CN211264055U

CN211264055U - Projector heat dissipation mechanism and projector

Info

Publication number: CN211264055U
Application number: CN202020209777.XU
Authority: CN
Inventors: 於德龙; 陈龙; 来源
Original assignee: Wuxi Seemile Laser Display Technology Co Ltd
Current assignee: Wuxi Seemile Laser Display Technology Co Ltd
Priority date: 2020-02-25
Filing date: 2020-02-25
Publication date: 2020-08-14
Anticipated expiration: 2030-02-25

Abstract

The utility model provides a projector heat dissipation mechanism and projector relates to projector technical field, the utility model provides a projector heat dissipation mechanism, include: a heat dissipating device; the heat dissipation device is provided with a light receiving part; in the dark picture state, the imaging chip emits light into the light receiving portion. The utility model provides a projector heat dissipation mechanism can improve the radiating efficiency of projector under the dark picture state, avoids the projector to lead to damaging because of high temperature, and then can prolong the life of projector.

Description

Projector heat dissipation mechanism and projector

Technical Field

The utility model belongs to the technical field of the projector technique and specifically relates to a projector heat dissipation mechanism and projector are related to.

Background

In a laser projection display device, light emitted from an optical machine is lost in a light path and generates a large amount of heat. Especially when projecting dark pictures, the light cannot be emitted to the outside of the projector, which causes the temperature of the optical machine and the prism in the projector to be increased sharply, and even causes the prism to be broken, which affects the projection quality. In the prior art, untreated light irradiates the inside of a shell of the projector in a dark picture state, so that the temperature of the projector is rapidly increased, and the heat radiation of the projector is not facilitated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a projector heat dissipation mechanism and projector can improve the radiating efficiency of projector under the dark picture state.

First aspect, the utility model provides a projector heat dissipation mechanism, include: a heat dissipation device and an imaging chip;

the heat dissipation device is provided with a light receiving part;

in a dark picture state, the imaging chip emits light into the light receiving part.

With reference to the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein the light receiving portion has a light shielding surface;

the light-blocking surface is configured to absorb light and convert to heat in the dark-picture state.

With reference to the first aspect, the present invention provides a second possible implementation manner of the first aspect, wherein the projector heat dissipation mechanism further includes an optical element;

the position of the prism at which the dark picture emits light is consistent with the connecting position of the heat dissipation device;

in a bright picture state, the imaging chip reflects light to the optical element and the optical element emits the light.

With reference to the second possible implementation manner of the first aspect, the present invention provides a third possible implementation manner of the first aspect, wherein the optical element is installed in an inner cavity of a housing, and the housing is provided with a side opening communicating with the inner cavity;

the heat dissipation device is connected to the side opening and extends to the outside of the inner cavity;

the light receiving portion extends from the side opening in a direction approaching the optical element.

In combination with the third possible implementation manner of the first aspect, the present invention provides a fourth possible implementation manner of the first aspect, wherein the heat dissipation device deviates from one side of the inner cavity and is provided with a plurality of heat dissipation fins, and the heat dissipation fins are arranged at intervals.

With reference to the third possible implementation manner of the first aspect, the present invention provides a fifth possible implementation manner of the first aspect, wherein the optical element comprises a prism; the prism is configured to adjust a light emitting position according to an incident angle of the light reflected by the imaging chip.

In combination with the fifth possible implementation manner of the first aspect, the present invention provides a sixth possible implementation manner of the first aspect, wherein the prism has a first heat conducting surface, and the first heat conducting surface is attached to the inner side wall of the housing.

In combination with the fifth possible implementation manner of the first aspect, the present invention provides a seventh possible implementation manner of the first aspect, wherein the prism has a second heat conducting surface, and the second heat conducting surface abuts against the heat dissipation device.

In combination with the first aspect, the present invention provides an eighth possible implementation manner of the first aspect, wherein the projector heat dissipation mechanism further includes a fan, and the fan is configured to drive air to flow through the heat dissipation device and the housing.

In a second aspect, the present invention provides a projector having a heat dissipation mechanism of the projector provided by the first aspect.

The embodiment of the utility model provides a following beneficial effect has been brought: the imaging chip emits light into the light receiving part, receives illumination and generates heat to be converted into heat through the light receiving part, and can directly transmit the heat to the outside through the heat radiating device and radiate the heat, so that the heat radiating efficiency in a dark picture state is improved.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention or the related art, the drawings required to be used in the description of the embodiments or the related art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a projector according to an embodiment of the present invention in a state where a top cover is removed;

fig. 2 is a top view of a projector according to an embodiment of the present invention.

Icon: 100-a heat sink device; 110-a light receiving part; 120-heat dissipation fins; 200-an imaging chip; 300-an optical element; 400-a housing; 410-a top cover; 500-fan.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "physical quantity" in the formula, unless otherwise noted, is understood to mean a basic quantity of a basic unit of international system of units, or a derived quantity derived from a basic quantity by a mathematical operation such as multiplication, division, differentiation, or integration.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example one

As shown in fig. 1, the embodiment of the present invention provides a heat dissipation mechanism for a projector, including: a heat spreader device 100 and an imaging chip 200; the heat dissipation device 100 is provided with a light receiving portion 110; in the dark-screen state, the imaging chip 200 emits light into the light receiving part 110. Wherein, the imaging chip 200 includes a digital micro-mirror, and in a bright picture state, the imaging chip 200 reflects light and emits the light to form a bright projection picture; in the dark-screen state, the imaging chip 200 reflects light to the light receiving part 110, shields the light by the light receiving part 110, generates heat, and radiates the heat by the heat dissipation device 100.

