CN211457521U - Thickening type flexible plate structure - Google Patents
Thickening type flexible plate structure Download PDFInfo
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- CN211457521U CN211457521U CN202020322317.8U CN202020322317U CN211457521U CN 211457521 U CN211457521 U CN 211457521U CN 202020322317 U CN202020322317 U CN 202020322317U CN 211457521 U CN211457521 U CN 211457521U
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Abstract
The utility model discloses a thickening flexible board structure, including the thickening flexible circuit board structure that first flexible board layer and second flexible board layer are constituteed, first flexible board layer and second flexible board layer are respectively by copper layer and polyimide layer composition, and polyimide layer in first flexible board layer and the second flexible board layer is the concatenation each other, and is provided with the thick glue film between two polyimide layers, the utility model provides a thickening flexible board structure, the utility model discloses can effectively realize the thickening of the flexible board that thickness exceeds 0.26mm and make; by designing the thick glue layer and adopting the filling and restraining effects of the soft glue layer and the hard glue layer of the covering film, the problems of glue overflow in pressing, sliding plate pressing, layer offset, poor glue filling and the like can be effectively avoided, and the flexible plate manufactured by adopting the method has high manufacturing efficiency, low cost and good reliability; the utility model discloses can realize the preparation of the local flexonics of sunkening (or drop), make the flexonics can be applied to in more scenes.
Description
Technical Field
The utility model relates to a flexible circuit board technical field specifically is a thickening type flexible plate structure.
Background
The following problems exist for manufacturing a double-sided flexible circuit board with a thicker thickness (the thickness is more than 0.26 mm):
1. generally, a soft board copper-clad plate with thicker thickness is not available, so that the requirement of raw materials (copper-clad plate) of a thicker flexible board cannot be met, and if the soft board base material is required to be manufactured, the soft board base material needs to be customized, so that the raw materials of the flexible board have higher cost and longer time;
2. the thickness is thicker, so that the problems of excessive glue lamination, slide plate lamination, layer offset, poor glue filling and the like are more easily caused.
To solve the above problems, a novel structure needs to be designed to meet the manufacturing requirements of a thick flexible board, and therefore, the inventor synthesizes various factors to provide a thickened flexible board structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thickening type flexible sheet structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a thickened flexible board structure comprises a thickened flexible circuit board structure consisting of a first flexible board layer and a second flexible board layer, wherein the first flexible board layer and the second flexible board layer respectively consist of a copper layer and a polyimide layer, the polyimide layers in the first flexible board layer and the second flexible board layer are mutually overlapped, a thick glue layer is arranged between the two polyimide layers, the first flexible board layer and the second flexible board layer are bonded through the thick glue layer to form a thickened flexible board main body structure, and a covering film layer is arranged on the outer side of the copper layer of the thickened flexible board main body structure;
as a further aspect of the present invention: a covering film adhesive layer is arranged between the covering film layer and the copper layer, and the covering film layer is bonded to the outer side of the copper layer through the covering film adhesive layer;
as a further aspect of the present invention: the cover film glue layer comprises a cover film soft glue layer with higher glue content and a cover film hard glue layer with lower glue content, and the cover film soft glue layer is positioned on the inner side of the cover film and is bonded with the copper layer;
as a further aspect of the present invention: the thickened flexible circuit board structure is locally provided with a single-side windowing type concave structure, and the single-side concave structure extends from the outside of one side to penetrate through the thick glue layer to the surface of the copper layer on the other side to increase local flexibility;
as a further aspect of the present invention: the thickened flexible circuit board structure is locally provided with a middle necking type sunken structure, the middle necking type sunken structure is formed by cutting off a local thick glue layer, and the first flexible board layer and the second flexible board layer on the outer side are extruded, overlapped and bonded to the cut-off position of the middle thick glue layer, so that local flexibility is increased;
compared with the prior art, the utility model discloses the beneficial effect of following several aspects has:
the utility model provides a thickened flexible plate structure, which can effectively realize the thickening and the manufacturing of the flexible plate with the thickness exceeding 0.26 mm; by designing the thick glue layer and adopting the filling and restraining effects of the soft glue layer and the hard glue layer of the covering film, the problems of glue overflow in pressing, sliding plate pressing, layer offset, poor glue filling and the like can be effectively avoided, and the flexible plate manufactured by adopting the method has high manufacturing efficiency, low cost and good reliability; the utility model discloses can realize the preparation of the local flexonics of sunkening (or drop), make the flexonics can be applied to in more scenes.
Drawings
Fig. 1 is a schematic structural diagram of a thickened flexible board structure.
Fig. 2 is a schematic view of a single-sided window-opening type recess structure in a thickened flexible board structure.
FIG. 3 is a schematic diagram of a middle necking-type recess structure in a thickened flexible board structure.
