CN211350618U - Semiconductor triode of dismantling fast - Google Patents
Semiconductor triode of dismantling fast Download PDFInfo
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- CN211350618U CN211350618U CN202020281808.2U CN202020281808U CN211350618U CN 211350618 U CN211350618 U CN 211350618U CN 202020281808 U CN202020281808 U CN 202020281808U CN 211350618 U CN211350618 U CN 211350618U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 230000000694 effects Effects 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 17
- 230000006978 adaptation Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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Abstract
The utility model relates to the field of semiconductor technology, specifically be a semiconductor triode of quick dismantlement, including mount and triode body, the activity groove has been seted up to one side of mount inner wall, the mounting groove has been seted up to one side that the activity inslot wall was kept away from to the mount, the equal fixedly connected with spring in both ends of activity inslot wall one side. This semiconductor triode of quick dismantlement, both sides through at the mount inner wall set up movable groove and mounting groove respectively, and two springs of inside fixed connection at the movable groove, baffle at one end fixed connection of spring surface, during the use with the inside of joint at movable groove and mounting groove respectively at the both ends of triode surface, can reach the purpose of fixed triode, and the inside fixedly connected with metal sheet at the mounting groove, can reach the purpose of triode normal use, thereby it needs with the help of multiple instrument to have solved when dismantling the triode, and cause the triode to damage and the unable normal use problem of device easily.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a semiconductor triode of dismantling fast.
Background
The triode is a semiconductor device for controlling current, has the function of amplifying a weak signal into an electric signal with a large amplitude value and is also used as a non-contact switch, is one of semiconductor basic elements, has the function of current amplification and is a core element of an electronic circuit.
The triode has all obtained extensive application because of its outstanding electricity performance on many electrical apparatus, and the performance of the great whole device that has increased in existence of crystal triode has guaranteed the normal use of whole equipment, and the triode that uses now is mostly the inside of lug weld at circuit or electrical apparatus to realize the intercommunication of circuit and the normal use of equipment, but, the triode that uses now, in normal use, still has following shortcoming:
the internal parts of the machine body in the prior art are damaged, so that a user needs to use various tools when disassembling the triode, and the triode is easily damaged, so that the condition that the device cannot be normally used occurs.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides a semiconductor triode which can be rapidly disassembled, the movable groove and the mounting groove are respectively arranged at the two sides of the inner wall of the fixing frame, two springs are fixedly connected in the movable groove, one end of the outer surface of the spring is fixedly connected with a baffle plate, when in use, the two ends of the outer surface of the triode are respectively clamped in the movable groove and the mounting groove, the purpose of fixing the triode can be achieved, a metal plate is fixedly connected in the mounting groove, the purpose of normal use of the triode can be achieved, meanwhile, a first clamping cap and a second clamping cap are respectively clamped at the two ends of the outer surface of the triode body, a first fixing table and a second fixing table are respectively and fixedly connected at the middle part of the outer surface of the first clamping cap and the second clamping cap, the communication between the triode body and other parts can be realized, and the purpose of repeated use of the first clamping cap and the, to a certain extent, the method accords with the concept of green environmental protection, and solves the problems in the background technology.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a semiconductor triode of quick dismantlement, includes mount and triode body, the activity groove has been seted up to one side of mount inner wall, the mounting groove has been seted up to one side that the activity inslot inner wall was kept away from to the mount, the equal fixedly connected with spring in both ends of activity inslot inner wall one side, the other end fixed connection baffle of spring surface, the bottom fixedly connected with metal sheet of mounting groove inner wall, the one end joint of triode body surface has first card cap, the first fixed station of middle part fixedly connected with on first card cap surface top, the one end joint that first card cap surface was kept away from to the triode body has second card cap, the middle part fixedly connected with second fixed station of first fixed station surface one end is kept away from to second card cap.
Optionally, the size of first fixed station and the size looks adaptation of mounting groove, first fixed station and mounting groove looks joint, the size of second fixed station and the size looks adaptation in activity groove, the second fixed station and the joint of activity groove looks.
Optionally, the size of the inside of the first clamping cap is slightly smaller than that of the triode body, the size of the inside of the second clamping cap is slightly smaller than that of the triode body, and the thicknesses of the side walls of the first clamping cap and the second clamping cap are equal.
Optionally, one end of the outer surface of the spring is fixedly connected with the inner wall of the movable groove in a welding mode, the other end of the outer surface of the spring is fixedly connected with the outer surface of the baffle in a welding mode, and the diameter of the spring is smaller than the width of the movable groove.
Optionally, the length of the baffle is equal to that of the movable groove, and the width of the baffle is equal to that of the movable groove.
Optionally, the size of the metal plate is slightly smaller than that of the mounting groove, and the metal plate is fixedly connected with the inside of the mounting groove in a welding mode.
Optionally, the length of the triode body is not greater than the length of the inner wall of the fixing frame, and the width of the triode body is smaller than the width of the inner wall of the fixing frame.
