CN211263279U - Flexible gas sensing device - Google Patents
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- CN211263279U CN211263279U CN201922392163.XU CN201922392163U CN211263279U CN 211263279 U CN211263279 U CN 211263279U CN 201922392163 U CN201922392163 U CN 201922392163U CN 211263279 U CN211263279 U CN 211263279U
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Abstract
The utility model discloses a flexible gas sensing device, which comprises a flexible sensitive testing unit and a flexible packaging unit, wherein the flexible packaging unit comprises a flexible cover plate with a transparent window, the flexible cover plate and the flexible sensitive testing unit are combined in a sealing way to form a packaging cavity, and the packaging cavity is communicated with at least one air hole arranged on the flexible cover plate; the flexible sensitive test unit comprises a heat insulation layer, a heating layer, a heat conduction insulation layer and a gas sensitive structure which are sequentially laminated on the flexible substrate, and the gas sensitive structure is also electrically connected with the test electrode; wherein at least the gas sensitive structure is disposed in the encapsulation chamber. The utility model provides a flexible gaseous sensing equipment combines together full printing technology and semiconductor oxide material, need not pass through technologies such as photoetching, has avoided the damage of high temperature or chemical corrosion liquid to flexible substrate or device.
Description
Technical Field
The utility model relates to a gas sensor, in particular to flexible gas sensing equipment belongs to flexible electron device technical field.
Background
The gas sensor is widely applied to detecting combustible gas, toxic gas and atmospheric components and quickly and sensitively monitoring various gases (such as NO) which bring harm to the environment2CO and H2S, etc.) becomes an important task thereof. The gas sensor is used as a device for detecting toxic gas components and converting the toxic gas components into appropriate electric signals inPlays an extremely important role in the fields of industrial production, family safety, environmental monitoring, medical treatment and the like. With the wider application of gas sensors, the requirements on the application range and performance of the gas sensors are higher, and therefore research and development of novel gas sensors are imperative.
At present, the main gas sensor is a hard substrate based on materials such as silicon, ceramics and the like, and the application of the existing gas sensor in the fields of food safety, medical health, flexible electronics and the like is difficult to meet, so that the development and preparation of the flexible gas sensor become one of the trends in the field of sensors. In addition, in the preparation process of the existing flexible gas sensor, the existing flexible gas sensor still needs to be subjected to semiconductor processes such as substrate and photoetching, and the flexible substrate is affected by high temperature or chemical corrosive liquid in the preparation process, so that the flexible substrate or the device is damaged.
Disclosure of Invention
A primary object of the present invention is to provide a flexible gas sensor device, which overcomes the disadvantages of the prior art.
In order to achieve the purpose of the invention, the technical scheme adopted by the utility model comprises:
the embodiment of the utility model provides a flexible gas sensing equipment, it includes flexible sensitive test unit and flexible encapsulation unit, flexible encapsulation unit includes the flexible apron that has transparent window, flexible apron and flexible sensitive test unit sealing combination form a encapsulation cavity;
the flexible sensitive test unit comprises a heat insulation layer, a heating layer, a heat conduction insulation layer and a gas sensitive structure which are sequentially arranged on a flexible substrate in a laminated mode, and the gas sensitive structure is further electrically connected with a test electrode arranged on the heat conduction insulation layer; wherein at least the gas sensitive structure is disposed in the encapsulation chamber.
Further, the material of the heating layer includes any one metal of Pt, W, Cu, and Ni or an alloy formed by two or more metals, but is not limited thereto.
Preferably, the heating layer comprises a plurality of heating electrodes arranged at intervals, the plurality of heating electrodes are electrically connected, and the thickness of the heating layer is 10-1000 μm.
Further, the material of the heat conducting and insulating layer includes, but is not limited to, a nano ceramic material, a nano-scale heat conducting and insulating glass fiber and/or organic silicon.
Preferably, the thickness of the heat conduction and insulation layer is 10-1000 μm.
Further, the gas sensitive structure has a three-dimensional porous structure formed by interweaving a plurality of porous conductive fibers.
The porous conductive fiber may be selected from those well known in the art.
Preferably, the porous conductive fiber comprises a plurality of semiconductor metal oxide nanoparticles which are closely packed, and sulfonated graphene and thiophene oligomers are distributed among at least part of the semiconductor metal oxide nanoparticles.
Furthermore, the diameter of the porous conductive fiber is 0.5-20 μm, the length is more than 10 μm, the porosity is 60-85%, and the aperture of the contained hole is 20-100 nm.
