CN211406656U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN211406656U CN211406656U CN201921595119.2U CN201921595119U CN211406656U CN 211406656 U CN211406656 U CN 211406656U CN 201921595119 U CN201921595119 U CN 201921595119U CN 211406656 U CN211406656 U CN 211406656U
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- heat dissipation
- heat
- dissipation mechanism
- electronic equipment
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Abstract
The utility model provides a heat abstractor and electronic equipment. The heat dissipation device is used for dissipating heat flow in the electronic equipment; the heat dissipation device comprises a heat dissipation mechanism and a heat dissipation mechanism which are arranged in the shell of the electronic equipment; the heat dissipation mechanism and the inner wall of the shell form a heat dissipation air channel; the heat dissipation mechanism is arranged at an air inlet of the heat dissipation air channel; when the heat dissipation mechanism is started, the heat dissipation mechanism drives the heat flow to the heat dissipation mechanism. The utility model extracts the hot air flow in the electronic equipment through the heat dissipation mechanism and leads the hot air flow to the radiating fins, thereby realizing the high-efficiency heat dissipation function of the hot air flow in the electronic equipment; the arrangement of the heat dissipation mechanism and the heat dissipation sheet does not influence the layout of the PCB and is not limited by the spatial position around the installation of the electronic equipment; the flowing direction of hot air flow in the electronic equipment is controlled by the radiating fins, so that the radiating effect is better.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation, especially, relate to a heat abstractor and electronic equipment.
Background
With the continuous development of electronic assembly technology, the volume of electronic equipment tends to be miniaturized, systems tend to be complicated, high heat density becomes an irresistible development trend, and in order to meet the requirement of high heat density, a heat dissipation structure becomes a standard configuration of the electronic equipment. The traditional heat dissipation scheme comprises the following steps: (1) the auxiliary material of the heat dissipation film is added for dredging, the thickness is generally 0.01-0.2mm, such as a graphite heat dissipation film, a nano composite graphite film, a copper foil and the like; (2) an axial fan is adopted for heat dissipation; (3) natural air convection is adopted.
The above-mentioned conventional heat dissipation scheme has the following disadvantages: (1) the heat dissipation film is only required to be arranged near the main heating source, so that the space is occupied, and the arrangement position of the electronic equipment is limited; (2) axial fans can occupy PCB area or affect PCB layout: (3) the passive heat dissipation method cannot meet the heat dissipation requirement.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide a heat abstractor and electronic equipment realizes high-efficient radiating function in to electronic equipment through utilizing centrifugal fan and fin for solve among the prior art not enough, the restricted problem of spatial layout position of heat abstractor's heat dissipation dynamics.
To achieve the above and other related objects, the present invention provides a heat dissipation device for dissipating heat flow in an electronic device; the heat dissipation device comprises a heat dissipation mechanism and a heat dissipation mechanism which are arranged in the shell of the electronic equipment; the heat dissipation mechanism and the inner wall of the shell form a heat dissipation air channel; the heat dissipation mechanism is arranged at an air inlet of the heat dissipation air channel; when the heat dissipation mechanism is started, the heat dissipation mechanism drives the heat flow to the heat dissipation mechanism.
In an embodiment of the present invention, the heat dissipation mechanism is a centrifugal fan or an exhaust fan, and the centrifugal fan or the exhaust fan is assembled on the heat dissipation mechanism.
In an embodiment of the present invention, the heat dissipation mechanism includes a heat dissipation plate forming the heat dissipation air channel with the inner wall and a fin disposed on the heat dissipation plate; the fins divide the heat dissipation air duct into independent air ducts.
In an embodiment of the present invention, the fins are disposed along a flowing direction of the airflow in the heat dissipation air duct.
In an embodiment of the present invention, the number of the fins is at least one.
In an embodiment of the present invention, the heat sink is made of a heat conductive metal material.
In an embodiment of the present invention, the longitudinal section of the heat sink is a concave structure.
In an embodiment of the present invention, an air opening is disposed on the housing, and the air outlet of the heat dissipation air duct is connected to the air opening; the heat dissipation mechanism is used for driving the heat flow to the heat dissipation mechanism, so that the heat flow is discharged to the outside of the shell through the air opening.
