CN211427378U - Smart card - Google Patents

Abstract

The utility model relates to a smart card, it includes: a backsheet layer; the metal layer is laminated with the back plate layer and is provided with an embedding hole, and the embedding hole is sunken from the surface of the metal layer, which is far away from the back plate layer, towards the back plate layer; the decoration piece is embedded in the embedding hole. The utility model discloses a smart card can promote individuality and pleasing to the eye degree through inlaying the decoration that has the third dimension on the metal level.

Description

Smart card

Technical Field

The utility model relates to a smart card technical field especially relates to a smart card.

Background

With the globalization of economy, the application range of smart cards has become more and more extensive. The smart card can realize the electronic transaction function, thereby providing payment convenience for the daily life of people. In the prior art, due to the regulation limitation of national standard and international standard, the smart card can be realized only by changing the printed pattern if the personalization or identification is required. However, such design is single, the stereoscopic impression is poor, and the personalized trend demand cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model provides a smart card can promote individuality and pleasing to the eye degree through inlaying the decoration that has the third dimension on the metal level.

In one aspect, the utility model provides a smart card, it includes:

a backsheet layer;

the metal layer is laminated with the back plate layer and is provided with an embedding hole, and the embedding hole is sunken from the surface of the metal layer, which is far away from the back plate layer, towards the back plate layer;

the decoration piece is embedded in the embedding hole.

According to the utility model discloses an aspect, the quantity of inlaying the hole is more than two, and adjacent two inlay minimum distance more than or equal to 0.3mm between the hole.

According to an aspect of the utility model, inlay the minimum distance more than or equal to 1mm at the edge of hole to metal level.

According to an aspect of the utility model, inlay the bottom in hole to the metal level be close to the minimum distance more than or equal to 0.2mm on the surface of backplate layer.

According to one aspect of the invention, the metal layer is a titanium alloy layer or a stainless steel layer.

According to an aspect of the utility model, the metal level has annular concave part, and annular concave part is sunken towards the direction of keeping away from the backplate layer from the surface of metal level orientation backplate layer, and the smart card still includes annular ferrite layer and loop antenna layer, and annular ferrite layer and loop antenna layer are range upon range of to be set up in annular concave part, and annular ferrite layer sets up between loop antenna layer and metal level.

According to an aspect of the utility model, the metal level has central concave part, and central concave part is located the annular concave part, and the smart card still includes central ferrite layer, and central ferrite layer sets up in central concave part.

According to the utility model discloses an aspect, the smart card still includes the bonding glue film, and annular ferrite layer bonds in the diapire of annular concave part through the bonding glue film, and central ferrite layer bonds in the diapire of central concave part through the bonding glue film.

According to an aspect of the utility model, the smart card still includes the adhesive linkage, adhesive linkage bonding backplate layer and metal level.

According to one aspect of the present invention, the ornamental member is one or more of a diamond, a gem, and a jade.

According to the utility model provides a smart card includes backplate layer, metal level and inlays the decoration on the metal level. The metal layer is provided with an embedded hole. And installing and fixing the decorative piece in the embedding hole of the metal layer. The decoration can promote the pleasing to the eye degree of outward appearance of the smart card of accomplishing the preparation, can show more individuality, promotes the noble feel and the third dimension of smart card.

Drawings

Features, advantages and technical effects of exemplary embodiments of the present invention will be described below by referring to the accompanying drawings.

Fig. 1 is a schematic top view of a smart card according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view taken along A-A of FIG. 1;

fig. 3 is a schematic view of a back plate layer according to an embodiment of the present invention in a partial cross-sectional view;

fig. 4 is a schematic diagram of a partial cross-sectional structure of a smart card according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional structure diagram of a smart card according to another embodiment of the present invention;

fig. 6 is a schematic diagram of a smart card according to another embodiment of the present invention;

fig. 7 is a schematic top view of a smart card according to another embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view taken along line B-B of FIG. 7;

fig. 9 is a schematic view of a card body according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a card body structure with a surface element layer according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a back plate layer according to an embodiment of the present invention.

