CN211436878U

CN211436878U - Glue baking machine

Info

Publication number: CN211436878U
Application number: CN201922275912.0U
Authority: CN
Inventors: 林彬; 穆俊宏; 奉建华; 王文君; 蔡星周; 张继华
Original assignee: Chengdu Maike Technology Co ltd
Current assignee: Chengdu Maike Technology Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-09-08
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses a glue baking machine, which comprises a base, wherein a motor and a heat preservation shell are fixedly arranged on the base, the motor is vertically arranged, a main shaft of the motor is connected with a horizontal turntable, a plurality of wafer positioning grooves are arranged on the turntable, and the plurality of wafer positioning grooves are uniformly distributed in a circumferential manner around the center of the turntable; the inner cavity of the heat preservation shell is divided into a preheating cavity, a heating cavity and a precooling cavity by a vertical partition plate, and a heating assembly is arranged in the heating cavity; the rotary plate is partially positioned in the heat-insulating shell, partially positioned outside the heat-insulating shell, and wafer positioning grooves are formed in the preheating cavity, the heating cavity and the precooling cavity. The heating chamber does not need to be opened manually by the glue baking machine, the use is more convenient, the motor drives the turntable to rotate continuously, continuous glue baking can be realized, the production efficiency is improved, and the mass and large-scale production is facilitated.

Description

Glue baking machine

Technical Field

The utility model relates to a wafer production facility field, concretely relates to roast machine of gluing.

Background

After the surface of the wafer is coated with the glue layer, a baking machine is generally used to bake the wafer in order to achieve rapid drying of the glue layer. The existing glue baking machine is closed, namely the heating panel is positioned in a closed heating cavity, during use, the heating cavity is opened, the wafer is horizontally placed on the heating panel, and the wafer is heated in an electric heating mode to promote the rapid drying and curing of the glue layer. The heating cavity of the glue baking machine is closed, so that the heat utilization rate can be improved, the energy consumption is relatively low, the glue baking machine can only bake a specific number of wafers at each time, the heating cavity needs to be opened manually, the wafers are placed in the heating cavity, the heating cavity is opened, and the wafers are taken out, the efficiency is low, and the glue baking machine is not beneficial to realizing large-scale and continuous production.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a can realize continuous production in order to improve work efficiency's machine of glue baking is provided.

The utility model provides a technical scheme that technical problem adopted is: the glue baking machine comprises a base, wherein a motor and a heat preservation shell are fixedly arranged on the base, the motor is vertically arranged, a main shaft of the motor is connected with a horizontal turntable, a plurality of wafer positioning grooves are formed in the turntable, and the wafer positioning grooves are uniformly distributed in a circumferential manner around the center of the turntable; the inner cavity of the heat preservation shell is divided into a preheating cavity, a heating cavity and a precooling cavity by a vertical partition plate, and a heating assembly is arranged in the heating cavity; the rotary plate is partially positioned in the heat-insulating shell, partially positioned outside the heat-insulating shell, and wafer positioning grooves are formed in the preheating cavity, the heating cavity and the precooling cavity.

Further, the heating assembly is a heating substrate.

Further, the carousel is thermal-insulated carousel, be provided with a plurality of through-holes on the thermal-insulated carousel, the lower extreme drill way of through-hole is provided with the heat-conducting plate, the wafer constant head tank is constituteed with the through-hole to the heat-conducting plate.

Further, the partition board is made of heat insulation materials.

Further, a sealing structure is arranged in a connecting gap between the rotary disc and the heat preservation shell.

Furthermore, the part of the turntable, which is positioned outside the heat-insulating shell, is provided with two wafer positioning grooves, and a plurality of waste heat cavities are also separated from the inner cavity of the heat-insulating shell by partition plates.

Furthermore, a charging station and an unloading station are arranged outside the heat preservation shell, a charging mechanism is arranged at the charging station, and an unloading mechanism is arranged at the unloading station.

Further, the tank bottom of every wafer positioning groove all is provided with the loading and unloading through-hole, charging mechanism and shedding mechanism all include a ejector pin, a supporting cylinder and a horizontally transmission arm, the vertical setting of ejector pin, and the lower extreme of ejector pin is connected with a lift actuating mechanism, the supporting cylinder is located the top of ejector pin, and the loading and unloading through-hole that is located the ejector pin of charging station, supporting cylinder, wafer positioning groove is coaxial, and the loading and unloading through-hole that is located the ejector pin of shedding station, supporting cylinder, wafer positioning groove is coaxial, the lateral wall of supporting cylinder is provided with the separation breach that extends to terminal surface down from the supporting cylinder up end, the width of separation breach is greater than the diameter of ejector pin, supporting cylinder and transmission arm fixed connection, transmission arm are connected with a rotation actuating mechanism.

