CN211304048U

CN211304048U - Semiconductor ultrasonic cleaning equipment assembly

Info

Publication number: CN211304048U
Application number: CN201921834136.7U
Authority: CN
Inventors: 陈绍勇; 王志华; 孙豹龙
Original assignee: Wuxi Xiang Hua Technology Co ltd
Current assignee: Wuxi Xiang Hua Technology Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2020-08-21
Anticipated expiration: 2029-10-29

Abstract

The utility model discloses a semiconductor ultrasonic cleaning equipment assembly, including the washing case, all be fixed with supersonic generator on two inner walls of washing case, the washing case is provided with the fluid-discharge tube near one side of its bottom, be provided with the subassembly of cleaning that can make the two-way stirring of washing liquid in the washing case, clean the subassembly including installing the motor at the bottom in the washing case, the output shaft of motor is fixed with the sun gear, the both sides of sun gear all mesh has the planet wheel, and the bottom of planet wheel is installed in the washing case through the axle, the axle center department at sun gear and planet wheel top all is fixed with the bull stick, the cover has the board of placing on the bull stick; the utility model discloses in putting into semiconductor device and placing the interval, the motor switch-on external power supply starts, makes the bull stick on it rotate through the cooperation of sun gear and planet wheel, and rotates opposite direction, and then makes the washing liquid of wasing the incasement carry out opposite direction's stirring, finally makes the washing liquid better to semiconductor device's cleaning performance.

Description

Semiconductor ultrasonic cleaning equipment assembly

Technical Field

The utility model relates to a semiconductor cleaning technology field specifically is a semiconductor ultrasonic cleaning equipment subassembly.

Background

In the prior art, as shown in chinese patent CN201620718654.2, an ultrasonic cleaning apparatus for a chip is provided, which includes a housing and a cover plate disposed on the top of the housing, wherein a water tank is disposed in the housing, the housing and the water tank are integrally formed, a sealed cavity is formed between the housing and the water tank, a cleaning control device is disposed in the sealed cavity, the cleaning control device includes a central processing unit, an ultrasonic cleaning module, an automatic constant temperature control module, a timing module and a hot air drying module, and the central processing unit is respectively connected to the ultrasonic cleaning module, the automatic constant temperature control module, the timing module and the hot air drying module; the surface of the front side of the shell is respectively provided with a touch screen and a control button, and the touch screen is electrically connected with the cleaning control device.

However, in the above-mentioned chinese patent, the water in the tank is injected before the housing is used, and thus the water does not flow in the tank, so that the cleaning effect for the semiconductor device is not good, and therefore, it is necessary to design a semiconductor ultrasonic cleaning apparatus assembly to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a semiconductor ultrasonic cleaning equipment subassembly has solved the water in the basin and has not flowed in chinese patent CN201620718654.2, to the not good problem of semiconductor device cleaning performance.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a semiconductor ultrasonic cleaning equipment assembly comprises a cleaning box, wherein ultrasonic generators are fixed on two inner walls of the cleaning box, a liquid discharge pipe is arranged on one side of the cleaning box close to the bottom of the cleaning box, and a scrubbing assembly capable of stirring cleaning liquid in a two-way mode is arranged in the cleaning box;

the scrubbing assembly comprises a motor arranged at the bottom in a cleaning box, a sun wheel is fixed to an output shaft of the motor, planetary wheels are meshed with the two sides of the sun wheel, the bottom of each planetary wheel is mounted in the cleaning box through a shaft, rotating rods are fixed to the shaft centers of the sun wheel and the tops of the planetary wheels, plates are placed on the rotating rods in a sleeved mode, the number of the plates is multiple, a placing interval is formed between each rotating rod and each placing plate, stirring blades are connected to the tops of the rotating rods in a threaded mode, and a scrubbing layer for scrubbing a semiconductor device is fixed to the outer surface of each rotating rod.

