CN211349287U - Water-cooling heat dissipation equipment for computer chip - Google Patents
Water-cooling heat dissipation equipment for computer chip Download PDFInfo
- Publication number
- CN211349287U CN211349287U CN202020410628.XU CN202020410628U CN211349287U CN 211349287 U CN211349287 U CN 211349287U CN 202020410628 U CN202020410628 U CN 202020410628U CN 211349287 U CN211349287 U CN 211349287U
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- computer chip
- water
- arc
- heat dissipation
- base
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a water-cooling heat dissipation equipment for computer chip, the on-line screen storage device comprises a base, the top fixed mounting of base has the installation piece, the mounting groove has been seted up at the middle part on installation piece top, the inside of mounting groove is inlayed and is equipped with the computer chip, the arc wall has all been seted up at the both ends of computer chip both sides, the bottom fixed mounting of mounting groove has annular cooling tube, the both ends of mounting groove both sides cell wall are all seted up flutedly, the equal fixed mounting in one side cell wall of four recesses has spacing spring, the equal fixed mounting in one end of four spacing springs has the arc piece, one side of four arc pieces inlays with the arc wall that corresponds respectively. The utility model discloses a miniature drawing liquid pump of temperature detect switch control of installation is convenient for with the inside cooling water suction of cavity to annular cooling tube in, through the cooling water of annular cooling tube, the quick heat of taking away computer chip work production of being convenient for guarantees computer chip's normal work.
Description
Technical Field
The utility model relates to a computer technology field, in particular to water-cooling heat dissipation equipment for computer chip.
Background
The computer chip is a thin sheet made of silicon material and has a size of only half of a fingernail. A chip is connected by hundreds of microcircuits, and the microcircuits for generating pulse current are distributed on the chip.
The heat generated by the existing computer chip in the working process is generally radiated by natural wind or radiated by a radiating fan, the radiating effect is poor, the computer chip is easily overheated, the computer chip is damaged, and the service life of the computer chip is influenced, so that a water-cooling radiating device for the computer chip is required to be designed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a water-cooling heat dissipation equipment for computer chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a water-cooling heat dissipation device for a computer chip comprises a base, wherein a mounting block is fixedly mounted at the top end of the base, a mounting groove is formed in the middle of the top end of the mounting block, the computer chip is embedded in the mounting groove, arc-shaped grooves are formed in two ends of two sides of the computer chip, an annular cooling pipe is fixedly mounted at the bottom end of the mounting groove, grooves are formed in two ends of two side groove walls of the mounting groove, a limiting spring is fixedly mounted on one side groove wall of each of the four grooves, an arc-shaped block is fixedly mounted at one end of each of the four limiting springs, one side of each of the four arc-shaped blocks is respectively embedded and connected with the corresponding arc-shaped groove, two sliding grooves communicated with the grooves are formed in two sides of the top end of the mounting block, sliding blocks are slidably connected with the interiors of the four, one end of each of the four connecting rods is fixedly connected with the top end of the corresponding arc-shaped block, a cavity is formed in the base, a miniature liquid pump is fixedly mounted on the bottom cavity wall of the cavity, the liquid outlet end of the miniature liquid pump is fixedly connected with one end of the annular cooling pipe, and the other end of the annular cooling pipe is communicated with the inside of the cavity.
Preferably, threaded holes are formed in four corners of the top end of the base, and fastening bolts are connected to the inner portions of the threaded holes in a threaded mode.
Preferably, the top ends of the four sliding blocks are provided with anti-skid grains which are uniformly distributed.
Preferably, one side of the top end of the base is provided with a liquid inlet communicated with the cavity, and a sealing plug is embedded in the liquid inlet.
Preferably, the joint of the computer chip and the mounting groove is coated with a sealant.
Preferably, a temperature control switch is fixedly mounted on a groove wall on one side of the mounting groove, and the miniature liquid pump is electrically connected with an external power supply through the temperature control switch.