In the drawings, the drawings are not necessarily drawn to scale.

Description of the labeling:

1. a smart card;

10. a backsheet layer; 11. a backplane base layer; 111. a glue film layer; 112. printing an image-text layer; 113. a reverse substrate layer; 12. a surface element layer; 121. a magnetic strip; 122. a signature strip; 123. an anti-counterfeiting label;

20. a metal layer; 21. embedding holes; 22. an annular recess; 23. a central recess;

30. a decorative member;

40. an annular ferrite layer;

50. a loop antenna layer;

60. a central ferrite layer;

70. bonding the adhesive layer;

80. an adhesive layer;

90. an IC chip;

100. a card body structure;

200. a peelable layer;

300. a thickness compensation layer; 301. a front compensation layer; 302. an intermediate compensation layer;

x, thickness direction.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention, but are not intended to limit the scope of the invention, i.e., the invention is not limited to the described embodiments.

In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", and the like, indicate orientations or positional relationships only for convenience in describing the present invention and to simplify the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The directional terms appearing in the following description are directions shown in the drawings and do not limit the specific structure of the present invention. In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.

For a better understanding of the present invention, embodiments of the present invention are described below with reference to fig. 1 to 11.

The embodiment of the utility model provides a smart card 1. The smart card 1 may be used to implement electronic transaction functions. The smart card 1 is a type of card having a predetermined length, width and thickness, and also has portability and convenience in use. The smart card 1 may be a financial card, credit card, stored value card, bus card, access card or membership card, but is not limited to the types of cards listed above. In one example, the card thickness may need to conform to a standard thickness of 0.76mm (millimeters) to 0.84mm, as per standard specifications, to ensure proper use of the card.

Referring to fig. 1 and 2, a smart card 1 according to an embodiment of the present invention includes a back sheet layer 10, a metal layer 20, and a decorative member 30. The metal layer 20 and the back sheet layer 10 are stacked and connected to each other in the thickness direction X. The metal layer 20 has an upper surface and a lower surface in the thickness direction X shown in fig. 1. Typically, the upper surface of the metal layer 20 serves as the front side of the smart card 1, while the lower surface of the back sheet layer 10 serves as the back side of the smart card 1. The edges of the metal layer 20 and the back sheet layer 10 are aligned with each other in the thickness direction X. The back sheet layer 10 includes a back sheet base layer 11 and a surface element layer 12 stacked on the back sheet base layer 11. In one example, referring to fig. 3, the back sheet base layer 11 includes an adhesive film layer 111, a printed graphics layer 112, and a reverse base layer 113, which are stacked. The reverse base layer 113 faces the metal layer 20 and is fixed to the metal layer 20. The surface element layer 12 is disposed on the surface of the adhesive film layer 111 away from the metal layer 20. Optionally, the surface element layer 12 includes at least one of a magnetic stripe 121, a signature strip 122, and a security label 123.

The embodiment of the utility model provides an in, for the plastic material layer of equal thickness, metal level 20 self has predetermined thickness, and self rigidity is high to self is difficult for the atress to produce deformation, bending, also is favorable to improving 1 self bulk rigidity of smart card and anti deformability. The metal layer 20 of the embodiment of the present invention has the damascene hole 21. The inlay holes 21 are recessed from the surface of the metal layer 20 remote from the back plate layer 10 towards the back plate layer 10. In one example, the damascene hole 21 may be machined in the metal layer 20 using an engraving machine or a milling machine. In one example, referring to fig. 1, the number of the damascene holes 21 may be two or more. The minimum distance L1 between two adjacent embedding holes 21 is greater than or equal to 0.3mm, so that when two adjacent embedding holes 21 are machined, the possibility that the two embedding holes 21 are overlapped due to position interference between the two embedding holes 21 is reduced, and the possibility that the area between the two embedding holes 21 is too small due to too close distance between the two embedding holes 21, and further the area is too small in rigidity and is easy to deform or crack is reduced.

