CN211414771U - Substrate sheet clamp for double-sided polishing machine - Google Patents
Substrate sheet clamp for double-sided polishing machine Download PDFInfo
- Publication number
- CN211414771U CN211414771U CN201921885437.2U CN201921885437U CN211414771U CN 211414771 U CN211414771 U CN 211414771U CN 201921885437 U CN201921885437 U CN 201921885437U CN 211414771 U CN211414771 U CN 211414771U
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- Prior art keywords
- substrate
- double
- board
- polishing machine
- substrate board
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- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000005498 polishing Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 17
- 229920002635 polyurethane Polymers 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 7
- 239000010985 leather Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000009966 trimming Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004018 waxing Methods 0.000 description 1
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Abstract
The utility model discloses a substrate slice clamp for a double-sided polishing machine, which comprises a circular substrate board, two surface symmetries of the substrate board are provided with material placing plates with the diameters consistent with the substrate board, the material placing plates are provided with a plurality of circular positioning grooves relative to the central symmetry, the positioning grooves are in one-to-one correspondence along the downward two surface directions of the substrate board, flexible gaskets contacting with products are coaxially arranged in the positioning grooves, the centers of the flexible gaskets are coaxially attached with padding patches contacting with the substrate board, after the substrate slices are placed in the positioning grooves, the surface heights of the substrate slices are higher than the height of the material placing plates, the technical proposal has the key points that the substrate slices are bent and deformed by utilizing the pressure of a double-sided polishing machine, the middle parts of the substrate slices are outwards protruded, and the substrate slices are polished and thinned by the double-sided polishing machine, thereby realizing the purpose of finely trimming the BOW value, having, and a plurality of substrate plates can be clamped at one time, so that the clamping device is more efficient.
Description
Technical Field
The utility model relates to a wafer manufacturing field, more specifically says that it relates to substrate piece anchor clamps for double side polisher.
Background
The substrate slice refers to a sapphire crystal bar or a substrate which is processed by silicon through slicing and cleaning and has no other processes, the quality of the substrate slice has great influence on the subsequent growth of a GaN epitaxial layer and the performance and yield of LED preparation, and the production of the high-quality substrate slice not only needs excellent substrate slice preparation process technology, but also is a very important link for the quality detection technology of the substrate slice. Flatness of a substrate sheet is one of key indicators for measuring substrate quality, and attention in the industry to flatness of products is mainly focused on BOW (BOW), warp (SORI) and Total Thickness Variation (TTV). BOW (BOW) is the distance between the center point of the median plane of a free undamped wafer and the median plane reference plane, which is the plane defined by three equidistant points on a given circle of diameter less than the nominal diameter of the wafer.
The BOW value of the substrate slice is controlled by grinding and polishing, the substrate slice needs to be thinned in order to improve the heat dissipation effect of a chip at the later stage and reduce the packaging difficulty, the main methods are grinding and polishing, the traditional polishing method mainly adopts a mode that a wax sheet is used for raising the middle part of a substrate to enable the substrate to be raised, and then a polishing machine is used for thinning and polishing the raised surface; however, due to the uncontrollable thickness of the wax sheet, the accuracy is often difficult to ensure, and the BOW value of the substrate sheet cannot meet the requirement.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a substrate anchor clamps for double-sided buffing machine, it has the advantage that can realize repairing crookedness (BOW) value, remedies prior art not enough, has the clamping efficient, the high characteristics of precision after the polishing.
In order to achieve the above purpose, the utility model provides a following technical scheme:
substrate piece anchor clamps for two-sided burnishing machine, its characterized in that: including circular shape substrate board, two surface symmetries of substrate board are provided with the blowing board that diameter and substrate board are unanimous, be provided with the circular shape constant head tank of a plurality of about central symmetry on the blowing board, the constant head tank is followed two downward surface direction one-to-ones of substrate board, coaxial placing in the constant head tank has the flexible gasket with the product contact, the central coaxial attaching of flexible gasket has the bed hedgehopping paster that touches with the substrate board, works as after putting into the substrate piece in the constant head tank, the surface height of substrate piece is higher than the height of blowing board.