(III) advantageous effects
The utility model provides a semiconductor triode of dismantling fast possesses following beneficial effect:
1. this semiconductor triode of quick dismantlement, both sides through at the mount inner wall set up movable groove and mounting groove respectively, and two springs of inside fixed connection at the movable groove, baffle at one end fixed connection of spring surface, during the use with the inside of joint at movable groove and mounting groove respectively at the both ends of triode surface, can reach the purpose of fixed triode, and the inside fixedly connected with metal sheet at the mounting groove, can reach the purpose of triode normal use, thereby it needs with the help of multiple instrument to have solved when dismantling the triode, and cause the triode to damage and the unable normal use problem of device easily.
2. This semiconductor triode of quick dismantlement has first card cap and second card cap through the both ends difference joint at triode body surface to at the first fixed station of first card cap and second card cap surface's middle part difference fixedly connected with and second fixed station, can realize the intercommunication of triode body and other parts, and can also realize first card cap and the used repeatedly's of second card cap purpose, to a certain extent, accords with green's theory.
Drawings
FIG. 1 is a schematic sectional view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic cross-sectional view of the fixing frame of the present invention;
fig. 4 is a schematic structural diagram of the transistor body of the present invention.
In the figure: the triode structure comprises a support 1, a triode body 2, a first clamping cap 3, a second clamping cap 4, a metal plate 5, a baffle 6, a spring 7, a movable groove 8, a mounting groove 9, a first fixing table 10 and a second fixing table 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a semiconductor triode of quick dismantlement, including mount 1 and triode body 2, movable groove 8 has been seted up to one side of 1 inner wall of mount, mounting groove 9 has been seted up to one side that mount 1 kept away from movable groove 8 inner wall, the equal fixedly connected with spring 7 in both ends of 8 inner wall one sides in movable groove, the other end fixed connection baffle 6 of spring 7 surface, the bottom fixedly connected with metal sheet 5 of mounting groove 9 inner wall, the one end joint of 2 surfaces of triode body has first card cap 3, the first fixed station 10 of middle part fixedly connected with on 3 surface tops of first card cap, the one end joint that triode body 2 kept away from 3 surfaces of first card cap has second card cap 4, the middle part fixedly connected with second fixed station 11 of 10 surface one ends is kept away from to second card cap 4.
As an optimal technical solution of the utility model:
size and the mounting groove 9 of first fixed station 10 size looks adaptation, first fixed station 10 and mounting groove 9 looks joint, the size of second fixed station 11 and the size looks adaptation in activity groove 8, second fixed station 11 and the 8 looks joints in activity groove, through respectively with first fixed station 10 and mounting groove 9 and second fixed station 11 and the 8 looks joints in activity groove during the use, can reach the purpose of fixed triode, this kind of mode of fixed triode can reach the purpose convenient to detach and installation simultaneously, reduced at the dismantlement in-process, the damage degree to the triode.
As an optimal technical solution of the utility model:
As an optimal technical solution of the utility model:
the one end of a plurality of springs 7 surface is through the welded mode and the inner wall fixed connection of activity groove 8, the other end of a plurality of springs 7 surface passes through the welded mode and is connected with the surface fixed connection of baffle 6, a plurality of springs 7's diameter is less than the width of activity groove 8, fixed connection's spring 7 can reach the purpose that unexpected condition can not appear in the use of spring 7, spring 7's existence can provide elasticity for baffle 6 simultaneously, in order to reach the purpose of withstanding triode body 2, prevent that the not hard up condition from appearing in the use of triode body 2.
As an optimal technical solution of the utility model:
the length of baffle 6 is equal with the length of activity groove 8, and the width of baffle 6 is equal with the width of activity groove 8, makes baffle 6 can easily place in the inside of activity groove 8, guarantees simultaneously that baffle 6 can be in the inside free activity of activity groove 8, and the smooth and easy nature of baffle 6 motion can be guaranteed to baffle 6 and the activity groove 8 of size adaptation, reduces the friction of baffle 6 and 8 lateral walls of activity groove, reduces the wearing and tearing of baffle 6.
As an optimal technical solution of the utility model:
the size of metal sheet 5 slightly is less than the size of mounting groove 9, and metal sheet 5 passes through the inside fixed connection of welded mode and mounting groove 9, makes placing in the inside of mounting groove 9 that metal sheet 5 can relax, and wherein the existence of metal sheet 5 can reach the purpose that triode body 2 can normal use, passes through the contact of triode with metal sheet 5 during the use, reaches the purpose of the whole device circuit of intercommunication to guarantee that whole device can normal use.
As an optimal technical solution of the utility model:
the length of triode body 2 is not more than the length of mount 1 inner wall, and triode body 2 width is less than the width of mount 1 inner wall, and the suitable triode body 2 of size can reach and be convenient for place and fixed purpose, and guarantees that triode body 2 after the fixed connection can not surpass the top surface and the bottom surface of mount 1 to guarantee that the existence of triode body 2 can not produce the use of other parts and interfere.