In the embodiment of the present invention, referring to fig. 2, a fixing decoration 30 is installed in the embedding hole 21 of the metal layer 20. The decoration 30 can improve the appearance attractiveness of the manufactured smart card 1, can show individuality more, and improves the noble texture and the third dimension of the smart card 1. The portion of the decoration 30 inserted into the insertion hole 21 is matched with the shape of the insertion hole 21. In one example, the ornamental piece 30 is a diamond. Types of diamonds include, but are not limited to, flat bottom diamonds and sharp bottom diamonds. The diamond may be, but is not limited to, a crystal diamond. It is to be understood that the ornamental member 30 is not limited to the diamond described above, but may be a gem stone or a jade. Or, when the number of the decoration members 30 is plural, the decoration members 30 may be a combination of diamond, gem and jade, which are freely mixed and matched, to present different textures and appearances. In one example, the prepared insertion hole 21 is filled with adhesive glue in advance, and then the decoration member 30 is inserted into the insertion hole 21. After the adhesive is cured, the decoration member 30 is connected and fixed to the metal layer 20.

The embodiment of the utility model provides an in, because the outward appearance layer of smart card 1 is provided with the decoration 30 that the third dimension is stronger, consequently can show card holder's individuality and noble sense, promote card holder's experience satisfaction. The smart card 1 uses the metal layer 20 as a base, then the inlay hole 21 is provided on the metal layer 20, and finally the decoration 30 is inlaid in the inlay hole 21. Compared with plastic base materials (including PVC, PC, PET and the like) with the same size and specification, the metal layer 20 is high in self rigidity and good in bending resistance, so that the possibility that the decoration 30 falls off due to bending of the intelligent card 1 is reduced, and the connection stability of the decoration 30 is improved.

In one embodiment, referring to fig. 1, a plurality of damascene holes 21 are provided in rows and columns on the metal layer 20. The minimum distance L2 between the outermost circle of inlay holes 21 and the edge of the metal layer 20 is equal to 1mm, so that the entire surface of the metal layer 20 substantially fills the inlay holes 21. Then, one decorative piece 30 is inserted into each insertion hole 21 so that all the decorative pieces 30 are substantially filled with the entire surface of the metal layer 20. The graphic design of the full-page decoration 30 can be carried out according to the arrangement design of the embedding holes 21 on the metal layer 20, and different graphic format information can be obtained by embedding and combining the decoration 30 with different colors at different positions of the embedding holes 21. Referring to fig. 1, the dark color decoration pieces 30 are used in the digital areas, and the light color decoration pieces 30 are used in other positions, so that a rather shocking visual effect can be formed, stiffness of a single color can be further avoided, and important information can be better highlighted. It is understood that the number of the damascene holes 21 formed in the metal layer 20 may be one, two, or a certain number of the damascene holes 21 may be formed in a small area of the metal layer 20 according to product requirements. The minimum distance L2 between the embedding hole 21 and the edge of the metal layer 20 is not limited to 1mm, but may be greater than 1mm, so as to effectively reduce the possibility that the decorative part 30 falls off due to the impact force applied to the edge during the falling process of the smart card 1. Since the metal layer 20 has good rigidity and bending resistance, the damascene holes 21 can be formed almost on the entire surface of the metal layer 20, and the number density of the damascene holes 21 can also be increased. In one example, the minimum distance L1 between two adjacent inlay holes 21 may be equal to 0.3 mm.

In one embodiment, referring to fig. 2, the minimum distance L3 from the bottom of the embedding hole 21 to the surface of the metal layer 20 close to the back plate layer 10 is greater than or equal to 0.2mm, so that compared to the embodiment in which the embedding hole 21 penetrates through the metal layer 20, the method is beneficial to ensuring the self-rigidity of the metal layer 20 after the embedding hole 21 is formed, and is also beneficial to reducing the possibility that the decoration piece 30 is easy to be clamped at the lower opening of the embedding hole 21 to cause inaccurate positioning in the embedding hole 21, and improving the operation convenience of the subsequent embedding decoration piece 30. In one example, the damascene hole 21 may be a blind hole.

