CN211428126U

CN211428126U - Refrigeration chip wafer high temperature gets rid of tin device

Info

Publication number: CN211428126U
Application number: CN202020215023.5U
Authority: CN
Inventors: 温汉军
Original assignee: Changshan Wangu Electronic Technology Co ltd
Current assignee: Zhejiang Wangu Semiconductor Co ltd
Priority date: 2020-02-26
Filing date: 2020-02-26
Publication date: 2020-09-04
Anticipated expiration: 2030-02-26

Abstract

The utility model provides a refrigeration chip wafer high temperature gets rid of tin device, the power distribution equipment comprises an equipment body, the left top bolt of equipment body has the control box, the positive top of control box is inlayed and is equipped with touch display screen, the horizontal bolt in left side at equipment body inner chamber back top has first removal axle. The utility model discloses a cooperation of control box and touch display screen, can carry out operation control to equipment body internal plant, drive cooperation through first built-in motor and the built-in motor of second, can drive first removal axle and second and remove the axle and carry out horizontal and vertical regulation removal, then can be to the quick adjustment location of carrying out of electric anchor clamps, through step motor, the cooperation of bearing frame and electric anchor clamps, can carry out quick location centre gripping to the wafer, through the air pump, the tin stove, store up the nitrogen jar, the cooperation of first nitrogen gas inflation inlet and second nitrogen gas inflation inlet, can get rid of the tin operation to the wafer, thereby improve getting rid of tin efficiency of wafer.

Description

Refrigeration chip wafer high temperature gets rid of tin device

Technical Field

The utility model relates to a refrigeration chip field especially relates to a refrigeration chip wafer high temperature gets rid of tin device.

Background

Chips, also known as microcircuits, microchips, and integrated circuits, are silicon chips containing integrated circuits that are small and often part of a computer or other electronic device.

Semiconductor material has a lot, and refrigeration chip is exactly one of them, and when current refrigeration chip carried out the wafer and gets rid of tin, need use get rid of the tin device, nevertheless current get rid of the tin device in the use, can not carry out quick centre gripping to the wafer and get rid of tin, mostly the manual work gets rid of the tin operation to the wafer, improves the probability that the staff takes place danger, simultaneously greatly reduced wafer get rid of tin efficiency.

Therefore, it is necessary to provide a high temperature tin throwing device for cooling chip wafers to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a refrigeration chip wafer high temperature gets rid of tin device has solved current tin device of getting rid of in the use, can not carry out quick centre gripping to the wafer and get rid of the problem of tin.

In order to solve the technical problem, the utility model provides a refrigeration chip wafer high temperature tin throwing device, which comprises an equipment body, the left top of the equipment body is bolted with a control box, the positive top of the control box is embedded with a touch display screen, the left side of the back top of the inner cavity of the equipment body is transversely bolted with a first movable shaft, the inner cavity of the first movable shaft is bolted with a first built-in motor, the right side of the front side of the first movable shaft is vertically movably connected with a second movable shaft, the inner cavity of the second movable shaft is bolted with a second built-in motor, the bottom of the second movable shaft is bolted with a stepping motor, the output shaft of the stepping motor is rotatably connected with an electric clamp through a bearing seat, the bottom of the equipment body is integrally processed with an operation table, the right side of the top of the operation table is bolted with an air pump, the center of the top of the operation table is bolted with a tin furnace, the gas outlet of air pump has the nitrogen storage tank through the pipeline intercommunication, the nitrogen storage tank is located the front at tin stove top, the left end intercommunication of nitrogen storage tank has first nitrogen gas inflation inlet, the right-hand member intercommunication of nitrogen storage tank has second nitrogen gas inflation inlet.

Preferably, the top of the front of the equipment body is hinged with three discharge doors through hinges from left to right, and a first pull handle is embedded in the center of one opposite side of each discharge door.

Preferably, toughened glass is embedded in the inner cavity of the discharge door, the number of layers of the toughened glass is double, and an aluminum alloy frame is bolted to the door frame of the discharge door.

Preferably, the bottom of the front surface of the equipment body is hinged with a double-acting door through a hinge, and a second pull handle is embedded in the center of one side of the double-acting door in the opposite direction.

Preferably, the center of the top of the equipment body is sequentially communicated with two draught fan smoke exhaust port pipelines from front to back.

Preferably, the size of the equipment body is 1700mm long, 800mm wide and 2000mm high respectively, and the height of operation panel is 750 mm.

Compared with the prior art, the utility model provides a pair of refrigeration chip wafer high temperature gets rid of tin device has following beneficial effect:

the utility model provides a high-temperature tin throwing device for a refrigeration chip wafer,

1. the utility model discloses a cooperation of control box and touch display screen, can carry out operation control to equipment body internal plant, drive cooperation through first built-in motor and the built-in motor of second, can drive first removal axle and second and remove the axle and carry out horizontal and vertical regulation removal, then can be to the quick adjustment location of carrying out of electric anchor clamps, through step motor, the cooperation of bearing frame and electric anchor clamps, can carry out quick location centre gripping to the wafer, through the air pump, the tin stove, store up the nitrogen jar, the cooperation of first nitrogen gas inflation inlet and second nitrogen gas inflation inlet, can get rid of the tin operation to the wafer, thereby improve getting rid of tin efficiency of wafer.