In summary, in the semiconductor triode with quick disassembly, when in use, the movable groove 8 and the mounting groove 9 are respectively arranged at two sides of the inner wall of the fixed frame 1, the two springs 7 are fixedly connected in the movable groove 8, the baffle 6 is fixedly connected at one end of the outer surface of the spring 7, when in use, two ends of the outer surface of the triode are respectively clamped in the movable groove 8 and the mounting groove 9, the purpose of fixing the triode can be achieved, the metal plate 5 is fixedly connected in the mounting groove 9, the purpose of normal use of the triode can be achieved, thereby solving the problems that the triode is easy to damage by means of various tools and the device cannot be normally used when in disassembly of the triode, by respectively clamping the first clamping cap 3 and the second clamping cap 4 at two ends of the outer surface of the triode body 2, and respectively fixedly connecting the first fixed platform 10 and the second fixed platform 11 at the middle parts of the outer surfaces of the first clamping cap 3 and the second clamping cap 4, can realize the intercommunication of triode body 2 and other parts, and can also realize the purpose of first card cap 3 and 4 used repeatedly of second card cap, to a certain extent, accord with green's theory.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A semiconductor triode of quick dismantlement which characterized in that: comprises a fixed frame (1) and a triode body (2), one side of the inner wall of the fixed frame (1) is provided with a movable groove (8), an installation groove (9) is arranged on one side of the fixed frame (1) far away from the inner wall of the movable groove (8), both ends of one side of the inner wall of the movable groove (8) are fixedly connected with springs (7), the other end of the outer surface of the spring (7) is fixedly connected with a baffle plate (6), the bottom of the inner wall of the mounting groove (9) is fixedly connected with a metal plate (5), one end of the outer surface of the triode body (2) is clamped with a first clamping cap (3), the middle part of the top end of the outer surface of the first clamping cap (3) is fixedly connected with a first fixing table (10), a second clamping cap (4) is clamped at one end of the triode body (2) far away from the outer surface of the first clamping cap (3), the middle part of one end, far away from the outer surface of the first fixed table (10), of the second clamping cap (4) is fixedly connected with a second fixed table (11).
2. A rapidly disassembled semiconductor transistor according to claim 1, wherein: the size of first fixed station (10) and the size looks adaptation of mounting groove (9), first fixed station (10) and mounting groove (9) looks joint, the size of second fixed station (11) and the size looks adaptation of activity groove (8), second fixed station (11) and activity groove (8) looks joint.
3. A rapidly disassembled semiconductor transistor according to claim 1, wherein: the size of the inside of the first clamping cap (3) is slightly smaller than that of the triode body (2), the size of the inside of the second clamping cap (4) is slightly smaller than that of the triode body (2), and the thicknesses of the side walls of the first clamping cap (3) and the second clamping cap (4) are equal.
4. A rapidly disassembled semiconductor transistor according to claim 1, wherein: a plurality of the one end of spring (7) surface is through the welded mode and the inner wall fixed connection of activity groove (8), and is a plurality of the other end of spring (7) surface is through the welded mode and the surface fixed connection of baffle (6), and is a plurality of the diameter of spring (7) is less than the width of activity groove (8).
5. A rapidly disassembled semiconductor transistor according to claim 1, wherein: the length of the baffle (6) is equal to that of the movable groove (8), and the width of the baffle (6) is equal to that of the movable groove (8).
6. A rapidly disassembled semiconductor transistor according to claim 1, wherein: the size of metal sheet (5) slightly is less than the size of mounting groove (9), metal sheet (5) are through the inside fixed connection of welded mode and mounting groove (9).
7. A rapidly disassembled semiconductor transistor according to claim 1, wherein: the length of the triode body (2) is not more than that of the inner wall of the fixing frame (1), and the width of the triode body (2) is less than that of the inner wall of the fixing frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020281808.2U CN211350618U (en) | 2020-03-09 | 2020-03-09 | Semiconductor triode of dismantling fast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020281808.2U CN211350618U (en) | 2020-03-09 | 2020-03-09 | Semiconductor triode of dismantling fast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211350618U true CN211350618U (en) | 2020-08-25 |
Family
ID=72093310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020281808.2U Active CN211350618U (en) | 2020-03-09 | 2020-03-09 | Semiconductor triode of dismantling fast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211350618U (en) |
-
2020
- 2020-03-09 CN CN202020281808.2U patent/CN211350618U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Address after: Front 209, Building 32, Shangxing Road, Shaqi Community, Xinqiao Street, Bao'an District, Shenzhen City, Guangdong Province 518000 Patentee after: Shenzhen Changtai Feng Electronic Technology Co.,Ltd. Country or region after: China Address before: B060-B061-B062, 1st Floor, Shajing West Ring Electronic Trading Center, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province 518000 Patentee before: Shenzhen changtaifeng Components Co.,Ltd. Country or region before: China |