In one embodiment, the metal layer 20 is a titanium alloy layer or a stainless steel layer. In the process of manufacturing the smart card 1, a stainless steel or titanium alloy blank is cut into sheets with a predetermined size according to the standard requirements of the industry, and then the subsequent processing procedures such as manufacturing the embedding hole 21 are performed. Preferably, the metal layer 20 is a titanium alloy layer with high strength and good corrosion resistance. The back sheet layer 10 covers the lower surface of the metal layer 20. The material of the back plate layer 10 can not be metal or other materials having shielding effect on electromagnetic field, so as to avoid influencing the normal use of the smart card 1. The material of the back plate layer 10 can be selected from PVC, PETG, ABS and the like.

In one embodiment, as shown in fig. 2 and 4, the metal layer 20 has an annular recess 22. The annular recess 22 is recessed from the surface of the metal layer 20 facing the back sheet layer 10 in a direction away from the back sheet layer 10. Referring also to fig. 3, the smart card 1 further includes a loop ferrite layer 40 and a loop antenna layer 50. Here, ferrite is a composite oxide containing iron oxide and other iron group or rare earth group oxides as main components. The annular ferrite layer 40 and the annular antenna layer 50 are stacked and disposed in the annular recess 22. The loop ferrite layer 40 is disposed between the loop antenna layer 50 and the metal layer 20. The loop antenna layer 50 may be used to transfer information so that the smart card 1 forms a contactless IC card. The annular ferrite layer 40 can improve the shielding effect of the metal layer 20 against electromagnetic waves. In one example, the annular ferrite layer 40 is attached to the metal layer 20 after being fitted into the annular recess 22, and the annular antenna layer 50 is attached to the annular ferrite layer 40 after being fitted into the annular recess 22.

In one embodiment, as shown in fig. 5 and 6, the metal layer 20 has a central recess 23. The central recess 23 is located within the annular recess 22. The smart card 1 further comprises a central ferrite layer 60. The central ferrite layer 60 is disposed within the central recess 23 and inside the annular ferrite layer 40. The central ferrite layer 60 is directly bonded and fixed to the bottom wall of the central recess 23 after being fitted into the central recess 23. The central ferrite layer 60 arranged in the middle area of the smart card 1 can improve the electromagnetic wave capability of the loop antenna layer 50 structure, effectively improve the response distance of the smart card 1, and meet the normal transaction function of the smart card 1. In one example, the thickness of the central ferrite layer 60 is equal to the thickness of the annular ferrite layer 40.

In one embodiment, referring to FIG. 5, the smart card 1 further includes a layer of adhesive glue 70.

After being fitted into the annular recess 22, the annular ferrite layer 40 is bonded to the bottom wall of the annular recess 22 by an adhesive layer 70. after being fitted into the annular recess 22, the annular antenna layer 50 is bonded to the annular ferrite layer 40 by the adhesive layer 70. After the central ferrite layer 60 is fitted into the central recess 23, it is bonded to the bottom wall of the central recess 23 by an adhesive layer 70. Alternatively, the adhesive layer 70 may be a liquid quick-dry adhesive or a double-sided adhesive.

In one embodiment, referring to FIG. 2, the smart card 1 further includes an adhesive layer 80. The adhesive layer 80 adheres the back sheet layer 10 and the metal layer 20. The back plate layer 10 and the metal layer 20 are bonded by the adhesive layer 80, so that the difficulty of connecting the back plate layer 10 and the metal layer 20 can be reduced, and the possibility that the metal layer 20 is stressed too much to be dented or broken in the lamination molding process of the back plate layer 10 and the metal layer 20 is reduced. Alternatively, the adhesive layer 80 may be a glue layer or a double-sided glue layer.

