CN211297176U - Buried corrosion-resistant etching equipment - Google Patents

Abstract

The utility model discloses a bury and hinder etching equipment, including the equipment frame, install in the etching groove of equipment frame, install in the equipment frame and be located the first washing tank on etching groove right, install in the equipment frame and be located the second washing tank on first washing tank right, install in the heater that etches the inslot wall, install in etching inslot and with heater electric connection's first float switch subassembly, install in the second float switch subassembly that etches the inslot, with second float switch subassembly electric connection's moisturizing solenoid valve, with the liquid medicine circulation subassembly that etches the groove and is connected, with first washing tank, the blast air subassembly that the second washing tank is connected, and be used for the electric cabinet of controlgear switch. The etching equipment of this scheme of adoption combines etching process, solves and realizes the accurate management and control of heating and etching temperature, but liquid medicine automatic compensation in time and loop filter's problem to realize burying the control of resistance layer etching quality, satisfy the preparation that higher accuracy buried resistance etching required.

Description

Buried corrosion-resistant etching equipment

Technical Field

The utility model relates to a PCB processing technology field who contains and bury the resistance layer especially relates to a bury and hinder etching equipment.

Background

The buried resistor is formed by electroplating a special thin film nickel alloy material on a PCB copper foil in the PCB processing stage, then positioning the buried resistor between the copper foil and a dielectric layer in a laminating mode to form a PCB core board with a buried resistor layer, and then completing the manufacture of resistance layers with different resistances by etching a copper surface circuit and the buried resistor layer, thereby replacing the traditional surface-mounted resistor. The process can save the space on the surface of the circuit board, reduce the size of the circuit board, reduce the weight and the thickness of the circuit board, and simultaneously improve the reliability of the printed board due to the elimination of welding points.

However, in the prior art, the etching process of the buried resistance printed board is different from that of a common PCB due to the special characteristics of the material. The prior art includes:

1. ZL201210445571.7 method for improving resistance value precision of a resistance-buried printed circuit board, wherein a three-time etching process is disclosed, a copper foil layer of a developing part is etched for the first time until a resistance-buried layer is exposed, the resistance-buried layer exposed by the second time is etched until an insulating medium layer is exposed, a copper foil of a resistance pattern part is etched and removed by the third time, wherein the first time etching and the second time etching are both acid etching, the third time etching is alkaline etching, the particularity of etching equipment is not provided, etching liquid medicine for etching the resistance-buried layer for the second time is formed by mixing anhydrous copper sulfate and sulfuric acid, a cylinder body material of an etching machine is polypropylene PP or PPN, a heating pen is made of Teflon material, a conveying roller is made of PP material, and stainless steel material is not used.

This patent discloses a method for removing a buried barrier copper foil and a buried barrier by acid etching + alkaline etching, and also discloses some of the equipment requirements for the buried barrier etching.

2. ZL 201810607305.7A etching method based on nickel-phosphorus alloy buried resistance copper foil, the disclosed etching method is to etch away the copper layer and the nickel-phosphorus alloy buried resistance layer through an acid etching process, the etching time of the nickel-phosphorus alloy buried resistance layer is 2-3 times of the etching time of the copper foil with the same thickness, and the copper layer at the position of a window is etched away through an alkaline etching process.

This patent also discloses acid etching to remove the copper layer (as well as the copper foil) and the buried barrier layer.

By analyzing the contents disclosed in the 2 patent documents and the processing method of the prior art, the etching method disclosed in the prior art does not basically use a special buried etching-resistant device structure, and because the etching device has a large influence on the actually obtained buried etching-resistant precision, the actually known buried etching-resistant devices mostly use a conventional cylinder body to perform etching treatment manually, and the manual treatment causes inaccurate control range of heating and etching temperature, untimely replenishment of liquid medicine, no circular filtration and uncontrolled buried etching-resistant quality, so that a device specially used for etching treatment is necessary to be designed.

The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.