Further, the bottom of wasing the incasement wall is fixed with the buckler, and the motor is located the buckler.

Furthermore, elastic layers are fixed on the upper portion and the lower portion of the placing plate.

Furthermore, the placing plate is provided with a through hole which enables the placing plate to be sleeved on the rotating rod.

Compared with the prior art, the utility model following beneficial effect possesses:

(1) this semiconductor ultrasonic cleaning equipment subassembly puts into semiconductor device and places the interval in, and the motor switch-on external power supply starts, makes the bull stick above it rotate through the cooperation of sun gear and planet wheel, and rotates opposite direction, and then makes the washing liquid of wasing the incasement carry out opposite direction's stirring, finally makes the washing liquid better to semiconductor device's cleaning performance.

(2) This semiconductor ultrasonic cleaning equipment subassembly, the rotation of bull stick cleans the layer and can cleans for fine semiconductor device's surface for semiconductor device's cleaning performance is better.

(3) This kind of semiconductor ultrasonic cleaning equipment subassembly places the board cover on the bull stick, can be so that wash case one shot performance places a plurality of boards of placing, and then makes and wash case one shot performance and wash a plurality of semiconductor device.

(4) This kind of semiconductor ultrasonic cleaning equipment subassembly, the setting of elastic layer can prevent semiconductor device and place the semiconductor device and damage between the board collision.

(5) This semiconductor ultrasonic cleaning equipment subassembly, the setting of stirring leaf can increase the resistance between its and the washing liquid, and then makes the stirring of washing liquid more violent, and is better to semiconductor device's cleaning performance, and the threaded connection of stirring leaf and bull stick, makes it not influence the loading and unloading of semiconductor device in wasing the incasement.

Drawings

FIG. 1 is a partial sectional view of a front view of a cleaning tank of the present invention;

FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;

fig. 3 is a top view of the sun gear of the present invention;

fig. 4 is a schematic view of the three-dimensional structure of the cleaning tank of the present invention.

In the figure: 1-cleaning box, 2-ultrasonic generator, 3-liquid discharge pipe, 4-motor, 5-sun gear, 6-planet gear, 7-rotating rod, 8-placing plate, 9-scrubbing layer, 10-waterproof cover, 11-elastic layer, 12-through hole and 13-stirring blade.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor ultrasonic cleaning equipment assembly comprises a cleaning box 1, wherein ultrasonic generators 2 are fixed on two inner walls of the cleaning box 1, a liquid discharge pipe 3 is arranged on one side of the cleaning box 1 close to the bottom of the cleaning box, and a scrubbing assembly capable of stirring cleaning liquid in a two-way mode is arranged in the cleaning box 1;

the scrubbing component comprises a motor 4 arranged at the bottom in a cleaning box 1, a sun wheel 5 is fixed on an output shaft of the motor 4, planet wheels 6 are meshed on two sides of the sun wheel 5, the bottom of the planet wheels 6 is arranged in the cleaning box 1 through a shaft, rotating rods 7 are fixed at the top parts of the sun wheel 5 and the planet wheels 6, the motor 4 is started by switching on an external power supply, as the output shaft of the motor 4 is fixedly connected with the sun wheel 5 and the sun wheel 5 are meshed with the planet wheels 6, after the motor 4 is started, the rotating rods 7 on the motor are rotated through the matching of the sun wheel 5 and the planet wheels and the rotating directions are opposite, a placing plate 8 is sleeved on the rotating rods 7, through holes 12 which are sleeved on the rotating rods 7 are arranged on the placing plate 8, the placing plate 8 is sleeved on the rotating rods 7, a plurality of placing plates 8 can be placed on the cleaning box 1 at one time, and then a plurality of semiconductor devices can be cleaned by the cleaning, and place the quantity of board 8 and be a plurality of, bull stick 7 with place and form one between the board 8 and place the interval, the washing liquid that washs in the case 1 carries out opposite direction's stirring, finally make the washing liquid better to semiconductor device's cleaning performance, the equal threaded connection in top of bull stick 7 has stirring leaf 13, can strengthen the resistance between its and the washing liquid, and then make the stirring of washing liquid more violent, the cleaning performance to semiconductor device is better, and stirring leaf 13 and bull stick 7's threaded connection, make it not influence the loading and unloading of semiconductor device in wasing case 1, and the external fixation of bull stick 7 has cleans layer 9 that cleans semiconductor device, it can be the sponge layer to clean layer 9.

