CN211400930U - High-heat-conductivity heat-dissipation composite material - Google Patents
High-heat-conductivity heat-dissipation composite material Download PDFInfo
- Publication number
- CN211400930U CN211400930U CN201922469349.0U CN201922469349U CN211400930U CN 211400930 U CN211400930 U CN 211400930U CN 201922469349 U CN201922469349 U CN 201922469349U CN 211400930 U CN211400930 U CN 211400930U
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- China
- Prior art keywords
- heat dissipation
- metal heat
- heat
- metal
- bottom plate
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 239000002131 composite material Substances 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 69
- 239000002184 metal Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 6
- 239000010439 graphite Substances 0.000 claims abstract description 6
- -1 graphite alkene Chemical class 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 4
- 229910052755 nonmetal Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000000112 cooling gas Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high heat conduction heat dissipation combined material, include: u type bottom plate the inside heat dissipation chamber that is provided with in upper end of U type bottom plate the upper end of U type bottom plate is provided with first metal heat-conducting layer the upper end of first metal heat-conducting layer is provided with second metal heat-conducting layer the outside coating of second metal heat-conducting layer has the nickel plating coating the outside of second metal heat-conducting layer is provided with graphite alkene layer evenly be provided with a plurality of enhancement stands between the U type bottom plate of heat dissipation intracavity and the first metal heat-conducting layer lower extreme of heat dissipation intracavity evenly is provided with a plurality of vertical fin the lower extreme of vertical fin is provided with the wave form fin one side of U type bottom plate is provided with the water inlet of mutually supporting with the heat dissipation chamber.
Description
Technical Field
The utility model relates to a heat dissipation field specifically is a high heat conduction heat dissipation combined material.
Background
The heat-conducting and heat-dissipating material generally comprises three types, namely metal, nonmetal and composite, and the common metal heat-conducting and heat-dissipating material is copper or aluminum, so that the heat-conducting property is very good, but the weight is heavy; non-metal heat conducting and radiating materials are divided into heat conducting silica gel, graphite and the like, wherein the heat conducting silica gel is compressible, but the heat conducting silica gel has too low heat conduction compared with metals such as copper and the like; the composite heat conducting and dissipating material is prepared by compounding metal and non-metal materials to make up for the deficiencies of the metal and the non-metal materials. At present, the heat conduction and radiation material in the market has a simple structure, can only conduct heat conduction and radiation by depending on the characteristics of the material, and has an unsatisfactory heat radiation effect.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a high heat conduction heat dissipation combined material has solved some characteristics that can only rely on self material of current and has carried out the heat conduction heat dissipation, the unsatisfactory problem of radiating effect.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a high thermal conductivity heat dissipating composite comprising: the heat dissipation structure comprises a U-shaped bottom plate, wherein a heat dissipation cavity is arranged in the upper end of the U-shaped bottom plate, a first metal heat conduction layer is arranged at the upper end of the U-shaped bottom plate, a second metal heat conduction layer is arranged at the upper end of the first metal heat conduction layer, a nickel plating coating is coated on the outer side of the second metal heat conduction layer, a graphene layer is arranged on the outer side of the second metal heat conduction layer, a plurality of reinforcing upright posts are uniformly arranged between the U-shaped bottom plate and the first metal heat conduction layer in the heat dissipation cavity, a plurality of vertical radiating fins are uniformly arranged at the lower end of the first metal heat conduction layer in the heat dissipation cavity, waveform radiating fins are arranged at the lower ends of the vertical radiating fins, a water inlet matched with the heat dissipation cavity is arranged at one side of the U-shaped bottom plate, a water outlet matched with the heat dissipation cavity is arranged, the heat dissipation structure comprises a first metal heat conduction layer, a second metal heat conduction layer and a plurality of heat dissipation holes, wherein the upper end of the first metal heat conduction layer is provided with a first heat dissipation hole, the lower end of the second metal heat conduction layer is provided with a second heat dissipation hole, the second heat dissipation hole and the first heat dissipation hole form a complete and mutually communicated wave-shaped heat dissipation hole, one side between the first metal heat conduction layer and the second metal heat conduction layer is provided with an air inlet which is mutually communicated with the wave-shaped heat dissipation hole, and the other side between the first metal heat conduction layer and the second metal heat.
Preferably, the first metal heat conduction layer and the second metal heat conduction layer are made of copper.
Advantageous effects
The utility model provides a high heat conduction heat dissipation combined material. Compared with the prior art, the method has the following beneficial effects: adopt double-deck metal and graphite alkene complex to form, make the material both have sufficient structural strength and have fine toughness, and simultaneously, form a complete wave form louvre between first metal heat-conducting layer and second metal heat-conducting layer, can take away the heat between first metal heat-conducting layer and the second metal heat-conducting layer fast through the business turn over cooling gas of wave form louvre internal recycle, in addition, adopt vertical fin and wave form fin combination to be connected with first metal heat-conducting layer, and take away the heat on two kinds of fin of heat conduction through the business turn over cooling liquid of circulation in the heat dissipation chamber fast, the radiating effect is good, people's operation requirement has been satisfied.
Drawings
Fig. 1 is a schematic structural view of the high thermal conductivity heat dissipation composite material of the present invention.