Furthermore, the ejector rod is a hollow rod, a wafer detector is arranged in the top of the ejector rod, the wafer detector is connected with a controller, and the lifting driving mechanism and the rotating driving mechanism are both electrically connected with the controller.

Further, lifting drive is linear motor, rotate actuating mechanism including rotating driving motor and reduction gear, it links to each other with the reduction gear to rotate driving motor, the reduction gear is connected with a vertical pivot, pivot and transmission arm fixed connection.

Compared with the prior art, the beneficial effects of the utility model are that: the heating chamber does not need to be opened manually by the glue baking machine, the use is more convenient, the motor drives the turntable to rotate continuously, continuous glue baking can be realized, the production efficiency is improved, and the mass and large-scale production is facilitated.

Drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic cross-sectional view of A-A of FIG. 1;

FIG. 3 is a schematic top cross-sectional view of an insulated housing;

FIG. 4 is a schematic view of the support cylinder moving over the lift pins;

reference numerals: 1-a base; 2, a motor; 3, a heat preservation shell; 4, rotating the disc; 5-positioning the wafer; 6, preheating a cavity; 7, heating the cavity; 8, a pre-cooling cavity; 9-a heating assembly; 10-a through hole; 11-a heat-conducting plate; 12-a separator; 13-a sealing structure; 14-loading and unloading through holes; 15-a mandril; 16-a support cylinder; 17-a transfer arm; 18-a lifting drive mechanism; 19-separation gap; 20-a rotational drive mechanism; 21-a waste heat cavity; 22-wafer prober; 23-controller.

Detailed Description

The present invention will be further explained with reference to the drawings and examples.

The utility model discloses a glue baking machine, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, including base 1, motor 2 and heat preservation shell 3 are fixedly arranged on base 1, motor 2 is vertically arranged, and the main shaft of motor 2 is connected with horizontal carousel 4, a plurality of wafer positioning slots 5 are arranged on carousel 4, and a plurality of wafer positioning slots 5 are uniformly distributed in a circumferential shape around the center of carousel 4; the inner cavity of the heat preservation shell 3 is divided into a preheating cavity 6, a heating cavity 7 and a precooling cavity 8 by a vertical partition plate 12, and a heating assembly 9 is arranged in the heating cavity 7; the turntable 4 is partially positioned in the heat-insulating shell 3, partially positioned outside the heat-insulating shell 3, and is provided with a wafer positioning groove 5 in each of the preheating cavity 6, the heating cavity 7 and the pre-cooling cavity 8.

The heat preservation shell 3 directly adopts insulation material, also can play thermal-insulated effect at metal casing outside cladding insulation material to reduce heat loss, improve the heat utilization ratio. The rotary table 4 is used for transmitting wafers, the wafers to be dried are placed in the wafer positioning grooves 5 outside the heat preservation shell 3, then the rotary table 4 is driven by the motor 2 to rotate, the wafers can be transported into the heat preservation shell 3, meanwhile, the dried wafers can be transported out of the heat preservation shell 3 from the heat preservation shell 3, continuous baking is achieved, and the working efficiency is improved.

In order to ensure the smooth rotation of the turntable 4, the turntable 4 and the heat-insulating shell 3 are difficult to be completely sealed and are not beneficial to heat insulation, therefore, the inner cavity of the heat-insulating shell 3 is divided into a preheating cavity 6, a heating cavity 7 and a pre-cooling cavity 8, only the heating cavity 7 is provided with a heating assembly 9, a small amount of heat in the heating cavity 7 enters the preheating cavity 6 and the pre-cooling cavity 8, the preheating cavity 6 can preheat wafers, the pre-cooling cavity 8 can pre-cool the wafers, so that the heat is more fully utilized, the heat loss is reduced, and the heat in the heating cavity 7 is prevented from being directly emptied and lost.

The heating assembly 9 may be various common electric heating structures such as an electric heating wire, and preferably, the heating assembly 9 is a heating substrate. The wafer is generally rectangular sheet-shaped, and the heating assembly 9 adopts a horizontal heating substrate, so that the wafer can be uniformly heated, and the drying efficiency is ensured.

The rotating disc 4 can be a metal rotating disc, preferably, the rotating disc 4 is a heat insulation rotating disc, and particularly can be made of high-temperature-resistant heat insulation materials such as ceramic materials. The heat-insulating rotary table is provided with a plurality of through holes 10, a heat-conducting plate 11 is arranged at the lower end orifice of each through hole 10, and the heat-conducting plate 11 and the through holes 10 form a wafer positioning groove 5. The heat conducting plate 11 can be made of copper plate and other materials with high heat conductivity coefficient, the thickness is not too large, and the thickness is about 1mm, so that the heat transfer rate is ensured. The heat-conducting plate 11 can imbed the 4 lower surfaces of carousel, and the lower surface of heat-conducting plate 11 flushes with the lower surface of carousel 4, guarantees that the upper and lower surface of carousel 4 levels smoothly to be favorable to improving the sealed between carousel 4 and the heat preservation shell 3.