The utility model discloses a technological effect and advantage:
(1) the miniature liquid pump is controlled by the installed temperature control switch, so that cooling water in the cavity can be conveniently pumped into the annular cooling pipe, heat generated by the work of the computer chip can be conveniently and quickly taken away by the cooling water of the annular cooling pipe, and the normal work of the computer chip is ensured;
(2) the extension and retraction of the arc-shaped block are controlled by the installed sliding block and the limiting spring arranged in the groove, so that the computer chip can be conveniently installed and detached.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the internal structure of the present invention.
Fig. 3 is a partial enlarged view of the present invention.
Fig. 4 is a schematic view of the structure of the annular cooling pipe of the present invention.
In the figure: 1. a base; 2. mounting blocks; 3. fastening a bolt; 4. a chute; 5. mounting grooves; 6. a computer chip; 7. a slider; 8. a liquid inlet; 9. a sealing plug; 10. a cavity; 11. a miniature liquid pump; 12. an annular cooling tube; 13. an arc-shaped block; 14. a groove; 15. a limiting spring; 16. an arc-shaped slot; 17. a connecting rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a water-cooling heat dissipation device for computer chip as shown in figures 1-4, which comprises a base 1, a mounting block 2 is fixedly arranged at the top end of the base 1, a mounting groove 5 is arranged at the middle part of the top end of the mounting block 2, a computer chip 6 is embedded in the mounting groove 5, sealant is coated at the joint of the computer chip 6 and the mounting groove 5, arc-shaped grooves 16 are arranged at the two ends of the two sides of the computer chip 6, an annular cooling pipe 12 is fixedly arranged at the bottom end of the mounting groove 5, grooves 14 are arranged at the two ends of the two side groove walls of the mounting groove 5, a limiting spring 15 is fixedly arranged at one side groove wall of the four grooves 14, arc-shaped blocks 13 are fixedly arranged at one end of the four limiting springs 15, one side of the four arc-shaped blocks 13 is respectively embedded and connected with the corresponding arc-shaped grooves 16, two sliding grooves 4 communicated with the grooves, four equal sliding connection in inside of spout 4 has slider 7, evenly distributed's anti-skidding line has all been seted up on the top of four slider 7, the equal fixed mounting in bottom of four slider 7 has connecting rod 17, the one end of four connecting rod 17 and the top fixed connection who corresponds arc piece 13, cavity 10 has been seted up to base 1's inside, the bottom chamber wall fixed mounting of cavity 10 has miniature drawing liquid pump 11, miniature drawing liquid pump 11's play liquid end and annular cooling tube 12's one end fixed connection, annular cooling tube 12's the other end and the inside intercommunication of cavity 10, be convenient for with the inside water suction of cavity 10 to annular cooling tube 12's inside through miniature drawing liquid pump 11, the heat that produces in the quick computer chip 6 course of operation of taking away of being convenient for, guarantee computer chip 6's normal work.
Four edges on base 1 top all set up threaded hole, the equal threaded connection in inside of four screw holes has fastening bolt 3, through threaded connection's fastening bolt 3, the base 1 of being convenient for is fixed with computer housing, the inlet 8 with cavity 10 intercommunication is seted up to one side on base 1 top, the inside of inlet 8 is inlayed and is equipped with sealing plug 9, through the inlet 8 of seting up, is convenient for pour into the cooling water into to the inside of cavity 10.
A temperature control switch is fixedly mounted on one side of the groove wall of the mounting groove 5, and the miniature liquid pump 11 is electrically connected with an external power supply through the temperature control switch and controls the miniature liquid pump 11 to work through the temperature control switch.
