CN211295052U - Crystal-fixing rotary swing arm device - Google Patents

Abstract

The application provides a die bonding rotary swing arm device which comprises a rotary seat, a rotary driver for driving the rotary seat to rotate horizontally and a swing arm mechanism arranged on the rotary seat; the swing arm mechanism comprises a pneumatic clamp for pneumatically disassembling and assembling the suction nozzle, a supporting arm for supporting the pneumatic clamp and a correcting and adjusting mechanism for driving the pneumatic clamp to rotate, the supporting arm is installed on the rotating seat, and the correcting and adjusting mechanism is connected with the supporting arm. The application provides a solid brilliant rotary swing arm device drives pneumatic clamp through setting up correction adjustment mechanism and rotates, and then drives the suction nozzle rotation on the pneumatic clamp to the angle of adjusting the wafer, thereby can realize the accurate regulation of wafer angle, so that the angle is unanimous when each wafer is solid brilliant, and then promotes solid brilliant quality, and the quality uniformity is good.

Description

Crystal-fixing rotary swing arm device

Technical Field

The application belongs to the field of die bonding equipment, and particularly relates to a die bonding rotary swing arm device.

Background

When the die is fixed, the die bonder drives the suction nozzle to suck the wafer, and then the wafer is placed and fixed on the bracket. However, when the suction nozzle sucks the wafers at different positions on the wafer tray, the wafer angle may have some differences, which affects the uniformity of the wafer bonding quality.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a die bonding rotation swing arm device to solve the problem of poor uniformity of die bonding quality in the related art.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: the die bonding rotary swing arm device comprises a rotary seat, a rotary driver for driving the rotary seat to horizontally rotate and a swing arm mechanism arranged on the rotary seat; the swing arm mechanism comprises a pneumatic clamp for pneumatically disassembling and assembling the suction nozzle, a supporting arm for supporting the pneumatic clamp and a correcting and adjusting mechanism for driving the pneumatic clamp to rotate, the supporting arm is installed on the rotating seat, and the correcting and adjusting mechanism is connected with the supporting arm.

In one embodiment, the correction and adjustment mechanism comprises a driving wheel, a driven wheel, a synchronous belt connecting the driving wheel and the driven wheel, and an adjustment motor driving the driving wheel to rotate, wherein the driven wheel is sleeved on the pneumatic clamp, the adjustment motor is installed on the rotary seat, and the driving wheel is installed on a main shaft of the adjustment motor.

In one embodiment, the calibration adjustment mechanism further comprises a support block mounted on the rotary base, and the adjustment motor is mounted on the support block.

In one embodiment, the calibration and adjustment mechanism further comprises an induction rod and a detector for detecting the induction rod, the detector is mounted on the support block, and the induction rod is connected with the main shaft of the adjustment motor.

In one embodiment, an accommodating cavity is formed in the rotary base, and the adjusting motor is placed in the accommodating cavity.

In one embodiment, the swing arm mechanism further comprises a lifting mechanism for driving the supporting arm to lift, the lifting mechanism is mounted on the rotating base, and the supporting arm is mounted on the lifting mechanism.

In one embodiment, the lifting mechanism comprises a guide rail, a sliding seat slidably mounted on the guide rail, and a voice coil motor driving the sliding seat to lift, wherein the voice coil motor and the guide rail are mounted on the rotating seat, and the supporting arm is mounted on the sliding seat.

In one embodiment, the swing arm mechanism further comprises a sensing piece connected with the sliding base and a sensor used for sensing the sensing piece, and the sensor is connected with the voice coil motor.

In one embodiment, the swing arm mechanism further comprises a scale grating and a grating reading head, the scale grating is mounted on the sliding seat, and the grating reading head is connected with the voice coil motor.

In one embodiment, the die bonding rotation swing arm device comprises a plurality of swing arm mechanisms, and the swing arm mechanisms are uniformly distributed on the periphery of the rotating seat.

One or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

the solid crystal rotary swing arm device provided by the embodiment of the application drives the pneumatic clamp to rotate by setting the correction adjusting mechanism, and then drives the suction nozzle on the pneumatic clamp to rotate so as to adjust the angle of the wafer, thereby realizing the accurate adjustment of the angle of the wafer, and ensuring the angle to be consistent when each wafer is in solid crystal, thereby improving the solid crystal quality and ensuring the good quality consistency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic front view structure diagram of a die bonding rotation swing arm device provided in an embodiment of the present application.

