CN211457538U

CN211457538U - Multilayer interconnected FPC

Info

Publication number: CN211457538U
Application number: CN202020026636.4U
Authority: CN
Inventors: 胡可; 胡高强; 张千; 胡潇然; 向勇
Original assignee: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY CO LTD; University of Electronic Science and Technology of China
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd; University of Electronic Science and Technology of China
Priority date: 2020-01-07
Filing date: 2020-01-07
Publication date: 2020-09-08
Anticipated expiration: 2030-01-07

Abstract

The utility model discloses a FPC aims at providing a simple structure, material utilization rate height, stable performance's multilayer interconnection FPC. The utility model comprises a main FPC and an auxiliary FPC, wherein the main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area; a plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area, a plurality of main input bonding pads connected with the main FPC circuit are arranged in the main input area, a plurality of auxiliary output bonding pads connected with the auxiliary FPC circuit and corresponding to the main input bonding pads one by one are arranged in the auxiliary output area, and a plurality of auxiliary input bonding pads connected with the auxiliary FPC circuit and corresponding to the main output bonding pads one by one are arranged in the auxiliary input area; the auxiliary input bonding pad is welded on the main output bonding pad, and the auxiliary output bonding pad is welded on the main input bonding pad. The utility model discloses be applied to the technical field of FPC production.

Description

Multilayer interconnected FPC

Technical Field

The utility model relates to a technical field of flexible circuit board, in particular to multilayer interconnection FPC.

Background

Multilayer FPC boards have multiple wiring layers with an insulating layer between two adjacent wiring layers, and multilayer circuit boards generally have at least three conductive layers, two of which are on the outer surface and the remaining one incorporated in an insulating board, and the electrical connection between them is usually made by plated through holes in the cross section of the circuit board. For some multi-layer FPCs, the number of the wires in a certain conductive layer is small, so that the practical use area of the layer is small, the material utilization rate is low, and great material waste is caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a simple structure, material utilization rate height, stable performance's multilayer interconnection FPC.

The utility model adopts the technical proposal that: the multilayer interconnected FPC comprises a main FPC and an auxiliary FPC, wherein the main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area; a plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area, a plurality of main input bonding pads connected with the main FPC circuit are arranged in the main input area, a plurality of auxiliary output bonding pads connected with the auxiliary FPC circuit and corresponding to the main input bonding pads one by one are arranged in the auxiliary output area, and a plurality of auxiliary input bonding pads connected with the auxiliary FPC circuit and corresponding to the main output bonding pads one by one are arranged in the auxiliary input area; the auxiliary input bonding pad is welded on the main output bonding pad, and the auxiliary output bonding pad is welded on the main input bonding pad.

Furthermore, the auxiliary output bonding pad and the auxiliary input bonding pad are both provided with tin-conducting through holes, and the tin-conducting through holes are communicated with the upper surface and the lower surface of the auxiliary FPC.

Further, a plurality of the main output pads are uniformly or non-uniformly distributed in the main output area.

Further, a plurality of the main input pads are uniformly or non-uniformly distributed in the main input area.

Furthermore, at least one exhaust hole is formed in the main output area and the main input area, and the exhaust holes are communicated with the upper surface and the lower surface of the main FPC; or the auxiliary output area and the auxiliary input area are both provided with at least one exhaust hole, and the exhaust holes are communicated with the upper surface and the lower surface of the auxiliary FPC.

Furthermore, a plurality of main output test pads are uniformly arranged at the edge of the main output area, and auxiliary input test pads corresponding to the main output test pads one to one are uniformly arranged at the edge of the auxiliary input area; the utility model discloses a tin-conducting wire, including main FPC, auxiliary input test pad, main output test pad, auxiliary FPC, auxiliary input test pad, lead the tin via hole, be equipped with a plurality of on the main FPC respectively with a plurality of the main output test circuit that main output test pad is connected, be equipped with a plurality of on the auxiliary FPC respectively with a plurality of the auxiliary input test circuit that auxiliary input test pad is connected, main output test circuit with main FPC circuit is not connected, auxiliary input test circuit with auxiliary FPC circuit is disconnected, on the main output test pad with auxiliary input test pad is also equipped with lead the tin via hole, main output test pad with auxiliary input test pad welds together.

Furthermore, a plurality of main input test pads are uniformly arranged at the edge of the main input area, and auxiliary output test pads corresponding to the main input test pads one to one are uniformly arranged at the edge of the auxiliary output area; the utility model discloses a tin-conducting wire, including main FPC, auxiliary output test pad, lead the tin via hole, be equipped with on the main FPC a plurality of respectively with a plurality of main input test circuit that main input test pad is connected, be equipped with a plurality of on the auxiliary FPC respectively with a plurality of auxiliary output test circuit that auxiliary output test pad is connected, main input test circuit with main FPC circuit is not connected, auxiliary output test circuit with auxiliary FPC circuit is not connected, on the main input test pad with auxiliary output test pad is also equipped with lead the tin via hole, main input test pad with auxiliary output test pad welds together.

