CN211378414U

CN211378414U - Circuit board assembly and battery pack with same

Info

Publication number: CN211378414U
Application number: CN201922058310.XU
Authority: CN
Inventors: 刘传君
Original assignee: Globe Jiangsu Co Ltd
Current assignee: Globe Jiangsu Co Ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-08-28
Anticipated expiration: 2029-11-26

Abstract

The utility model provides a circuit board assembly and battery package that has this circuit board assembly, circuit board assembly includes: the glue pouring box is provided with a glue pouring area, a non-glue pouring area and a separation component, and the separation component separates the glue pouring area from the non-glue pouring area so as to prevent glue from entering the non-glue pouring area from the glue pouring area; the circuit board is arranged on the glue filling box and comprises a first area corresponding to the glue filling area and a second area corresponding to the non-glue filling area; the first area is provided with a glue passing hole, so that glue enters the glue filling area from one side, deviating from the glue filling area, of the circuit board through the glue passing hole. Compared with the prior art, the utility model discloses circuit board assembly can effectively avoid sealed glue pollution part to need not sealed components and parts when the encapsulating.

Description

Circuit board assembly and battery pack with same

Technical Field

The utility model relates to a circuit board assembly and have battery package of this circuit board assembly.

Background

The long-term effective protection of sensitive circuits and electronic components undoubtedly plays an increasingly important role in today's sophisticated and demanding electronic applications. Currently, potting adhesives are commonly used in the industry to seal circuit boards. So not only can strengthen electronic device's wholeness, improve the resistance to external impact, vibrations, can improve the insulating nature between internal component, circuit moreover, be favorable to the device miniaturization, lightweight, can also avoid component, circuit directly to expose simultaneously, improve the waterproof, the humidity resistance of device. However, when the sealant is poured after the circuit board is manufactured into the PCBA, the sealant may contaminate parts of the components that need not be sealed, such as: LED light areas, conductive terminals, and the like.

In view of the above problems, there is a need to provide a new circuit board assembly to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board assembly, this circuit board assembly can effectively avoid sealed glue pollution part need not sealed components and parts when the encapsulating.

In order to achieve the above object, the utility model provides a circuit board assembly, include: the glue pouring box is provided with a glue pouring area, a non-glue pouring area and a separation component, and the separation component separates the glue pouring area from the non-glue pouring area so as to prevent glue from entering the non-glue pouring area from the glue pouring area; the circuit board is arranged on the glue filling box and comprises a first area corresponding to the glue filling area and a second area corresponding to the non-glue filling area; the first area is provided with a glue passing hole, so that glue enters the glue filling area from one side, deviating from the glue filling area, of the circuit board through the glue passing hole.

As a further improvement of the present invention, the separation assembly includes a protruding rib formed by protruding the bottom wall of the potting box, the protruding rib supports the circuit board.

As a further improvement of the present invention, the partition assembly includes an elastic sealing member; one end of the elastic sealing element abuts against the bottom wall of the glue pouring box, and the other end of the elastic sealing element abuts against the circuit board.

As a further improvement of the present invention, the partition assembly further includes a rib protruding from the bottom wall of the potting box to the circuit board and abutting against the circuit board; the elastic sealing element is slightly higher than the height of the convex rib, so that the circuit board and the elastic sealing element are in interference fit.

As a further improvement of the utility model, the elastic sealing element is foam.

As a further improvement of the utility model, the side wall of the glue pouring box is provided with a buckling arm protruding to the glue pouring area or the non-glue pouring area; the buckling arm supports one side of the circuit board, which is far away from the glue pouring box, so that the circuit board is prevented from being separated from the glue pouring box.

As a further improvement of the present invention, the latching arm includes a guiding portion for guiding the circuit board to slide into the potting box; the guiding part inclines from one end of the buckling arm, which is far away from the circuit board, to one end of the buckling arm, which is close to the circuit board.

As a further improvement of the utility model, the circuit board deviates from one side of encapsulating box is provided with first region, the regional separated separation of second separation barrier spare.

