CN211264255U - Computer mainframe convenient to heat dissipation - Google Patents

Computer mainframe convenient to heat dissipation Download PDF

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Publication number
CN211264255U
CN211264255U CN202020415992.5U CN202020415992U CN211264255U CN 211264255 U CN211264255 U CN 211264255U CN 202020415992 U CN202020415992 U CN 202020415992U CN 211264255 U CN211264255 U CN 211264255U
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CN
China
Prior art keywords
heat dissipation
frame
frames
computer mainframe
computer
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Expired - Fee Related
Application number
CN202020415992.5U
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Chinese (zh)
Inventor
尹魁
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Hunan Financial and Industrial Vocational Technical College
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Hunan Financial and Industrial Vocational Technical College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN202020415992.5U priority Critical patent/CN211264255U/en
Application granted granted Critical
Publication of CN211264255U publication Critical patent/CN211264255U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer mainframe convenient to heat dissipation belongs to the computer field. The utility model provides a computer mainframe convenient to heat dissipation, includes the frame, the frame is the hollow tube, the both ends of hollow tube are connected, the quantity of frame is two, sets up fixedly connected with connecting rod, bracing piece, parting bead, side board and support frame between two frames. The utility model discloses a frame and connecting rod's cooperation is used, can form the frame of support, the connecting rod couples together the frame of both sides, establish the parting bead cover on the bracing piece, form heat dissipation channel between the adjacent parting bead, hot-air can discharge fast through the heat dissipation channel between the parting bead, a plurality of parting beads simultaneously can form a braced frame, the components and parts of computer are placed to braced frame's bottom, the utility model discloses heat radiation structure is simple, the radiating effect is good, outward appearance elegant appearance has very strong practicality.

