CN211295088U - Power module, power assembly and vehicle - Google Patents
Power module, power assembly and vehicle Download PDFInfo
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- CN211295088U CN211295088U CN202020133121.4U CN202020133121U CN211295088U CN 211295088 U CN211295088 U CN 211295088U CN 202020133121 U CN202020133121 U CN 202020133121U CN 211295088 U CN211295088 U CN 211295088U
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Abstract
The utility model discloses a power module, power assembly and vehicle, power module includes: the temperature measuring device comprises a wafer, a temperature measuring resistor and a first insulating heat conducting layer, wherein the temperature measuring resistor is arranged on the wafer to measure the temperature of the wafer; the first insulating heat conduction layer is arranged between the wafer and the temperature measuring resistor. According to the embodiment of the utility model provides a power module, with temperature measuring resistor setting on the wafer to separate both through first insulating heat-conducting layer, not only can improve temperature measuring resistor's measurement accuracy, make temperature measuring resistor measuring wafer temperature be close actual temperature more, with the job stabilization nature who improves power module, can guarantee temperature measuring resistor's withstand voltage insulating moreover.
Description
Technical Field
The utility model belongs to the technical field of the vehicle technique and specifically relates to a power module, power assembly and vehicle are related to.
Background
The power module used in the controller of the power assembly of the electric vehicle is mostly composed of parts such as a wafer, an insulating heat conducting layer, a radiator, a packaging shell, a temperature measuring resistor and the like. Among them, the wafer portion is the most important component of the power module. Taking the IGBT power module as an example, the current passing capability of the wafer directly affects the power output performance of the whole module, and the current passing through the wafer directly results in the amount of heat energy generated by the wafer, and the more serious the wafer is heated, the higher the risk of damage.
In other words, each wafer has a maximum temperature limit that can be tolerated by itself, and once the maximum temperature limit is exceeded, the wafer is irreversibly damaged, and based on this, the wafer temperature detection becomes an essential component of the power module, and the accuracy of the wafer temperature detection is an important index for evaluating the performance of the power module.
In addition, since the wafer mostly works in a high-voltage and high-current working environment, the problem of voltage resistance and insulation between the temperature measuring resistor and the wafer is also an important safety consideration index for temperature detection.
The wafer temperature measuring method used by the power module for new energy in the market can be divided into two methods, one method is an indirect measuring method, a part of area is extended on an insulating heat conduction layer, a temperature measuring resistor is placed on the area, heat generated by a wafer is conducted to the temperature measuring resistor through the heat conduction layer, and the temperature on the power wafer is judged by detecting the resistance value change of the temperature measuring resistor. The other method is a calculation estimation method, which is to calculate the trend on the basis of an indirect test method, and estimate the wafer temperature, all of which have the problem of low measurement precision.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a power module, the temperature monitoring of which is more accurate.
The utility model also provides an adopt above-mentioned power module's power assembly.
The utility model discloses a vehicle is further provided, the vehicle has above-mentioned powertrain.
According to the utility model discloses a power module for power assembly of first aspect embodiment includes: the temperature measuring device comprises a wafer, a temperature measuring resistor and a first insulating heat conducting layer, wherein the temperature measuring resistor is arranged on the wafer to measure the temperature of the wafer; the first insulating heat conduction layer is arranged between the wafer and the temperature measuring resistor.
According to the embodiment of the utility model provides a power module, with temperature measuring resistor setting on the wafer to separate both through first insulating heat-conducting layer, not only can improve temperature measuring resistor's measurement accuracy, make temperature measuring resistor measuring wafer temperature be close actual temperature more, with the job stabilization nature who improves power module, can guarantee temperature measuring resistor's withstand voltage insulating moreover.
According to some embodiments of the present invention, the first insulating and heat conducting layer is coated on the wafer or on the temperature measuring resistor.
In some embodiments, the power module further comprises a heat sink located below or above the wafer, and a second insulating and heat conducting layer is disposed between the heat sink and the wafer.
In some embodiments, the power module further comprises: and the wafer, the temperature measuring resistor and the temperature measuring resistor are all arranged in the packaging shell.
Further, the temperature measuring resistor is arranged above the wafer.
In some embodiments, the power module is configured as an IGBT power module.
According to the utility model discloses power assembly of second aspect embodiment includes: the power module described in the above embodiments.
According to the utility model discloses vehicle of third aspect embodiment includes: the powertrain described in the above embodiments.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic diagram of a power module according to an embodiment of the invention.
Reference numerals:
the power module (100) is provided with a power supply,
the temperature measuring device comprises a wafer 10, a temperature measuring resistor 20, a first insulating heat conduction layer 30 and a packaging shell 40.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
A power module 100 according to an embodiment of the present invention is described below with reference to fig. 1.
As shown in fig. 1, a power module 100 for a powertrain according to an embodiment of the present invention includes: wafer 10, temperature measuring resistor 20 and first insulating heat conduction layer 30.