Further, the porous conductive fiber comprises the following components in a mass ratio of 90-95: 0.01-0.5: 2-5 of semiconducting metal oxide nanoparticles, sulfonated graphene, and thiophene oligomers.
Further, the particle size of the semiconductor metal oxide nano-particles is 10-100 nm.
Furthermore, the thiophene oligomer contains 2-20 monomer units and has a molecular weight of 800-3000 g/mol.
Further, the test electrode is formed by printing conductive ink containing metal nanoparticles, and the metal elements contained in the metal nanoparticles are the same as those contained in the semiconductor metal oxide nanoparticles forming the gas-sensitive structure.
Further, the metal nanoparticles include metal nanoparticles such as Au, Cu, or Al, but are not limited thereto.
Preferably, the flexible sensitive test unit comprises more than two test electrodes, the gas sensitive structure is arranged between the more than two test electrodes, the more than two test electrodes are electrically connected, and the thickness of each test electrode is 10-1000 μm.
Further, the flexible cover plate is connected with the heat conduction insulating layer in a sealing mode.
Further, the material of the flexible cover plate includes, but is not limited to, polydimethylsiloxane.
Further, the diameter of the air hole is 10-500 μm.
Wherein, through set up transparent window on the flexible apron, do benefit to the user and observe the sensing equipment internal conditions, the appearance is also more pleasing to the eye, and aforementioned gas pocket can be seted up on transparent window or one side.
Further, the material of the flexible substrate includes a flexible polymer, and the flexible polymer includes any one or a combination of two or more of polyimide, polyethylene terephthalate, polytetrafluoroethylene, polydimethylsiloxane, and polyethylene, but is not limited thereto.
Preferably, the thickness of the flexible substrate is 10-1000 μm.
Further, the material of the heat insulation layer comprises polyimide and/or polyethylene, and the thickness of the heat insulation layer is 100nm-5000 nm. Further, still be provided with the wiring pad on the heat conduction insulating layer, the wiring pad respectively with zone of heating, test electrode electricity are connected.
The embodiment of the utility model provides a still provide flexible gas sensing equipment's manufacturing method, it includes:
sequentially manufacturing a heat insulation layer, a heating layer and a heat conduction insulation layer which are arranged in a laminated manner on a flexible substrate in a printing manner;
manufacturing and forming a testing electrode and a gas sensitive structure on the heat-conducting insulating layer in a printing mode, and electrically connecting the gas sensitive structure with the testing electrode to further form a flexible sensitive testing unit;
providing a flexible cover plate with air holes, sealing and combining the flexible cover plate with the flexible sensitive testing unit, further enclosing and forming a packaging cavity between the flexible cover plate and the flexible sensitive testing unit, packaging at least the gas sensitive structure in the packaging cavity, and communicating the packaging cavity with the air holes in the flexible cover plate.
Specifically, the manufacturing method comprises the following steps: dissolving thiophene oligomer in an organic solvent to form a dispersion liquid, sequentially adding sulfonated graphene and semiconductor metal oxide nanoparticles into the dispersion liquid, uniformly dispersing to form printing ink, printing the printing ink on a heat-conducting insulating layer, drying and aging to form a gas sensitive structure; drying and aging the printing ink to form a plurality of porous conductive fibers which are interwoven with each other; wherein the mass ratio of the semiconductor metal oxide nanoparticles to the sulfonated graphene to the thiophene oligomer in the printing ink is 90-95: 0.01-0.5: 2-5, the semiconductor metal oxide nano-particles can be copper oxide nano-particles, cuprous oxide nano-particles, aluminum oxide nano-particles and the like, the particle size of the semiconductor metal oxide nano-particles is 10-100nm, the thiophene oligomer contains 2-20 monomer units, and the molecular weight is 800-3000 g/mol.
Specifically, the method specifically comprises the following steps: and printing conductive ink containing metal nano particles on the conductive insulating layer to form a test electrode, and electrically connecting the test electrode with the gas sensitive structure, wherein the metal nano particles can be Au, Cu or Al and the like, and the thickness of the test electrode is 10-1000 μm.
Further, the method further comprises the following steps: and manufacturing a wiring pad on the heat insulation layer in a printing mode, and electrically connecting the wiring pad with the heating layer and the test electrode respectively.
