CN211267334U - Improved welding structure of circuit board - Google Patents
Improved welding structure of circuit board Download PDFInfo
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- CN211267334U CN211267334U CN201921909734.6U CN201921909734U CN211267334U CN 211267334 U CN211267334 U CN 211267334U CN 201921909734 U CN201921909734 U CN 201921909734U CN 211267334 U CN211267334 U CN 211267334U
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Abstract
The utility model relates to an improvement welded structure of circuit board, it includes the circuit board, is equipped with a plurality of through-holes and copper foil on the circuit board, its characterized in that: the rivet is arranged in the through hole and provided with a sleeve part and a supporting part, the sleeve part is used for being inserted into the through hole and receiving pins of the electronic element, the supporting part is pressed on one side or two sides of the through hole and is in contact with the copper foil, and the supporting part is electrically connected with the copper foil beside the through hole and the pins of the electronic element into a whole after welding to form a reliable welding structure. The through hole is a round hole which penetrates through the circuit board so that the rivet can enter and penetrate through the through hole, a bonding pad is arranged at the joint of the round hole and the supporting part, and the projection area of the bonding pad is larger than that of the supporting part pressed on the circuit board. The novel LED packaging structure has the substantial characteristics and progresses of strong bearing capacity, capability of preventing electronic components from falling off due to stress, strong overcurrent capacity, good heat dissipation capacity, capability of preventing the welding discs from being carbonized easily and the like.
Description
Technical Field
The utility model relates to an improvement welded structure of circuit board can improve welded structure's reliability, is applicable to the manufacturing of circuit board. Belongs to the technical field of electronic manufacturing industry.
Background
Currently, circuit board structures are classified into single-sided circuit boards and double-sided circuit boards. In order to save cost, a single-sided circuit board structure (hereinafter referred to as a single-sided board) is generally used, and since only one side of the single-sided board is provided with a pad, there are the following problems: (1) the welding part is of a single-point welding structure, the bearing capacity is weak, and electronic components with large weight are easy to fall off; (2) the solder contacted by the pins of the components is less, so that the overcurrent capacity and the heat dissipation capacity are poor, the welding disc works in a place with higher temperature for a long time, and the welding disc is easy to carbonize and the circuit board is easy to lose efficacy.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an improvement welded structure of circuit board in order to solve present single-sided board and to have that bearing capacity is weak, electronic components that weight is big easily drops, overcurrent ability and heat dissipation capacity are poor scheduling problem. The LED lamp has the substantial characteristics and progresses of strong bearing capacity, capability of preventing heavy electronic components from falling off, strong overcurrent capacity and heat dissipation capacity and the like.
In order to achieve the above object, the utility model discloses can adopt following technical scheme:
the utility model provides an improvement welded structure of circuit board, its includes the circuit board, is equipped with a plurality of through-holes and copper foil on the circuit board, and its structural feature lies in: the rivet is arranged in the through hole and provided with a sleeve part and a supporting part, the sleeve part is used for being inserted into the through hole and receiving pins of the electronic element, the supporting part is pressed on one side or two sides of the through hole and is in contact with the copper foil, and the supporting part is electrically connected with the copper foil beside the through hole and the pins of the electronic element into a whole after welding to form a reliable welding structure.
In order to achieve the above purpose, the utility model discloses can also adopt following technical scheme:
furthermore, the through hole is a round hole, the round hole penetrates through the circuit board to allow a rivet to enter and penetrate through, a bonding pad is arranged at the joint of the round hole and the supporting part, and the projection area of the bonding pad is larger than that of the supporting part pressed on the circuit board.
Furthermore, the circuit board is a single-sided printed circuit board, the electronic elements are concentrated on one surface of the circuit board, the copper foil is concentrated on the other opposite surface of the circuit board, and a port, far away from the supporting part, in the sleeve part is a cylindrical port.
Furthermore, the circuit board is a double-sided printed circuit board, and electronic elements and copper foils are arranged on two sides of the circuit board; the port of the sleeve part in the rivet, which is far away from the supporting part, is deformed and expanded by impact to form an umbrella-shaped flanging, and the umbrella-shaped flanging is pressed on the surface of the circuit board to form a riveting structure.