The applicant proposes a buried-resistance etching apparatus aiming at solving the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

In order to meet the above requirement, an object of the present invention is to provide a buried resistor etching apparatus, which aims to solve the problems of optimizing the buried resistor etching process control flow and improving the buried resistor control accuracy.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a bury and hinder etching equipment, including the equipment frame, install in the etching groove of equipment frame, install in the equipment frame and be located the first washing tank on etching groove the right, install in the equipment frame and be located the second washing tank on first washing tank the right, install in the heater that etches the inslot wall, install in etching inslot and with heater electric connection's first float switch subassembly, install in the second float switch subassembly that etches the inslot, with second float switch subassembly electric connection's moisturizing solenoid valve, the liquid medicine circulation subassembly that is connected with etching groove, with first washing tank, the blast air subassembly that the second washing tank is connected, and be used for controlling equipment switch's electric cabinet.

In one possible embodiment, the first float switch assembly includes a first liquid level float disposed at an upper end of the etch bath, and a switch electrically connected to the first liquid level float and used for controlling the operation of the heater.

In one possible embodiment, the second float switch assembly includes a second liquid level float disposed at a lower end of the etch bath, and a switch electrically connected to the second liquid level float and used for controlling the water replenishment solenoid valve.

In one possible embodiment, the chemical liquid circulating assembly comprises a circulating filter barrel arranged on the equipment frame, a vertical pump used for pumping out the chemical liquid in the etching bath, a water outlet pipe connected with the vertical pump and used for discharging the chemical liquid in the etching bath to the circulating filter barrel, and a water inlet pipe used for injecting the chemical liquid treated by the circulating filter barrel into the etching bath.

In one possible embodiment, the inlet of the water outlet pipe and the outlet of the water inlet pipe are both arranged at the bottom of the etching tank, and a space is arranged between the inlet of the water outlet pipe and the outlet of the water inlet pipe.

In one possible embodiment, the inlet of the water outlet pipe and the outlet of the water inlet pipe are both arranged at the bottom of the etching tank, and a space is arranged between the inlet of the water outlet pipe and the outlet of the water inlet pipe.

In one possible embodiment, the air blowing assembly includes an air blower for blowing air to the wash tank and a duct connected to an output end of the air blower, the duct being provided with two openings for blowing air to the first wash tank and the second wash tank, respectively.

In one possible embodiment, the equipment rack is provided with a tank body cover above the etching tank.

In one possible embodiment, the equipment rack is provided with an operating platform in front of the etching bath, and the operating platform comprises a bench.

In one possible embodiment, the equipment rack is provided with an insulating layer around the etching bath.

Compared with the prior art, the beneficial effects of the utility model reside in that: the etching equipment of this scheme of adoption combines etching process, solves and realizes the accurate management and control of heating and etching temperature, but liquid medicine automatic compensation in time and loop filter's problem to realize burying the control of resistance layer etching quality, satisfy the preparation that higher accuracy buried resistance etching required.

The invention is further described with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of a buried-resistance etching apparatus according to the present invention;

FIG. 2 is a schematic cross-sectional view of the apparatus of FIG. 1;

fig. 3 is a left side view (inside of the apparatus with insulation removed and a portion of the housing removed) of the apparatus of fig. 1 in block form.

Reference numerals

100 equipment rack 101 etch bath

102 first cleaning tank 103 second cleaning tank

104 heater 105 first float switch assembly

106 second float switch assembly 107 water-replenishing electromagnetic valve

108 circulating filter vat 109 electric cabinet

110 vertical pump 111 outlet pipe

112 water inlet pipe 113 trough cover

114 operating platform 115 bench

116 insulating layer

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

As shown in fig. 1, fig. 2 and fig. 3, for the utility model provides a bury and hinder etching equipment's concrete embodiment structure sketch map, including equipment rack 100, install in the etching bath 101 of equipment rack 100, install in equipment rack 100 and be located the first washing tank 102 on the right of etching bath 101, install in equipment rack 100 and be located the second washing tank 103 on the right of first washing tank 102, install in the heater 104 of etching bath 101 inner wall, install in etching bath 101 and with the first float switch subassembly 105 of heater 104 electric connection, install the second float switch subassembly 106 in etching bath 101, with the moisturizing solenoid valve 107 of second float switch subassembly 106 electric connection, the liquid medicine circulation subassembly of being connected with etching bath 101, the air blast subassembly of being connected with first washing tank 102, second washing tank 103, and the electric cabinet 109 that is used for controlling the equipment switch.

