CN211404759U - Copper-coated flat steel grounding material - Google Patents

Copper-coated flat steel grounding material Download PDF

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Publication number
CN211404759U
CN211404759U CN202020258933.1U CN202020258933U CN211404759U CN 211404759 U CN211404759 U CN 211404759U CN 202020258933 U CN202020258933 U CN 202020258933U CN 211404759 U CN211404759 U CN 211404759U
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China
Prior art keywords
copper
flat steel
steel substrate
plating layer
band steel
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Active
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CN202020258933.1U
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Chinese (zh)
Inventor
黄惠清
姚伟清
胡惠明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Wufeng Cable Co ltd
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Zhejiang Wufeng Cable Co ltd
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Priority to CN202020258933.1U priority Critical patent/CN211404759U/en
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Abstract

The utility model discloses a copper covers band steel ground material, including the band steel substrate, the cross section of band steel substrate is rectangle and its corner is the arc angle, and the surface of band steel substrate covers and has the nickel coating, and the nickel coating surface covers and has the copper plate. The copper-coated flat steel grounding material has uniform plating layer, good conductivity and better corrosion resistance.

Description

Copper-coated flat steel grounding material
The technical field is as follows:
the utility model relates to a cable field specifically says a flat steel grounding material is covered to copper.
Background art:
the existing copper-coated flat steel for grounding engineering is generally produced by a rack plating process, and because the edges and corners of the four corners are right angles, a copper-coated flat steel produced by the rack plating process has uneven copper coating, particularly, the copper-coated flat steel with low current density at a hanging point has low coating thickness, and the quality of a product cannot be guaranteed, so that the engineering quality is influenced. Meanwhile, the existing copper-coated flat steel has thick oxide layer on the surface and uneven pits, which can generate electroplating pinholes during the electroplating process, and the low conductivity affects the grounding resistance to reduce the engineering quality.
The utility model has the following contents:
the utility model aims to solve the technical problem that a cladding material is even, electric conductivity is good and have the copper of better corrosion resistance and cover band steel ground material is provided, this copper covers band steel ground material's long service life.
The technical solution of the utility model is that, a copper covers band steel ground material is provided, including the band steel substrate, the cross section of band steel substrate is rectangle and its corner is the arc angle, and the surface of band steel substrate covers and has the nickel-plating layer, and the nickel-plating layer surface covers has the copper-plating layer.
Compared with the prior art after the structure more than adopting, the utility model has the advantages of it is following: the flat steel substrate replaces the flat copper in the prior art, and the corners of the flat steel substrate are improved into the arc corners, so that nickel plating and copper plating are facilitated, the plating layer is uniform, the conductivity is good, the nickel plating aims to improve the bonding force between the flat steel substrate and the copper plating layer, the corrosion resistance of the flat steel substrate is improved, and the service life is prolonged.
Preferably, the flat steel substrate is hot-drawn from an M6 low carbon steel strip. Reducing surface irregularities.
Further, the nickel plating layer was 0.15mm, and the copper plating layer was 0.25 mm.
Description of the drawings:
fig. 1 is a schematic structural diagram of the present invention.
The specific implementation mode is as follows:
the invention will be further explained with reference to the drawings and the detailed description below:
as shown in fig. 1, the copper-coated flat steel grounding material comprises a flat steel substrate 1, wherein the cross section of the flat steel substrate 1 is rectangular, the corners of the flat steel substrate are arc corners, a nickel-plated layer 2 covers the outer surface of the flat steel substrate 1, and a copper-plated layer 3 covers the outer surface of the nickel-plated layer 2. Specifically, the flat steel base 1 is formed by hot-rolling and drawing an M6 low-carbon steel strip, the surface of the flat steel base 1 is bright and flat after being drawn by a die, so that a subsequent coating is uniform, and the compactness of the surface coating is improved, and during the coating, nickel plating is firstly carried out, and then copper plating is carried out, wherein the nickel plating layer is 0.15mm, and the copper plating layer is 0.25 mm.
The grounding material has the conductivity of more than 40 percent, can improve the transmission of high-frequency current and achieves good grounding lightning protection effect.
The foregoing is illustrative of the preferred embodiments of the present invention only, and is not to be construed as limiting the claims. All the equivalent structures or equivalent flow changes made by using the contents of the specification and the attached drawings of the utility model are included in the patent protection scope of the utility model.

Claims (3)

1. The copper-clad flat steel grounding material is characterized in that: the steel plate comprises a flat steel substrate, wherein the cross section of the flat steel substrate is rectangular, the corners of the flat steel substrate are arc corners, the outer surface of the flat steel substrate is coated with a nickel plating layer, and the outer surface of the nickel plating layer is coated with a copper plating layer.
2. The copper-clad flat steel grounding material of claim 1, wherein: the flat steel substrate is formed by hot-rolling and drawing an M6 low-carbon steel strip.
3. The copper-clad flat steel grounding material of claim 1, wherein: the nickel plating layer was 0.15mm and the copper plating layer was 0.25 mm.
CN202020258933.1U 2020-03-05 2020-03-05 Copper-coated flat steel grounding material Active CN211404759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020258933.1U CN211404759U (en) 2020-03-05 2020-03-05 Copper-coated flat steel grounding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020258933.1U CN211404759U (en) 2020-03-05 2020-03-05 Copper-coated flat steel grounding material

Publications (1)

Publication Number Publication Date
CN211404759U true CN211404759U (en) 2020-09-01

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Family Applications (1)

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CN202020258933.1U Active CN211404759U (en) 2020-03-05 2020-03-05 Copper-coated flat steel grounding material

Country Status (1)

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CN (1) CN211404759U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114664955A (en) * 2020-12-24 2022-06-24 苏州阿特斯阳光电力科技有限公司 Method for testing coating uniformity of solder strip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114664955A (en) * 2020-12-24 2022-06-24 苏州阿特斯阳光电力科技有限公司 Method for testing coating uniformity of solder strip

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