CN211414575U - Acousto-optic-magnetic composite polishing device for semiconductor substrate - Google Patents

Acousto-optic-magnetic composite polishing device for semiconductor substrate Download PDF

Info

Publication number
CN211414575U
CN211414575U CN201922345505.2U CN201922345505U CN211414575U CN 211414575 U CN211414575 U CN 211414575U CN 201922345505 U CN201922345505 U CN 201922345505U CN 211414575 U CN211414575 U CN 211414575U
Authority
CN
China
Prior art keywords
polishing
polishing disk
component
acousto
optic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922345505.2U
Other languages
Chinese (zh)
Inventor
卓志佳
潘继生
阎秋生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong University of Technology
Original Assignee
Guangdong University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong University of Technology filed Critical Guangdong University of Technology
Priority to CN201922345505.2U priority Critical patent/CN211414575U/en
Application granted granted Critical
Publication of CN211414575U publication Critical patent/CN211414575U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The utility model relates to a technical field of ultra-precision machining, more specifically relates to a semiconductor substrate is with compound burnishing device of reputation magnetism, including magnetic current becomes polishing subassembly, the catalyst adds the subassembly, photocatalysis subassembly and megasonic wave catalysis subassembly, magnetic current becomes polishing subassembly and includes a driving motor, polishing axle and polishing dish, it is connected with a driving motor and polishes the axle and can stretch into to polishing dish inboard to polish the axle, the splendid attire has magnetic current becomes in polishing dish, polishing dish below is equipped with the electromagnetic component who forms magnetic field in polishing dish, the sub-unit connection of polishing dish has the rotatory drive assembly of drive polishing dish, the catalyst adds subassembly and polishing dish intercommunication, photocatalysis subassembly locates the polishing dish side, megasonic wave catalysis subassembly is connected with polishing dish. The utility model discloses add the catalyst in to magnetorheological suspensions, cooperation photocatalysis subassembly and megasonic wave catalysis subassembly, magnetorheological suspensions mechanical polishing goes on simultaneously with chemical oxidation corrosion action, has better machining efficiency and processingquality.