Further, the tin-conducting through hole is an elliptical hole or a cross-shaped hole.

Furthermore, a metal layer is plated in the tin guide through hole, the metal layer of the tin guide through hole on the auxiliary output bonding pad is connected with the auxiliary output bonding pad, and the metal layer of the tin guide through hole on the auxiliary input bonding pad is connected with the auxiliary input bonding pad.

Furthermore, soldering tin is melted into the tin guide through hole, the main input pad is communicated with the auxiliary output pad through the soldering tin, and the main output pad is communicated with the auxiliary input pad through the soldering tin.

Further, tin or gold is plated in the tin conducting through holes, the main FPC is a single-layer or multi-layer FPC, and the auxiliary FPC is a single-layer or multi-layer FPC; and a double-sided adhesive tape is arranged between the main FPC and the auxiliary FPC.

The utility model has the advantages that: the utility model adopts the welding design of the main FPC and the auxiliary FPC, and comprises the main FPC and the auxiliary FPC, the main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area; a plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area, a plurality of main input bonding pads connected with the main FPC circuit are arranged in the main input area, a plurality of auxiliary output bonding pads connected with the auxiliary FPC circuit and corresponding to the main input bonding pads one by one are arranged in the auxiliary output area, and a plurality of auxiliary input bonding pads connected with the auxiliary FPC circuit and corresponding to the main output bonding pads one by one are arranged in the auxiliary input area; assist the welding of input pad on the main output pad, assist the welding of output pad on the main input pad, so, the utility model discloses simple structure avoids the material of simple circuit use whole face, for traditional multilayer FPC, the utility model discloses a material utilization rate is high, and the performance is more stable.

Drawings

Fig. 1 is a schematic structural view of the main FPC;

fig. 2 is a schematic view of the structure of the auxiliary FPC;

FIG. 3 is an enlarged view at A of FIG. 2;

FIG. 4 is a schematic structural view of the multi-layer interconnected FPC of the present invention;

fig. 5 is a schematic structural view of the main FPC1 and the auxiliary FPC2 when they are not yet soldered;

fig. 6 is a schematic view of the structure when the main FPC1 and the auxiliary FPC2 have been soldered.

Detailed Description

As shown in fig. 1 to 4, in the present embodiment, the multilayer interconnection FPC includes a main FPC1 and an auxiliary FPC2, the main FPC1 is provided with a main output region 3 and a main input region 4, and the auxiliary FPC2 is provided with an auxiliary output region 5 and an auxiliary input region 6; a plurality of main output pads 7 which are in circuit connection with the main FPC1 are arranged in the main output area 3, a plurality of main input pads 8 which are in circuit connection with the main FPC1 are arranged in the main input area 4, a plurality of auxiliary output pads 9 which are in circuit connection with the auxiliary FPC2 and in one-to-one correspondence with the main input pads 8 are arranged in the auxiliary output area 5, and a plurality of auxiliary input pads 10 which are in circuit connection with the auxiliary FPC2 and in one-to-one correspondence with the main output pads 7 are arranged in the auxiliary input area 6; assist input pad 10 welding and be in on the main output pad 7, assist output pad 9 welding and be in on the main input pad 8, thereby the utility model provides a circuit passes through assist FPC2 intercommunication. The utility model discloses simple structure can avoid simple circuit to use the material of the whole face, for traditional multilayer FPC, the utility model discloses a material utilization rate is high, and the performance is more stable.

In this embodiment, the auxiliary output pad 9 and the auxiliary input pad 10 are both provided with a tin conducting via 11, and the tin conducting via 11 conducts the upper and lower surfaces of the auxiliary FPC 2. Through lead the design of tin via hole 11, enable assist output pad 9 with between the main input pad 8 and assist input pad 10 with weld more firmly between the main output pad 7, the contact is more abundant, can not produce phenomenons such as contact failure.

In this embodiment, a plurality of the primary output pads 7 are uniformly or non-uniformly distributed in the primary output region 3. Since the plurality of main output bonding pads 7 are not linearly distributed, more main output bonding pads 7 can be arranged in the main output area 3, and more requirements are met.

In this embodiment, a plurality of the primary input pads 8 are distributed in a two-dimensional matrix in the primary input area 4. Because a plurality of the main input pads 8 are distributed in a two-dimensional matrix, more main input pads 8 can be arranged in the main input area 4, and more requirements are met.