In the dark image state, the light intensity required for projecting the image is low, and the imaging chip 200 reflects the light to the light receiving portion 110. The light receiving part 110 generates heat under the action of light and radiates the heat through the heat radiating device 100, so that light can be prevented from acting on other devices. In the dark frame state, the light reflected by the imaging chip 200 is directly incident to the light receiving part 110, so that the heat dissipation device 100 is heated and directly dissipates heat to the outside through the heat dissipation device 100, thereby shortening the heat transfer path in the heat dissipation process and improving the heat dissipation efficiency of the projector.

It should be noted that the reflected light directly acts on the heat dissipation device 100, and causes the heat dissipation device 100 to generate heat, and heat dissipation is performed through the heat dissipation device 100, which greatly improves heat transfer efficiency compared with heat transfer through air, and further can prevent heat from concentrating inside the projector, and prevent the projector from being damaged due to high temperature.

In the embodiment of the present invention, the heat dissipation device 100 is made of metal with large thermal conductivity, such as aluminum alloy, copper or steel, and the heat dissipation device 100 is made of material with large thermal conductivity, so as to improve the heat dissipation efficiency.

Further, the light receiving portion 110 has a light shielding surface; the light-shielding surface is configured to absorb light and convert into heat in a dark-picture state.

Specifically, the light-shielding surface includes a flat surface or a curved surface, and in order to prevent light irradiated on the light-shielding surface from being reflected, the light-shielding surface may be coated in black to improve light absorption capability of the light-shielding surface.

Further, the heat dissipation mechanism of the projector further includes an optical element 300; in the bright frame state, the imaging chip 200 reflects the imaging light to the optical element 300, and the optical element 300 emits the imaging light.

Specifically, in the bright screen state, the light is reflected by the imaging chip 200 and enters the optical element 300, and the light processed by the optical element 300 exits. In the dark image state, the imaging chip 200 reflects the light to the light receiving portion 110, and the light is blocked and absorbed by the light receiving portion 110, so that the reflected light is prevented from being incident on the optical element 300, the optical element 300 is prevented from generating heat under the illumination effect in the dark image state, and the optical element 300 is prevented from being damaged due to high temperature.

As shown in fig. 1 and 2, the optical element 300 is installed in an inner cavity of the housing 400, and the housing 400 is provided with a side opening communicating with the inner cavity; the heat dissipation device 100 is connected to the side opening and extends to the outside of the inner cavity; the light receiving portion 110 extends from the side opening in a direction approaching the optical element 300.

Specifically, the heat dissipation device 100 is inserted into the side opening and connected to the housing 400. The light receiving portion 110 extends to a position close to the optical element 300, and an end of the heat dissipation device 100 facing away from the optical element 300 extends to the outside of the inner cavity. In the dark state, the light receiving part 110 is heated by light, and the heat is transferred to the outside of the cavity through the heat dissipation device 100, so as to prevent the temperature in the cavity from being too high, and prevent the optical element 300 from being damaged due to high temperature. In the bright image state, the light is reflected by the imaging chip 200 and enters the optical element 300, the optical element 300 generates heat under the action of the light, and the optical element 300 contacts the light receiving part 110 or the shell 400, thereby directly transferring heat; alternatively, the heat of the optical element 300 is transferred to the air, and is transferred to the heat dissipation device 100 and the case 400 by the air.

It should be noted that an opening is formed at the top of the housing 400, and the top cover 410 covers the opening. The optical element 300 may be mounted in the cavity through an opening and the cavity is sealed by covering the cap 410.

As shown in fig. 1, a plurality of heat dissipation fins 120 are disposed on a side of the heat dissipation device 100 away from the inner cavity, and the heat dissipation fins 120 are spaced apart from each other.

Specifically, the plurality of heat dissipation fins 120 are arranged at intervals, and an air flow channel is formed between any two heat dissipation fins 120, so that the contact area between the heat dissipation device 100 and the air is increased, and the heat dissipation speed of the heat dissipated from the heat dissipation device 100 to the air outside the inner cavity can be increased.

Further, the optical element 300 includes a prism; the prism is configured to adjust the light emitting position according to the incident angle of the light reflected by the imaging chip 200.

In the bright screen state, the imaging chip 200 reflects light emitted from the light engine to the prism, and the light processed by the prism exits and is used to project a bright projection screen. In the dark-frame state, the imaging chip 200 reflects a part of the light emitted from the optical engine to the light receiving portion 110, thereby preventing the reflected light from being emitted to the optical element 300 or the housing 400.

Further, the prism has a first heat conducting surface, and the first heat conducting surface is attached to the inner side wall of the housing 400.