Furthermore, the umbrella-shaped flanging is a horn-mouth umbrella-shaped flanging, a roll-type umbrella-shaped flanging or a petal-shaped umbrella-shaped flanging, and the petal-shaped umbrella-shaped flanging is an inward petal-shaped umbrella-shaped flanging or an outward petal-shaped umbrella-shaped flanging.
Furthermore, the inward petal-shaped umbrella-shaped flanging or the outward petal-shaped umbrella-shaped flanging is a hexapetal-shaped flanging.
Further, after the riveting structure is formed, the rivet and the circuit board keep a distance of 0.05-0.1, so that the rivet can rotate freely.
Adopt above-mentioned scheme, guaranteed that the rivet can not cause the damage to the pad on the circuit board when the crimping, the solder also can flow into inside through the gap, strengthens the welding effect.
The utility model discloses place the circuit board in automatic riveter, the rivet is worn to locate in the through-hole to towards needle impact rivet sleeve pipe opening part, the sleeve pipe open end of rivet receives the impact and warp and open and pressfitting on the face, forms riveting stationary state.
In practical application, the circuit board is placed in an automatic riveting machine, the rivet penetrates through the through hole of the circuit board, the end part of the rivet is exposed out of the through hole, the punch pin impacts the opening of the rivet, the opening of the rivet is impacted, deformed, opened and pressed on the board surface to form a supporting part, and the part inserted in the through hole forms the supporting part to form a sleeve part, so that the riveting fixing structure is formed.
The utility model has the following substantive characteristics and progress:
1. the rivet is arranged in the through hole of the circuit board for connecting the pins of the electronic element, the rivet is provided with the sleeve part and the supporting part, the sleeve part is inserted into the through hole and receives the pins of the electronic element, the supporting part is pressed on one side or two sides of the through hole and is contacted with the copper foil, and the supporting part is electrically connected with the copper foil beside the through hole and the pins of the electronic element into a whole after welding to form a reliable welding structure; therefore, the problems that the existing single panel is weak in bearing capacity, electronic components are easy to fall off due to stress, poor in overcurrent capacity and poor in heat dissipation capacity, the bonding pad is easy to carbonize and the like are solved, and the single panel has the substantial characteristics and the advantages that the bearing capacity is strong, the electronic components are prevented from falling off due to stress, the overcurrent capacity is strong, the heat dissipation capacity is good, the bonding pad is prevented from carbonizing easily and the like.
2. The utility model discloses owing to use rivet riveted structure, the solder accessible rivet of pad permeates the face with the hole of circuit board junction (including sleeve pipe portion, supporting part and circuit board junction), forms two-sided welding effect, has electronic components and circuit board and is connected firm, firm characteristics.
3. In the rivet, the port of the sleeve part far away from the supporting part is deformed by impact to be expanded to form an umbrella-shaped flanging, and the umbrella-shaped flanging is pressed on the surface of the circuit board 1 to form a riveting structure; therefore, the solder can permeate into the board surface through the rivet hole to form a double-sided welding effect, so that the components are more stably fixed on the circuit board; the solder permeates to the plate surface through the rivet round hole, so that the sectional area of the solder is increased, and the over-current capability is enhanced; the welding flux can fully fill and wet the flanging and the welding disc of the rivet, the copper exposure area is increased, and the heat dissipation capability is enhanced.
Drawings
Fig. 1 is a schematic view of a partial structure of an embodiment of the present invention.
Fig. 2 is a schematic view of the usage status of the embodiment of the present invention.
Fig. 3 is an enlarged schematic view of a portion a of fig. 2.
Fig. 4 is an enlarged schematic view of a portion B of fig. 2.
Fig. 5 is a schematic view of the rivet structure of embodiment 1 of the present invention.
Fig. 6 is a schematic view of a rivet structure (rolled flange) according to embodiment 2 of the present invention.
Fig. 7 is a schematic view of the rivet structure of embodiment 3 of the present invention (petal type flanging, outward petals).