As a further improvement of the utility model, the circuit board with be provided with the bleeder vent between the lateral wall of encapsulating box, the bleeder vent with the encapsulating district is linked together.

The utility model also provides a battery pack, including battery pack, aforementioned circuit board subassembly and casing, aforementioned circuit board subassembly control battery pack's charge-discharge state, battery pack, aforementioned circuit board subassembly accept in the casing.

The utility model has the advantages that: the utility model discloses circuit board assembly can effectively avoid sealed glue pollution part need not sealed components and parts when the encapsulating.

Drawings

Fig. 1 is a schematic perspective view of the circuit board assembly of the present invention.

Fig. 2 is a schematic perspective view of the glue pouring box.

Fig. 3 is a cross-sectional view of the circuit board assembly shown in fig. 1.

Fig. 4 is a schematic perspective view of the glue-pouring box and the elastic sealing element when they are matched.

Fig. 5 is an exploded perspective view of the battery pack.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1, the present invention discloses a circuit board assembly 100, which includes a potting box 10 and a circuit board 20 mounted on the potting box 10.

Referring to fig. 2 and 3, the potting box 10 includes a bottom wall 11, a plurality of side walls 12 perpendicular to the bottom wall 11, and a partition component 13 disposed on the bottom wall 11. The bottom wall 11 and the side wall 12 jointly enclose to form an accommodating cavity 14. The side wall 12 is provided with a retaining arm 121 projecting toward the housing cavity 14. The buckling arm 121 abuts against a side of the circuit board 20 away from the potting box 10 to prevent the circuit board 20 from separating from the potting box 10. The latching arm 121 includes a supporting portion 1211 for supporting the circuit board 20 to move away from the potting box 10 and a guiding portion 1212 for guiding the circuit board 20 to slide into the potting box 10. The guiding portion 1212 is inclined from an end of the latching arm 121 away from the circuit board 20 to an end of the latching arm 121 close to the circuit board 20. In this embodiment, the number of the latching arms 121 is 4. It is understood that the number of the retaining arms 121 can be set as required in practical applications.

Referring to fig. 2 and fig. 4, the separating element 13 separates the accommodating cavity 14 into a glue filling area 141 and a non-glue filling area 142. The partition member 13 includes a rib 131 and an elastic sealing member 132, which are formed to protrude from the bottom wall 11 toward the circuit board 20 and abut against the circuit board 20. The rib 131 abuts against the circuit board 20 and is matched with the buckling arm 121 to fix the circuit board 20 and prevent the circuit board 20 from shaking. So set up, can effectively reduce the stress injury of beating the screw and producing PCBA. The rib 131 divides the accommodating cavity 14 into a glue filling area 141 and a non-glue filling area 142. The elastic sealing element 132 is disposed in the non-glue-pouring area 142 and tightly abuts against the rib 131. One end of the elastic sealing member 132 abuts against the bottom wall 11, and the other end abuts against the circuit board 20. The height of the elastic sealing member 132 is slightly higher than that of the rib 131, so that the circuit board 20 and the elastic sealing member 132 are in interference fit. So set up, can prevent effectively that the colloid from the circuit board 20 with the clearance between the protruding muscle 131 from getting into non-encapsulating district 142. In the present embodiment, the elastic sealing element 132 is disposed on the non-glue-pouring area 142, but in other embodiments, the elastic sealing element 132 may also be disposed on the glue-pouring area 141 and tightly abut against the rib 131. Of course, it is understood that the elastic sealing member 132 may also be disposed on the rib 131, in which case the elastic sealing member 132 is located between the circuit board 20 and the rib 131. In this embodiment, the elastic sealing member 132 is foam. Of course, it is understood that other materials capable of achieving sealing are also possible, and the embodiment is not limited thereto.