Preferably, the substrate plate is a ceramic plate, and the thickness of the substrate plate is 2-4 mm.
Preferably, the material discharging plate is a resin plate, and the thickness of the material discharging plate is 2-3.5 mm.
Preferably, the flexible gasket is a polyurethane polishing leather, and the heightening patch is attached to the back surface of the polyurethane polishing leather.
Preferably, the flexible gasket has a diameter corresponding to the product.
Preferably, the ratio of the diameter of the heightening patch to the flexible gasket is 1: 10.
to sum up, the utility model has the advantages of it is following:
1. by adopting the scheme, the heightening patches with different specifications are attached to the bottom of the flexible gasket to control the BOW value of the bending degree, and a front and back symmetrical design is adopted, so that a plurality of substrate pieces can be clamped at one time, and the polishing efficiency is high; the pressure of a pressure plate of the double-sided polishing machine is utilized to enable the substrate slice to be bent and deformed, the middle part of the substrate slice protrudes outwards, and the substrate slice is polished and thinned by the double-sided polishing machine, so that the aim of finely trimming the BOW value is fulfilled, and the double-sided polishing machine has the characteristic of high precision;
2. the flexible gasket is made of polyurethane polishing leather waste and leftover materials, so that the production cost is reduced; after soaking, the substrate piece can be fixedly adsorbed in the positioning groove, the polishing stability is good, the waxing process is saved, and the efficiency is effectively improved.
Drawings
FIG. 1 is a schematic view of an exploded structure of the present embodiment;
fig. 2 is a schematic structural diagram of the present embodiment.
In the figure: 1. a substrate board; 2. a material placing plate; 21. positioning a groove; 3. a flexible gasket; 4. heightening the patch; 5. a substrate sheet.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A substrate clamp for a double-sided polishing machine is disclosed, and referring to FIGS. 1 and 2, the substrate clamp comprises a circular substrate plate 1, wherein the substrate plate 1 is a ceramic plate, and the thickness of the substrate plate is 2-4 mm; the two surfaces of the substrate plate 1 are symmetrically provided with material discharging plates 2 with the diameter consistent with that of the substrate plate 1, the material discharging plates 2 are resin plates, the thickness is 2-3.5 mm, and the material discharging plates 2 can be adhered to the two surfaces of the substrate plate 1 by an adhering method; a plurality of circular positioning grooves 21 are symmetrically arranged on the material placing plate 2 relative to the center, the positioning grooves 21 penetrate through the upper surface and the lower surface of the material placing plate 2, and the positioning grooves 21 are in one-to-one correspondence with the downward two surface directions of the substrate plate 1.
The flexible gasket 3 contacting with the product is coaxially arranged in the positioning groove 21, the diameter of the flexible gasket 3 is consistent with that of the product, and the diameters of the substrate plate 1, the material placing plate 2 and the positioning groove 21 can be customized according to the substrate sheet 5 product; the flexible gasket 3 is made of polyurethane polishing leather and is formed by cutting polyurethane polishing leather waste or leftover materials, so that the cost is saved, and the product can be stably adsorbed in the positioning groove 21 after being soaked in water; 3 central coaxial pastes of flexible pad has the bed hedgehopping paster 4 that touches with substrate board 1, and bed hedgehopping paster 4 pastes in the back of polyurethane polishing skin, makes the product of putting into and the positive laminating of polyurethane polishing skin, and the ratio of bed hedgehopping paster 4 diameter and flexible pad 3 is 1: 10, ensuring that the middle part of the substrate sheet 5 product is jacked up; the heightening paster can be made of a metal sheet, a ceramic sheet, a plastic sheet and a paper sheet, and cannot deform under pressure; by measuring the bending value of the polished substrate sheet 5, the heightening patch 4 and its material are selected to have a suitable thickness.
After putting into substrate piece 5 in the constant head tank 21, need to guarantee that the surface height of substrate piece 5 is higher than the height of blowing board 2 to under the pressure effect of two-sided burnishing machine, owing to the bed hedgehopping effect of bed hedgehopping paster 4, elastic deformation arch takes place for substrate piece 5, thins it through two-sided burnishing machine, repaiies crookedness BOW value, has high efficiency, the characteristics of high accuracy.