Description

Computer mainframe convenient to heat dissipation
Technical Field
The utility model belongs to the technical field of the computer, specifically be a computer mainframe convenient to heat dissipation.
Background
Computer hardware refers to the general term for various physical devices in a computer system, including electronic, mechanical, and opto-electronic components. The physical devices form an organic whole according to the requirements of the system structure to provide a material basis for the operation of computer software. Briefly, the computer hardware functions to input and store programs and data, and to execute the programs to manipulate the data into a usable form. From the appearance, the microcomputer is composed of a main case and external equipment. The main case mainly comprises a CPU, an internal memory, a mainboard, a hard disk drive, an optical disk drive, various expansion cards, a connecting wire, a power supply and the like; the external devices include a mouse, a keyboard, and the like.
The invention relates to a computer hardware mainframe box convenient for heat dissipation, which is invented and named as a computer hardware mainframe box convenient for heat dissipation by means of heat dissipation of a heat dissipation device and then by means of heat dissipation holes arranged on the mainframe box, for example, the Chinese patent publication No. CN205540466U, wherein the mainframe box comprises a mainframe box, a heat dissipation box and a heat dissipation negative pressure fan arranged in the heat dissipation box, the top end of the mainframe box is fixedly provided with the heat dissipation box, the front side of the heat dissipation box is fixedly provided with a temperature detector, the top end of the heat dissipation box is fixedly provided with a vent at a position corresponding to the heat dissipation negative pressure fan, and two sides of the mainframe box.
The above patent and the existing mainframe box have the condition of too few heat radiation structures and poor air flow guiding effect, so that a better mainframe box structure with heat radiation all the time is still needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at above problem, provide a computer mainframe convenient to heat dissipation to solve current mainframe heat radiation structure too few, the poor problem of air water conservancy diversion effect reaches the purpose that further improves the thermal diffusivity of mainframe box.
In order to realize the above purpose, the utility model adopts the technical scheme that: a computer mainframe that facilitates heat dissipation, comprising:
the frame is a hollow pipe, two ends of the hollow pipe are connected, the number of the frames is two, and a connecting rod is fixedly connected between the two frames;
the supporting rod is fixedly connected between the two frames, the area between the two frames is defined as a heat dissipation area, and the supporting rod is positioned at the top, the bottom and the left side of the heat dissipation area;
the spacing bar is sleeved on the supporting rod, a first through hole matched with the supporting rod is formed in the spacing bar, and a second through hole matched with the connecting rod is further formed in the spacing bar;
the side panels are arranged on two sides of the heat dissipation area and are detachably connected with the frame;
the support frame is installed on the right side of the heat dissipation area and used for installing internal components.
Preferably, the material of the frame is aluminum alloy or copper.
Preferably, the frame is rectangular, and the number of the connecting rods is four, and the connecting rods are respectively and fixedly connected to four corners of the frame.
Preferably, six are no less than to the quantity of bracing piece, and two frames of definition and connecting rod form braced frame, the bracing piece is located top, bottom and the left side of frame respectively, and forms bearing structure for support inside components and parts.
Preferably, the number of the division bars is not less than two, the distance between every two adjacent division bars is less than one centimeter, the division bars are C-shaped, and the distance between the division bars is a heat dissipation channel.
Preferably, the support frame comprises a support plate and a side plate, and the side plate is provided with a first heat dissipation hole and a second heat dissipation hole.
The beneficial effects of the utility model, the utility model discloses a frame and connecting rod's cooperation is used, can form the frame of support, and the connecting rod couples together the frame of both sides, establishes the parting bead cover on the bracing piece, forms heat dissipation channel between the adjacent parting bead, and hot-air can discharge fast through the heat dissipation channel between the parting bead, and a plurality of parting beads simultaneously can form a braced frame, and the components and parts of computer are placed to braced frame's bottom, and the utility model discloses heat radiation structure is simple, and the radiating effect is good, and outward appearance elegant appearance has very strong practicality.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the connection between the frame and the connection rod of the present invention.
Fig. 3 is a schematic position diagram of the parting strip and the side panel of the present invention.
Fig. 4 is a schematic perspective view of the support frame of the present invention;
fig. 5 is a schematic perspective view of the parting strip of the present invention.
The text labels in the figures are represented as: 1. a frame; 2. a connecting rod; 3. a support bar; 4. a parting strip; 401. a first through hole; 402. a second through hole; 5. a side panel; 6. a support frame; 601. a first heat dissipation hole; 602. a second heat dissipation hole.
Detailed Description
In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.
The main way of current mainframe box is still seted up the louvre for the heat dissipation, and utilize heat-radiating equipment, do not change mainframe box overall structure, for the radiating effect of further improvement mainframe box, six panels of traditional mainframe box are remain only to this embodiment, side panel 5 in figure 1, and install in the both sides of frame 1, as shown in figure 1, the top of mainframe box, bottom and left side do not all set up the panel, but set up parting bead 4 side by side, radiating channel has between the adjacent parting bead 4, the top of mainframe box like this, bottom and left side homoenergetic are the hot-air of quick discharge, do not influence the installation of inside components and parts again simultaneously and use, improve its radiating effect.
In order to achieve the above-mentioned effect, as shown in fig. 1-5, the specific structure of the present invention is a computer mainframe convenient for heat dissipation, including:
frame 1, frame 1 is the hollow tube, the both ends of hollow tube are connected, in this embodiment, the material can be aluminum alloy or copper, increase heat conduction radiating effect, the quantity of frame 1 is two, set up fixedly connected with connecting rod 2 between two frames 1, connecting rod 2 is with 1 fixed connection of frame of both sides, form a stable braced frame, in this embodiment, frame 1 is the rectangle, the quantity of connecting rod 2 is four, fixed connection is in the four corners of frame 1 respectively, when material is saved, braced frame's structural stability is guaranteed.
In order to install parting bead 4, set up bracing piece 3 between frame 1, bracing piece 3 fixed connection is between two frames 1, the region of defining between two frames 1 is the heat dissipation region, bracing piece 3 is located the regional top of heat dissipation, bottom and left side, in this embodiment, six are no less than to the quantity of bracing piece 3, two frames 1 of definition and connecting rod 2 form braced frame, bracing piece 3 is located the top of frame, bottom and left side respectively, and form bearing structure, be used for supporting inside components and parts.
The division bars 4 are sleeved on the supporting rod 3, first through holes 401 matched with the supporting rod 3 are formed in the division bars 4, second through holes 402 matched with the connecting rod 2 are further formed in the division bars 4, as shown in fig. 3, the space between the two frames 1 is uniformly divided by the division bars 4, the appearance is attractive and elegant, and meanwhile, the heat dissipation performance of the mainframe box is improved.
In order to further improve the aesthetic property of the mainframe box, the mainframe box is also provided with side panels 5, the side panels 5 are arranged at two sides of the heat dissipation area, and the side panels 5 are detachably connected with the frame 1;
support frame 6, support frame 6 are installed on the right side in heat dissipation region for install inside components and parts, in this embodiment, support frame 6 includes backup pad and side board, has seted up first louvre 601 and second louvre 602 on the side board.
To sum up, the utility model discloses a frame 1 and connecting rod 2's cooperation is used, can form the frame of support, connecting rod 2 couples together frame 1 of both sides, establish 4 covers of parting bead on bracing piece 3, form heat dissipation channel between the adjacent parting bead 4, hot-air can discharge fast through the heat dissipation channel between the parting bead 4, a plurality of parting beads 4 simultaneously can form a braced frame, the components and parts of computer are placed to braced frame's bottom, this heat radiation structure is simple, the radiating effect is good, shape elegant appearance has very strong practicality.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the above technical features can be combined in a proper manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.