Specifically, the prism is installed in the inner cavity of the housing 400, and the housing 400 is in surface contact with the prism to limit and fix the prism. The heat of the prism can be transferred to the housing 400 through the first heat-conducting surface, and the heat is transferred to the outside of the inner cavity through the housing 400, so that the heat dissipation of the projector is realized.

Further, a plurality of fins are disposed on the outer end surface of the housing 400, the plurality of fins are disposed at intervals, a gas flow channel is formed between any two adjacent fins, and the heat dissipation area is increased by the plurality of fins, so that heat on the housing 400 is dissipated to the outside air.

Further, the prism has a second heat-conducting surface, which abuts against the heat sink device 100.

Specifically, the light receiving portion 110 extends and abuts against the second heat conducting surface, and in a bright image state, the imaging chip 200 emits light into the prism, and the light is emitted after being processed by the prism. The light entering the prism will cause the prism to increase in temperature, transferring heat to the heat sink device 100 through the second heat conducting surface, and dissipating heat to the air outside the cavity through the heat sink device 100. Compare in dispelling the heat to the prism through air heat transfer, the prism passes through the face contact heat transfer with heat dissipation device 100, can improve the radiating efficiency of prism, and then avoids the prism because of the heat dissipation untimely lead to the high temperature often, not only can prevent that the prism from producing because of the high temperature and breaking, can avoid high temperature to influence the optical property of prism moreover.

As shown in fig. 2, the heat dissipation mechanism of the projector further includes a fan 500, and the fan 500 is configured to drive air to flow through the heat dissipation device 100 and the housing 400.

Specifically, the fan 500 is disposed outside the housing 400, and the fan 500 may be attached to a bracket and the bracket is attached to the heat sink device 100 or the housing 400. When the fan 500 operates, the fan 500 drives air to flow across the surfaces of the heat dissipation device 100 and the housing 400, and the heat on the heat dissipation device 100 and the housing 400 is dissipated into the air by the air flow, so that the heat dissipation of the projector is accelerated.

Example two

As shown in fig. 1 and fig. 2, a projector according to an embodiment of the present invention is provided with a heat dissipation mechanism according to a first embodiment of the present invention.

Specifically, the light emitted from the optical engine is reflected by the imaging chip 200. In the bright image state, the imaging chip 200 reflects the light to the optical element 300, and the light is emitted after being processed by the optical element 300, so as to project a bright projection image. In a dark-screen state, the imaging chip 200 reflects light to the light receiving portion 110, the light receiving portion 110 absorbs light and generates heat, and the heat is dissipated to the outside of the housing 400 through the heat dissipating device 100, thereby preventing the heat from being concentrated in the inner cavity of the housing 400. In the dark frame state, the light reflected by the imaging chip 200 is prevented from being irradiated on the inner side wall of the housing 400 and the optical element 300, the light receiving part 110 shields redundant reflected light, heat is directly transmitted to the outside air through the heat dissipation device 100, the air flow rate of the heat dissipation device 100 and the surface of the housing 400 is accelerated by the fan 500, the heat dissipation efficiency of the projector can be improved, the projector is prevented from being damaged due to high temperature, and the service life of the projector is prolonged.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A heat dissipation mechanism for a projector, comprising: a heat sink device (100) and an imaging chip (200);

the heat dissipation device (100) is provided with a light receiving part (110);

in a dark-screen state, the imaging chip (200) emits light into the light receiving section (110).

2. The projector heat dissipation mechanism as defined in claim 1, wherein the light receiving portion (110) has a light shielding surface;

3. The heat dissipation mechanism of claim 1, further comprising an optical element (300);

in a bright picture state, the imaging chip (200) reflects light to the optical element (300) and the optical element (300) emits the light.

4. The heat dissipation mechanism of claim 3, wherein the optical element (300) is mounted in an inner cavity of a housing (400), and the housing (400) is provided with a side opening communicating with the inner cavity;

the heat dissipation device (100) is connected to the side opening and extends to the outside of the inner cavity;

the light receiving unit (110) extends from the side opening in a direction approaching the optical element (300).

5. The heat dissipation mechanism of claim 4, wherein a side of the heat dissipation device (100) facing away from the inner cavity is provided with a plurality of heat dissipation fins (120), and the plurality of heat dissipation fins (120) are spaced apart from each other.

6. The projector heat dissipation mechanism of claim 4, wherein the optical element (300) comprises a prism;

the prism is configured to adjust a light emitting position according to an incident angle of the light reflected by the imaging chip (200).

7. The heat dissipation mechanism of claim 6, wherein the prism has a first heat conduction surface, and the first heat conduction surface is attached to an inner side wall of the housing (400).

8. The heat dissipation mechanism of projector as claimed in claim 6, wherein the prism has a second heat conduction surface abutting the heat dissipation device (100).

9. The projector heat dissipation mechanism as defined in any of claims 4-8, further comprising a fan (500), the fan (500) configured to drive a gas flow through the heat dissipation device (100) and the housing (400).

10. A projector characterized in that the projector is provided with the heat dissipation mechanism for a projector according to any one of claims 1 to 9.