In this embodiment, at least one vent hole 19 is formed on both the main output area 3 and the main input area 4, and the vent hole 19 conducts the upper and lower surfaces of the main FPC 1; or the auxiliary output area 5 and the auxiliary input area 6 are both provided with at least one vent hole 19, and the vent holes 19 conduct the upper surface and the lower surface of the auxiliary FPC 2. The utility model discloses a reflow soldering's welding mode, reflow soldering make tin melt from the surface to the inside hot-blast messenger, and the surface melts the inside air of back and passes through exhaust hole 19 is discharged to can not produce the rosin joint, the design size in exhaust hole 19's aperture is 0.05-0.2mm, best 0.1 mm. The utility model discloses simple structure avoids simple circuit to use the material of whole page, for traditional multilayer FPC, the utility model discloses a material utilization rate is high, and can effectively prevent the rosin joint through exhaust hole with air escape when the welding, can also accelerate soldering tin inflow speed, and the soldering tin volume is sufficient, and welding performance is stable, and the product quality is high.

In this embodiment, a plurality of main output test pads 12 are uniformly arranged at the edge of the main output area 3, and auxiliary input test pads 13 corresponding to the main output test pads 12 one to one are uniformly arranged at the edge of the auxiliary input area 6; be equipped with on the main FPC1 a plurality of respectively with a plurality of the main output test circuit that main output test pad 12 is connected, be equipped with on the assistance FPC2 a plurality of respectively with a plurality of assist the input test circuit of assisting that input test pad 13 is connected, main output test circuit with main FPC1 circuit is disconnected, assist the input test circuit with assist FPC2 circuit and do not throw out, on the main output test pad 12 with assist also to be equipped with on the input test pad 13 lead tin via hole 11, main output test pad 12 with assist the welding of input test pad 13 and be in the same place.

In this embodiment, a plurality of main input test pads 14 are uniformly arranged at the edge of the main input area 4, and auxiliary output test pads 15 corresponding to the main input test pads 14 one to one are uniformly arranged at the edge of the auxiliary output area 5; be equipped with on the main FPC1 a plurality of respectively with a plurality of the main input test circuit that main input test pad 14 is connected, be equipped with on the assistance FPC2 a plurality of respectively with a plurality of assist the supplementary output test circuit that output test pad 15 is connected, main input test circuit with main FPC1 circuit is disconnected, assist output test circuit with assist FPC2 circuit and do not throw out, on the main input test pad 14 with assist also to be equipped with on the output test pad 15 lead tin via hole 11, main input test pad 14 with assist the welding of output test pad 15 and be in the same place.

In this embodiment, the tin-conducting via 11 is an elliptical hole or a cross-shaped hole. Lead tin via hole 11 and vacate more tin channels through establishing to oval hole or cross shape hole, the pad that enables to have certain area for soldering tin can smoothly flow in lead in the tin via hole 11, can effectively avoid rosin joint, welding inadequately and other bad phenomena.

In this embodiment, a metal layer 16 is plated in the tin-conducting via hole 11, the metal layer 16 of the tin-conducting via hole 11 on the auxiliary output pad 9 is connected to the auxiliary output pad 9, and the metal layer 16 of the tin-conducting via hole 11 on the auxiliary input pad 10 is connected to the auxiliary input pad 10.

In this embodiment, a solder 17 is melted into the solder via 11, the main input pad 8 and the auxiliary output pad 9 are communicated through the solder 17, and the main output pad 7 and the auxiliary input pad 10 are communicated through the solder 17.

As shown in fig. 5 and 6, in the present embodiment, the main FPC1 and the auxiliary FPC2 are both double-layer FPCs. Be provided with double faced adhesive tape 18 between main FPC1 and the supplementary FPC2, double faced adhesive tape 18 is used for main FPC1 with supplementary FPC2 is fixed in advance, ensures that follow-up welding has higher precision, guarantees the yields. In this embodiment, the main FPC1 and the auxiliary FPC2 each include a base material PI, copper foils are disposed on both surfaces of the base material PI, a coverlay film or green oil is disposed on the surfaces of the copper foils, and the two copper foils of the auxiliary FPC2 are electrically connected by plating gold in the tin conductive vias 11. The main output pad 7 and the main input pad 8 are both connected with the upper copper foil of the main FPC 1. The main FPC1 and the auxiliary FPC2 can achieve the same function as a four-layer FPC board after welding, and a local four-layer FPC structure is formed. For traditional multilayer FPC, the utility model discloses a material utilization is high, and the performance is more stable.