The polishing method comprises the following steps:
(1) and (3) thickness of the pad: according to the requirement of the BOW value of the bending degree of the substrate sheet 5, sticking a heightening patch 4 with required thickness at the center of the back surface of the flexible gasket 3, and then putting the flexible gasket 3 into the positioning groove 21;
(2) soaking: washing the surface of a substrate slice 5 clamp for a double-sided polishing machine to remove surface dust and dirt, soaking in pure water, and taking out to ensure that the front and back surfaces are wet;
(3) and (3) mounting: putting the substrate slices 5 to be polished into the positioning grooves 21 in sequence, and pressing and extruding redundant water to enable the substrate slices 5 to be adsorbed in the positioning grooves 21;
(4) polishing: put into planet wheel with 5 anchor clamps of substrate piece for the double-sided burnishing machine, then put into the double-sided burnishing machine in proper order, after the double-sided burnishing machine closed the dish, utilize bed hedgehopping paster 4 to make the substrate pad protruding, start the double-sided burnishing machine and grind the attenuate, make the crookedness BOW value reach the requirement.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications without inventive contribution to the present embodiment as required after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (6)
1. Substrate piece anchor clamps for two-sided burnishing machine, its characterized in that: including circular shape substrate board, two surface symmetries of substrate board are provided with the blowing board that diameter and substrate board are unanimous, be provided with the circular shape constant head tank of a plurality of about central symmetry on the blowing board, the constant head tank is followed two downward surface direction one-to-ones of substrate board, coaxial placing in the constant head tank has the flexible gasket with the product contact, the central coaxial attaching of flexible gasket has the bed hedgehopping paster that touches with the substrate board, works as after putting into the substrate piece in the constant head tank, the surface height of substrate piece is higher than the height of blowing board.
2. The substrate holder for a double-side polishing machine according to claim 1, characterized in that: the substrate board is the ceramic plate, and thickness is 2 ~ 4 mm.
3. The substrate holder for a double-side polishing machine according to claim 1, characterized in that: the material discharging plate is a resin plate, and the thickness of the material discharging plate is 2-3.5 mm.
4. The substrate holder for a double-side polishing machine according to claim 1, characterized in that: the flexible gasket is made of polyurethane polishing leather, and the heightening patch is attached to the back of the polyurethane polishing leather.
5. The substrate holder for a double-side polishing machine according to claim 4, characterized in that: the diameter of the flexible gasket is consistent with that of the product.
6. The substrate holder for a double-side polishing machine according to claim 1, characterized in that: the ratio of the diameter of the heightening patch to the diameter of the flexible gasket is 1: 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921885437.2U CN211414771U (en) | 2019-11-04 | 2019-11-04 | Substrate sheet clamp for double-sided polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921885437.2U CN211414771U (en) | 2019-11-04 | 2019-11-04 | Substrate sheet clamp for double-sided polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211414771U true CN211414771U (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921885437.2U Active CN211414771U (en) | 2019-11-04 | 2019-11-04 | Substrate sheet clamp for double-sided polishing machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN211414771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110695844A (en) * | 2019-11-04 | 2020-01-17 | 苏州爱彼光电材料有限公司 | Substrate sheet clamp for double-sided polishing machine and polishing method thereof |
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2019
- 2019-11-04 CN CN201921885437.2U patent/CN211414771U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110695844A (en) * | 2019-11-04 | 2020-01-17 | 苏州爱彼光电材料有限公司 | Substrate sheet clamp for double-sided polishing machine and polishing method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231130 Address after: No. 1 Yanyue Bridge North, Meiyan Lianhe Village, Pingwang Town, Wujiang District, Suzhou City, Jiangsu Province, 215221 Patentee after: Yangfan Semiconductor (Jiangsu) Co.,Ltd. Address before: 215000 558 FENHU Road, Wujiang District, Suzhou, Jiangsu Patentee before: SUZHOU EPI PHOTOELECTRIC MATERIAL CO.,LTD. |