Description

Acousto-optic-magnetic composite polishing device for semiconductor substrate
Technical Field
The utility model relates to a technical field of ultra-precision machining, more specifically relates to a semiconductor substrate is with reputation magnetism composite polishing device.
Background
With the rapid development of high and new technology industries, the requirements on the processing quality and the processing efficiency of optical elements, electronic elements, aerospace devices, semiconductors and the like are higher and higher, and the magnetorheological polishing technology belongs to an ultra-precision processing technology. The magnetorheological polishing technology can enable the processing quality of the workpiece to be extremely high and the damage to the sub-surface of the workpiece to be extremely small, but the magnetorheological polishing technology has the following advantages: on one hand, the existing magnetorheological polishing technology adopts a permanent magnet to generate a magnetic field, the magnetic field intensity is uncontrollable, and the magnetism is reduced along with the lapse of time, so that the processing efficiency is low; on the other hand, magnetorheological polishing belongs to a mechanical removal mode, and contradiction exists between the processing efficiency and the surface processing quality.
Chinese patent CN201710085353.X discloses a disc type magnetorheological polishing device, which only depends on the mechanical action of magnetorheological polishing to remove when processing a material with strong brittleness and hardness and ensuring that the subsurface damage is extremely small, so that the time spent on removing the material is longer; chinese patent CN201210304530.6 discloses a chemical cluster magnetorheological composite processing method of a single crystal silicon carbide wafer, wherein chemical action is combined in magnetorheological fluid, the chemical action causes the surface of a workpiece to be oxidized and corroded, the surface of the workpiece is modified to be changed into an oxide material which is easy to process, but the chemical action is not obvious, the chemical action is far lower than the mechanical action, and the processing efficiency is not well improved; chinese patent CN201910675879.2 discloses a uniform and efficient polishing method combining pre-fenton treatment and magnetic field, which is to perform chemical pretreatment on a workpiece before magnetorheological polishing, and perform oxidation corrosion on the surface of the workpiece, so that the surface of the workpiece is modified to become an oxide material easy to process, but the thickness of the workpiece corroded by chemical action cannot be well controlled, and the processing thickness and the processing quality cannot be effectively controlled.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome not enough among the prior art, provide a semiconductor substrate is with reputation magnetism composite polishing device, adopt ultraviolet light and megasonic wave catalytic oxidation corrosion process increase chemical action, match mechanical action and chemical action, improve the machining efficiency and the processingquality of work piece.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the magneto-rheological polishing component comprises a first driving motor, a polishing shaft and a polishing disk, the polishing shaft is connected with the first driving motor and can extend into the inner side of the polishing disk, magneto-rheological fluid is contained in the polishing disk, an electromagnetic component for forming a magnetic field in the polishing disk is arranged below the polishing disk, and a driving component for driving the polishing disk to rotate is connected to the lower portion of the polishing disk, the catalyst adding component is communicated with the polishing disk and conveys a catalyst into the polishing disk, the photocatalytic component is arranged beside the polishing disk and transmits ultraviolet light to the inner side of the polishing disk, and the megasonic wave catalytic component is connected with the polishing disk and transmits megasonic waves to the inner side of the polishing disk.
The acousto-optic-magnetic composite polishing device for the semiconductor substrate adopts the electromagnetic component to replace the traditional permanent magnet, can ensure the stability and controllability of a magnetic field, and can adjust the appropriate magnetic field according to different workpiece requirements; the catalyst is added into the magnetorheological fluid through the catalyst adding component, and the catalyst is matched with the photocatalytic component and the megasonic catalytic component, so that the chemical reaction in the magnetorheological fluid can be accelerated, and the chemical action in the polishing process is improved; the utility model discloses in, magnetic current becomes mechanical polishing and chemical oxidation corrosion effect goes on simultaneously, has better machining efficiency and processingquality.
Furthermore, the magnetorheological polishing assembly further comprises a machine shell, a support and a slide rail, the first driving motor is connected with one end of the support, the other end of the support is connected with the slide rail in a sliding mode, and the slide rail is fixed on the machine shell. The bracket is connected with the sliding rail in a sliding way, and the heights of the polishing shaft and the workpiece can be adjusted to be in a working distance.
