CN211428415U

CN211428415U - High temperature resistant reflow soldering SMA interface

Info

Publication number: CN211428415U
Application number: CN201922335413.6U
Authority: CN
Inventors: 刘萍; 唐亚红; 朱玉勇
Original assignee: Zhenjiang Putian Electronic Co ltd
Current assignee: Zhenjiang Putian Electronic Co ltd
Priority date: 2019-12-24
Filing date: 2019-12-24
Publication date: 2020-09-04
Anticipated expiration: 2029-12-24

Abstract

The utility model discloses a high temperature resistant reflow soldering SMA interface, including the inner conductor and the outer conductor of coaxial setting, form the cavity of setting for the distance between inner conductor and the outer conductor, the one end of outer conductor is oral area and the other end and is the weld part, and the weld part is provided with the welding pin, and one side that is close to the oral area between inner conductor and the outer conductor is provided with one side that is close to the weld part between first insulation medium and inner conductor and the outer conductor and is provided with the second insulation medium, the distance that the interval was set for between first insulation medium and the second insulation medium. The utility model discloses cut apart into 2 to the holistic structure of insulating medium, leave the expansion space in the middle of the two. According to the interface size allowed by the product standard of 0-0.25 mm, a small step is arranged on the end face of the first insulating medium, and the first insulating medium is prevented from directly sliding out of the opening part after being heated. The utility model discloses make the SMA interface when carrying out high temperature reflow soldering, reduce the influence to interface size, realize the reliable contact with the plug.

Description

High temperature resistant reflow soldering SMA interface

Technical Field

The utility model relates to a high temperature resistant reflow soldering SMA interface.

Background

The SMA interface is named as Small A Type, the butt joint of the SMA interface is an SMA plug, the SMA interface of the existing design is shown in figure 1, the SMA plug comprises an inner conductor 1, an insulating medium 2 and an outer conductor 3 which are arranged from inside to outside, wherein the insulating medium 2 is of an integrated structure and is arranged between the inner conductor 1 and the outer conductor 3, the A position must ensure that the interface size of an SMA product is 0-0.25 mm, when high-temperature reflow soldering is carried out, the reflow soldering temperature reaches 220 ℃, the material of the interface can expand along with the temperature rise and protrude from the mouth part, and the interface size is influenced, so that the SMA connector cannot be contacted in place when being matched with the plug.

SUMMERY OF THE UTILITY MODEL

To the problem, the utility model provides a high temperature resistant reflow soldering SMA interface through institutional advancement for the SMA interface reduces the influence to interface size when carrying out high temperature reflow soldering, realizes the reliable contact with the plug.

For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:

the utility model provides a high temperature resistant reflow soldering SMA interface, includes inner conductor and the outer conductor of coaxial setting, form the cavity of setting for the distance between inner conductor and the outer conductor, the one end of outer conductor is oral area and the other end and is the welding part, the welding part is provided with the welding pin, one side that is close to the oral area between inner conductor and the outer conductor is provided with first insulating medium just one side that is close to the welding part between inner conductor and the outer conductor is provided with second insulating medium, the distance that the interval set for between first insulating medium and the second insulating medium.

Preferably, the inner wall of the case of the outer conductor extends inward along the end surface direction of the first insulating medium to form a stepped portion.

Preferably, the first insulating medium and the second insulating medium are both polytetrafluoroethylene media.

Preferably, barbs are respectively arranged between the first insulating medium and the inner conductor and between the first insulating medium and the outer conductor.

Preferably, barbs are respectively arranged between the second insulating medium and the inner conductor and between the second insulating medium and the outer conductor.

Preferably, the number of the pins is 3-6.

Preferably, the number of the pins is 5.

The utility model has the advantages that:

1. the insulating medium material selected for the SMA interface is high-temperature-resistant plastic king-polytetrafluoroethylene, the melting point is 327 ℃, and the SMA interface can work at minus 180 ℃ to plus 250 ℃.

2. The utility model discloses cut apart into 2 to the holistic structure of insulating medium, first insulating medium and second insulating medium promptly, leave the expansion space in the middle of the two.

3. According to the interface size allowed by the product standard of 0-0.25 mm, a small step is arranged on the end face of the first insulating medium, and the first insulating medium is prevented from directly sliding out of the opening part after being heated.

4. 2 small barbs are respectively made on the inner conductor and the outer conductor to firmly grasp the divided insulating medium, so that double insurance is achieved.

To sum up, the utility model discloses make the SMA interface when carrying out high temperature reflow soldering, reduce the influence to interface size, realize the reliable contact with the plug.

Drawings

FIG. 1 is a schematic structural diagram of a high temperature reflow-resistant SMA interface of a prior art design;

fig. 2 is a schematic structural diagram of a high temperature reflow-resistant SMA interface of the present invention;

the reference numerals of the drawings have the following meanings:

1: an inner conductor; 2: an insulating medium; 3: an outer conductor; 4: a pin; 5: an expansion space; 6: a first insulating medium; 7: a second insulating medium; 8: a step portion; 9: a mouth; 10: and barbs.

Detailed Description

The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not limited to the present invention.

As shown in fig. 2, the high temperature reflow-resistant SMA interface includes an inner conductor 1 and an outer conductor 2 which are coaxially arranged, a cavity with a set distance is formed between the inner conductor 1 and the outer conductor 2, and the cavity is used for filling an insulating medium. Taking the direction of fig. 2 as an example, the left end of the outer conductor 2 is a mouth portion 9, the right end of the outer conductor is a welding portion, the mouth portion 9 is used for matching with a standard connector to realize electrical connection, the welding portion is provided with welding pins 4, and generally, the number of the pins 4 is 3-6. Preferably, the number of the pins 4 is 5, and 5 pins 4 are inserted into the printed board for high-temperature reflow soldering, so that the pins 4 are also soldering points.

A first insulating medium 6 is arranged between the inner conductor 1 and the outer conductor 2 on one side close to the mouth part 9, a second insulating medium 7 is arranged between the inner conductor 1 and the outer conductor 2 on one side close to the welding part, and the inner conductor 1 and the outer conductor 2 are separated by the divided first insulating medium 6 and the second insulating medium 7.

Preferably, the first insulating medium 6 and the second insulating medium 7 are both polytetrafluoroethylene media, and have good high-temperature resistance. A set distance is formed between the first insulating medium 6 and the second insulating medium 7, that is, in fig. 2, a gap is left between the right end of the first insulating medium 6 and the left end of the paper piece of the second insulating medium 7 to serve as an expansion space 5, the gap can be set according to actual needs, and in fig. 2, the cross section of the gap portion of the expansion space 5 is in an inverted T shape.

Preferably, the inner wall of the housing of the outer conductor 2 extends inward along the end face direction of the first insulating medium 6 to form a step portion 8, the step portion 8 and the housing of the mouth portion are wrapped outside the first insulating medium 6, and a small step is provided on the end face of the first insulating medium to prevent the first insulating medium from directly sliding out of the mouth portion when being heated.

Preferably, barbs 10 are respectively arranged between the first insulating medium 6 and the inner conductor 1, and between the second insulating medium 7 and the inner conductor 1, and between the second insulating medium 2 and the outer conductor 2, barbs 10 are also respectively arranged, and barbs 10 can be respectively arranged at the middle positions of the first insulating medium 6 and the second insulating medium 7, so that the connection relationship between the components can be reinforced.

The utility model has the advantages that:

The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings are utilized, or directly or indirectly applied to other related technical fields, and all the same principles are included in the protection scope of the present invention.

Claims

1. The utility model provides a high temperature resistant reflow soldering SMA interface, includes inner conductor (1) and outer conductor (2) of coaxial setting, form the cavity of setting for the distance between inner conductor (1) and outer conductor (2), the one end of outer conductor (2) is oral area (9) and the other end is the welding part, the welding part is provided with welding pin (4), a serial communication port, one side that is close to oral area (9) between inner conductor (1) and outer conductor (2) is provided with first insulating medium (6) just one side that is close to the welding part between inner conductor (1) and outer conductor (2) is provided with second insulating medium (7), the distance that the interval set for between first insulating medium (6) and second insulating medium (7).

2. A high temperature reflow-resistant SMA interface according to claim 1, wherein the inner wall of the housing of the outer conductor (2) extends inwardly with a step (8) along the end face of the first insulating medium (6).

3. A high temperature reflow-resistant SMA interface according to claim 2, wherein the first insulating medium (6) and the second insulating medium (7) are both teflon media.

4. A high temperature reflow-resistant SMA interface according to claim 2, wherein barbs (10) are provided between the first insulating medium (6) and the inner and outer conductors (1, 2), respectively.

5. A high temperature reflow-resistant SMA interface according to claim 2, wherein barbs (10) are provided between the second insulating medium (7) and the inner conductor (1) and the outer conductor (2), respectively.

6. A high temperature reflow-resistant SMA interface according to claim 1, wherein the number of pins (4) is 3-6.

7. A high temperature reflow-resistant SMA interface according to claim 6, wherein the number of pins (4) is 5.