CN211365034U - Solder paste packaging equipment - Google Patents
Solder paste packaging equipment Download PDFInfo
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- CN211365034U CN211365034U CN201922012976.1U CN201922012976U CN211365034U CN 211365034 U CN211365034 U CN 211365034U CN 201922012976 U CN201922012976 U CN 201922012976U CN 211365034 U CN211365034 U CN 211365034U
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- heating
- solder paste
- filling
- heating container
- paste packaging
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Abstract
The utility model provides a solder paste packaging device, which comprises a heating container and a placing platform; the heating container is connected with the workbench through a heating system, the heating system comprises a heating wire, a detachable end cover is arranged at the top end of the heating container, the side edge of the bottom end of the heating container is connected with the filling box through a conveying pipe, a solenoid valve is arranged on the conveying pipe, a plurality of filling heads are arranged on the lower end face of the filling box, and each filling head side edge is provided with a sensor, the placing table is connected with the workbench through a straight line module, a plurality of placing grooves are formed in the workbench, and the placing grooves correspond to the positions of the filling heads. The utility model discloses, realize packing the tin cream automatically, reduce staff's intensity of labour, improve the work efficiency of tin cream packing.
Description
Technical Field
The utility model relates to a tin cream production facility field especially relates to a tin cream equipment for packing.
Background
The tin paste is mainly used as a novel welding material, a paste mixture is formed after fusion of tin solder powder, scaling powder and other active materials, the tin paste generally needs to be packaged through packaging equipment in the production process of the tin paste, the traditional packaging equipment needs to be observed by a specially-assigned person in the operation process, time and labor are wasted, the labor intensity of workers is increased, the tin paste cannot reach the same packaging dosage when being packaged, and the packaging efficiency and quality of the tin paste are reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the utility model provides a solder paste equipment for packing realizes packing the solder paste automatically, reduces staff's intensity of labour, improves the work efficiency of solder paste packing.
The technical scheme is as follows: a solder paste packaging apparatus includes a heating container and a placing table; the heating container is connected with the workbench through a heating system, the heating system comprises a heating wire, a detachable end cover is arranged at the top end of the heating container, the side edge of the bottom end of the heating container is connected with the filling box through a conveying pipe, a solenoid valve is arranged on the conveying pipe, a plurality of filling heads are arranged on the lower end face of the filling box, and each filling head side edge is provided with a sensor, the placing table is connected with the workbench through a straight line module, a plurality of placing grooves are formed in the workbench, and the placing grooves correspond to the positions of the filling heads.
Preferably, the heating system further comprises a heating sleeve, and the heating wire is located in the heating sleeve.
Preferably, two ends of the heating wire are connected with the heating sleeve through fixing seats.
Preferably, the top of the end cover is provided with a motor, a rotating shaft of the motor penetrates through the end cover, and the bottom of the motor is provided with a stirring rod.
Preferably, the filling box is connected with the workbench through a support plate.
Preferably, the sensor is a distance sensor, and the straight line of the length direction of the straight line module is parallel to the straight line of the length direction of the filling box.
The utility model discloses realize following beneficial effect:
1. the solder paste flows into the filling box from the heating container, and is quantitatively filled into the solder paste packaging box through the matching of the filling head and the sensor, so that the solder paste dosage in the solder paste packaging box is ensured to be the same;
2. preliminary heating is carried out the tin cream through heating system, ensures the mobility of tin cream, and the stirring rod stirs simultaneously, prevents that the tin cream from taking place to deposit, ensures the quality of tin cream.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a front view of the overall structure provided by the present invention.
In the figure: 1. a work table; 2. heating the container; 3. an end cap; 4. a motor; 5. a stirring rod; 6. a heating system; 61. heating the sleeve; 62. a fixed seat; 63. heating wires; 7. a delivery pipe; 8. an electromagnetic valve; 9. a support plate; 10. filling the box; 11. a filling head; 12. a sensor; 13. a linear module; 14. a placing table; 15. and (6) placing the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1, a solder paste packaging apparatus includes a heating container 2 and a placing table 14; the heating container 2 is connected with the workbench 1 through a heating system 6, and the heating container 2 heats the poured solder paste, so that the solder paste is prevented from being solidified due to temperature reduction, and the fluidity of the solder paste is ensured; the heating system 6 comprises a heating wire 63, the top end of the heating container 2 is provided with a detachable end cover 3, the end cover 3 is opened to pour solder paste into the heating container 2, and the heating container 2 after being packaged is convenient to clean; the side edge of the bottom end of the heating container 2 is connected with a filling box 10 through a material conveying pipe 7, an electromagnetic valve 8 is arranged on the material conveying pipe 7, and the electromagnetic valve 8 controls whether solder paste is conveyed or not; the lower end face of the filling box 10 is provided with a plurality of filling heads 11, a sensor 12 is arranged on the side edge of each filling head 11, and the sensor 12 senses the distance between solder paste in the packaging box and the filling heads 11, so that an external controller can conveniently control the opening and closing of the filling heads 11; the placing table 14 is connected with the workbench 1 through a linear module 13, a plurality of placing grooves 15 are formed in the workbench 1, and the packaging box is placed in the placing grooves 15; the placing groove 15 corresponds to the position of the filling head 11, so that the distance between the filling head 11 and the solder paste in the packaging box can be controlled accurately, and the packaging dosage of the solder paste is ensured.