Furthermore, the driving assembly comprises a second driving motor and a spindle, the spindle is connected with the second driving motor, the spindle is connected with a clamping disc, and the polishing disc is connected with the clamping disc. The second driving motor drives the spindle to rotate, and the spindle drives the chuck plate and the polishing plate to rotate.
Furthermore, the electromagnetic assembly comprises an electric brush sliding ring sleeved on the main shaft and an electromagnet embedded in the clamping disc, and the electric brush sliding ring is electrically connected with the electromagnet. The brush slip ring is electrically connected with a coil on the electromagnet, so that the coil is electrified and a magnetic field is generated.
Further, the polishing disc is clamped on the clamping disc, the polishing disc is of a transparent structure, a polishing iron disc is laid at the bottom of the polishing disc, and the photocatalytic component is provided with a polishing disc side portion. The polishing disc is set to be of a transparent structure, and ultraviolet light emitted by the photocatalytic component can irradiate the magnetorheological fluid in the polishing disc, so that the chemical reaction in the magnetorheological fluid is accelerated.
Further, the catalyst adds the subassembly and includes box, delivery pump, transfer line and liquid suction pipe, the splendid attire has the catalyst in the box, the delivery pump is equipped with the water inlet of being connected with the liquid suction pipe and the delivery port of being connected with the transfer line, the one end of transfer line stretches into to the polishing dish. And pumping the catalyst in the box body into the magnetorheological fluid under the action of the delivery pump, so as to accelerate the chemical reaction in the magnetorheological fluid.
Furthermore, the photocatalysis component is a fan-shaped lamp bead light source capable of emitting ultraviolet rays, and the fan-shaped lamp bead light source is arranged on the side part of the polishing disc.
Further, megasonic catalysis subassembly includes anchor clamps, ultrasonic head and supersonic generator, anchor clamps and polishing dish lateral wall joint, the inboard one side of anchor clamps orientation polishing dish is located to the ultrasonic head, supersonic generator is connected with the ultrasonic head electricity. Megasonic waves generated by an ultrasonic generator are transmitted to the magnetorheological fluid through an ultrasonic head, and when waves on the surface of the catalyst are matched with the inherent frequency of chemical reaction, the catalysis rate is obviously improved by a 'resonance' mechanism, so that the chemical action in the polishing process is improved; meanwhile, the function of trimming the flexible polishing pad on line by megasonic vibration can be realized, unstable abrasive particles clamped in the magnetic chain string are removed, new abrasive particles are supplemented, and the updating of the abrasive is realized.
Further, the clamp comprises a clamp body and a connecting frame, and the clamp body and the connecting frame are connected to form a clamping part connected with the side wall of the polishing disc; the multiple groups of ultrasonic heads are arranged on the clamp body at equal angles, and the clamp body is provided with a cambered surface attached to the inner wall surface of the polishing disk.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model adopts the electromagnetic component to replace the traditional permanent magnet, which can ensure the stability and controllability of the magnetic field and adjust the appropriate magnetic field according to different work piece requirements; the chemical reaction in the magnetorheological fluid is accelerated by adding a catalyst into the magnetorheological fluid and matching with a photocatalytic component and a megasonic catalytic component, so that the chemical action in the polishing process is improved; the magnetorheological mechanical polishing and the chemical oxidation corrosion are simultaneously carried out, and the machining efficiency and the machining quality are better.
Drawings
FIG. 1 is a schematic view showing the structure of an acousto-optic-magnetic composite polishing apparatus for a semiconductor substrate;
FIG. 2 is an isometric view of an acousto-optic-magnetic composite polishing apparatus for semiconductor substrates;
FIG. 3 is a schematic structural view of a catalyst adding assembly of the acousto-optic-magnetic composite polishing apparatus for semiconductor substrates;
FIG. 4 is an isometric view of a megasonic catalytic assembly of an acousto-optic-magnetic composite polishing apparatus for semiconductor substrates;
FIG. 5 is a rear view of a megasonic catalytic assembly of the acousto-optic-magnetic composite polishing apparatus for semiconductor substrates;
FIG. 6 is a schematic view showing the structure of a chuck plate of the acousto-optic-magnetic composite polishing apparatus for semiconductor substrates;
in the drawings: 1-a magnetorheological finishing component; 11-a first drive motor; 12-a polishing shaft; 13-a polishing disc; 14-a housing; 15-a scaffold; 16-a slide rail; 17-polishing the iron disc; 2-a catalyst addition component; 21-a box body; 22-a delivery pump; 23-a transfusion tube; 24-a liquid extracting pipe; 25-a magnetic stirring device; 3-a photocatalytic component; a 4-megasonic catalytic component; 41-a clamp; 42-an ultrasonic head; 43-ultrasonic generator; 44-a clip body; 45-a connecting frame; 46-height adjustment knob; 5-an electromagnetic assembly; 51-brush slip ring; 52-an electromagnet; 6-a drive assembly; 61-a second drive motor; 62-a main shaft; 63-a reducer; 64-a coupling; 65-a thrust bearing; 66-clamping disc; 67-mounting groove.