Claims (6)

1. A computer mainframe convenient for heat dissipation, comprising:
the frame comprises frames (1), wherein the frames (1) are hollow pipes, the two ends of each hollow pipe are connected, the number of the frames (1) is two, and a connecting rod (2) is fixedly connected between the two frames (1);
the supporting rod (3) is fixedly connected between the two frames (1), an area between the two frames (1) is defined as a heat dissipation area, and the supporting rod (3) is positioned at the top, the bottom and the left side of the heat dissipation area;
the spacing bar (4) is sleeved on the supporting rod (3), a first through hole (401) matched with the supporting rod (3) is formed in the spacing bar (4), and a second through hole (402) matched with the connecting rod (2) is formed in the spacing bar (4);
the side panels (5) are arranged on two sides of the heat dissipation area, and the side panels (5) are detachably connected with the frame (1);
the support frame (6), support frame (6) are installed on the right side in heat dissipation region for install inside components and parts.
2. The computer mainframe box facilitating heat dissipation according to claim 1, wherein the material of the frame (1) is aluminum alloy or copper.
3. The computer mainframe box convenient for heat dissipation according to claim 2, wherein the frame (1) is rectangular, and the number of the connecting rods (2) is four, and the four connecting rods are respectively fixedly connected to four corners of the frame (1).
4. The computer mainframe box convenient for heat dissipation according to claim 3, wherein the number of the support rods (3) is not less than six, two frames (1) and two connecting rods (2) are defined to form a support frame, the support rods (3) are respectively located at the top, bottom and left side of the frame, and form a support structure for supporting internal components.
5. The computer mainframe box convenient for heat dissipation according to claim 1, wherein the number of the division bars (4) is not less than two, the distance between two adjacent division bars (4) is less than one centimeter, the division bars (4) are in a "C" shape, and the distance between the division bars (4) is a heat dissipation channel.
6. The computer case convenient for heat dissipation according to claim 1, wherein the supporting frame (6) comprises a supporting plate and a side plate, and the side plate is provided with a first heat dissipation hole (601) and a second heat dissipation hole (602).
CN202020415992.5U 2020-03-27 2020-03-27 Computer mainframe convenient to heat dissipation Expired - Fee Related CN211264255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020415992.5U CN211264255U (en) 2020-03-27 2020-03-27 Computer mainframe convenient to heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020415992.5U CN211264255U (en) 2020-03-27 2020-03-27 Computer mainframe convenient to heat dissipation

Publications (1)

Publication Number Publication Date
CN211264255U true CN211264255U (en) 2020-08-14

Family

ID=71953576

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020415992.5U Expired - Fee Related CN211264255U (en) 2020-03-27 2020-03-27 Computer mainframe convenient to heat dissipation

Country Status (1)

Country Link
CN (1) CN211264255U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200814

CF01 Termination of patent right due to non-payment of annual fee