Fig. 8 is a schematic structural view of the rivet according to embodiment 4 of the present invention (petal type flanging, inward petals).
Fig. 9 is a schematic structural diagram of an electronic component according to an embodiment of the present invention.
Detailed Description
Specific example 1:
referring to fig. 1 to 5, the improved soldering structure of a circuit board according to the present embodiment includes a circuit board 1, the circuit board 1 is provided with a plurality of through holes 2 and copper foils, a rivet 3 is disposed in the through hole 2, the rivet 3 has a bushing portion 3-1 and a support portion 3-2, the bushing portion 3-1 is configured to be inserted into the through hole 2 and receive pins of an electronic component, the support portion 3-2 is pressed on one side or both sides of the through hole 2 and contacts with the copper foils, and the support portion 3-2 is electrically connected with the copper foils beside the through holes and the pins of the electronic component to form a reliable soldering structure after soldering.
In this embodiment:
the through hole 2 is a circular hole which penetrates through the circuit board 1 for the rivet 3 to enter and penetrate through, a bonding pad is arranged at the joint of the circular hole and the supporting part 3-2, and the projection area of the bonding pad is larger than that of the supporting part 3-2 pressed on the circuit board 1.
Due to the rivet riveting structure, solder of the bonding pad can permeate into the board surface through the pores at the joint of the rivet and the circuit board (including the joint of the sleeve part 3-1 and the support part 3-2 and the circuit board), so that a double-sided welding effect is formed, and the electronic component can be stably fixed on the circuit board 1.
Referring to fig. 5, the circuit board 1 of this embodiment 1 is a single-sided printed circuit board, the electronic components are concentrated on one side, the copper foil 4 is concentrated on the other opposite side, and the port of the sleeve portion 3-1 far from the support portion 3-2 in the rivet 3 is a cylindrical port, which can be punched into a horn-shaped port to be attached to the circuit board 1.
Adopt this embodiment technical scheme, guaranteed that the rivet can not cause the damage to the pad on the circuit board when the crimping, the solder also can flow into inside through the gap, strengthens the welding effect.
The welding process of this embodiment is as follows: the circuit board 1 with the components is arranged in a soldering flux adding area, and reaches a tin furnace after a preheating area, when the circuit board 1 enters the front end of a wave surface, the circuit board 1 and pins are heated, and before leaving the wave surface, the circuit board 1 with the components is soaked in solder, the solder flows through a gap between a rivet and a pad, so that the rivet 3 and the pad of the circuit board 1 are firmly fixed together, meanwhile, the solder permeates an upper board surface through a rivet round hole, a full welding point is also formed on the board surface, a small amount of solder is adhered to the rivet due to the action of wetting force at the moment of leaving the tail end of the wave, and due to the surface tension, a small shrinkage state taking a lead as a center can appear, and a full and round welding point is formed.
Specific example 2:
referring to fig. 6, embodiment 3 of the present invention is characterized in that: the port of the sleeve part 3-1 far away from the support part 3-2 in the rivet 3 is punched into a rolled flanging, the curled edge faces inwards, and the rolled flanging is pressed on the surface of the circuit board 1 to form a riveting structure; the distance of 0.05-0.1mm is reserved between the support part 3-2 and the flanging, the inner diameter of the sleeve part 3-1 is 1.6mm, and the diameter of the flanging is 3 mm. The rest is the same as in embodiment 1.
Specific example 3:
referring to fig. 7, embodiment 3 of the present invention is characterized in that: the port of the sleeve part 3-1 far away from the support part 3-2 in the rivet 3 is punched into a petal type flanging, the petal type flanging faces inwards, a distance of 0.05-0.1mm is reserved between the support part 3-2 and the flanging, the number of petals is six, the inner diameter of the flanging part is 1.8mm, and the diameter of the flanging is 4.4 mm. The rest is the same as in embodiment 1.