The bottom of wasing 1 inner wall of case is fixed with buckler 10, and motor 4 is located buckler 10, prevents that motor 4 from intaking to influence its normal work.

The upper and lower parts of the placing plate 8 are both fixed with an elastic layer 11, and the elastic layer 11 can be a rubber layer.

When the cleaning box works, a semiconductor device is placed in a placing interval, the motor 4 is switched on an external power supply to be started, because the output shaft of the motor 4 is fixedly connected with the sun wheel 5, and the sun wheel 5 is meshed with the planet wheel 6, after the motor 4 is started, the rotating rod 7 on the motor is rotated through the matching of the sun wheel 5 and the planet wheel, and the rotating directions are opposite, so that the cleaning liquid in the cleaning box 1 is stirred in opposite directions, and finally the cleaning effect of the cleaning liquid on the semiconductor device is better, meanwhile, the rotating rod 7 is rotated, the cleaning layer 9 can well clean the surface of the semiconductor device, so that the cleaning effect of the semiconductor device is better, the placing plate 8 is sleeved on the rotating rod 7, a plurality of placing plates 8 can be placed on the cleaning box 1 at one time, and then the cleaning box 1 can clean a plurality of semiconductor devices, and the elastic layer 11 is arranged, can prevent semiconductor device and place between the board 8 bump and damage semiconductor device, stirring leaf 13's setting can increase its and the washing liquid between the resistance, and then makes the stirring of washing liquid more violent, and is better to semiconductor device's cleaning performance, and stirring leaf 13 and bull stick 7's threaded connection, makes it not influence the loading and unloading of semiconductor device in wasing case 1.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor ultrasonic cleaning equipment subassembly, is including wasing case (1), all be fixed with supersonic generator (2) on two inner walls of wasing case (1), it is provided with fluid-discharge tube (3), its characterized in that to wash one side that case (1) is close to its bottom: a scrubbing component capable of stirring cleaning liquid in a two-way manner is arranged in the cleaning box (1);

the cleaning assembly comprises a motor (4) arranged at the bottom in a cleaning box (1), an output shaft of the motor (4) is fixed with a sun wheel (5), planetary wheels (6) are meshed with the two sides of the sun wheel (5), the bottom of each planetary wheel (6) is arranged in the cleaning box (1) through a shaft, rotating rods (7) are fixed at the axle centers of the tops of the sun wheel (5) and the planetary wheels (6), plates (8) are placed on the rotating rods (7) in a sleeved mode, the number of the plates (8) is large, an interval is formed between each rotating rod (7) and each plate (8), stirring blades (13) are connected to the tops of the rotating rods (7) in a threaded mode, and a cleaning layer (9) for cleaning semiconductor devices is fixed on the outer surface of each rotating rod (7).

2. The semiconductor ultrasonic cleaning device assembly of claim 1, wherein: the bottom of the inner wall of the cleaning box (1) is fixed with a waterproof cover (10), and the motor (4) is positioned in the waterproof cover (10).

3. The semiconductor ultrasonic cleaning device assembly of claim 1, wherein: elastic layers (11) are fixed on the upper portion and the lower portion of the placing plate (8).

4. The semiconductor ultrasonic cleaning device assembly of claim 1, wherein: the placing plate (8) is provided with a through hole (12) which is sleeved on the rotating rod (7).