The partition plate 12 can be made of metal plates and the like, and preferably, the partition plate 12 is made of heat insulation materials, so that heat loss in the heating cavity 7 is reduced, and energy consumption is reduced.

In order to further improve the heat preservation effect, a sealing structure 13 is arranged in a connecting gap between the rotating disc 4 and the heat preservation shell 3. The sealing structure 13 can be a flexible metal seal, which can play a role in sealing and reduce the rotation resistance of the rotary table 4.

The part of the turntable 4 outside the heat preservation shell 3 is provided with two wafer positioning grooves 5, one wafer positioning groove 5 can be used for accommodating a wafer, and the other wafer positioning groove 5 is used for taking out the wafer. The inner cavity of the heat-insulating shell 3 is also divided into a plurality of waste heat cavities 21 by the partition plates 12, so that more inner cavities are separated, the distance from the heating cavity 7 to the two ends of the heat-insulating shell 3 is increased, the heat dissipation speed can be further reduced, and the heat loss is reduced.

In order to realize automatic loading and unloading of the wafers, a loading station and an unloading station are arranged outside the heat preservation shell 3, a loading mechanism is arranged at the loading station, and an unloading mechanism is arranged at the unloading station.

Specifically, the tank bottom of every wafer positioning groove 5 all is provided with loading and unloading through-hole 14, charging mechanism and shedding mechanism all include a ejector pin 15, a supporting cylinder 16 and a horizontally transmission arm 17, the vertical setting of ejector pin 15, and the lower extreme of ejector pin 15 is connected with a lift actuating mechanism 18, supporting cylinder 16 is located the top of ejector pin 15, and the loading and unloading through-hole 14 that is located loading station's ejector pin 15, supporting cylinder 16, wafer positioning groove 5 is coaxial, and the loading and unloading through-hole 14 that is located unloading station's ejector pin 15, supporting cylinder 16, wafer positioning groove 5 is coaxial, supporting cylinder 16's lateral wall is provided with the separation breach 19 that extends to the lower terminal surface from supporting cylinder 16 up end, the width of separation breach 19 is greater than the diameter of ejector pin 15, supporting cylinder 16 and transmission arm 17 fixed connection, transmission arm 17 is connected with a rotation actuating mechanism 20.

The supporting cylinder 16 and the ejector rod 15 can both support the wafer through the upper end face of the supporting cylinder, the area of the upper end face of the supporting cylinder 16 is slightly smaller than that of the wafer, the supporting cylinder 16 is a thin-walled tube, the thickness of the supporting cylinder is below 1mm, and the ejector rod 15 can be in clearance fit with the supporting cylinder 16. The charging process comprises the following steps: the wafer after the glue spreading machine is placed on the upper end surface of the supporting cylinder 16, the rotation driving mechanism 20 drives the transmission arm 17 to rotate for a certain angle, so that the transmission arm 17 conveys the wafer to the loading station, at the moment, the lifting driving mechanism 18 of the loading station drives the ejector rod 15 to move upwards, the ejector rod 15 penetrates through the loading and unloading through hole 14 of the wafer positioning groove 5 and the supporting cylinder 16 to jack up the wafer, then the rotation driving mechanism 20 drives the transmission arm 17 to reset, because the separation notch 19 is arranged on the side wall of the supporting cylinder 16, the supporting cylinder 16 is separated from the ejector rod 15 through the separation notch 19, the lifting driving mechanism 18 drives the ejector rod 15 to move downwards to the initial position, the wafer is driven to move downwards, and when the upper end of the ejector rod 15 passes through the loading and unloading through hole 14, the wafer falls on the bottom of the wafer. When unloading, the lifting driving mechanism 18 of the unloading station drives the ejector rod 15 to move upwards, when the upper end of the ejector rod 15 passes through the loading and unloading through hole 14, the wafer in the wafer positioning groove 5 is jacked up, when the ejector rod 15 moves to the highest position of the stroke, the rotating driving mechanism 20 for unloading drives the transmission arm 17 to rotate, the support cylinder 16 is conveyed to the unloading station, the ejector rod 15 enters the support cylinder 16 through the separation notch 19 on the support cylinder 16, then the lifting driving mechanism 18 drives the ejector rod 15 to move downwards to the initial position, the rotating driving mechanism 20 drives the transmission arm 17 to reset, and the dried wafer can be conveyed to the next station.