Specific example 4:
referring to fig. 8, embodiment 4 of the present invention is characterized in that: in the rivet 3, the port of the sleeve part 3-1 far away from the support part 3-2 is punched into a petal type flanging, the petal type flanging faces outwards, the inner diameter of the flanging part is 4.5mm, the length of the sleeve part 3-1 is 1.65-1.7mm after riveting, the diameter of the flanging is 6.5mm, the number of petals is six, the inner diameter of the sleeve part 3-1 is 1.8mm, and the diameter of the flanging is 4.4 mm. The rest is the same as in embodiment 1.
In practical application of the embodiments 2 to 4, the circuit board 1 is placed in an automatic riveting machine, the rivet 3 is inserted into the through hole 2, the punch pin impacts the opening of the rivet sleeve, and the open end of the rivet sleeve 3 is deformed and expanded by impact and pressed on the board surface to form a riveting and fixing state.
Before the rivet 3 is impacted by the impact pin at the opening of the rivet, the circuit board 1 is placed in an automatic riveting machine, the rivet 3 penetrates through the through hole 2 of the circuit board, the end part of the rivet is exposed out of the through hole 2, the impact pin impacts the opening of the rivet 3, the opening of the rivet 3 is deformed, opened and pressed on the board surface to form a supporting part 3-2, and the part inserted in the through hole 2 forms the supporting part 3-2 to form a sleeve part 3-1, so that the riveting fixing structure is formed.
Referring to fig. 9, in practical application of embodiments 1 to 4, the component 5 has a pin 52, a pin 53, a pin 51, a pin 54, a pin 55, and a pin 56, where: the diameters of the pin 52 and the pin 53 are 4.0, and the diameters of the pin 51, the pin 54, the pin 55 and the pin 56 are all 1.0 mm; the component 5 is mounted on the circuit board 1, and the pins 52 and 53 correspond to the caulking method of fig. 4. Corresponding to the riveting method of fig. 2.
In practical application, for the smaller pins 51, 54, 55 and 56, the copper foils connected with the pins are narrower, and a rolled flanging structure as shown in fig. 8 is used to ensure creepage distance and improve welding effect. For the wider pins 52 and 53, the copper foil area at the positions is also larger, an umbrella-shaped flanging which is a petal-shaped flanging is adopted as shown in fig. 6, the flanging faces outwards and is an outward petal, the inner diameter is 4.5mm, the length of the sleeve part is 3-1 mm and is 1.65-1.7mm after riveting, and the petal-shaped flanging is a six-petal-shaped flanging with the diameter of 6.5 mm. After the riveting structure is formed, the rivet 3 and the circuit board 1 keep a distance of 0.05-0.1, so that the rivet 3 can rotate freely.
The component 7 is assembled on the circuit board, the pin diameters are all 1.0mm, but because the copper foil 72 and the copper foil 73 need to pass larger current (the width of the copper foil needs to be larger than 5mm), and a safe distance (larger than 3.2mm) needs to be reserved between the copper foil 72 and the copper foil 73, at this time, the riveting mode of fig. 2 can be selected.
Other specific examples:
the utility model discloses other concrete embodiment's characteristics are: the circuit board 1 is a single-sided printed circuit board, electronic elements are concentrated on one side of the circuit board, and copper foils 4 are concentrated on the opposite side; or the circuit board 1 is a double-sided printed circuit board, and electronic elements and copper foils 4 are arranged on two sides of the circuit board 1.
The utility model has the advantages of it is following: (1) when wave soldering is carried out, the solder can permeate the board surface through the rivet hole, so that a double-side soldering effect is formed, and the components are fixed on the circuit board more stably. (2) When wave soldering is carried out, the solder permeates to the board surface through the rivet round hole, the sectional area of the solder is increased, and the over-current capacity is enhanced. (3) After wave soldering, the welding flux can fully fill and wet the flanging and the welding pad of the rivet, the copper exposure area is increased, and the heat dissipation capability is enhanced.
To sum up, the utility model adopts the above technical scheme, to the less condition of copper foil, can use a formula turn-ups, both guaranteed creepage distance, the welding effect is also good. For copper foils with wider positions, petal type flanging can be adopted.
The above is only the preferred embodiment of the present invention, the protection scope of the present invention is not limited to the above embodiment, all belong to the technical solution of the present invention under the thought. It should be noted that, for those skilled in the art, a plurality of improvements and modifications without departing from the principle of the present invention should be considered as the protection scope of the present invention.
Claims (7)
1. The utility model provides an improvement welded structure of circuit board, its includes circuit board (1), is equipped with a plurality of through-holes (2) and copper foil on circuit board (1), its characterized in that: the through hole (2) is internally provided with a rivet (3), the rivet (3) is provided with a sleeve part (3-1) and a supporting part (3-2), the sleeve part (3-1) is used for being inserted into the through hole (2) and receiving a pin of an electronic element, the supporting part (3-2) is pressed on one side or two sides of the through hole (2) and is in contact with the copper foil, and the supporting part (3-2) is electrically connected with the copper foil beside the through hole and the pin of the electronic element into a whole after welding to form a reliable welding structure.
2. The improved soldering structure for circuit board as set forth in claim 1, wherein: the through hole (2) is a round hole which penetrates through the circuit board (1) so that the rivet (3) can enter and penetrate through the through hole, a bonding pad is arranged at the joint of the round hole and the supporting part (3-2), and the projection area of the bonding pad is larger than that of the supporting part (3-2) pressed on the circuit board (1).
3. An improved soldering structure of a circuit board according to claim 1 or 2, wherein: the circuit board (1) is a single-sided printed circuit board, electronic elements are concentrated on one surface of the circuit board, copper foil (4) is concentrated on the other opposite surface of the circuit board, and a port, far away from the supporting part (3-2), in the sleeve part (3-1) is a cylindrical port.
4. An improved soldering structure of a circuit board according to claim 1 or 2, wherein: the circuit board (1) is a double-sided printed circuit board, and electronic elements and copper foils (4) are arranged on two sides of the circuit board (1); the port of the sleeve part (3-1) in the rivet (3), which is far away from the support part (3-2), is deformed and opened by impact to form an umbrella-shaped flanging, and the umbrella-shaped flanging is pressed on the surface of the circuit board (1) to form a riveting structure.
5. The improved soldering structure for circuit board as set forth in claim 4, wherein: the umbrella-shaped flanging is a horn-mouth umbrella-shaped flanging, a roll-type umbrella-shaped flanging or a petal-shaped umbrella-shaped flanging, and the petal-shaped umbrella-shaped flanging is an inward petal-shaped umbrella-shaped flanging or an outward petal-shaped umbrella-shaped flanging.
6. The improved soldering structure for circuit board as set forth in claim 5, wherein: the inward petal-shaped umbrella-shaped flanging or the outward petal-shaped umbrella-shaped flanging is a hexapetal-shaped flanging.
7. An improved soldering structure of a circuit board according to claim 1 or 2, wherein: after the riveting structure is formed, the rivet (3) and the circuit board (1) keep a distance of 0.05-0.1, so that the rivet (3) can rotate freely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921909734.6U CN211267334U (en) | 2019-11-07 | 2019-11-07 | Improved welding structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921909734.6U CN211267334U (en) | 2019-11-07 | 2019-11-07 | Improved welding structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211267334U true CN211267334U (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921909734.6U Active CN211267334U (en) | 2019-11-07 | 2019-11-07 | Improved welding structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211267334U (en) |
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2019
- 2019-11-07 CN CN201921909734.6U patent/CN211267334U/en active Active
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| GR01 | Patent grant | ||
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Address after: 528311 No. 1, DUYE South Road, duning Industrial Zone, Bijiang community, Beijiao Town, Shunde District, Foshan City, Guangdong Province Patentee after: Guangdong Shangyan Electronic Technology Co.,Ltd. Address before: 528312 No. 11, Shunde innovation and entrepreneurship Industrial Park, No. 25, Sanle East Road, Shunjiang neighborhood committee, Beijiao Town, Shunde District, Foshan City, Guangdong Province Patentee before: GUANGDONG SONG RESEARCH ELECTRONIC TECHNOLOGY CO.,LTD. |