Detailed Description
The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
Example one
Fig. 1 to 6 show an embodiment of the acousto-optic-magnetic composite polishing device for semiconductor substrates according to the present invention, which includes a magnetorheological polishing component 1, a catalyst adding component 2, a photocatalytic component 3, and a megasonic catalytic component 4, wherein the magnetorheological polishing component 1 includes a first driving motor 11, a polishing shaft 12, and a polishing disk 13, the polishing shaft 12 is connected to the first driving motor 11, the polishing shaft 12 can extend into the polishing disk 13, the polishing disk 13 contains magnetorheological fluid, an electromagnetic component 5 is disposed below the polishing disk 13 and forms a magnetic field in the polishing disk 13, the lower portion of the polishing disk 13 is connected to a driving component 6 for driving the polishing disk 13 to rotate, the catalyst adding component 2 is communicated with the polishing disk 13 to transport a catalyst into the polishing disk 13, the photocatalytic component 3 is disposed beside the polishing disk 13 and emits ultraviolet light to the inner side of the polishing disk 13, the megasonic catalytic assembly 4 is connected with the polishing disk 13 and emits megasonic waves to the inner side of the polishing disk 13. The type and concentration of the catalyst and the type and concentration of the magnetorheological fluid in the embodiment can be selected according to the type of the workpiece to be processed, and the light emitted by the photocatalytic component 3 in the embodiment is not limited to ultraviolet light, and can be adjusted to light such as infrared light, visible light and the like according to the catalytic acceleration requirement.
In the implementation of the embodiment, the electromagnetic assembly 5 is adopted to replace a traditional permanent magnet, so that the stability and controllability of the magnetic field can be ensured, and the appropriate magnetic field can be adjusted according to different workpiece requirements; the catalyst is added into the magnetorheological fluid through the catalyst adding component 2, and the chemical reaction in the magnetorheological fluid can be accelerated by matching with the photocatalytic component 3 and the megasonic catalytic component 4, so that the chemical action in the polishing process is improved; the magnetorheological mechanical polishing and the chemical oxidation corrosion are simultaneously carried out, and the machining efficiency and the machining quality are better.
As shown in fig. 1 to 2, the magnetorheological polishing assembly 1 further includes a housing 14, a bracket 15 and a slide rail 16, the first driving motor 11 is connected to one end of the bracket 15, the other end of the bracket 15 is slidably connected to the slide rail 16, and the slide rail 16 is fixed to the housing 14. In this embodiment, the slide rail 16 is a commercially available lead screw slide rail 16, the lead screw slide rail 16 is provided with a slider and a servo motor, the other end of the bracket 15 is connected with the slider, and the servo motor can drive the slider to ascend or descend by forward and reverse rotation to adjust the distance between the polishing shaft 12 and the bottom of the polishing disk 13. However, the slide rail 16 of this embodiment is not limited to the screw slide rail 16, and other lifting mechanisms capable of driving the support 15 to ascend and descend may also be applicable to the present invention.
As shown in fig. 1, the driving assembly 6 is disposed inside the housing 14, and includes a second driving motor 61 and a spindle 62, the spindle 62 is connected to the second driving motor 61, the spindle 62 is connected to a chuck 66, and the polishing disk 13 is connected to the chuck 66; in this embodiment, the second driving motor 61 drives the spindle 62 to rotate, and the spindle 62 drives the chuck 66 and the polishing disk 13 to rotate. In the present embodiment, a speed reducer 63 is connected to an output end of the second driving motor 61, a coupling 64 is connected between the speed reducer 63 and the main shaft 62, and a thrust bearing 65 is provided at a connection point between the main shaft 62 and the housing 14, but these arrangements are preferable for increasing the stability of rotation of the main shaft 62 and the stability of connection between the components of the driving assembly 6, and are not limited to the above. In this embodiment, the polishing disk 13 is clamped on the clamping plate 66, the polishing disk 13 is of a transparent structure, the polishing iron disk 17 is laid at the bottom of the polishing disk 13, and the photocatalytic component 3 is provided with the side part of the polishing disk 13, so that ultraviolet light emitted by the photocatalytic component 3 can irradiate the magnetorheological fluid in the polishing disk 13, thereby accelerating the chemical reaction in the magnetorheological fluid; it should be noted that the position of the photocatalytic component 3 and the material of the polishing disc 13 do not serve as the restrictive provisions of the present invention, and other settings that can irradiate the ultraviolet light emitted by the photocatalytic component 3 to the magnetorheological fluid are also applicable to the present invention.