In an embodiment of the present invention, the housing is provided with a plurality of external air inlet holes; when the heat driving mechanism pumps the gas in the electronic equipment, external gas enters the electronic equipment through the external air inlet hole.
The utility model provides an electronic equipment, including foretell heat abstractor.
As described above, the heat dissipation device and the electronic apparatus of the present invention have the following advantageous effects:
(1) hot air flow in the electronic equipment is extracted through the heat dissipation mechanism, and the hot air flow flows to the radiating fins, so that the efficient heat dissipation function of the hot air flow in the electronic equipment is realized;
(2) the arrangement of the heat dissipation mechanism and the heat dissipation sheet does not occupy the area of the PCB or influence the layout of the PCB, and is not limited by the space position around the installation of the electronic equipment;
(3) the flowing direction of hot air flow in the electronic equipment is controlled by the radiating fins, so that the radiating effect is better.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
Fig. 2 is a schematic top view of a heat sink according to an embodiment of the present invention.
Description of the element reference numerals
1 casing
2 Heat sink
3 heat-dissipating mechanism
4 fin
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
The heat dissipation device and the electronic equipment of the utility model extract the hot air flow in the electronic equipment through the heat dissipation mechanism and lead the hot air flow to the radiating fins, thus realizing the high-efficiency heat dissipation function of the hot air flow in the electronic equipment; the arrangement of the heat dissipation mechanism and the heat dissipation sheet does not influence the layout of the PCB and is not limited by the spatial position around the installation of the electronic equipment; the flowing direction of hot air flow in the electronic equipment is controlled by the radiating fins, so that the radiating effect is better.
Example one
The embodiment provides a heat dissipation device for dissipating heat flow in an electronic device; the heat dissipation device comprises a heat dissipation mechanism and a heat dissipation mechanism which are arranged in the shell of the electronic equipment; the heat dissipation mechanism and the inner wall of the shell form a heat dissipation air channel; the heat dissipation mechanism is arranged at an air inlet of the heat dissipation air channel; when the heat dissipation mechanism is started, the heat dissipation mechanism drives the heat flow to the heat dissipation mechanism.
The heat sink provided by the present embodiment will be described in detail below with reference to fig. 1 and 2.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention. As shown in fig. 1, the heat dissipation device of the present invention is used for dissipating heat flow in an electronic device; the heat dissipation device comprises a heat dissipation mechanism and a heat dissipation mechanism 3 which are both arranged in the electronic equipment shell 1; the heat dissipation mechanism and the inner wall of the shell 1 form a heat dissipation air channel; the heat dissipation mechanism 3 is arranged at an air inlet of the heat dissipation air channel; when the heat dissipation mechanism 3 is started, the heat dissipation mechanism 3 drives the heat flow to the heat dissipation mechanism.
It should be noted that the installation position of heat dissipation mechanism in the casing 1 is not regarded as the restriction the utility model discloses a condition, promptly the heat dissipation mechanism as long as in the casing 1 with the casing 1 inner wall forms the heat dissipation wind channel, in the heat dissipation process for the interior thermal current of electronic equipment can in the heat dissipation wind channel under the effect of heat dissipation mechanism 3, specific installation position can be decided according to actual installation demand.
Specifically, when the electronic device works, the heat dissipation mechanism 3 is started, so that the heat dissipation mechanism 3 drives the hot air flow in the electronic device to flow into the heat dissipation air duct formed by the heat dissipation mechanism and the housing 1, and the purpose of dissipating heat in the electronic device is achieved through the heat dissipation effect of the heat dissipation mechanism on the hot air flow.
In this embodiment, the heat dissipation mechanism 3 is a centrifugal fan or an exhaust fan, and the centrifugal fan or the exhaust fan is assembled on the heat dissipation mechanism.
Specifically, the centrifugal fan or the exhaust fan is assembled on the heat dissipation mechanism, so that the space occupied by the whole heat dissipation device can be reduced, and the influence of the assembly of the heat dissipation device in the housing 1 on the layout of the PCB in the housing 1 is avoided.