The utility model discloses the theory of operation: when the water-cooling heat dissipation device for the computer chip needs to be used, firstly, the four sliding blocks 7 are manually pushed, the four sliding blocks 7 move to drive the four arc-shaped blocks 13 to move, the four arc-shaped blocks 13 move to the inner part of the groove 14, then, the computer chip 6 is manually embedded into the inner part of the mounting groove 5, then, the sliding blocks 7 are manually released, the four arc-shaped blocks 13 are embedded into the inner part of the arc-shaped groove 16 arranged on the side of the computer chip 6 through the limiting springs 15 to complete the mounting of the computer chip 6, when the heat generated by the computer chip 6 during working reaches the stability set by the temperature control switch, the micro liquid pump 11 is opened through the temperature control switch, the cooling liquid in the cavity 10 is pumped into the inner part of the annular cooling pipe 12 through the micro liquid pump 11, and the heat generated by the computer chip 6 during working is conveniently and quickly taken away through the cooling water flowing in the annular cooling pipe, ensuring the normal operation of the computer chip 6.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses the standard parts that use all can purchase from the market, and dysmorphism piece all can be customized according to the record of the description with the drawing.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The water-cooling heat dissipation equipment for the computer chip comprises a base (1) and is characterized in that an installation block (2) is fixedly installed at the top end of the base (1), an installation groove (5) is formed in the middle of the top end of the installation block (2), the computer chip (6) is embedded in the installation groove (5), arc-shaped grooves (16) are formed in two ends of two sides of the computer chip (6), an annular cooling pipe (12) is fixedly installed at the bottom end of the installation groove (5), grooves (14) are formed in two ends of two side groove walls of the installation groove (5), limiting springs (15) are fixedly installed on one side groove wall of each of the four grooves (14), arc-shaped blocks (13) are fixedly installed at one ends of the four limiting springs (15), and one sides of the four arc-shaped blocks (13) are respectively embedded and connected with the corresponding arc-shaped grooves (16), two chutes (4) communicated with the groove (14) are respectively formed in two sides of the top end of the mounting block (2), four chutes (4) are respectively formed in two sides of the top end of the mounting block (2), a sliding block (7) and a connecting rod (17) are respectively and fixedly mounted at the bottom end of the sliding block (7) and four ends of the connecting rod (17) are fixedly connected with the top end of the corresponding arc-shaped block (13), a cavity (10) is formed in the base (1), a miniature liquid pump (11) is fixedly mounted on the bottom cavity wall of the cavity (10), a liquid outlet end of the miniature liquid pump (11) is fixedly connected with one end of the annular cooling pipe (12), and the other end of the annular cooling pipe (12) is communicated with the inside of the cavity (10).
2. The water-cooling heat dissipation apparatus for a computer chip according to claim 1, wherein: threaded holes are formed in four corners of the top end of the base (1), and fastening bolts (3) are connected with the inner portions of the threaded holes in a threaded mode.
3. The water-cooling heat dissipation apparatus for a computer chip according to claim 1, wherein: the top ends of the four sliding blocks (7) are all provided with anti-skid lines which are uniformly distributed.
4. The water-cooling heat dissipation apparatus for a computer chip according to claim 1, wherein: a liquid inlet (8) communicated with the cavity (10) is formed in one side of the top end of the base (1), and a sealing plug (9) is embedded in the liquid inlet (8).
5. The water-cooling heat dissipation apparatus for a computer chip according to claim 1, wherein: and sealant is coated at the joint of the computer chip (6) and the mounting groove (5).
6. The water-cooling heat dissipation apparatus for a computer chip according to claim 1, wherein: a temperature control switch is fixedly mounted on the wall of one side of the mounting groove (5), and the miniature liquid pump (11) is electrically connected with an external power supply through the temperature control switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020410628.XU CN211349287U (en) | 2020-03-26 | 2020-03-26 | Water-cooling heat dissipation equipment for computer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020410628.XU CN211349287U (en) | 2020-03-26 | 2020-03-26 | Water-cooling heat dissipation equipment for computer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211349287U true CN211349287U (en) | 2020-08-25 |
Family
ID=72095033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020410628.XU Expired - Fee Related CN211349287U (en) | 2020-03-26 | 2020-03-26 | Water-cooling heat dissipation equipment for computer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211349287U (en) |
-
2020
- 2020-03-26 CN CN202020410628.XU patent/CN211349287U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200825 Termination date: 20210326 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |