CN211362430U

CN211362430U - Circuit board cutting and grinding equipment capable of increasing board thickness processing effect

Info

Publication number: CN211362430U
Application number: CN201921878578.1U
Authority: CN
Inventors: 罗天送
Original assignee: Jhy Huey Auto Machine Co ltd
Current assignee: Jiehui Automatic Machinery Co., Ltd
Priority date: 2019-11-04
Filing date: 2019-11-04
Publication date: 2020-08-28
Anticipated expiration: 2029-11-04

Abstract

The utility model relates to a circuit board cutting and grinding device capable of increasing board thickness processing effect, which can not only cut and grind the circuit board with normal board thickness, but also cut and grind the circuit board with thickness of more than 3.2 mm; comprises an aligning unit, a plate cutting unit, an edge grinding unit and a transferring unit; the circuit board is sequentially transferred to other units by the transfer unit to carry out the processes of alignment, plate cutting and edge grinding.

Description

Circuit board cutting and grinding equipment capable of increasing board thickness processing effect

Technical Field

The utility model relates to a to circuit board cutting and grinding equipment of multiplicable thick processing ability effect of processes such as counterpoint, cut-to-size board and edging according to the preface to circuit board medium plate structure.

Background

The sizes of the circuit boards are various according to different needs of customers, wherein one of the circuit boards is a thick board structure, and the circuit board with a thickness of more than 2.5mm is often called as a thick board in the field. The thick plate circuit board is slightly different from a non-thick plate in structure on processing equipment, and particularly when the circuit board is cut, the thick plate circuit board is greatly different from a common thin plate circuit board, so that different special machines are required to be used for processing, and the method is suitable.

In the patents of the inventor's previously approved taiwan patent application No. 091132140, "board cutting and edging machine and method for circuit board" and application No. 092129075 "board cutting and edging machine for circuit board capable of improving productivity", etc., the wheel cutter performs cutting and edging in a shearing manner, even though the circuit board with the thickness of 2.5mm or even 3.2mm can still be cut and ground, the thick board processing is not a strong item; if the thickness of the circuit board exceeds 3.2mm, the cutting and grinding process is still slightly laborious; in addition, in the prior art, when the wheel cutter is used for processing a thick circuit board, the cutting is performed in a slightly extruding manner, and the pressure often causes damage and loss of the multilayer thick circuit board due to board explosion.

In addition, other producers of prior art cut with respect to the processing of cutting of circuit board thick plate, one of them mode is cut with CNC edge grinding machine, this mode is mostly the manual work and carries out the material loading, use milling cutter to carry out the overall dimension shaping, need carry out chamfer and burring operation by manual work or other edging equipment after the completion again, wholly, processing needs to use relatively more manpower and multiple equipment, also owing to adopt half manual work mode, consequently the circuit board also causes the face easy damage because of the manual work factor of moving easily, and cause the higher shortcoming of finished product breakage rate.

With the professional and automatic processing of various modern machines, it is obvious that the former semi-manual thick plate processing mode is extremely undesirable and perfect, and needs to be improved.

The inventor is in view of this, especially in order to create the utility model discloses, can borrow the utility model discloses a, improve the shortcoming of current circuit board thick plate processing mode, the process that makes the thick plate processing in phase can be more perfect and ideal, accords with actual demand.

SUMMERY OF THE UTILITY MODEL

For improving a great deal of disappearance of aforementioned prior art circuit board thick plate processing, the utility model discloses its main aim at: the circuit board cutting and grinding equipment capable of increasing the board thickness processing effect is automatic equipment, can cut and grind a circuit board with normal board thickness and can also cut and grind a circuit board with a thickness of more than 3.2 mm; after the circuit board is fed, the circuit board is completely transferred in an automatic mode, and the processes of alignment, plate cutting, edge grinding and the like are sequentially carried out, so that manual use is avoided, efficiency can be improved, and cost can be reduced; secondly, the damage of the board surface caused by artificial contact can be prevented, the loss is reduced, and further, the profit is created.