Compared with the prior art, the utility model has the advantages that:
the embodiment of the utility model provides a flexible gas sensing equipment combines full printing technology with semiconductor oxide material, need not pass through processes such as photoetching, has avoided the damage of high temperature or chemical corrosion liquid to flexible substrate or device for this flexible gas sensing equipment has characteristics such as sensitivity height and selectivity are good;
in the gas sensitive structure of the flexible gas sensing device provided by the embodiment of the utility model, the porous conductive fibers are interwoven with each other to form a three-dimensional porous structure, which contains multi-level holes, has a large specific surface area, can absorb target gas more quickly and more, and further can improve the sensitivity of the gas sensor;
the embodiment of the utility model provides a pair of flexible gas sensing equipment, preparation simple process, the cost is lower, the performance is good, easy integration is particularly useful for fields such as consumer electronics, white household electrical appliances.
Drawings
Fig. 1 is a schematic diagram of a flexible gas sensing device in accordance with an exemplary embodiment of the present invention;
fig. 2 is a schematic diagram of a process for manufacturing a flexible gas sensing device according to an exemplary embodiment of the present invention.
Detailed Description
In view of the deficiencies in the prior art, the inventor of the present invention has made extensive studies and practices to provide the technical solution of the present invention. The technical solution, its implementation and principles, etc. will be further explained as follows.
The embodiment of the utility model provides a flexible gas sensing equipment adopts the preparation technology of full printing to combine together with semiconductor metallic oxide material, and the preparation has the flexible gas sensor chip of good sensitivity and selection on flexible substrate to form flexible encapsulation apron through the mould printing.
Specifically, referring to fig. 1, a flexible gas sensing device provided in an exemplary embodiment of the present invention includes a flexible sensitive testing unit and a flexible packaging unit, wherein the flexible packaging unit is connected to the flexible sensitive testing unit in a packaging manner;
the flexible sensitive test unit comprises a heat insulating layer 30, a heating layer 40, a heat conducting insulating layer 50, a test electrode 60 and a gas sensitive structure 70 which are sequentially arranged on a flexible substrate 10 in a laminated manner, wherein the gas sensitive structure 70 is arranged on the test electrode 60 and is electrically connected with the test electrode 60, and the heating layer 40 comprises a heating electrode;
the flexible packaging unit comprises a flexible cover plate 20 with a transparent window, the flexible cover plate is connected with a heat conduction insulating layer of the flexible sensitive testing unit in a sealing mode and is enclosed with the heat conduction insulating layer to form a packaging cavity, the testing electrode and the gas sensitive structure are packaged in the packaging cavity, and the packaging cavity is communicated with at least one air hole 21 in the flexible cover plate.
Specifically, a wiring pad is further provided on the heat conductive insulating layer, and the wiring pad is electrically connected to the test electrode.
Specifically, the material of the flexible cover plate 20 includes polydimethylsiloxane, the diameter of the air hole 21 on the flexible cover plate is 10-500 μm, the material of the flexible substrate 10 includes a flexible polymer, the flexible polymer includes one or a combination of two or more of polyimide, polyethylene terephthalate, polytetrafluoroethylene, polydimethylsiloxane and polyethylene, and the thickness of the flexible substrate 10 is 10-1000 μm.
Specifically, the heat insulating layer 30 is made of polyimide and/or polyethylene and has a thickness of 100-5000nm, the heating layer 40 is made of any one metal or an alloy formed by more than two metals of Pt, W, Cu and Ni and has a thickness of 10-1000 μm, and the heat conducting insulating layer 50 is made of a nano ceramic material, nano heat conducting insulating glass fiber and/or organic silicon and has a thickness of 10-1000 μm.
Specifically, the material of the gas sensitive structure 70 includes a semiconductor metal oxide with a thickness of 10-1000 μm, and the material of the test electrode 60 includes any one metal or an alloy of two or more metals of Au, Cu, and Al with a thickness of 10-1000 μm.
Further, the gas sensitive structure 70 has a three-dimensional porous structure formed by interweaving a plurality of porous conductive fibers.
The porous conductive fiber may be selected from those known in the art, and will not be described herein.
Preferably, the porous conductive fiber comprises a plurality of semiconductor metal oxide nanoparticles which are closely packed, and sulfonated graphene and thiophene oligomers are further distributed among at least part of the semiconductor metal oxide nanoparticles, wherein the diameter of the porous conductive fiber is 0.5-20 μm, the length of the porous conductive fiber is more than 10 μm, the porosity of the porous conductive fiber is 60-85%, and the pore diameter of pores contained in the porous conductive fiber is 20-100 nm.