2. The utility model is convenient for a user to place the wafer to be tin-spun below the electric clamp through the discharge door and the first pull handle, the toughened glass is convenient for a user to penetrate through the inside of the equipment body from the outer side of the discharge door, the overall strength of the material of the discharge door is enhanced through the aluminum alloy frame, the discharge door is prevented from being deformed and damaged due to stress, through the double door and the second pull handle, a user can conveniently place required tools, the space utilization rate of the operating platform is enhanced, and through the pipeline of the smoke exhaust port of the fan, can remove and dissipate heat in time to prevent high temperature from damaging the internal parts of the equipment body, the size through the equipment body is length 1700mm, wide 800mm and high 2000mm respectively and the height of operation panel 11 is 750mm, increases the space of equipment body and operation panel, prevents that the too much work of appearance of equipment body internal part from interfering.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of a high-temperature tin throwing device for a refrigeration chip wafer according to the present invention;

FIG. 2 is a sectional view showing the structure of the apparatus body shown in FIG. 1;

fig. 3 is a front view of the stepping motor and the electric clamp shown in fig. 1.

Reference numbers in the figures: 1. an apparatus body; 2. a control box; 3. a touch display screen; 4. a first moving axis; 5. a first built-in motor; 6. a second moving axis; 7. a second built-in motor; 8. a stepping motor; 9. a bearing seat; 10. an electric clamp; 11. an operation table; 12. an air pump; 13. a tin furnace; 14. a nitrogen storage tank; 15. a first nitrogen gas charging port; 16. a second nitrogen charging port; 17. a discharge door; 18. double doors are opened; 19. a fan smoke exhaust port pipeline.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and embodiments.

Please refer to fig. 1, fig. 2 and fig. 3 in combination, wherein fig. 1 is a schematic structural diagram of a preferred embodiment of a refrigeration chip wafer high temperature tin-throwing device provided by the present invention, fig. 2 is a sectional structural diagram of an apparatus body shown in fig. 1, fig. 3 is a front structural diagram of a stepping motor and an electric fixture shown in fig. 1, a refrigeration chip wafer high temperature tin-throwing device includes an apparatus body 1, a control box 2 is bolted on the top of the left side of the apparatus body 1, a touch display screen 3 is embedded on the top of the front side of the control box 2, a first moving shaft 4 is transversely bolted on the left side of the top of the back side of the inner cavity of the apparatus body 1, a first built-in motor 5 is bolted on the inner cavity of the first moving shaft 4, a second moving shaft 6 is vertically movably connected on the right side of the front side of the first moving shaft 4, a second built-in motor 7 is bolted on the inner cavity, the bottom bolt of second removal axle 6 has step motor 8, step motor 8's output shaft rotates through bearing frame 9 and is connected with electronic anchor clamps 10, the bottom integrated into one piece of equipment body 1 has operation panel 11, the right side bolt at operation panel 11 top has air pump 12, the center department bolt at operation panel 11 top has tin stove 13, the gas outlet of air pump 12 has nitrogen storage tank 14 through the pipeline intercommunication, nitrogen storage tank 14 is located the front at tin stove 13 top, nitrogen storage tank 14's left end intercommunication has first nitrogen gas inflation inlet 15, nitrogen storage tank 14's right-hand member intercommunication has second nitrogen gas inflation inlet 16.

The top on the front side of the equipment body 1 is hinged with three discharge doors 17 through hinges in sequence from left to right, the number of the discharge doors 17 is three, a first pull handle is embedded in the center of one side of the discharge doors 17 opposite to each other, and a user can conveniently place a wafer to be subjected to tin throwing below the electric fixture 10.

The inner chamber of blowing door 17 inlays and is equipped with toughened glass, and toughened glass's the number of piles is the bilayer, and the person of facilitating the use runs through the inside condition of equipment body 1 from the blowing door 17 outside, the door frame bolt of blowing door 17 has aluminum alloy frame, and the bulk strength of reinforcing blowing door 17 material prevents that blowing door 17 atress from taking place deformation damage.

The positive bottom of equipment body 1 has two doors 18 through the hinge joint, two central departments of opening one side in opposite directions of door 18 inlay and are equipped with the second pull handle, and convenient to use person places required instrument, strengthens operation panel 11's space utilization.

The central department at equipment body 1 top communicates in proper order in the past to the back has fan smoking mouth pipeline 19, fan smoking mouth pipeline 19's quantity is two, can in time get rid of the heat dissipation to the heat of equipment body 1 inside, prevents that high temperature from causing the damage to equipment body 1 internals.