As shown in fig. 1, the electromagnetic assembly 5 includes a brush slip ring 51 sleeved on the main shaft 62, and an electromagnet 52 embedded on the chuck 66, wherein the brush slip ring 51 is electrically connected with the electromagnet 52; the principle of the magnetic field generated by the electromagnet 52 is consistent, and the brush slip ring 51 is electrically connected with the coil on the electromagnet 52, so that the energization of the coil and the generation of the magnetic field can be ensured. The electromagnets 52 in this embodiment may be provided in multiple groups, and multiple groups of mounting grooves 67 may be provided on the chuck 66, and the multiple groups of mounting grooves 67 are uniformly arranged. As shown in fig. 6, in the present embodiment, an inner ring installation groove 67 and an outer ring installation groove 67 may be provided, 1 to 6 electromagnets 52 are disposed on the inner ring installation groove 67, 1 to 12 electromagnets 52 are disposed on the outer ring installation groove 67, and the magnetic field strength of the electromagnetic field is in a range of 0T to 2T.
As shown in fig. 3, the catalyst adding assembly 2 includes a box 21, a delivery pump 22, a liquid delivery pipe 23 and a liquid pumping pipe 24, the box 21 contains a catalyst, the delivery pump 22 is provided with a water inlet connected to the liquid pumping pipe 24 and a water outlet connected to the liquid delivery pipe 23, one end of the liquid delivery pipe 23 extends into the polishing tray 13, and the other end of the liquid delivery pipe 23 is rotatably connected to the water outlet. Specifically, the box body 21 of the embodiment is divided into two sides by a box wall, the delivery pump 22, the infusion tube 23 and the liquid pumping tube 24 are installed on one side, the box wall is provided with a through hole, the liquid pumping tube 24 passes through the through hole and stretches across to the other side of the box body 21, the magnetic stirring device 25 is installed on the other side of the box body 21, so that the catalyst is stirred in real time, and the bad influence on the catalytic efficiency caused by the precipitation and deterioration of the catalyst is prevented; under the action of the delivery pump 22, the catalyst in the box 21 is pumped into the magnetorheological fluid, so that the chemical reaction in the magnetorheological fluid is accelerated.
The photocatalysis component 3 of this embodiment is the fan-shaped lamp pearl light source of emittance ultraviolet ray, the lateral part of polishing dish 13 is located to fan-shaped lamp pearl light source. The fan-shaped lamp bead light source in the embodiment can be provided with 1-5 rows of lamp beads, the emitted light source is not limited to ultraviolet light, and the light source can be adjusted to be infrared light, visible light or ultraviolet light within the wavelength range of 100 nm-1000 nm according to the requirement of chemical reaction.
As shown in fig. 4 to 5, the megasonic catalytic assembly 4 includes a clamp 41, an ultrasonic head 42, and an ultrasonic generator 43, the clamp 41 is clamped to the sidewall of the polishing disk 13, the ultrasonic head 42 is disposed on one side of the clamp 41 facing the inner side of the polishing disk 13, and the ultrasonic generator 43 is electrically connected to the ultrasonic head 42. Megasonic waves generated by the ultrasonic generator 43 are transmitted to the magnetorheological fluid through the ultrasonic head 42, and when the wave on the surface of the catalyst is matched with the inherent frequency of the chemical reaction, the catalysis rate is obviously improved by a 'resonance' mechanism, so that the chemical action in the polishing process is improved; meanwhile, the function of trimming the flexible polishing pad on line by megasonic vibration can be realized, unstable abrasive particles clamped in the magnetic chain string are removed, new abrasive particles are supplemented, and the updating of the abrasive is realized. The clamp 41 comprises a clamp body 44 and a connecting frame 45, wherein the clamp body 44 and the connecting frame 45 are connected to form a clamping part connected with the side wall of the polishing disc 13; the ultrasonic heads 42 are arranged at equal angles on the inner side of the holder 44, and the outer side of the holder 44 is attached to the inner wall of the polishing pad 13, but the shape of the holder 44 is not limited to the specific shape. In order to realize the height adjustment of the megasonic catalytic assembly 4, in this embodiment, a height adjustment knob 46 penetrates through the connecting frame 45, and one end of the height adjustment knob 46 penetrates through the connecting frame 45 to contact with the polishing disk 13 to realize the connection between the megasonic catalytic assembly 4 and the polishing disk 13; thus, adjusting the height of the height adjustment knob 46 can adjust the height of the megasonic catalytic assembly 4. In addition, in this embodiment, the acceleration frequency of the megasonic waves emitted by the megasonic catalytic assembly 4 may be adjusted within a range of 10kHz to 10MHz according to the actual application.