In the figure: 1. u type bottom plate, 2, heat dissipation chamber, 3, first metal heat-conducting layer, 4, second metal heat-conducting layer, 5, nickel coating, 6, graphite alkene layer, 7, enhancement stand, 8, vertical fin, 9, wave form fin, 10, water inlet, 11, delivery port, 12, water proof coating, 13, first louvre, 14, second louvre, 15, air inlet, 16, gas outlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a high thermal conductivity heat dissipating composite comprising: the heat dissipation structure comprises a U-shaped bottom plate 1, wherein a heat dissipation cavity 2 is arranged inside the upper end of the U-shaped bottom plate 1, a first metal heat conduction layer 3 is arranged at the upper end of the U-shaped bottom plate 1, a second metal heat conduction layer 4 is arranged at the upper end of the first metal heat conduction layer 3, a nickel plating coating 5 is coated on the outer side of the second metal heat conduction layer 4, a graphene layer 6 is arranged on the outer side of the second metal heat conduction layer 4, a plurality of reinforcing upright posts 7 are uniformly arranged between the U-shaped bottom plate 1 and the first metal heat conduction layer 3 in the heat dissipation cavity 2, a plurality of vertical radiating fins 8 are uniformly arranged at the lower end of the first metal heat conduction layer 3 in the heat dissipation cavity 2, a waveform radiating fin 9 is arranged at the lower end of the vertical radiating fin 8, a water inlet 10 matched with the heat dissipation cavity 2 is arranged at one side of the U-shaped bottom plate 1, and a water outlet, the lower extreme of first metal heat-conducting layer 3 still is provided with waterproof coating 12 the upper end of first metal heat-conducting layer 3 is provided with first louvre 13 the lower extreme of second metal heat-conducting layer 4 is provided with second louvre 14, second louvre 14 constitutes a complete and waveform louvre that communicates each other with first louvre 13 one side is provided with the air inlet 15 that communicates each other with the waveform louvre between first metal heat-conducting layer 3 and the second metal heat-conducting layer 4 the opposite side is provided with the gas outlet 16 that communicates each other with the waveform louvre between first metal heat-conducting layer 3 and the second metal heat-conducting layer 4.
Referring to fig. 1, the first metallic heat conductive layer 3 and the second metallic heat conductive layer 4 are made of copper.
Before using, be connected water inlet 10 and delivery port 11 with circulation water supply system, be connected air inlet 15 and gas outlet 16 with circulation gas supply system, during the use, the coolant liquid circulation is through heat dissipation chamber 2, the wave form louvre that cooling gas circulation is constituteed through first louvre 13 and second louvre 14, quick absorbed heat of graphite alkene layer 6 conducts to first metal heat-conducting layer 3 in proper order, second metal heat-conducting layer 4, vertical fin 8 and wave form fin 9, the heat on first metal heat-conducting layer 3 and the second metal heat-conducting layer 4 is taken out fast through the cooling gas in the wave form louvre, the heat on vertical fin 8 and the wave form fin 9 is taken out fast through the cooling liquid in the heat dissipation chamber 2.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. The utility model provides a high heat conduction heat dissipation combined material which characterized in that: the method comprises the following steps: u type bottom plate (1) the inside heat dissipation chamber (2) that is provided with in upper end of U type bottom plate (1) the upper end of U type bottom plate (1) is provided with first metal heat-conducting layer (3) the upper end of first metal heat-conducting layer (3) is provided with second metal heat-conducting layer (4) the outside coating of second metal heat-conducting layer (4) has nickel coating (5) the outside of second metal heat-conducting layer (4) is provided with graphite alkene layer (6) evenly be provided with a plurality of enhancement posts (7) between U type bottom plate (1) in heat dissipation chamber (2) and first metal heat-conducting layer (3) lower extreme in heat dissipation chamber (2) evenly is provided with a plurality of vertical fin (8) the lower extreme of vertical fin (8) is provided with wave form fin (9) one side of U type bottom plate (1) is provided with water inlet (10) of mutually supporting with heat dissipation chamber (2) A water outlet (11) which is matched with the heat dissipation cavity (2) is arranged on the other side of the U-shaped bottom plate (1), the lower end of the first metal heat conduction layer (3) is also provided with a waterproof coating (12), a first heat dissipation hole (13) is arranged at the upper end of the first metal heat conduction layer (3), a second heat dissipation hole (14) is arranged at the lower end of the second metal heat conduction layer (4), the second heat dissipation hole (14) and the first heat dissipation hole (13) form a complete and mutually communicated wave-shaped heat dissipation hole, one side between the first metal heat conduction layer (3) and the second metal heat conduction layer (4) is provided with an air inlet (15) which is communicated with the wave-shaped heat dissipation holes, and an air outlet (16) communicated with the wave-shaped heat dissipation holes is arranged on the other side between the first metal heat conduction layer (3) and the second metal heat conduction layer (4).
2. A high thermal conductivity heat dissipating composite material as claimed in claim 1, wherein: the first metal heat conduction layer (3) and the second metal heat conduction layer (4) are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922469349.0U CN211400930U (en) | 2019-12-31 | 2019-12-31 | High-heat-conductivity heat-dissipation composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922469349.0U CN211400930U (en) | 2019-12-31 | 2019-12-31 | High-heat-conductivity heat-dissipation composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211400930U true CN211400930U (en) | 2020-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922469349.0U Expired - Fee Related CN211400930U (en) | 2019-12-31 | 2019-12-31 | High-heat-conductivity heat-dissipation composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211400930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112659654A (en) * | 2020-12-29 | 2021-04-16 | 江苏金彩高分子材料科技有限公司 | PET antifog sheet for antifog mask |
-
2019
- 2019-12-31 CN CN201922469349.0U patent/CN211400930U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112659654A (en) * | 2020-12-29 | 2021-04-16 | 江苏金彩高分子材料科技有限公司 | PET antifog sheet for antifog mask |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200901 |