Fig. 2 is a schematic top view of a heat sink according to an embodiment of the present invention. As shown in fig. 2, the heat dissipation mechanism includes a heat dissipation plate 2 forming the heat dissipation air duct with the inner wall, and a fin 4 disposed on the heat dissipation plate 2; the fins 4 divide the heat dissipation air duct into independent air ducts.
In this embodiment, the longitudinal section of the heat sink 2 is a concave structure, forming the concave heat dissipation air duct; the fins 4 are arranged along the flowing direction of the airflow in the heat dissipation air duct; the number of the fins 4 is at least one. Specifically, the heat sink 2 is provided with at least one fin 4, and the fin 4 divides the concave-shaped heat dissipation air duct into at least two independent air ducts, so that hot air can be separated during heat dissipation, the hot air can dissipate heat along the independent air ducts, and the heat dissipation effect on the hot air is better.
In this embodiment, the heat sink 2 is made of a heat conductive metal material. Specifically, the heat sink 2 is made of a heat conductive metal having a good heat conductive effect, for example, copper, and a better heat dissipation effect can be achieved. Similarly, the fins 4 are also made of a heat-conducting metal material.
In this implementation, an air port is arranged on the housing 1, and an air outlet of the heat dissipation air duct is connected with the air port; the heat dissipation mechanism 3 drives the heat flow to the heat dissipation mechanism, so that the heat flow is discharged to the outside of the shell 1 through the air opening.
Specifically, in the working process of the heat dissipation device, the heat dissipation mechanism 3 firstly draws the hot air flow in the electronic device into the heat dissipation air duct formed by the heat dissipation fins 2 and the housing 1, and finally flows to the outside of the housing 1 through the air opening after passing through the heat dissipation effect of the heat dissipation air duct on the hot air flow.
Furthermore, the air port not only can be used as an exhaust port for air flow in the heat dissipation air duct, but also can be used as an inlet port for external air to enter the electronic equipment while being used as an exhaust port for air flow in the heat dissipation air duct, so that convection between the air in the electronic equipment and the external air is realized, and a better heat dissipation effect is achieved; specifically, the air port is arranged on the side wall of the shell 1, the air port comprises an upper part and a lower part, and the upper part is used as an air outlet of air flow in the heat dissipation air duct and is connected with an air outlet of the heat dissipation air duct; the lower part of the heat dissipation mechanism is used as an inlet for external air to enter the electronic equipment, and when the heat dissipation mechanism 3 pumps the air in the electronic equipment, the external air enters the electronic equipment through the inlet; the upper part is connected with the air outlet of the heat dissipation air duct, the lower part is used as an inlet for external air to enter the electronic equipment, and the two parts form two independent channels, so that the two independent channels cannot generate cross influence with each other in the actual heat dissipation process, and the design of an air port structure for external air to enter the electronic equipment on the shell can be reduced; of course, the upper portion may also be used as an inlet for external air to enter the electronic device, and the lower portion may be used as an outlet for airflow in the heat dissipation air duct.
In this embodiment, the housing 1 is provided with a plurality of external air inlet holes; when the heat driving mechanism 3 pumps the gas in the electronic equipment, external gas enters the electronic equipment through the external air inlet hole.
Specifically, when the heat dissipation mechanism 3 pumps the gas in the electronic device, the external gas enters the electronic device through the external air inlet hole, the hot gas flow in the electronic device enters the heat dissipation air duct along with the external gas, and after the heat dissipation effect of the heat dissipation air duct, the hot gas is discharged to the outside of the housing 1 through the air opening.
It is further explained that, when the external air is pumped into the casing 1 through the external air inlet hole, the air port may be only used as the outlet of the air flow in the heat dissipation air duct, or certainly, a part of the air port may be used as the outlet of the air flow in the heat dissipation air duct and connected to the air outlet of the heat dissipation air duct; the other part is used as an inlet for external gas to enter the electronic equipment, namely the other part is equivalent to the external air inlet hole.
The heat dissipation device provided by the present embodiment is further verified by the following specific embodiments.
The heat dissipation device provided by the embodiment is applied to a vehicle-mounted entertainment system host and used for dissipating heat flow in the vehicle-mounted entertainment system host; the heat dissipation device comprises a heat dissipation sheet and a centrifugal fan which are arranged in a main machine shell of the vehicle-mounted entertainment system; the radiating fins are arranged on the upper end cover of the shell, and a radiating air duct is formed between the radiating fins and the upper end cover; the centrifugal fan is arranged at an air inlet of the heat dissipation air channel; when the centrifugal fan is started, the centrifugal fan drives the heat flow to the heat radiating fin.
The shell is provided with an air port and an external air inlet hole, and an air outlet of the heat dissipation air channel is connected with the air port; when the centrifugal fan pumps the air in the vehicle-mounted entertainment system host, the external air enters the vehicle-mounted entertainment system host through the external air inlet; the heat dissipation fins are arranged on the heat dissipation fins and divide the heat dissipation air channel into independent air channels; the fins are arranged along the flowing direction of the airflow in the heat dissipation air duct.
Example two
The utility model provides an electronic equipment, including foretell heat abstractor.
Specifically, the electronic device achieves the effect of dissipating heat flow in the electronic device through the heat dissipation device.
To sum up, the heat dissipation device and the electronic equipment of the present invention extract the hot air flow in the electronic equipment through the heat dissipation mechanism, and let the hot air flow to the heat dissipation plate, thereby realizing the high-efficiency heat dissipation function of the hot air flow in the electronic equipment; the arrangement of the heat dissipation mechanism and the heat dissipation sheet does not influence the layout of the PCB and is not limited by the spatial position around the installation of the electronic equipment; the flowing direction of hot air flow in the electronic equipment is controlled by the radiating fins, so that the radiating effect is better. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A heat dissipation device for dissipating heat flow within an electronic device; the heat dissipation device comprises a heat dissipation mechanism and a heat dissipation mechanism which are arranged in the shell of the electronic equipment; the heat dissipation mechanism and the inner wall of the shell form a heat dissipation air channel; the heat dissipation mechanism is arranged at an air inlet of the heat dissipation air channel; when the heat dissipation mechanism is started, the heat dissipation mechanism drives the heat flow to flow into a heat dissipation air channel formed by the heat dissipation mechanism and the shell, and the purpose of dissipating heat in the electronic equipment is achieved through the heat dissipation effect of the heat dissipation mechanism on the heat flow; the heat dissipation mechanism is characterized in that the heat dissipation mechanism is a centrifugal fan or an exhaust fan, and the centrifugal fan or the exhaust fan is assembled on the heat dissipation mechanism.
2. The heat dissipating device of claim 1, wherein the heat dissipating mechanism comprises a heat sink forming the heat dissipating air channel with the inner wall and a fin disposed on the heat sink; the fins divide the heat dissipation air duct into independent air ducts.
3. The heat dissipating device of claim 2, wherein the fins are arranged along a flow direction of the airflow in the heat dissipating air duct.
4. The heat dissipating device of claim 2, wherein the number of fins is at least one.
5. The heat dissipating device of claim 2, wherein said heat sink is made of a thermally conductive metal.
6. The heat sink of claim 2, wherein the fins have a concave configuration in longitudinal cross-section.
7. The heat dissipation device of claim 1, wherein an air opening is formed in the housing, and an air outlet of the heat dissipation air duct is connected with the air opening; the heat dissipation mechanism is used for driving the heat flow to the heat dissipation mechanism, so that the heat flow is discharged to the outside of the shell through the air opening.
8. The heat dissipating device of claim 7, wherein the housing defines a plurality of external inlet openings; when the heat driving mechanism pumps the gas in the electronic equipment, external gas enters the electronic equipment through the external air inlet hole.
9. An electronic device, characterized by comprising the heat dissipating apparatus according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921595119.2U CN211406656U (en) | 2019-09-24 | 2019-09-24 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921595119.2U CN211406656U (en) | 2019-09-24 | 2019-09-24 | Heat dissipation device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211406656U true CN211406656U (en) | 2020-09-01 |
Family
ID=72232313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921595119.2U Active CN211406656U (en) | 2019-09-24 | 2019-09-24 | Heat dissipation device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211406656U (en) |
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2019
- 2019-09-24 CN CN201921595119.2U patent/CN211406656U/en active Active
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