In one embodiment, referring to fig. 7, the smart card 1 further includes a contact IC chip 90. The IC chip 90 is embedded in the metal layer 20. The arrangement of the inlay holes 21 and the arrangement of the decoration 30 need to avoid the position of the IC chip 90 to ensure that the smart card 1 can read the card normally. In one example, referring to fig. 8, the smart card 1 performs a transaction work only using the contact IC chip 90, so that it may not be necessary to provide the annular recess 22 and the central recess 23 on the lower surface of the metal layer 20. The backsheet layer 10 may be adhesively secured directly to the metal layer 20 by an adhesive layer 80.

The embodiment of the utility model provides a still provide a smart card 1 manufacturing method, it includes:

manufacturing a back plate layer 10;

manufacturing a metal layer 20, and laminating the metal layer 20 on the back plate layer 10;

processing an embedded hole 21, and processing the embedded hole 21 on the surface of the metal layer 20 far away from the back plate layer 10;

the decoration 30 is embedded, and the decoration 30 is embedded in the embedding hole 21.

In one embodiment, since the metal layer 20 is adopted as the substrate of the inlaid decoration 30 on the front surface of the smart card 1, and the thickness of the back plate base layer 11 is very thin, the method of processing and manufacturing the surface element layer 12 on the back plate base layer 11 with a small thickness after connecting and fixing the metal layer 20 and the back plate base layer 11 is difficult, and the requirement on processing equipment is high, thereby resulting in high processing cost. The technical scheme of the utility model, can reduce the processing cost under the prerequisite of guaranteeing 11 processingquality of backplate basal layer. In this embodiment, adopt metal level 20 and backplate layer 10 to process separately manufacturing respectively, then process manufacturing with the mode of both assemblings and form smart card 1, be favorable to reducing backplate layer 10 processing degree of difficulty and processing cost, also be favorable to reducing the possibility that structural damage appears in backplate layer 10 in the course of working.

The step of manufacturing the back sheet layer 10 includes:

referring to fig. 9, a card body structure 100 to be processed is manufactured, and a back plate base layer 11, a peelable layer 200 and a thickness compensation layer 300 are sequentially stacked and subjected to a hot pressing process to form the card body structure 100;

referring to fig. 10, a surface element layer 12 is prepared, and the surface of the back plate base layer 11 away from the peelable layer 200 is processed to form the surface element layer 12;

referring to fig. 11, the peelable layer 200 and the thickness compensation layer 300 are peeled off, and the back sheet base layer 11 and the surface element layer 12 are configured as the back sheet layer 10.

In this embodiment, the card body structure 100 is a simulated card, and the peelable layer 200 and the thickness compensation layer 300 are used for thickness compensation in the thickness direction X, so that the thickness dimension of the card body structure 100 meets the processing requirement, thereby ensuring normal card walking on the processing equipment, and enabling the corresponding equipment to process and form the surface element layer 12 on the back plate base layer 11. In one example, the thickness compensation layer 300 includes a front compensation layer 301 and an intermediate compensation layer 302. The peelable layer 200 is disposed between the intermediate compensation layer 302 and the backing plate base layer 11. Optionally, the front compensation layer 301 and the middle compensation layer 302 are both 0.33mm PVC white substrates. The bonding force between the peelable layer 200 and the back sheet base layer 11 and the thickness compensation layer 300 is weak. After the surface element layer 12 is processed and formed on the back sheet base layer 11, the peelable layer 200 and the thickness compensation layer 300 are easily separated together from the back sheet layer 10.

In the existing processing technology, the layer structures are combined into a whole after hot pressing treatment and cannot be separated from each other. Can separate each layer structure after realizing through hot pressing technology processing each other, obtain qualified, complete backplate layer, the utility model discloses a following technical scheme:

in one example, peelable layer 200 is offset ink or silk-screen ink. Optionally, offset or silk-screen ink is applied over the backing base layer 11. Since the peelable layer 200 separates the thickness compensation layer 300 and the back sheet base layer 11, the thickness compensation layer 300 and the back sheet base layer 11 are not integrated after the hot pressing process, thereby ensuring that the thickness compensation layer 300 and the back sheet base layer 11 can be easily separated after the hot pressing.

In this embodiment, the surface element layer 12 includes at least one of a magnetic stripe 121, a tamper proof label 123, and a signature strip 122. It is to be understood that the surface element layer 12 is not limited to the above listed types, and a specific layer structure may be provided according to product requirements.

In one embodiment, the back sheet base layer 11 includes a laminated film layer 111, a printed graphics layer 112, and a reverse base layer 113. The opposite substrate layer 113 is attached to the peelable layer 200. The surface element layer 12 is formed on the surface of the adhesive film layer 111 remote from the peelable layer 200. The opposite substrate layer 113 may be a PVC white substrate or a PVC black substrate. Optionally, the thickness of the reverse substrate layer 113 is 0.12 mm. The printed image-text layer 112 contains text information and picture information. Alternatively, the printed image layer 112 is formed by silk-screening or offset printing four colors. The adhesive film layer 111 may be a PVC adhesive film. Optionally, the thickness of the adhesive film layer 111 is 0.06 mm. In the embodiment where the surface element layer 12 is a magnetic stripe 121, it is formed on the adhesive film layer 111 by means of lamination. In the embodiment where the surface element layer 12 is the anti-counterfeit label 123 or the signature strip 122, the surface element layer is formed on the adhesive film layer 111 by a hot-bonding method.

The utility model discloses smart card 1 or smart card 1 manufacturing approach manufacturing smart card 1 of embodiment, it includes backplate layer 10, metal level 20 and inlays decoration 30 on metal level 20. The decoration 30 is advantageous to improve the beauty and the nobility of the smart card 1 and to show the individuality of the smart card 1. Because the metal layer 20 has good rigidity and good bending resistance, the metal layer 20 is not easy to deform, so that the possibility that the decorative part 30 inlaid on the metal layer 20 is easy to fall off is caused, and the inlaid holes 21 with higher number density can be arranged on the metal layer 20 without reducing the overall rigidity of the smart card 1.

While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, and particularly, various features shown in the various embodiments may be combined in any combination as long as there is no structural conflict. The present invention is not limited to the particular embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (10)

1. A smart card, comprising:

a backsheet layer;

the metal layer is laminated with the back plate layer and provided with embedding holes, and the embedding holes are sunken from the surface of the metal layer, which is far away from the back plate layer, to the back plate layer;

the decoration piece is embedded in the embedding hole.

2. The smart card of claim 1, wherein the number of the damascene holes is two or more, and a minimum distance between two adjacent damascene holes is greater than or equal to 0.3 mm.

3. The smart card of claim 1, wherein the minimum distance from the damascene hole to the edge of the metal layer is 1mm or more.

4. The smart card of claim 1, wherein a minimum distance from a bottom of the damascene hole to a surface of the metal layer adjacent to the back plate layer is 0.2mm or more.

5. The smart card of claim 1, wherein the metal layer is a titanium alloy layer or a stainless steel layer.

6. The smart card of any one of claims 1 to 5 wherein the metal layer has an annular recess that is recessed from the metal layer toward a surface of the backplane layer in a direction away from the backplane layer, the smart card further comprising an annular ferrite layer and an annular antenna layer, the annular ferrite layer and the annular antenna layer being stacked within the annular recess, the annular ferrite layer being disposed between the annular antenna layer and the metal layer.

7. The smart card of claim 6 wherein the metal layer has a central recess located within the annular recess, the smart card further comprising a central ferrite layer disposed within the central recess.

8. The smart card of claim 7 further comprising a layer of adhesive glue, wherein the annular ferrite layer is adhered to the bottom wall of the annular recess by the layer of adhesive glue, and wherein the central ferrite layer is adhered to the bottom wall of the central recess by the layer of adhesive glue.

9. The smart card of any one of claims 1 to 5, further comprising an adhesive layer adhering the back sheet layer and the metal layer.

10. A smart card according to any of claims 1 to 5, wherein the decorative item is one or more of a diamond, gemstone and jade.

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