Specifically, the porous conductive fiber comprises the following components in a mass ratio of 90-95: 0.01-0.5: 2-5 semiconductor metal oxide nanoparticles, sulfonated graphene and thiophene oligomer, wherein the particle size of the semiconductor metal oxide nanoparticles is 10-100nm, the thiophene oligomer contains 2-20 monomer units, and the molecular weight is 800-3000 g/mol; the sulfonated graphene and the thiophene oligomer can obviously improve the transmission efficiency of electrons between semiconductor nano particles, and further obviously improve the sensitivity of the gas sensitive structure.
Specifically, the test electrode 60 is formed by printing conductive ink containing metal nanoparticles, the metal elements contained in the metal nanoparticles are the same as those contained in the semiconductor metal oxide nanoparticles forming the gas-sensitive structure, and the metal nanoparticles forming the test electrode include metal nanoparticles such as Au, Cu, or Al.
Embodiment 1 referring to fig. 2, a method for manufacturing a flexible gas sensing device may include the following steps:
1) providing a flexible substrate with the thickness of 10-1000 μm and cleaning, wherein the material of the flexible substrate can be any one or the combination of more than two of polyimide, polyethylene terephthalate, polytetrafluoroethylene, polydimethylsiloxane and polyethylene;
2) manufacturing a heat insulation layer with the thickness of 100-5000nm on the flexible substrate by adopting a printed electronic process, wherein the heat insulation layer can be a polyimide layer or a polyethylene layer;
3) printing metal paste on the heat insulating layer by screen printing or gravure printing to form a heating layer with a thickness of 10-1000 μm, wherein the metal paste for forming the heating layer comprises a main material and a binder, the main material can be selected from any one or a combination of more than two of Pt, W, Cu and Ni, and the binder can be selected from triammonium citrate (TAC) and/or ammonium polymethacrylate (PMAA-NH)4) The adhesive can increase the heating layer and the heat insulating layerBinding force;
4) printing heat-conducting insulating layer slurry on the heating layer by adopting a printing process, and then curing at the temperature of 100-300 ℃ to form a heat-conducting insulating layer, wherein the thickness of the heat-conducting insulating layer is 10-1000 mu m, and the heat-conducting insulating layer is used for isolating a conductive path between the heating layer and a material layer positioned above the heat-conducting insulating layer; the heat-conducting insulating layer slurry for forming the heat-conducting insulating layer is mainly formed by nano-scale heat-conducting insulating glass fibers and/or organic silicon filled nano-ceramic materials;
5) dissolving thiophene oligomer in an organic solvent (such as acetonitrile, acetone and the like) to form a dispersion liquid, sequentially adding sulfonated graphene and semiconductor metal oxide nanoparticles into the dispersion liquid, uniformly dispersing to form printing ink, printing the printing ink on a heat-conducting insulating layer and/or a test electrode, drying and aging to form a gas sensitive structure; drying and aging the printing ink to form a plurality of porous conductive fibers which are interwoven with each other; wherein the mass ratio of the semiconductor metal oxide nanoparticles to the sulfonated graphene to the thiophene oligomer in the printing ink is 90-95: 0.01-0.5: 2-5, the semiconductor metal oxide nanoparticles can be copper oxide nanoparticles, cuprous oxide nanoparticles, aluminum oxide nanoparticles and the like, the particle size of the semiconductor metal oxide nanoparticles is 10-100nm, the thiophene oligomer contains 2-20 monomer units, and the molecular weight is 800-3000 g/mol;
6) printing conductive ink containing metal nano particles on the conductive insulating layer to form a test electrode, and electrically connecting the test electrode with the gas sensitive structure, wherein the metal nano particles can be Au, Cu or Al and other metal nano particles, and the thickness of the test electrode is 10-1000 mu m;
7) manufacturing a wiring pad on the heat-conducting insulating layer by adopting a printing process, and electrically connecting the wiring pad with the test electrode and the heating electrode respectively;
8) the flexible cover plate with the transparent window is manufactured and formed in an injection molding mode, the air holes are manufactured in the flexible cover plate, the flexible cover plate covers the testing electrode and the gas sensitive structure, the flexible cover plate is connected with the heat-conducting insulating layer in a UV curing mode, the testing electrode and the gas sensitive structure are packaged in a packaging cavity formed by the flexible cover plate and the heat-conducting insulating layer in a surrounding mode, and then the flexible gas sensing equipment is obtained.