Wherein, the temperature measuring resistor 20 is arranged on the wafer 10 to measure the temperature of the wafer 10; the first insulating and heat conducting layer 30 is disposed between the wafer 10 and the temperature measuring resistor 20.
It can be understood that, set up first insulating heat conduction layer 30 between temperature measurement resistor 20 and wafer 10 to make the heat that wafer 10 produced can transmit to temperature measurement resistor 20 through first insulating heat conduction layer 30, and then temperature measurement resistor 20 measures the temperature of wafer 10, first insulating heat conduction layer 30 has good insulating effect and withstand voltage performance simultaneously, and the operating voltage of wafer 10 under the high-voltage heavy current operational environment can't puncture first insulating heat conduction layer 30, thereby realizes the withstand voltage of temperature measurement resistor 20 and insulates.
According to the embodiment of the utility model provides a power module 100 sets up temperature measuring resistor 20 on wafer 10 to separate both through first insulating heat-conducting layer 30, not only can improve temperature measuring resistor 20's measurement accuracy, make temperature measuring resistor 20 measuring wafer 10 temperature be close actual temperature more, with the job stabilization nature that improves power module 100, can guarantee temperature measuring resistor 20's withstand voltage insulation moreover.
According to some embodiments of the present invention, the first insulating and heat conducting layer 30 is coated on the wafer 10 or on the temperature measuring resistor 20.
In other words, in some embodiments, the first insulating and heat conducting layer 30 is coated on the wafer 10, and in other embodiments, the first insulating and heat conducting layer 30 is coated on the temperature measuring resistor 20, so as to prevent the temperature measuring resistor 20 from being exposed to a high-voltage environment, improve the working stability of the temperature measuring resistor 20, and prevent the temperature measuring resistor 20 from being damaged.
It is understood that in some embodiments, the power module 100 further includes a heat sink, the heat sink is located below the wafer 10 or above the wafer 10, and a second insulating and heat conducting layer is disposed between the heat sink and the wafer 10.
Therefore, on one hand, the power module 100 can be cooled by the radiator, so that the wafer 10 is prevented from being overheated, and the working stability of the power module 100 is improved; on the other hand, through setting up the insulating heat-conducting layer of second to avoid radiator work under high-pressure environment, improve the job stabilization nature of radiator.
As shown in fig. 1, the power module 100 further includes: the package housing 40, the wafer 10, the temperature measuring resistor 20 and the temperature measuring resistor 20 are all disposed in the package housing 40. Thus, not only is the integrity of the power module 100 better, facilitating batch processing and subsequent assembly, maintenance and replacement, but also the structural stability of the power module 100 can be improved to prolong the service life of the power module 100.
Preferably, the temperature measuring resistor 20 is disposed above the wafer 10.
In some embodiments, power module 100 is configured as an IGBT power module. That is, the power module 100 is an IGBT (Insulated Gate Bipolar Transistor) power module 100.
According to the utility model discloses power assembly includes: the power module 100 in the above embodiment.
According to the utility model discloses power assembly adopts above-mentioned power module 100, can avoid power assembly to shut down, improves power assembly's job stabilization nature.
According to the utility model discloses vehicle includes: the power assembly in the above embodiment.
According to the utility model discloses the vehicle adopts above-mentioned power assembly, can improve the security of traveling of vehicle effectively to reduce the cost of maintenance of vehicle.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.
In the description of the present invention, "a plurality" means two or more.
In the description of the present invention, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.
In the description of the invention, the first feature being "on", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. A power module for a powertrain, comprising:
a wafer;
the temperature measuring resistor is arranged on the wafer to measure the temperature of the wafer; and
the first insulating heat conduction layer is arranged between the wafer and the temperature measuring resistor.
2. The power module for the powertrain of claim 1, wherein the first insulating and thermally conductive layer is coated on the wafer or on the temperature measuring resistor.
3. The power module for the powertrain of claim 2, further comprising a heat sink positioned below or above the wafer with a second insulating and thermally conductive layer disposed therebetween.
4. The power module for a powertrain of claim 1, further comprising: and the wafer, the temperature measuring resistor and the temperature measuring resistor are all arranged in the packaging shell.
5. The power module for a powertrain of claim 1, wherein the thermometric resistance is disposed above the wafer.
6. The power module for a powertrain according to any one of claims 1-5, characterized in that the power module is configured as an IGBT power module.
7. A powertrain, comprising: the power module of any one of claims 1-6.
8. A vehicle, characterized by comprising: the locomotion assembly of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020133121.4U CN211295088U (en) | 2020-01-20 | 2020-01-20 | Power module, power assembly and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020133121.4U CN211295088U (en) | 2020-01-20 | 2020-01-20 | Power module, power assembly and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211295088U true CN211295088U (en) | 2020-08-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020133121.4U Active CN211295088U (en) | 2020-01-20 | 2020-01-20 | Power module, power assembly and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211295088U (en) |
-
2020
- 2020-01-20 CN CN202020133121.4U patent/CN211295088U/en active Active
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