In a preferred embodiment, the first float switch assembly 105 includes a first liquid level float disposed at the upper end of the etch bath 101, and a switch (not shown) electrically connected to the first liquid level float and used for controlling the operation of the heater 104 (alternatively, the switch may be integrally connected to the heater 104).

Specifically, when the liquid level in the etching tank reaches the position of the first liquid level float ball, the heater 104 will heat up, so as to ensure the liquid level requirement of production and safe production.

In an alternative embodiment, the number of heaters 104 is at least 3 and the heaters 104 are Teflon heaters.

In a preferred embodiment, the second float switch assembly 106 includes a second liquid level float disposed at the lower end of the etch bath 101, and a switch electrically connected to the second liquid level float for controlling the water replenishment solenoid valve 107 (not shown, the switch may be integrally connected to the water replenishment solenoid valve 104).

Specifically, when the liquid level is evaporated to be lower than the lower liquid level floating ball, the water replenishing electromagnetic valve 107 is opened and automatically replenishes water into the etching tank 101;

as an alternative embodiment, the etch bath 101 tank size: 780 × 400 × 650mm (length × width × height), etch bath 101 bath material: PVDF material can resist 150 deg.c.

In a preferred embodiment, the chemical solution circulating assembly includes a circulating filter tank 108 disposed in the apparatus frame 100, a vertical pump 110 for pumping out the chemical solution in the etch bath 101, a water outlet pipe 111 connected to the vertical pump 110 for discharging the chemical solution in the etch bath 101 to the circulating filter tank 108, and a water inlet pipe 112 for injecting the chemical solution processed by the circulating filter tank 108 into the etch bath 101.

In a preferred embodiment, the inlet of the water outlet pipe 111 and the outlet of the water inlet pipe 112 are both installed at the bottom of the etching chamber 101, and a gap is provided between the inlet of the water outlet pipe 111 and the outlet of the water inlet pipe 112.

In a preferred embodiment, the electric cabinet 109 is electrically connected to the vertical pump 110, and is configured to control the power on and off of the vertical pump 110.

The electric cabinet 109 further comprises a power supply main switch, a control power supply switch, a filter switch, a blower switch, a heater switch and the like, and a user can operate the electric cabinet to operate the electric cabinet.

In a preferred embodiment, the air blowing assembly comprises an air blower for blowing air to the first cleaning tank 102 and the second cleaning tank 103, and a pipeline connected with the output end of the air blower, wherein the pipeline is provided with two openings for respectively blowing air to the first cleaning tank 102 and the second cleaning tank 103, so that the circulation of pure water in the tanks and the board surface cleanliness are ensured.

As an optional embodiment, the sizes of the first cleaning tank 102 and the second cleaning tank 103 are as follows: 780 × 380 × 650mm (length × width × height).

In the embodiment shown in fig. 1, the equipment rack 100 is provided with a tank cover 113 above the etching tank 101.

As an alternative embodiment, the equipment rack 100 is provided with an operation platform 114 in front of the etching bath 101, and the operation platform 114 includes a bench 115 with 1500 × 380 × 278mm (length × width × height), so as to facilitate standing for rest during operation.

As shown in fig. 1, in a preferred embodiment, the equipment rack 100 is provided with an insulating layer 116 around the etching chamber 101.

As an optional implementation mode, a human-machine operation interface connected with the electric control box 109 is further included.

As an alternative embodiment, the upper end of the etching bath 101 is provided with a cross bar.

The using method of the equipment sequentially comprises the following steps:

opening a water inlet pipeline to enable pure water to enter each etching tank 101, the first cleaning tank 102 and the second cleaning tank 103, and preparing liquid medicine;

secondly, sequentially turning on electric cabinet switches (a power supply main switch, a control power supply switch, a filter switch, a blower switch and a heater switch);

entering a man-machine operation interface, and starting corresponding functional items (a blower, a filter, a water replenishing electromagnetic valve and a temperature controller);

specifically, during etching operation, the PCB is fixed by a special clamp, and the clamp is fixed on a cross bar above the groove body, so that the PCB is completely immersed into the liquid level in the groove, and the immersion time is accurately controlled;