Of course, it is also possible to fabricate the test electrodes on the thermal insulation layer first, and then fabricate the gas sensitive structure between the test electrodes, and electrically connect the gas sensitive structure with the test electrodes.
The flexible gas sensing device manufactured in example 1 was used to detect gases such as nitrogen dioxide, carbon monoxide, and hydrogen sulfide:
placing the flexible gas sensing equipment obtained in the embodiment 1 in a test environment, and respectively introducing 100-1000ppm of nitrogen dioxide, carbon monoxide and hydrogen sulfide into the test environment; the sensitivity of the flexible gas sensing device to nitrogen dioxide is 5.1-25.3, wherein when the introduction amount of the nitrogen dioxide is 500ppm, the sensitivity of the gas sensor to the nitrogen dioxide reaches 25.3, the sensitivity of the flexible gas sensing device to carbon monoxide is 6.6-33.8, wherein when the introduction amount of the carbon monoxide is 550ppm, the sensitivity of the flexible gas sensing device to the carbon monoxide reaches 33.8, the sensitivity of the flexible gas sensing device to hydrogen sulfide reaches 9-43.6, and when the introduction amount of the hydrogen sulfide reaches 900ppm, the sensitivity of the flexible gas sensing device to the hydrogen sulfide reaches 43.6.
Comparative example 1 a method of fabricating a gas sensor may include the following processes:
1) providing a flexible substrate with the thickness of 10-1000 μm and cleaning, wherein the material of the flexible substrate can be any one or the combination of more than two of polyimide, polyethylene terephthalate, polytetrafluoroethylene, polydimethylsiloxane and polyethylene;
2) manufacturing a heat insulation layer with the thickness of 100-5000nm on the flexible substrate by adopting a printed electronic process, wherein the heat insulation layer can be a polyimide layer or a polyethylene layer;
3) printing metal paste on the heat insulating layer by silk screen or gravure printing to form a heating layer with a thickness of 10-1000 μm, wherein the metal paste for forming the heating layer comprises main material and adhesiveThe main material can be selected from any one or combination of more than two of Pt, W, Cu and Ni, and the adhesive can be selected from triammonium citrate (TAC) and/or ammonium polymethacrylate (PMAA-NH)4) The adhesive can increase the bonding force between the heating layer and the heat insulating layer;
4) printing heat-conducting insulating layer slurry on the heating layer by adopting a printing process, and then curing at the temperature of 100-300 ℃ to form a heat-conducting insulating layer, wherein the thickness of the heat-conducting insulating layer is 10-1000 mu m, and the heat-conducting insulating layer is used for isolating a conductive path between the heating layer and a material layer positioned above the heat-conducting insulating layer; the heat-conducting insulating layer slurry for forming the heat-conducting insulating layer is mainly formed by nano-scale heat-conducting insulating glass fibers and/or organic silicon filled nano-ceramic materials;
5) directly dissolving semiconductor metal oxide nanoparticles into an organic solvent (such as acetonitrile, acetone and the like) to be uniformly dispersed to form printing ink, and printing the printing ink on a heat-conducting insulating layer to form a gas sensitive structure; wherein the semiconductor metal oxide nanoparticles can be copper oxide nanoparticles, cuprous oxide nanoparticles, aluminum oxide nanoparticles, etc., and the particle size of the semiconductor metal oxide nanoparticles is 10-100 nm;
6) printing conductive ink containing metal nano particles on the conductive insulating layer to form a test electrode, and electrically connecting the test electrode with the gas sensitive structure, wherein the metal nano particles can be Au, Cu or Al and other metal nano particles, and the thickness of the test electrode is 10-1000 mu m;
7) manufacturing a wiring pad on the heat-conducting insulating layer by adopting a printing process, and electrically connecting the wiring pad with the test electrode and the heating electrode respectively;
8) the flexible cover plate is manufactured and formed in an injection molding mode, air holes are manufactured in the flexible cover plate, the flexible cover plate covers the testing electrode and the gas sensitive structure, the flexible cover plate is connected with the heat conduction insulating layer in a UV curing mode, the testing electrode and the gas sensitive structure are packaged in a packaging cavity formed by the flexible cover plate and the heat conduction insulating layer in a surrounding mode, and then the gas sensor is obtained.
Of course, it is also possible to fabricate the test electrodes on the thermal insulation layer first, and then fabricate the gas sensitive structure between the test electrodes, and electrically connect the gas sensitive structure with the test electrodes.