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. An acousto-optic-magnetic composite polishing device for a semiconductor substrate is characterized by comprising a magneto-rheological polishing component (1), a catalyst adding component (2), a photocatalytic component (3) and a megasonic catalytic component (4), wherein the magneto-rheological polishing component (1) comprises a first driving motor (11), a polishing shaft (12) and a polishing disk (13), the polishing shaft (12) is connected with the first driving motor (11), the polishing shaft (12) can extend into the inner side of the polishing disk (13), magneto-rheological fluid is contained in the polishing disk (13), an electromagnetic component (5) for forming a magnetic field in the polishing disk (13) is arranged below the polishing disk (13), a driving component (6) for driving the polishing disk (13) to rotate is connected to the lower part of the polishing disk (13), the catalyst adding component (2) is communicated with the polishing disk (13) to convey a catalyst into the polishing disk (13), the photocatalysis component (3) is arranged beside the polishing disk (13) and emits ultraviolet light to the inner side of the polishing disk (13), and the megasonic wave catalysis component (4) is connected with the polishing disk (13) and emits megasonic waves to the inner side of the polishing disk (13).
2. The acousto-optic-magnetic composite polishing device for the semiconductor substrate according to claim 1, wherein the magnetorheological polishing assembly (1) further comprises a housing (14), a bracket (15) and a slide rail (16), the first driving motor (11) is connected with one end of the bracket (15), the other end of the bracket (15) is slidably connected with the slide rail (16), and the slide rail (16) is fixed on the housing (14).
3. The acousto-optic-magnetic composite polishing device for semiconductor substrates according to claim 2, wherein the drive assembly (6) includes a second drive motor (61) and a spindle (62), the spindle (62) is connected with the second drive motor (61), the spindle (62) is connected with a chuck plate (66), and the polishing disk (13) is connected with the chuck plate (66).
4. The acousto-optic-magnetic composite polishing device for semiconductor substrates according to claim 3, wherein the electromagnetic assembly (5) comprises a brush slip ring (51) sleeved on the spindle (62), and an electromagnet (52) embedded in the chuck (66), wherein the brush slip ring (51) is electrically connected with the electromagnet (52).
5. The acousto-optic-magnetic composite polishing device for semiconductor substrates according to claim 3, wherein the polishing disk (13) is clamped to a clamping plate (66), the polishing disk (13) is of a transparent structure, a polishing iron disk (17) is laid on the bottom of the polishing disk (13), and the photocatalytic component (3) is provided with the side part of the polishing disk (13).
6. The acousto-optic-magnetic composite polishing device for the semiconductor substrate according to any one of claims 1 to 5, wherein the catalyst adding assembly (2) comprises a box body (21), a delivery pump (22), a liquid conveying pipe (23) and a liquid pumping pipe (24), the box body (21) contains the catalyst, the delivery pump (22) is provided with a water inlet connected with the liquid pumping pipe (24) and a water outlet connected with the liquid conveying pipe (23), and one end of the liquid conveying pipe (23) extends into the polishing disk (13).
7. The acousto-optic-magnetic composite polishing device for semiconductor substrates according to claim 6, wherein the photocatalytic component (3) is a fan-shaped lamp bead light source capable of emitting ultraviolet rays, and the fan-shaped lamp bead light source is arranged on the side of the polishing disk (13).
8. The acousto-optic-magnetic composite polishing device for the semiconductor substrate according to claim 6, wherein the megasonic catalytic assembly (4) comprises a clamp (41), an ultrasonic head (42) and an ultrasonic generator (43), the clamp (41) is clamped with the side wall of the polishing disk (13), the ultrasonic head (42) is arranged on one side of the clamp (41) facing the inner side of the polishing disk (13), and the ultrasonic generator (43) is electrically connected with the ultrasonic head (42).
9. The acousto-optic-magnetic composite polishing apparatus for semiconductor substrates according to claim 8, wherein the jig (41) includes a clamp body (44) and a connecting frame (45), and the clamp body (44) and the connecting frame (45) are connected to form a clamping portion connected to the side wall of the polishing disk (13).
10. The acousto-optic-magnetic composite polishing device for semiconductor substrates according to claim 9, wherein the ultrasonic heads (42) are in multiple groups, the multiple groups of ultrasonic heads (42) are arranged at equal angles on the clamp body (44), and the clamp body (44) is provided with an arc surface attached to the inner wall surface of the polishing disk (13).
CN201922345505.2U 2019-12-23 2019-12-23 Acousto-optic-magnetic composite polishing device for semiconductor substrate Expired - Fee Related CN211414575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922345505.2U CN211414575U (en) 2019-12-23 2019-12-23 Acousto-optic-magnetic composite polishing device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922345505.2U CN211414575U (en) 2019-12-23 2019-12-23 Acousto-optic-magnetic composite polishing device for semiconductor substrate