The size of equipment body 1 is length 1700mm, wide 800mm and high 2000mm respectively, the height of operation panel 11 is 750mm, increases the space of equipment body 1 and operation panel 11, prevents that the too much work of appearance of equipment body 1 internal component from interfering.

The utility model provides a pair of refrigeration chip wafer high temperature gets rid of tin device's theory of operation as follows:

when in use, a user opens the discharging door 17 to place a wafer to be subjected to tin throwing to a set position, then the user performs touch operation through the touch display screen 3, then the control box 2 controls the first built-in motor 5 and the second built-in motor 7 to be started successively, then the first built-in motor 5 applies a driving source to the first moving shaft 4, so that the first moving shaft 4 drives the second moving shaft 6 to move left and right, similarly, the second built-in motor 7 applies a driving source to the second moving shaft 6, the second moving shaft 6 drives the stepping motor 8 and the electric clamp 10 to move up and down, so that the electric clamp 10 moves to a wafer clamping position, so that the electric clamp 10 clamps and fixes the wafer, meanwhile, the control box 2 controls the air pump 12 to be started, the air pump 12 conveys nitrogen gas into the nitrogen storage tank 14, so that the nitrogen gas is supplied as an energy source, and the tin furnace 13 keeps a heating and heat preservation state, then the second moving shaft 6 drives the electric fixture 10 to move the wafer downwards into the tin furnace 13 and immerse the wafer, then the control box 2 drives the stepping motor 8 to rotate at a constant speed, and the stepping motor 8 drives the wafer on the electric fixture 10 to rotate at a constant speed through the rotation fit of the bearing seat 9, so that the wafer can be subjected to tin throwing operation, and heat generated in the tin throwing process is discharged through the fan smoke outlet pipeline 19.

the utility model discloses a cooperation of control box 2 and touch display screen 3, can carry out operation control to 1 internal plant of equipment body, drive cooperation through first built-in motor 5 and second built-in motor 7, can drive first removal axle 4 and second removal axle 6 and carry out horizontal and vertical regulation and remove, then can fix a position carrying out the quick adjustment to electric fixture 10, through step motor 8, bearing frame 9 and electric fixture 10's cooperation, can carry out the quick location centre gripping to the wafer, through air pump 12, tin stove 13, nitrogen storage tank 14, the cooperation of first nitrogen gas inflation inlet 15 and second nitrogen gas inflation inlet 16, can get rid of the tin operation to the wafer, thereby improve getting rid of tin efficiency of wafer.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.

Claims

1. The utility model provides a refrigeration chip wafer high temperature gets rid of tin device, includes equipment body (1), its characterized in that: the device is characterized in that a control box (2) is bolted at the left top of the device body (1), a touch display screen (3) is embedded at the front top of the control box (2), a first moving shaft (4) is transversely bolted at the left side of the top of the back of an inner cavity of the device body (1), a first built-in motor (5) is bolted at the inner cavity of the first moving shaft (4), a second moving shaft (6) is vertically and movably connected at the right side of the front of the first moving shaft (4), a second built-in motor (7) is bolted at the inner cavity of the second moving shaft (6), a stepping motor (8) is bolted at the bottom of the second moving shaft (6), an output shaft of the stepping motor (8) is rotatably connected with an electric clamp (10) through a bearing seat (9), an operating table (11) is integrally machined at the bottom of the device body (1), an air pump (12) is bolted at the right side of the top of the operating table, center department bolt at operation panel (11) top has tin stove (13), the gas outlet of air pump (12) has nitrogen storage tank (14) through the pipeline intercommunication, nitrogen storage tank (14) are located the front at tin stove (13) top, the left end intercommunication of nitrogen storage tank (14) has first nitrogen gas inflation inlet (15), the right-hand member intercommunication of nitrogen storage tank (14) has second nitrogen gas inflation inlet (16).

2. The refrigeration chip wafer high-temperature tin throwing device according to claim 1, wherein three emptying doors (17) are hinged to the top of the front face of the equipment body (1) from left to right sequentially through hinges, and a first pull handle is embedded in the center of one opposite side of each emptying door (17).

3. The refrigeration chip wafer high-temperature tin throwing device according to claim 2, wherein toughened glass is embedded in the inner cavity of the discharge door (17), the number of layers of the toughened glass is two, and an aluminum alloy frame is bolted to the door frame of the discharge door (17).

4. The refrigeration chip wafer high-temperature tin throwing device according to claim 1, wherein the bottom of the front surface of the equipment body (1) is hinged with a double door (18) through a hinge, and a second pull handle is embedded in the center of one side of the double door (18) facing to the double door.

5. The refrigeration chip wafer high-temperature tin throwing device according to claim 1, wherein the center of the top of the equipment body (1) is sequentially communicated with two fan smoke outlet pipelines (19) from front to back, and the number of the fan smoke outlet pipelines (19) is two.

6. The high-temperature tin throwing device for the refrigeration chip wafer as claimed in claim 1, wherein the size of the equipment body (1) is 1700mm in length, 800mm in width and 2000mm in height, and the height of the operating platform (11) is 750 mm.