To achieve the above object, the present invention provides a method for manufacturing a semiconductor device, comprising: the special cutting and grinding equipment for the circuit board with the thickness of more than 3.2mm comprises a pair of position units, a plate cutting unit, an edge grinding unit and a transfer unit; the circuit board can be sequentially sent to other units by using the transfer unit so as to carry out the processes of alignment, plate cutting and edge grinding.

In a preferred embodiment, the alignment unit, which provides alignment after the circuit board is fed, comprises one or more optical alignment elements, and the optical alignment elements at least read and align the circuit board position in an X-Ray or CCD manner, so as to correct the directionality of the circuit board. The optical alignment elements are two in number and are respectively arranged on the left side and the right side of the alignment unit.

In one preferred embodiment, the plate cutting unit is connected to the rear end of the alignment unit; the board cutting unit comprises one or more cutters, wherein the cutters are of saw blade structures, and the circuit board can be cut in a reciprocating mode or a fixed-point mode after being rotated so as to obtain the required size. The number of the cutters is two, and the cutters are correspondingly arranged on the left side and the right side of the circuit board to be cut.

In one preferred embodiment, the edge grinding unit is connected to the rear end of the plate cutting unit; the edge grinding unit comprises one or more than one grinding knife which is of the existing structure, and the edge of the circuit board can be ground in a reciprocating mode or a fixed point mode after the grinding knife rotates, so that the effects of chamfering, deburring and the like are achieved. The aforesaid should whet a knife, quantity is two, corresponds the branch and locates the left and right sides department by edging circuit board.

In a preferred embodiment, the transferring unit is a structure continuously disposed among the aligning unit, the board cutting unit and the edge grinding unit, and is used for moving the circuit board among the units. The power element can be used for linking a platform positioned above the transfer unit to move back and forth, one or more bearing frames are arranged on the platform, the bottom of each bearing frame is provided with a rotating mechanism, and the bearing frames can rotate when the rotating mechanism acts. The mechanism for driving the platform to move by the power element can be implemented according to various mechanical principles in the prior art.

One of them embodiment of preferred, the utility model discloses when carrying out this cut-to-size board and edging process, can both utilize and make the bearer rotatory to divide twice with four edges of circuit board, process with two liang of corresponding modes.

In a preferred embodiment, the tool is a saw blade, the saw blade includes a plurality of saw teeth, and each adjacent saw tooth is formed by alternately and continuously staggering first saw teeth and second saw teeth. The first sawtooth has a V-shaped blade with a cross section comprising a first blade surface and a second blade surface, and the length of the cross section of the first blade surface is greater than that of the second blade surface; the second sawtooth is characterized in that the section of the second sawtooth consists of a third blade surface and a fourth blade surface which form a V-shaped blade, and the length of the section of the fourth blade surface is greater than that of the section of the third blade surface.

In short, the present invention can be used for cutting and grinding thick plates, and one of the reasons is to use a cutting method for processing.

Drawings

FIG. 1: is a three-dimensional structure chart of the utility model;

FIG. 2: is a overlooking structure chart of the utility model;

FIG. 3: is a schematic diagram of circuit board material feeding alignment in the implementation of the utility model;

FIG. 4: the schematic diagram of the circuit board cutting during the implementation of the utility model is shown;

FIG. 5: the schematic diagram of the circuit board being rotated ninety degrees to process the other two edges when the utility model is implemented;

FIG. 6: is a structural diagram of the cutter in the utility model;

FIG. 7: do the utility model discloses in carry out the schematic diagram of edging with the circuit board.

Description of the reference numerals

1 alignment unit

11 optical alignment element

2 cutting plate unit

21 cutting tool

211 first saw tooth

212 second saw tooth

2111 first edge surface

2112 second facet

2121 third edge face

2122 fourth land

3 edging unit

31 sharpening machine

4 transfer unit

41 Power element

42 platform

43 support rack

9 Circuit Board

91 remainder.