In order to enable the loading mechanism and the unloading mechanism to automatically and coordinately act, the ejector rod 15 is a hollow rod, a wafer detector 22 is arranged in the top of the ejector rod 15, the wafer detector 22 is connected with a controller 23, and the lifting driving mechanism 18 and the rotating driving mechanism 20 are both electrically connected with the controller 23. The controller 23 may adopt the existing common control elements, such as PLC, etc. The wafer detector 22 may adopt a conventional photoelectric sensor or the like, and is configured to detect whether the wafer reaches a target position, for example, when the wafer after drying moves to the unloading station along with the turntable 4, the wafer detector 22 can detect the wafer and transmit a signal to the controller 23, and the controller controls the lifting driving mechanism 18 of the unloading station to operate, and then controls the rotation driving mechanism 20 to operate, so that the unloading is completed.

The lifting driving mechanism 18 may be a cylinder, etc., preferably, the lifting driving mechanism 18 is a linear motor, the rotation driving mechanism 20 includes a rotation driving motor and a speed reducer, the rotation driving motor is connected to the speed reducer, the speed reducer is connected to a vertical rotating shaft, and the rotating shaft is fixedly connected to the transmission arm 17.

To sum up, the utility model discloses can realize automatic, wafer stoving in succession, improve work efficiency, be favorable to realizing extensive, the production of batchization.

Claims

1. The glue baking machine is characterized by comprising a base (1), wherein a motor (2) and a heat preservation shell (3) are fixedly arranged on the base (1), the motor (2) is vertically arranged, a spindle of the motor (2) is connected with a horizontal turntable (4), a plurality of wafer positioning grooves (5) are formed in the turntable (4), and the wafer positioning grooves (5) are uniformly distributed in a circumferential manner around the center of the turntable (4); the inner cavity of the heat preservation shell (3) is divided into a preheating cavity (6), a heating cavity (7) and a precooling cavity (8) by a vertical partition plate (12), and a heating assembly (9) is arranged in the heating cavity (7); the turntable (4) is partially positioned in the heat-insulating shell (3), partially positioned outside the heat-insulating shell (3), and is provided with a wafer positioning groove (5) in each of the preheating cavity (6), the heating cavity (7) and the precooling cavity (8).

2. Baking machine according to claim 1, characterized in that said heating element (9) is a heating base plate.

3. The glue baking machine according to claim 2, characterized in that the turntable (4) is a heat-insulating turntable, a plurality of through holes (10) are arranged on the heat-insulating turntable, a heat-conducting plate (11) is arranged at the lower end of the through holes (10), and the heat-conducting plate (11) and the through holes (10) form a wafer positioning slot (5).

4. Baking machine according to claim 1, characterized in that said partition (12) is of heat-insulating material.

5. Baking machine according to claim 1, characterized in that a sealing structure (13) is arranged in the connecting gap between the turntable (4) and the thermal insulation shell (3).

6. The machine according to claim 1, wherein the turntable (4) has two wafer positioning slots (5) at the outer portion of the thermal insulation shell (3), and the inner cavity of the thermal insulation shell (3) is further partitioned into a plurality of waste heat cavities (21) by partition plates (12).

7. The glue baking machine according to claim 1, characterized in that a loading station and an unloading station are arranged outside the heat preservation shell (3), a loading mechanism is arranged at the loading station, and an unloading mechanism is arranged at the unloading station.

8. The glue baking machine according to claim 7, characterized in that the bottom of each wafer positioning slot (5) is provided with a loading and unloading through hole (14), the loading mechanism and the unloading mechanism each comprise a top rod (15), a supporting cylinder (16) and a horizontal transmission arm (17), the top rod (15) is vertically arranged, the lower end of the top rod (15) is connected with a lifting driving mechanism (18), the supporting cylinder (16) is positioned above the top rod (15), the top rod (15) of the loading station, the supporting cylinder (16) and the loading and unloading through hole (14) of the wafer positioning slot (5) are coaxial, the top rod (15) of the unloading station, the supporting cylinder (16) and the loading and unloading through hole (14) of the wafer positioning slot (5) are coaxial, the side wall of the supporting cylinder (16) is provided with a separation notch (19) extending from the upper end face to the lower end face of the supporting cylinder (16), the width of separation breach (19) is greater than the diameter of ejector pin (15), a support section of thick bamboo (16) and transmission arm (17) fixed connection, transmission arm (17) are connected with a rotation actuating mechanism (20).

9. The glue baking machine according to claim 8, characterized in that the top rod (15) is a hollow rod, a wafer detector (22) is arranged in the top of the top rod (15), the wafer detector (22) is connected with a controller (23), and the lifting driving mechanism (18) and the rotating driving mechanism (20) are both electrically connected with the controller (23).

10. The glue baking machine according to claim 8, characterized in that the lifting driving mechanism (18) is a linear motor, the rotating driving mechanism (20) comprises a rotating driving motor and a speed reducer, the rotating driving motor is connected with the speed reducer, the speed reducer is connected with a vertical rotating shaft, and the rotating shaft is fixedly connected with the transmission arm (17).