The utility model discloses be applied to flexible circuit board's technical field.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. A multilayer interconnected FPC is characterized in that: the multilayer interconnection FPC comprises a main FPC (1) and an auxiliary FPC (2), wherein a main output area (3) and a main input area (4) are arranged on the main FPC (1), and an auxiliary output area (5) and an auxiliary input area (6) are arranged on the auxiliary FPC (2); a plurality of main output bonding pads (7) which are in circuit connection with the main FPC (1) are arranged in the main output area (3), a plurality of main input bonding pads (8) which are in circuit connection with the main FPC (1) are arranged in the main input area (4), a plurality of auxiliary output bonding pads (9) which are in circuit connection with the auxiliary FPC (2) and are in one-to-one correspondence with the main input bonding pads (8) are arranged in the auxiliary output area (5), and a plurality of auxiliary input bonding pads (10) which are in circuit connection with the auxiliary FPC (2) and are in one-to-one correspondence with the main output bonding pads (7) are arranged in the auxiliary input area (6); the auxiliary input pad (10) is welded on the main output pad (7), and the auxiliary output pad (9) is welded on the main input pad (8).

2. The multilayer interconnected FPC as claimed in claim 1, wherein: and the auxiliary output bonding pad (9) and the auxiliary input bonding pad (10) are respectively provided with a tin guiding through hole (11), and the tin guiding through holes (11) are communicated with the upper surface and the lower surface of the auxiliary FPC (2).

3. The multilayer interconnected FPC as claimed in claim 1, wherein: a plurality of the main output pads (7) are uniformly or non-uniformly distributed in the main output area (3); a plurality of said primary input pads (8) are uniformly or non-uniformly distributed within said primary input area (4).

4. The multilayer interconnected FPC as claimed in claim 1, wherein: at least one exhaust hole (19) is formed in the main output area (3) and the main input area (4), and the exhaust holes (19) are communicated with the upper surface and the lower surface of the main FPC (1); or the auxiliary output area (5) and the auxiliary input area (6) are both provided with at least one exhaust hole (19), and the exhaust holes (19) are communicated with the upper surface and the lower surface of the auxiliary FPC (2).

5. The multilayer interconnected FPC as claimed in claim 2, wherein: a plurality of main output test pads (12) are uniformly arranged at the edge of the main output area (3), and auxiliary input test pads (13) which are in one-to-one correspondence with the main output test pads (12) are uniformly arranged at the edge of the auxiliary input area (6); be equipped with on main FPC (1) a plurality of respectively with a plurality of main output test circuit that main output test pad (12) is connected, be equipped with on assisting FPC (2) a plurality of respectively with a plurality of assist the input test circuit of assisting that input test pad (13) are connected, main output test circuit with main FPC (1) circuit is disconnected from, assist input test circuit with assist FPC (2) circuit and throw out of gear, main output test pad (12) go up with assist also to be equipped with on input test pad (13) lead tin via hole (11), main output test pad (12) with assist input test pad (13) welding together.

6. The multilayer interconnected FPC as claimed in claim 2, wherein: a plurality of main input test pads (14) are uniformly arranged at the edge of the main input area (4), and auxiliary output test pads (15) which are in one-to-one correspondence with the main input test pads (14) are uniformly arranged at the edge of the auxiliary output area (5); the main FPC (1) is provided with a plurality of main input test circuits which are respectively connected with a plurality of main input test pads (14), the auxiliary FPC (2) is provided with a plurality of auxiliary output test circuits which are respectively connected with a plurality of auxiliary output test pads (15), the main input test circuit is not connected with the main FPC (1) circuit, and the auxiliary output test circuit is not connected with the auxiliary FPC (2) circuit; the main input testing pad (14) and the auxiliary output testing pad (15) are also provided with the tin guiding through hole (11), and the main input testing pad (14) and the auxiliary output testing pad (15) are welded together.

7. The multilayer interconnected FPC as claimed in claim 2, wherein: the tin-conducting through hole (11) is an elliptical hole or a cross-shaped hole.

8. The multilayer interconnected FPC as claimed in claim 2 or 7, wherein: a metal layer (16) is plated in the tin guiding through hole (11), the metal layer (16) of the tin guiding through hole (11) on the auxiliary output bonding pad (9) is connected with the auxiliary output bonding pad (9), and the metal layer (16) of the tin guiding through hole (11) on the auxiliary input bonding pad (10) is connected with the auxiliary input bonding pad (10).

9. The multilayer interconnected FPC as claimed in claim 8, wherein: lead and fuse tin (17) in tin via hole (11), main input pad (8) with assist output pad (9) and pass through soldering tin (17) intercommunication, main output pad (7) with assist input pad (10) and pass through soldering tin (17) intercommunication.

10. The multilayer interconnected FPC as claimed in claim 8, wherein: the tin conducting through holes (11) are plated with tin or gold; the main FPC (1) is a single-layer or multi-layer FPC, and the auxiliary FPC (2) is a single-layer or multi-layer FPC; a double-sided adhesive tape (18) is arranged between the main FPC (1) and the auxiliary FPC (2).