Detailed Description

Now, in order to increase the thickness of the circuit board, the detailed contents and the functions of the circuit board cutting and grinding device of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 and 2, the circuit board cutting and grinding apparatus capable of increasing board thickness processing effect of the present invention includes a pair of unit units 1, a board cutting unit 2, an edge grinding unit 3 and a transfer unit 4; the transfer unit 4 can sequentially transfer the circuit boards to other units for alignment, board cutting and edge grinding.

The alignment unit 1 provides an alignment process after the circuit board is fed, and includes one or more optical alignment elements 11, where the optical alignment elements 11 at least read and align the circuit board position in an X-Ray or CCD manner, so that the circuit board has correct directivity. The optical alignment devices 11 are preferably two in number, and are disposed on the left and right sides.

The plate cutting unit 2 is connected to the rear end of the alignment unit 1; the board cutting unit 2 includes one or more cutters 21, and the cutters 21 are saw blade structures, and can cut the circuit board in a reciprocating manner or a fixed point manner after rotating to obtain a desired size. The aforementioned cutting tools 21, preferably two, are correspondingly disposed at the left and right sides of the circuit board to be cut.

The edge grinding unit 3 is connected to the rear end of the plate cutting unit 2; the edge grinding unit 3 comprises one or more sharpeners 31, the sharpeners 31 are of the prior art and can grind the edge of the circuit board in a reciprocating or fixed-point manner after rotation, so as to achieve the effects of chamfering and deburring. The aforesaid sharpeners 31, preferably two, are correspondingly disposed on the left and right sides of the circuit board to be edged.

The transfer unit 4 is a structure that is continuously disposed between the alignment unit 1, the board cutting unit 2 and the edge grinding unit 3, and is used for moving the circuit board among the units. At least comprises a power component 41, the power component 41 can be used to link a platform 42 above the transfer unit 4 to move back and forth, the platform 42 is provided with one or more supporting frames 43, the bottom of each supporting frame 43 is provided with a rotating mechanism (prior art structure), and the rotating mechanism can rotate the supporting frame 43 when in action. The mechanism for the power element 41 to move the platform 42 is also implemented by various known mechanical principles. The utility model discloses when carrying out this cut-to-size board and edging process, can both utilize to make and hold frame 43 rotatory to divide twice with four edges of circuit board, process with two liang of corresponding modes.

As shown in fig. 3, in the implementation of the present invention, a circuit board 9 is sent into the supporting frame 43 on the transfer unit 4, so that the optical alignment element 11 of the alignment unit 1 aligns the target position of the circuit board 9; then, the moving and carrying unit 4 is moved to move the circuit board to the board cutting unit 2, the board cutting unit 2 comprises two cutters 21, and the redundant part of the edge of the circuit board 9 can be cut in a cutting mode by utilizing the operation of the two cutters 21 so as to remove the redundant material 91 (figure 4); when the cutting of the two edges is completed, the support 43 is rotated ninety degrees so as to cut the other two corresponding edges of the circuit board 9 (fig. 5); the cutting tool 21 used in the present invention, as shown in fig. 6, includes a plurality of saw teeth, and each adjacent saw tooth is a first saw tooth 211 and a second saw tooth 212 that are continuously staggered at intervals; the first saw tooth 211 has a cross section comprising a first edge surface 2111 and a second edge surface 2112 to form a V-shaped blade, wherein the length of the cross section of the first edge surface 2111 is greater than that of the second edge surface 2112; for the second saw tooth 212, the cross section is a V-shaped blade composed of a third surface 2121 and a fourth surface 2122, and the cross section length of the fourth surface 2122 is greater than that of the third surface 2121. Thus, the cutter 21 with the composite sawtooth structure is used for cutting thick plates in a cutting mode, and the effect is excellent. After the cutting process, the circuit board 9 with the required size can be obtained, and the circuit board is sent to the edge grinding unit 3 (fig. 7) by the carrying unit 4, so that the two corresponding edges of the circuit board are ground by the knife grinder 31 to realize the functions of chamfering, deburring and the like. After finishing the edge grinding of the two edges, the supporting frame 43 is rotated ninety degrees to grind the other two corresponding edges of the circuit board 9, and finally the circuit board 9 is sent out, thereby finishing the cutting and edge grinding process of the thick board of the circuit board 9.