The heating system 6 further comprises a heating sleeve 61, the heating wire (63) being located within the heating sleeve 61.
Two ends of the heating wire 63 are connected with the heating sleeve 61 through the fixing seat 62.
The top of the end cover 3 is provided with a motor 4, the rotating shaft of the motor 4 penetrates through the end cover 3, the stirring rod 5 is installed at the bottom of the motor 4, the motor 4 rotates, the stirring rod 5 is driven to stir solder paste, the solder paste is prevented from precipitating, and the quality of solder paste filling is ensured.
The filling box 10 is connected to the work table 1 via a support plate 9.
The sensor 12 is a distance sensor and is used for sensing the distance between the solder paste in the packaging box and the filling head 11 so as to ensure the dosage of the filled solder paste; the straight line at the length direction of the straight line module 13 is parallel to the straight line at the length direction of the filling box 10, the placing platform 14 for placing the packing box is moved to the filling head 11 for filling by the straight line module 13, the carrying by workers is not needed, and the labor intensity of the workers is reduced.
The working principle is as follows: the staff pours the tin cream into heating container 2 in, motor 4 rotates and drives stirring rod 5 and carry out the stirring to the tin cream, heating system 6 begins work simultaneously, heat the tin cream, ensure the mobility of tin cream, solenoid valve 8 is opened in external control ware control, the tin cream passes through conveying pipeline 7 and gets into in the filling box 10, solenoid valve 8 closes when filling box 10 is full of the tin cream in, filling head 11 fills the packing carton in standing groove 15, distance between the tin cream in the sensor 12 response packing carton and the filling head 11, close filling head 11 immediately, ensure that the tin cream dosage in the packing carton is the same.
The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (6)
1. A solder paste packaging apparatus is characterized by comprising a heating container (2) and a placing table (14); heating container (2) are connected with workstation (1) through heating system (6), heating system (6) include heater strip (63), heating container (2) top is provided with detachable end cover (3), heating container (2) bottom side is connected with filling case (10) through conveying pipeline (7), be provided with solenoid valve (8) on conveying pipeline (7), the terminal surface is provided with a plurality of filling head (11) under filling case (10), every filling head (11) side all is provided with a sensor (12), place platform (14) are connected with workstation (1) through sharp module (13), be provided with a plurality of standing groove (15) on workstation (1), standing groove (15) are corresponding with filling head (11) position.
2. A solder paste packaging apparatus according to claim 1, wherein said heating system (6) further comprises a heating sleeve (61), said heating wire (63) being located within the heating sleeve (61).
3. The solder paste packaging apparatus according to claim 2, wherein both ends of the heating wire (63) are connected to the heating sleeve (61) through fixing seats (62).
4. The solder paste packaging device according to claim 1, wherein a motor (4) is arranged on the top of the end cover (3), the rotating shaft of the motor (4) penetrates through the end cover (3), and a stirring rod (5) is arranged at the bottom of the motor (4).
5. Solder paste packaging apparatus according to claim 1, characterized in that the filling box (10) is connected to the work table (1) by means of a support plate (9).
6. Solder paste packaging apparatus according to claim 1, characterized in that the sensor (12) is a distance sensor, and the straight line of the linear module (13) is parallel to the straight line of the filling box (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012976.1U CN211365034U (en) | 2019-11-20 | 2019-11-20 | Solder paste packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012976.1U CN211365034U (en) | 2019-11-20 | 2019-11-20 | Solder paste packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211365034U true CN211365034U (en) | 2020-08-28 |
Family
ID=72168587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922012976.1U Active CN211365034U (en) | 2019-11-20 | 2019-11-20 | Solder paste packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211365034U (en) |
-
2019
- 2019-11-20 CN CN201922012976.1U patent/CN211365034U/en active Active
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