much concatenates and makes the cooling capacity decline, and too few concatenates then makes the inside single water course 4 of equipment too much, through the experiment, radiating effect and water course setting quantity are more balanced when 18 MOS pipe 2 are concatenated to water course 4.

The heat sink 3 may be made of any material with excellent heat conductivity, and may be made of a material capable of rapidly absorbing heat on the MOS tube 2, and preferably, the heat sink 3 is a metal patch or a heat conductive silicone sheet. Furthermore, the metal patch is sealed, water seepage of the metal patch can be prevented, the size of the metal patch is equivalent to that of the MOS tube 2, the metal patch is tightly attached to the MOS tube 2, and the contact area between the metal patch and the MOS tube 2 is increased. The water channel 4 is made of stainless steel, the stainless steel has excellent heat conducting performance, is not rusted, has stable material properties, and is not easy to break down. Through the radiator 3 of metal paster formula design, take away the heat of the MOS pipe 2 that generates heat the highest in the board 101 of sending out light rapidly, effectively reduce the operating temperature of the board 101 of sending out light, make it can long-term operation in the optimum temperature interval, reinforcing board 101 of sending out light operating stability.

The radiator 3 adopts a continuous S-shaped water channel inside. The purpose is to increase the contact area between the water channel 4 and the radiator 3 and improve the heat dissipation effect.

Insulating cement is smeared on the outer surface of the radiator 3, so that the stability of the radiator 3 is enhanced on one hand, and the problem of discharging caused by insufficient insulation distance between the radiator 3 and other board cards in the layer frame 2 is prevented on the other hand.

The radiating pipe 10 is a finned coil or a copper coil. The purpose is to increase the contact area between the radiating pipe 10 and the air, thereby improving the radiating effect. The contact area between the fin coil and the air is larger, and the copper coil is discussed only by materials, so that the heat dissipation capacity of the copper coil is stronger, and a technician can select a proper coil by himself.

As can be seen from fig. 7, the diameters of the water inlet manifold 8 and the water outlet manifold 9 are larger than those of the water inlet pipeline 5 and the water outlet pipeline 6, so as to perform the function of confluence; the water inlet collecting pipe 8 and the water outlet collecting pipe 9 are linear or curved stainless steel pipes, the setting angle is parallel to the ground, and the water inlet collecting pipe 8 and the water outlet collecting pipe 9 collect and buffer water flow, so that cold water in all pipelines is more stable and uniform.

The pump set 11 comprises at least two water pumps, the output ends of the two water pumps are connected in parallel and then connected to the water inlet collecting pipe 8, the input ends of the two water pumps are connected in parallel and then connected to the water outlet collecting pipe 9, the parameters of the two water pumps are consistent as much as possible, the two water pumps run at half rated power when working normally, and when one of the water pumps fails, the other water pump runs at rated power. The number of the water pumps in the pump group 11 can be increased continuously according to the requirement, so that the redundancy of the water pumps is enhanced, and the operation stability of the system is enhanced.

At least two fans 13 are provided, the parameters of the two fans 13 should be consistent as much as possible, the two fans 13 are operated at half rated power when in normal operation, and when one fan 13 fails, the other fan 13 is operated at rated power. The number of fans 13 can be increased according to the requirement, so that the redundancy of the fans 13 is enhanced, and the operation stability of the system is enhanced.

The working principle is as follows: the output end 111 of the pump unit 11 is connected to the water inlet manifold 8 through the radiating pipe 10, cold water is conveyed to the water inlet manifold 8, the cold water of the water inlet manifold 8 enters the water inlet pipeline 5, the cold water in the water inlet pipeline 5 continuously enters the radiator 3 under the action of water pump pressure, the radiator 3 absorbs a large amount of heat on the MOS tube 2, the water flow takes away the heat of six radiators 3 connected in series through the water channel 4, the water temperature rises, then the water flow also takes away the heat of twelve radiators 3 on the other two light emission plates 101 through the water channel 4, the water outlet pipeline 6 conveys hot water to the water outlet manifold 9, and the water outlet manifold 9 returns to the pump unit 11 through the radiating pipe 10 and the input end 112 to form water circulation. During the water circulation, the fan 13 in a rotated state generates an air flow to discharge the heat of the radiating pipe 10 from the radiating box 7 while supplementing air from the ventilating holes 12 of the walls of both sides of the radiating box 7, thereby maintaining the air pressure inside and outside the radiating box 7 to be uniform.

The first heat exchange is carried out between the radiator 3 and the MOS tube 2, the radiator 3 carries heat into the water of the internal circulation, the second heat exchange is carried out in the radiating box 7, the fan 13 carries the heat in the radiating tube 10 to the atmosphere, and the internal heat of the VBE system light emitting plate 101 is carried away through the two heat exchanges. The closed water source is circulated continuously, and continuous heat dissipation of the light emitting plate 101 in the VBE system is completed, so that the board card operates in an optimal temperature range, and the stability of components inside the board card is guaranteed.

In the drawings, the positional relationship is described for illustrative purposes only and is not to be construed as limiting the present patent; it is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A heat sink for a VBE system, comprising: the surface of an MOS tube (2) arranged on a light emission plate (101) is provided with a radiator (3), the radiator (3) is connected in series through a water channel (4), the water channels (4) of three adjacent light emission plates (101) are connected in series, the head and the tail of the water channel (4) respectively form a water inlet pipeline (5) and a water outlet pipeline (6), the bottom of a screen cabinet (1) is provided with a heat dissipation box (7), the water inlet pipeline (5) and the water outlet pipeline (6) penetrate through the bottom of the screen cabinet (1) to enter the heat dissipation box (7) and are respectively connected to a water inlet manifold (8) and a water outlet manifold (9), one end of the water inlet manifold (8) and one end of the water outlet manifold (9) are connected, the other end of the water inlet manifold (8) is connected to an output end (111) of a pump group (11) through a heat dissipation tube (10), and the other end of the water outlet manifold (9) is connected to an input end (112) of the pump group (11) through, the two side box walls of the heat dissipation box (7) are provided with ventilation holes (12), and the front surface of the box wall of the heat dissipation box (7) is provided with a fan (13).

2. The cooling device for a VBE system of claim 1, wherein: the radiator (3) is a metal patch or a heat conduction silica gel sheet.

3. The cooling device for a VBE system of claim 1 or claim 2, wherein: and a continuous S-shaped water channel is adopted in the radiator (3).

4. The cooling device for a VBE system of claim 1, wherein: and insulating glue is coated on the outer surface of the radiator (3).

5. The cooling device for a VBE system of claim 1, wherein: the radiating pipe (10) is a finned coil pipe or a copper coil pipe.

6. The cooling device for a VBE system of claim 1, wherein: the pump set (11) comprises at least two water pumps, the output ends of the two water pumps are connected in parallel and then connected to the water inlet collecting pipe (8), and the input ends of the two water pumps are connected in parallel and then connected to the water outlet collecting pipe (9).

7. The cooling device for a VBE system of claim 1, wherein: at least two fans (13) are arranged.