The gas sensor obtained in comparative example 1 was used to detect gases such as nitrogen dioxide, carbon monoxide, and hydrogen sulfide:
placing the gas sensor obtained in the comparative example 1 in a test environment, and respectively introducing 100-1000ppm of nitrogen dioxide, carbon monoxide and hydrogen sulfide into the test environment; the sensitivity of the gas sensor to nitrogen dioxide is 4.6-12.1, the sensitivity to carbon monoxide is 5.1-14.8, and the sensitivity to hydrogen sulfide is 3.4-10.6.
The embodiment of the utility model provides an among flexible gas sensing equipment's the sensitive structure of gas, porous conductive fiber interweaves each other and can forms three-dimensional porous structure, wherein contains multistage hole, and specific surface is big, can be faster, more absorption target gas, and then can improve gas sensor's sensitivity.
The embodiment of the utility model provides a pair of flexible gas sensing equipment, preparation simple process, the cost is lower, the performance is good, easy integration is particularly useful for fields such as consumer electronics, white household electrical appliances.
The embodiment of the utility model provides a pair of flexible gas sensing equipment combines together printing technology and semiconductor oxide material entirely for this flexible gas sensing equipment has characteristics such as sensitivity height and selectivity are good.
The embodiment of the utility model provides a flexible gas sensing equipment, through printing technology preparation heating part and test electrode part on high temperature resistant flexible substrate, keep apart through insulating heat-conducting layer in the middle of heating part and the test electrode part, the utility model provides a manufacturing approach provides the reliability that improves the processing technology, and improves the sensitivity of flexible gas sensor greatly; and moreover, standardized process production can be carried out, and the yield of devices is improved.
It should be understood that the above-mentioned embodiments are merely illustrative of the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, and therefore, the protection scope of the present invention should not be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (10)
1. A flexible gas sensing device is characterized by comprising a flexible sensitive testing unit and a flexible packaging unit, wherein the flexible packaging unit comprises a flexible cover plate with a transparent window, the flexible cover plate and the flexible sensitive testing unit are combined in a sealing mode to form a packaging chamber, and the packaging chamber is communicated with at least one air hole formed in the flexible cover plate;
the flexible sensitive test unit comprises a heat insulation layer, a heating layer, a heat conduction insulation layer and a gas sensitive structure which are sequentially arranged on a flexible substrate in a laminated mode, and the gas sensitive structure is further electrically connected with a test electrode arranged on the heat conduction insulation layer; wherein at least the gas sensitive structure is disposed in the encapsulation chamber.
2. The flexible gas sensing apparatus of claim 1, wherein: the heating layer comprises a plurality of heating electrodes arranged at intervals, the plurality of heating electrodes are electrically connected, and the thickness of the heating layer is 10-1000 microns.
3. The flexible gas sensing apparatus of claim 1, wherein: the thickness of the heat conduction insulating layer is 10-1000 mu m.
4. The flexible gas sensing apparatus of claim 1, wherein: the thickness of the gas sensitive structure is 10-1000 μm.
5. The flexible gas sensing device of claim 4, comprising two or more test electrodes, wherein the gas sensitive structure is disposed between the two or more test electrodes, wherein the two or more test electrodes are electrically connected, and wherein the test electrodes have a thickness of 10-1000 μm.
6. The flexible gas sensing apparatus of claim 1, wherein: the diameter of the air holes is 10-500 μm.
7. The flexible gas sensing apparatus of claim 1, wherein: the thickness of the flexible substrate is 10-1000 μm.
8. The flexible gas sensing apparatus of claim 1, wherein: the thickness of the thermal insulation layer is 100-5000 nm.
9. The flexible gas sensing apparatus of claim 1, wherein: and a wiring pad is further arranged on the heat conduction insulating layer and is electrically connected with the heating layer and the testing electrode respectively.
10. The flexible gas sensing apparatus of claim 1, wherein: the gas sensitive structure has a three-dimensional porous structure formed by interweaving a plurality of porous conductive fibers.
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| CN112881471A (en) * | 2021-02-09 | 2021-06-01 | 建木柔电(深圳)智能设备有限公司 | Quick-response carbon monoxide gas sensor and preparation process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112881471A (en) * | 2021-02-09 | 2021-06-01 | 建木柔电(深圳)智能设备有限公司 | Quick-response carbon monoxide gas sensor and preparation process thereof |
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