In the figure: 1. covering the film layer; 2. covering a hard glue layer with a film; 3. covering the film with a soft adhesive layer; 4. a copper layer; 5. a polyimide layer; 6. a thick glue layer.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1-3, a thickened flexible board structure includes a thickened flexible circuit board structure composed of a first flexible board layer and a second flexible board layer, where the first flexible board layer and the second flexible board layer are respectively composed of a copper layer 4 and a polyimide layer 5, the polyimide layers 5 in the first flexible board layer and the second flexible board layer are overlapped with each other, and a thick glue layer 6 is disposed between the two polyimide layers 5, the first flexible board layer and the second flexible board layer are bonded through the thick glue layer 6 to form a thickened flexible board main body structure, and a covering film layer 1 is disposed on the outer side of the copper layer 4 of the thickened flexible board main body structure; a covering film layer is arranged between the covering film layer 1 and the copper layer 4, and the covering film layer 1 is bonded to the outer side of the copper layer 4 through the covering film layer; the covering film glue layer comprises a covering film soft glue layer 3 with high glue content and a covering film hard glue layer 2 with low glue content, and the covering film soft glue layer 3 is positioned on the inner side and is bonded with a copper layer 4; the thickened flexible circuit board structure is locally provided with a single-side windowing type concave structure, and the single-side concave structure extends from the outside of one side to penetrate through the thick glue layer 6 to the surface of the copper layer 4 on the other side to increase local flexibility; the thickened flexible circuit board structure is locally provided with a middle necking type sunken structure, the middle necking type sunken structure is formed by cutting off a local thick glue layer 6, and a first flexible board layer and a second flexible board layer on the outer sides are extruded and overlapped to the cut-off position of the middle thick glue layer 6, so that local flexibility is increased;
the utility model discloses a theory of operation is: the utility model provides a thickened flexible plate structure, which can effectively realize the thickening and the manufacturing of the flexible plate with the thickness exceeding 0.26 mm; by designing the thick glue layer and adopting the filling and restraining effects of the soft glue layer and the hard glue layer of the covering film, the problems of glue overflow in pressing, sliding plate pressing, layer offset, poor glue filling and the like can be effectively avoided, and the flexible plate manufactured by adopting the method has high manufacturing efficiency, low cost and good reliability; the utility model discloses can realize the preparation of the local flexonics of sunkening (or drop), make the flexonics can be applied to in more scenes.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (5)
1. The utility model provides a thickening type flexible board structure, includes the thickening type flexible circuit board structure that first flexible board layer and second flexible board layer are constituteed, its characterized in that, first flexible board layer and second flexible board layer comprise copper layer (4) and polyimide layer (5) respectively, polyimide layer (5) in first flexible board layer and the second flexible board layer overlap joint each other to be provided with thick glue layer (6) between two polyimide layers (5), first flexible board layer and second flexible board layer bond through thick glue layer (6), constitute thickening type flexible board major structure, copper layer (4) the outside of thickening type flexible board major structure is provided with cover rete (1).
2. A thickened flexible board structure according to claim 1, characterized in that a cover film glue layer is arranged between the cover film layer (1) and the copper layer (4), and the cover film layer (1) is bonded to the outer side of the copper layer (4) through the cover film glue layer.
3. A thickening flexible board structure according to claim 2, wherein said cover film glue layers comprise a cover film soft glue layer (3) with a higher glue content and a cover film hard glue layer (2) with a lower glue content, and said cover film soft glue layer (3) is located on the inner side of the bonding copper layer (4).
4. The thickened flexible circuit board structure as claimed in any one of claims 1-3, wherein a single-sided windowing recessed structure is partially disposed on the thickened flexible circuit board structure, and the single-sided recessed structure extends from one side to the other side of the copper layer (4) from the outside through the thick adhesive layer (6).
5. The thickened flexible circuit board structure as claimed in any one of claims 1-3, wherein the thickened flexible circuit board structure is locally provided with a middle necking-type concave structure, the middle necking-type concave structure is formed by breaking a local thick glue layer (6), and the first flexible sheet material layer and the second flexible sheet material layer on the outer side are extruded, overlapped and bonded towards the breaking position of the middle thick glue layer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020322317.8U CN211457521U (en) | 2020-03-16 | 2020-03-16 | Thickening type flexible plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020322317.8U CN211457521U (en) | 2020-03-16 | 2020-03-16 | Thickening type flexible plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211457521U true CN211457521U (en) | 2020-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020322317.8U Active CN211457521U (en) | 2020-03-16 | 2020-03-16 | Thickening type flexible plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211457521U (en) |
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2020
- 2020-03-16 CN CN202020322317.8U patent/CN211457521U/en active Active
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