soaking the PCB in an etching tank 101 (the liquid medicine is 2ml/L of sulfuric acid and 250g/L of anhydrous copper sulfate, the temperature is 90-95 ℃) for 15 minutes to completely etch the buried resistance layer outside the circuit area, and soaking the PCB in a first cleaning tank 102 and a second cleaning tank 103 respectively for 5 minutes for cleaning after the etching is finished;

film removing: the PCB needs to be removed in time after being taken out from the buried resistance etching cleaning tank, so that the deep oxidation of the board surface is avoided;

browning: tests show that after the PCB with the embedded resistor and the window is subjected to browning, the embedded resistor resistance is larger than 10%, and the PCB is subjected to browning in advance in consideration of the stability of the embedded resistor resistance;

pasting a photoresist film II: pasting an alkali-resistant dry film;

windowing exposure: note exposure alignment;

developing step two;

windowing and etching: alkaline etching is used, the buried resistance layer is not damaged, the size of a buried resistance windowing is adjusted by controlling the etching speed, and the buried resistance value is ensured to meet the design requirement (the browned layer after etching is slightly red, and no abnormity occurs after 6 times of thermal stress after pressing);

removing the film, cleaning and drying: after etching, the film is required to be removed in time, cleaned and dried, so that deep oxidation and heterochromous color of a browning layer are avoided;

baking the plate: drying the moisture on the board surface before pressing;

remarking: the baking of the plate is completed within 24 hours from browning to pressing (the browning storage time is 24 hours).

In conclusion, by adopting the etching equipment of the scheme and combining the etching process, the problems that the heating and etching temperature is accurately controlled, the liquid medicine is timely and automatically supplemented and can be circularly filtered are solved, so that the etching quality of the buried resistance layer is controlled, and the manufacture of the higher-precision buried resistance etching requirement is met.

Various other modifications and changes can be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the protection scope of the present invention.

Claims (10)

1. The utility model provides a bury and hinder etching equipment, a serial communication port, including the equipment frame, install in the etching groove of equipment frame, install in the equipment frame and be located the first washing tank on etching groove right, install in the equipment frame and be located the second washing tank on first washing tank right, install in the heater of etching inslot wall, install in the etching groove and with heater electric connection's first float switch subassembly, install in the second float switch subassembly of etching inslot, moisturizing solenoid valve with second float switch subassembly electric connection, the liquid medicine circulation subassembly of being connected with the etching groove, with first washing tank, the blast air subassembly of second washing tank connection, and the electric cabinet that is used for the control equipment switch.

2. The apparatus of claim 1, wherein the first float switch assembly comprises a first liquid level float disposed at an upper end of the etch bath, and a switch electrically connected to the first liquid level float and controlling operation of the heater.

3. The apparatus of claim 1, wherein the second float switch assembly comprises a second float ball disposed at a lower end of the etching chamber, and a switch electrically connected to the second float ball for controlling a water-replenishing solenoid valve.

4. The buried etching equipment of claim 1, wherein the chemical solution circulating assembly comprises a circulating filter vat arranged on the equipment frame, a vertical pump for pumping out the chemical solution in the etching bath, a water outlet pipe connected with the vertical pump and used for discharging the chemical solution in the etching bath to the circulating filter vat, and a water inlet pipe used for injecting the chemical solution processed by the circulating filter vat into the etching bath.

5. The apparatus of claim 4, wherein the inlet of the water outlet pipe and the outlet of the water inlet pipe are both installed at the bottom of the etching bath, and a gap is provided between the inlet of the water outlet pipe and the outlet of the water inlet pipe.

6. The apparatus of claim 4, wherein the electric cabinet is electrically connected to a vertical pump for controlling the power on and off of the vertical pump.

7. The apparatus of claim 4, wherein the blowing assembly comprises a blower for blowing air to the cleaning bath and a duct connected to an output end of the blower, the duct having two openings for blowing air to the first cleaning bath and the second cleaning bath, respectively.

8. The buried resistance etching equipment according to claim 1, wherein the equipment frame is provided with a tank body cover above the etching tank.

9. The apparatus of claim 1, wherein the apparatus frame is provided with an operating platform in front of the etching bath, the operating platform comprising a bench.

10. The apparatus of claim 1, wherein the apparatus housing is provided with an insulating layer around the etching chamber.

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