To sum up, the utility model discloses the circuit board of multiplicable thick board processing effect cuts out mill equipment, and it is with automatic mode, coherent carry out counterpoint, cut out board and the edging process of thick board circuit board, can raise the efficiency really, reduce cost, prevent to cause the face to damage, reduce the consume because of the human contact, and then create the profit. The technical content of the utility model completely meets the requirements of the new patent. The present invention is industrially utilized, and has not been published or publicly used before application, and is not a publicly known technique. And, the utility model discloses effectively solve the problem that exists for a long time among the prior art and reach relevant user and the long-term demand of consumer, must assist the card the utility model discloses can not accomplish easily.

Although the present invention has been described with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. The foregoing description of the preferred embodiments of the present invention is provided for the purpose of illustrating the principles of the invention and is not to be taken in a limiting sense, but is to be defined by the appended claims.

Claims

1. The utility model provides a circuit board of multiplicable thick processing effect cuts out mill equipment which characterized in that includes:

a pair of bit positions comprising one or more optical alignment elements;

a plate cutting unit connected to the rear end of the alignment unit; the plate cutting unit comprises one or more cutters;

the edge grinding unit is connected with the rear end of the plate cutting unit; the edge grinding unit comprises one or more than one grinding knife;

a transfer unit, which is a structure that is arranged between the alignment unit, the plate cutting unit and the edge grinding unit; the shifting unit at least comprises a power element which can be used for linking a platform positioned above the shifting unit to move back and forth, one or more bearing frames are arranged on the platform, and the bottom of each bearing frame is provided with a rotating mechanism which can enable the bearing frame to rotate when the bearing frame acts.

2. The apparatus for cutting and grinding a circuit board with an increased thickness of the board as claimed in claim 1, wherein the optical alignment element includes at least an alignment element for reading and aligning the position of the circuit board in an X-Ray or CCD manner.

3. The apparatus for cutting and grinding a circuit board with an increased thickness as set forth in claim 1, wherein the alignment unit is an alignment unit for reading the position of the circuit board and then correcting the orientation of the circuit board.

4. The apparatus for cutting and grinding a circuit board with an increased thickness as set forth in claim 1, wherein the number of the optical alignment elements is two and the optical alignment elements are provided on both left and right sides of the alignment unit.

5. The apparatus for cutting and grinding a circuit board with an increased thickness in accordance with claim 1, wherein the cutter is rotated to cut the circuit board in a reciprocating manner or a fixed point manner.

6. The apparatus for cutting and grinding a circuit board capable of increasing the effect of processing the thickness of the board as set forth in claim 1 or 5, wherein the number of the cutters is two.

7. The apparatus of claim 1, wherein the edge of the circuit board is ground by moving the blade in a reciprocating manner or in a fixed point manner.

8. The apparatus for cutting and grinding a circuit board with an increased thickness as claimed in claim 1 or 7, wherein the number of the grinding blades is two and the grinding blades are disposed at the left and right sides of the edge grinding unit.

9. The apparatus for cutting and grinding a circuit board capable of increasing the thickness of the board as claimed in claim 1 or 5, wherein the cutter is a saw blade, the saw blade includes a plurality of saw teeth, each adjacent saw tooth is provided with a first saw tooth and a second saw tooth which are alternately arranged in succession; the section of the first sawtooth is a V-shaped blade formed by a first blade surface and a second blade surface, and the length of the section of the first blade surface is greater than that of the section of the second blade surface; the second sawtooth has a V-shaped blade with a cross section comprising a third blade surface and a fourth blade surface, and the fourth blade surface has a cross section length greater than that of the third blade surface.