Referring to fig. 1, the circuit board 20 includes a first area 21 corresponding to the glue filling area 141, a second area 22 corresponding to the non-glue filling area 142, and a blocking member 23. The first area 21 is provided with a glue passing hole 211 communicated with the glue filling area 142, so that glue enters the glue filling area 141 from one side of the circuit board 20 departing from the glue filling area 141 through the glue passing hole 211, and components arranged in the first area 21 are sealed. The second region 22 is provided with components that do not need to be sealed in order to avoid contamination of the components that do not need to be sealed by the glue. In the present embodiment, the second region 22 is provided with a conductive terminal (not shown) and an LED lamp 221. The blocking member 23 is disposed on a side of the circuit board 20 away from the potting box 10 to separate the first area 21 from the second area 22, so as to prevent the glue from flowing into the second area 22 from the first area 21 during potting. In this embodiment, the barrier 23 is foam. Of course, it is understood that other structures and materials capable of blocking the glue from flowing into the second region 22 are also possible, and this embodiment is not limited in this respect. Referring to fig. 1, an air hole 24 is further disposed between the circuit board 20 and the sidewall 12. The air holes 24 are communicated with the glue filling area 141 so as to facilitate air discharge during glue filling.

Referring to fig. 5, the present invention further discloses a battery pack 200, which includes a battery assembly 201, a circuit board assembly 100 for controlling the charging and discharging states of the battery assembly 201, and a housing 202. The housing 202 is configured to accommodate the battery assembly 201 and the circuit board assembly 100, and is provided with an air inlet 2021 and an air outlet (not shown) opposite to the air inlet 2021. The air inlet 2021 and the air outlet are respectively located on a pair of oppositely disposed sidewalls of the housing 202. The area of the air inlet 2021 is much larger than that of the air outlet.

Compared with the prior art, the utility model discloses circuit board assembly 100 can effectively avoid the colloid to pollute when the encapsulating and need not sealed components and parts.

The above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A circuit board assembly, comprising:

the glue pouring box is provided with a glue pouring area, a non-glue pouring area and a separation component, and the separation component separates the glue pouring area from the non-glue pouring area so as to prevent glue from entering the non-glue pouring area from the glue pouring area;

the circuit board is arranged on the glue filling box and comprises a first area corresponding to the glue filling area and a second area corresponding to the non-glue filling area; the first area is provided with a glue passing hole, so that glue enters the glue filling area from one side, deviating from the glue filling area, of the circuit board through the glue passing hole.

2. The circuit board assembly of claim 1, wherein: the separation component comprises a convex rib formed by protruding from the bottom wall of the glue pouring box to the circuit board, and the convex rib abuts against the circuit board.

3. The circuit board assembly of claim 1, wherein: the partition assembly includes an elastomeric seal; one end of the elastic sealing element abuts against the bottom wall of the glue pouring box, and the other end of the elastic sealing element abuts against the circuit board.

4. The circuit board assembly of claim 3, wherein: the separation component also comprises a convex rib which is formed by protruding from the bottom wall of the glue pouring box to the circuit board and supports against the circuit board; the elastic sealing element is slightly higher than the height of the convex rib, so that the circuit board and the elastic sealing element are in interference fit.

5. The circuit board assembly of claim 3 or 4, wherein: the elastic sealing element is foam.

6. The circuit board assembly of claim 1, wherein: the side wall of the glue pouring box is provided with a buckling arm protruding towards the glue pouring area or the non-glue pouring area; the buckling arm supports one side of the circuit board, which is far away from the glue pouring box, so that the circuit board is prevented from being separated from the glue pouring box.

7. The circuit board assembly of claim 6, wherein: the buckling arm comprises a guide part for guiding the circuit board to slide into the glue pouring box; the guiding part inclines from one end of the buckling arm, which is far away from the circuit board, to one end of the buckling arm, which is close to the circuit board.

8. The circuit board assembly of claim 1, wherein: one side of the circuit board, which is far away from the glue pouring box, is provided with a blocking piece which separates the first area from the second area.

9. The circuit board assembly of claim 1, wherein: and air holes are formed between the circuit board and the side wall of the glue pouring box and communicated with the glue pouring area.

10. A battery pack, comprising: a battery assembly, a circuit board assembly according to any one of claims 1 to 9 and a housing; the circuit board assembly controls the charging and discharging state of the battery assembly, and the battery assembly and the circuit board assembly are contained in the shell.