Fig. 2 is a schematic perspective view of the die bonding rotation swing arm device in fig. 1, in which a rotation driver is not shown.

Fig. 3 is an exploded view of the die bonding rotary swing arm device shown in fig. 2.

Fig. 4 is a schematic structural diagram of a swing arm mechanism provided in an embodiment of the present application.

Fig. 5 is an exploded view of the swing arm mechanism of fig. 4.

Fig. 6 is an exploded schematic view of a suction nozzle and a pneumatic clamp according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional structural view of a pneumatic clamp according to an embodiment of the present application.

Fig. 8 is a schematic partial sectional view illustrating a suction nozzle mounted on a pneumatic clamp according to an embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

10-die bonding rotary swing arm device; 11-a rotary drive; 12-a rotating base; 121-a housing chamber;

20-a swing arm mechanism; 21-a support arm; 211-lightening holes; 220-a lifting mechanism; 22-a guide rail; 23-a slide; 24-a voice coil motor; 25-a grating reader; 26-scale grating; 27-an inductor; 28-a sensing piece;

30-a pneumatic clamp; 31-a chuck; 311-a containing hole; 312-a vent; 313-a boss; 32-a linker; 33-a support sleeve; 331-a baffle table; 332-a positioning ring groove; 333-limiting table; 34-a sealing ring; 35-a push spring; 36-a bearing; 37-a limit nut;

40-a correction adjustment mechanism; 41-adjusting the motor; 42-a driving wheel; 43-a driven wheel; 44-a synchronous belt; 45-support block; 46-a sensing rod; 47-a detector;

90-suction nozzle; 91-tip; 92-a containing ring groove; 93-sealing ring.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "middle", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1 to 3, a die bonding rotation swing arm device 10 provided in the present application will now be described. The die bonding rotary swing arm device 10 comprises a rotary seat 12, a rotary driver 11 and a swing arm mechanism 20; the rotary driver 11 is used for driving the rotary base 12 to rotate horizontally, and the swing arm mechanism 20 is installed on the rotary base 12, so that the swing arm mechanism 20 is driven to rotate horizontally by the rotary driver 11, so that the swing arm mechanism 20 performs die bonding operation. In one embodiment, the rotary actuator 11 may be a motor, a rotary cylinder, or the like.

In one embodiment, referring to fig. 3, 4 and 5, the swing arm mechanism 20 includes a pneumatic clamp 30, a support arm 21 and a calibration adjustment mechanism 40, the pneumatic clamp 30 is mounted on the support arm 21, the pneumatic clamp 30 is supported by the support arm 21, the pneumatic clamp 30 is used for fixing the suction nozzle 90, and the pneumatic clamp 30 can be used for pneumatically mounting and dismounting the suction nozzle 90 so as to automatically mount and dismount the suction nozzle 90. The supporting arm 21 is installed on the rotary base 12, so that the rotary base 12 supports the swing arm mechanism 20, thereby facilitating the die bonding operation. The corrective adjustment mechanism 40 is connected to the support arm 21. The correcting and adjusting mechanism 40 is used for driving the pneumatic clamp 30 to rotate so as to correct the angle of the wafer deviated in the direction, realize accurate die bonding and improve the die bonding precision.

The application provides a solid brilliant rotary swing arm device 10, through setting up the correction adjustment mechanism 40 and drive pneumatic clamp 30 and rotate, and then drive suction nozzle 90 on the pneumatic clamp 30 and rotate to adjust the angle of wafer, thereby can realize the accurate regulation of wafer angle, so that the angle is unanimous when each wafer is solid brilliant, and then promotes solid brilliant quality, and the quality uniformity is good.

In one embodiment, referring to fig. 4 and 5, the calibration and adjustment mechanism 40 includes a driving wheel 42, a driven wheel 43, a timing belt 44 and an adjustment motor 41, the driven wheel 43 is sleeved on the pneumatic clamp 30, the driving wheel 42 is mounted on a main shaft of the adjustment motor 41, the timing belt 44 connects the driving wheel 42 and the driven wheel 43, and the adjustment motor 41 drives the driving wheel 42 to rotate, so as to drive the driven wheel 43 to rotate, so as to drive the pneumatic clamp 30 to rotate, thereby adjusting the angle of the pneumatic clamp 30. The synchronous belt 44 is used for transmission, so that the layout is convenient, and the assembly precision is reduced. The adjusting motor 41 is mounted on the rotary base 12, and the adjusting motor 41 is supported by the rotary base 12, so that the weight of the supporting arm 21 can be reduced, the supporting arm 21 can rotate stably, and the vibration of the supporting arm 21 can be reduced. In one embodiment, the adjustment motor 41 may also be mounted on the support arm 21. In some embodiments, a motor may be directly mounted to the support arm 21 to drive the rotation of the pneumatic clamp 30.

In one embodiment, referring to fig. 2 and 3, a receiving cavity 121 is formed in the rotary base 12, and the adjusting motor 41 is disposed in the receiving cavity 121, so as to mount and fix the adjusting motor 41, reduce the volume of the die bonding swing arm device 10, and enable the center of gravity of the die bonding swing arm device 10 to be close to the axis of the rotary base 12, thereby facilitating the driving of the rotary base 12 to rotate smoothly.

In one embodiment, referring to fig. 4 and 5, the calibration adjustment mechanism 40 further includes a support block 45, the support block is mounted on the rotary base 12, and the adjustment motor 41 is mounted on the support block 45. The supporting block 45 is provided to facilitate mounting and fixing the adjusting motor 41, and to facilitate fixing the adjusting motor 41 on the rotary base 12.

In one embodiment, referring to fig. 4 and 5, the alignment adjustment mechanism 40 further includes a sensing rod 46 and a detector 47, the detector 47 is mounted on the supporting block 45, the sensing rod 46 is connected to the spindle of the adjustment motor 41, and the detector 47 is used for detecting the sensing rod 46 to determine the rotation angle of the adjustment motor 41, so as to control the rotation angle of the pneumatic clamp 30 to perform precise alignment on the angle of the wafer.

In one embodiment, referring to fig. 4 and 5, the swing arm mechanism 20 further includes a lifting mechanism 220, the lifting mechanism 220 is mounted on the rotary base 12, and the supporting arm 21 is mounted on the lifting mechanism 220. The lifting mechanism 220 is arranged so as to drive the supporting arm 21 to lift, thereby facilitating die bonding and simultaneously facilitating picking and placing of the suction nozzle 90.

In one embodiment, referring to fig. 4 and 5, the lifting mechanism 220 includes a guide rail 22, a sliding base 23, and a voice coil motor 24, wherein the sliding base 23 is slidably mounted on the guide rail 22, and the sliding base 23 is guided by the guide rail 22 to move smoothly. The supporting arm 21 is mounted on the sliding base 23, so that the sliding base 23 drives the supporting arm 21 to lift. The slider 23 is connected to a voice coil motor 24, so that the slider 23 is driven to move up and down by the voice coil motor 24. The voice coil motor 24 is small in size and light in weight, and can accurately drive the sliding seat 23 to move up and down, so that the swing arm mechanism 20 can rotate stably. The voice coil motor 24 and the guide 22 are mounted on the rotary base 12 to support the voice coil motor 24 and the guide 22.

In some embodiments, the guide rails 22 are cross rails to support and guide the movement of the carriage 23.

In some embodiments, the lifting mechanism 220 is a lead screw and nut mechanism to precisely drive the lifting of the support arm 21. In some embodiments, the lifting mechanism 220 may be a cam mechanism to quickly drive the supporting arm 21 to lift and lower for quick die bonding.

In one embodiment, referring to fig. 4 and 5, the swing arm mechanism 20 further includes a sensor plate 28 and a sensor 27, the sensor 27 is connected to the voice coil motor 24, the sensor plate 28 is connected to the slide carriage 23, and the sensor 27 is used for sensing the sensor plate 28, so as to detect the sensor plate 28 through the sensor 27 to determine the position of the slide carriage 23 and ensure the accuracy of the lifting movement of the slide carriage 23.

In one embodiment, the inductor 27 is mounted on the swivel 12. In some embodiments, the inductor 27 may be fixedly coupled to the voice coil motor 24.

In one embodiment, referring to fig. 4 and 5, the swing arm mechanism 20 further includes a scale grating 26 and a grating reading head 25, the scale grating 26 is mounted on the sliding base 23, and the grating reading head 25 is connected to the voice coil motor 24 to determine the position of the sliding base 23 and ensure the accuracy of the lifting movement of the sliding base 23.

In one embodiment, the grating reader head 25 is mounted on the rotating base 12. In some embodiments, the grating reader 25 may be fixedly coupled to the voice coil motor 24.

In one embodiment, referring to fig. 1 to 2, the die bonding swing arm apparatus 10 includes a plurality of swing arm mechanisms 20, and the plurality of swing arm mechanisms 20 are uniformly distributed on the peripheral side of the rotating base 12. Set up a plurality of swing arm mechanisms 20, can each swing arm mechanism 20 respectively solid brilliant, get the wafer like a swing arm mechanism 20, and synchronous another swing arm mechanism 20 can be solid brilliant to improve solid brilliant efficiency. A plurality of swing arm mechanisms 20 evenly distributed on roating seat 12 can make roating seat 12 drive each swing arm mechanism more steady rotation.

In one embodiment, the two sides of the rotary base 12 are respectively mounted on the swing arm mechanisms 20. In other embodiments, swing arm mechanisms 20 may be mounted on four sides of the rotary base 12, respectively. In still other embodiments, the swing arm mechanisms 20 can be provided in three, five, etc. numbers.

In one embodiment, referring to fig. 4, 6-8, the pneumatic clamp 30 includes a clamp head 31, and the clamp head 31 is mounted on the support arm 21. One end of the cartridge 31 is provided with a housing hole 311, and the other end of the cartridge 31 is provided with a vent hole 312. A receiving hole 311 is provided, and the suction nozzle 90 can be inserted into the receiving hole 311 to fix the suction nozzle 90 to the cartridge 31. The vent 312 is provided to allow air to enter and exit the containing hole 311 when the other end of the chuck 31 is connected to the air path, i.e., the vent 312 is connected to the containing hole 311, and when the air path is evacuated, a negative pressure is generated in the suction nozzle 90 to suck the wafer. When the air path supplies air, the wafer can be separated from the suction nozzle 90, so that the wafer fixing is realized. When the air path supplies compressed air, the tip 91 of the suction nozzle 90 is small, the air pressure in the containing hole 311 discharged by the suction nozzle 90 is slow, and the suction nozzle 90 can be blown out by the air pressure in the containing hole 311, so that the suction nozzle 90 can be detached pneumatically.

In one embodiment, referring to fig. 6 to 8, a sealing ring 93 is sleeved on the suction nozzle 90, and a receiving ring groove 92 for positioning the sealing ring 93 is formed on the suction nozzle 90. Set up sealing washer 93 on suction nozzle 90, when suction nozzle 90 was arranged in holding hole 311, can increase frictional force, better prevent that suction nozzle 90 from dropping to can be sealed between holding hole 311 inner wall and suction nozzle 90, when the gas circuit of being convenient for bled, suction nozzle 90 department produced the negative pressure.

In one embodiment, referring to fig. 6-8, the pneumatic clamp 30 further includes a connector 32, the connector 32 is connected to the clamp head 31, and the connector 32 is used for connecting to an air tube. A connector 32 is provided to facilitate connection to an air pipe, and further to an air passage, and further to communicate the collet 31 with the air passage.

In one embodiment, referring to fig. 6 to 8, the pneumatic clamp 30 further includes a support sleeve 33, the clamping head 31 is mounted at one end of the support sleeve 33, and the joint 32 is mounted at the other end of the support sleeve 33. A support sleeve 33 is provided to connect the joint 32 with the collet 31 through the support sleeve 33. A support sleeve 33 is mounted on support arm 21 to secure collet 31 to support arm 21 and also to protect collet 31. In some embodiments, the collet 31 may also be directly connected to the joint 32. In some embodiments, the collet 31 may also be mounted directly on the support arm 21.

In one embodiment, referring to fig. 6 to 8, the collet 31 is slidably mounted in the support sleeve 33, the boss 313 is convexly disposed on the periphery of the other end of the collet 31, and the stop 331 is convexly disposed on the inner wall of one end of the support sleeve 33, so that when the collet 31 slides in the support sleeve 33, the boss 313 can be stopped by the stop 331 to position the collet 31, thereby preventing the collet 31 from falling off. With chuck 31 slip set up in supporting sleeve 33, then when being equipped with suction nozzle 90 in chuck 31, can control chuck 31's position through atmospheric pressure, and then control the position of suction nozzle 90, atress is balanced when making suction nozzle 90 contact wafer, avoids weighing wounded, crushing wafer, reduces to the minimum to the wearing and tearing of suction nozzle 90 and the thimble that supports the wafer simultaneously, practices thrift the consumptive material to reduction in production cost.

In one embodiment, referring to fig. 6 to 8, a sealing ring 34 is disposed between the supporting sleeve 33 and the chuck 31, and a positioning ring groove 332 for positioning and receiving the sealing ring 34 is disposed on an inner wall of one end of the supporting sleeve 33. A sealing ring 34 is provided in the support sleeve 33 to seal a gap between the support sleeve 33 and the collet 31 so as to control more the gas pressure in the collet 31; in addition, the structure can reduce the matching precision of the chuck 31 and the support sleeve 33 during processing and manufacturing, thereby facilitating the manufacturing and reducing the cost.

In one embodiment, the supporting sleeve 33 is provided with an ejector spring 35, and both ends of the ejector spring 35 elastically abut against the chuck 31 and the joint 32, respectively. An ejector spring 35 is provided in the support sleeve 33 to elastically eject the collet 31, facilitating the restoration of the collet 31.

In one embodiment, referring to fig. 4 and 5, the support arm 21 is provided with a plurality of lightening holes 211 to lighten the weight of the support arm 21 and facilitate driving the support arm 21 to rotate smoothly.

In one embodiment, referring to fig. 4 to 6, the swing arm mechanism 20 further includes a bearing 36, the bearing 36 is mounted on the support arm 21, and the bearing 36 is sleeved on the pneumatic clamp 30, so that the pneumatic clamp 30 can rotate on the support arm 21, and the angle of the pneumatic clamp 30 can be conveniently adjusted.

In one embodiment, referring to fig. 4 to 6, a limit stop 333 is protruded on the periphery of one end of the support sleeve 33, and a limit nut 37 is installed on the other end of the support sleeve 33, so that the bearing 36 can be prevented from falling off after the bearing 36 is installed.

In one embodiment, when installing the suction nozzle 90 into the pneumatic clamp 30, the suction nozzle 90 can be automatically inserted into the pneumatic clamp 30 by driving the supporting arm 21 to move up and down by the lifting mechanism 220, so as to automatically install the suction nozzle 90.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims (10)

1. The die bonding rotary swing arm device is characterized by comprising a rotary seat, a rotary driver for driving the rotary seat to horizontally rotate and a swing arm mechanism arranged on the rotary seat; the swing arm mechanism comprises a pneumatic clamp for pneumatically disassembling and assembling the suction nozzle, a supporting arm for supporting the pneumatic clamp and a correcting and adjusting mechanism for driving the pneumatic clamp to rotate, the supporting arm is installed on the rotating seat, and the correcting and adjusting mechanism is connected with the supporting arm.

2. The die bonding rotary swing arm device according to claim 1, wherein: the correcting and adjusting mechanism comprises a driving wheel, a driven wheel, a synchronous belt for connecting the driving wheel with the driven wheel and an adjusting motor for driving the driving wheel to rotate, the driven wheel is sleeved on the pneumatic clamp, the adjusting motor is installed on the rotary seat, and the driving wheel is installed on a main shaft of the adjusting motor.

3. The die bonding rotary swing arm device according to claim 2, wherein: the correction adjusting mechanism further comprises a supporting block, the supporting block is installed on the rotating seat, and the adjusting motor is installed on the supporting block.

4. The die bonding rotary swing arm device according to claim 3, wherein: the correction adjusting mechanism further comprises an induction rod and a detector for detecting the induction rod, the detector is mounted on the supporting block, and the induction rod is connected with a main shaft of the adjusting motor.

5. The die bonding rotary swing arm device according to claim 2, wherein: an accommodating cavity is formed in the rotating seat, and the adjusting motor is arranged in the accommodating cavity.

6. The die bonding rotary swing arm device according to any one of claims 1 to 5, wherein: the swing arm mechanism further comprises a lifting mechanism for driving the supporting arm to lift, the lifting mechanism is installed on the rotating seat, and the supporting arm is installed on the lifting mechanism.

7. The die bonding rotary swing arm device according to claim 6, wherein: the lifting mechanism comprises a guide rail, a sliding seat arranged on the guide rail in a sliding mode, and a voice coil motor for driving the sliding seat to lift, wherein the voice coil motor and the guide rail are arranged on the rotating seat, and the supporting arm is arranged on the sliding seat.

8. The die bonding rotary swing arm device according to claim 7, wherein: the swing arm mechanism further comprises an induction sheet connected with the sliding seat and an inductor used for sensing the induction sheet, and the inductor is connected with the voice coil motor.

9. The die bonding rotary swing arm device according to claim 7, wherein: the swing arm mechanism further comprises a scale grating and a grating reading head, the scale grating is installed on the sliding seat, and the grating reading head is connected with the voice coil motor.

10. The die bonding rotary swing arm device according to any one of claims 1 to 5, wherein: the die bonding rotary swing arm device comprises a plurality of swing arm mechanisms which are uniformly distributed on the periphery of the rotary seat.

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