Publications (1)

Publication Number Publication Date
CN211414575U true CN211414575U (en) 2020-09-04

Family

ID=72250531

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922345505.2U Expired - Fee Related CN211414575U (en) 2019-12-23 2019-12-23 Acousto-optic-magnetic composite polishing device for semiconductor substrate

Country Status (1)

Country Link
CN (1) CN211414575U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948293A (en) * 2019-12-23 2020-04-03 广东工业大学 Acousto-optic-magnetic composite polishing device and polishing method for semiconductor substrate
CN113386045A (en) * 2021-07-15 2021-09-14 南华大学 Deep ultraviolet electro-catalysis assisted magnetorheological elastomer flattening device and method
CN113831845A (en) * 2021-10-29 2021-12-24 大连理工大学 Visible light-assisted diamond chemical mechanical polishing solution and polishing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948293A (en) * 2019-12-23 2020-04-03 广东工业大学 Acousto-optic-magnetic composite polishing device and polishing method for semiconductor substrate
CN110948293B (en) * 2019-12-23 2024-03-22 广东工业大学 Acousto-optic-magnetic composite polishing device and polishing method for semiconductor substrate
CN113386045A (en) * 2021-07-15 2021-09-14 南华大学 Deep ultraviolet electro-catalysis assisted magnetorheological elastomer flattening device and method
CN113831845A (en) * 2021-10-29 2021-12-24 大连理工大学 Visible light-assisted diamond chemical mechanical polishing solution and polishing method

Similar Documents

Publication Publication Date Title
CN211414575U (en) Acousto-optic-magnetic composite polishing device for semiconductor substrate
CN110948293A (en) Acousto-optic-magnetic composite polishing device and polishing method for semiconductor substrate
JP3620554B2 (en) Semiconductor wafer manufacturing method
US20130244551A1 (en) Polishing mechanism and manipulator using the polishing mechanism
CN105458839A (en) Magnetorheological polishing method and device
KR20010021731A (en) Substrate polishing
CN111069984B (en) Dynamic magnetic field magnetorheological polishing device and polishing method
CN112692716B (en) Inner surface magnetic field auxiliary finishing device and method based on controllable magnetic field
CN102091975A (en) Magnetorheological polishing method for free-form surface of mould
CN215700759U (en) Magnetorheological polishing vessel convenient to clean and polishing device
TWM314092U (en) Magnetism grinding and polishing apparatus
JP5735974B2 (en) Magnet fixture
CN204935268U (en) A kind of workpiece multiple degrees of freedom driving mechanism of MRF equipment
CN100484709C (en) Bidimensional fluid vibration ultra smooth surface polishing equipment and its polishing method
CN113290501A (en) Diamond wafer composite polishing processing method and device
CN210879141U (en) Glass sweeps ray apparatus
CN210615995U (en) Ultrasonic vibration assisted magnetorheological ultra-precise polishing device
CN211681233U (en) Dynamic magnetic field magneto-rheological polishing device
CN112296862B (en) Magnetorheological polishing device, polishing processing method and application
CN108284352A (en) One kind being suitable for sapphire sheet burnishing device and polishing method before laser lift-off
CN109093466A (en) A kind of manufacturing equipment of seamless steel pipe
CN112658958A (en) Cluster magnetorheological ultrasonic composite polishing device and method
CN208759253U (en) Lower groove grinding device in a kind of automatic loading/unloading formula
CN217291800U (en) Horizontal steel surface polishing device for machining
CN214642748U (en) Chemical mechanical polishing device and polishing system using light assistance

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200904