CN211261161U

CN211261161U - Air supply device capable of generating ion airflow

Info

Publication number: CN211261161U
Application number: CN201921641889.6U
Authority: CN
Inventors: 邱庆彬
Original assignee: 邱庆彬; 陈千智
Current assignee: Stratospheric composite water ions (Shenzhen) Co., Ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-08-14
Anticipated expiration: 2029-09-29

Abstract

The utility model discloses an air supply arrangement that can produce ionic air current, including the cavity body, the fan, the fin, the semiconductor refrigeration piece, the negative pole, the insulating part, the positive pole, the internal mounting panel that is equipped with of cavity, the mounting panel is separated into the air inlet duct to the cavity body, the air duct of giving vent to anger, the negative pole is fixed on the refrigeration face of semiconductor refrigeration piece, the insulating part is equipped with the water conservancy diversion clearance of adjustable clearance size, the positive pole is fixed on the insulating part, the positive pole, the insulating part is cavity, the positive pole, the cavity of insulating part constitutes the discharge chamber, the negative pole other end is located the cooling and discharges on the coaxial line in chamber center. The utility model has the advantages that: guiding a part of air flow in the air duct to enter a discharge cavity, liquefying water molecules in the discharge cavity when meeting cold negative poles, and generating ozone ions, nano water ions, air positive and negative ions and plasma by utilizing the discharge effect to form ion air flow purification air supply; the fan in the cavity body is utilized, and the fan is not additionally arranged for exhausting air, so that the energy is saved, and the cost is reduced.

Description

Air supply device capable of generating ion airflow

Technical Field

The invention relates to an air treatment device, belongs to the field of air treatment and the field of air duct design, and particularly relates to an air supply device for generating ion airflow.

Background

For the hazard of air pollution, people pay more and more attention to improving the environment of a relatively closed space, such as a household indoor environment, a supermarket, a factory workshop, a corridor, a tunnel, an elevator room, an interior of a car and the like, and need to purify and supply air to the environment, the air circulation purification system is also called a fresh air system, and is generally a set of independent air processing system consisting of an air supply system and an exhaust system, and the air processing system is divided into a pipeline type fresh air system and a pipeline-free fresh air system, wherein the pipeline type fresh air system consists of a fresh air fan and pipeline accessories, outdoor air is purified by the fresh air fan and is led into a room, and indoor air is exhausted by a pipeline; the ductless fresh air system is composed of a fresh air fan, and the fresh air fan is used for purifying outdoor air and guiding the outdoor air into a room. At present, air purification in the market mainly adopts the mode of blowing outside air in through a fan and supplying air in a gas replacement mode, or introduces outdoor air into a room through filtration and then discharges the indoor air out of the room, but the two modes do not effectively purify the air, cannot solve harmful microorganism pollutants such as bacteria, viruses and the like in the air, and cannot treat organic pollutants and sulfur and nitrogen pollutants; the device also has the advantages that the ion discharge device is used for discharging and purifying ozone and the like, or the cathode is used for generating nano water ions for purifying, but no air supply combination for simultaneously generating ozone and nano water ions is available, the nano water ion discharge needs to provide a device or combine the discharge cathode with a refrigeration semiconductor, water molecules in the air are discharged on the cold cathode to generate the nano water ions, the refrigeration of the semiconductor needs a refrigeration fan for heat dissipation, and in addition, a fan is required to be prepared, so that the device has a complex structure and high production and maintenance cost.

Because the nano water ions have the advantages of biological activity, small particle size, stable performance, weak acidity, sterilization, peculiar smell removal and the like, the nano water ion technology is more and more concerned by people and is gradually applied to products such as air purifiers, hair dryers, air conditioners, deodorants and the like. However, the water source required for producing nano water ions often needs to be added continuously and artificially, which brings inconvenience to the use. The research content of the invention is how to prepare nano water ions and generate air negative ions simultaneously under the condition of not adding water from the outside to form purified ion airflow for air purification.

Disclosure of Invention

The present invention aims at solving the above problems, and provides a method and a device with simple structure, which can provide large air volume air supply, generate ion airflow at the same time, and mix the ion airflow into the air flow to purify the air and improve the air quality.

The invention realizes the purpose through the following technical scheme:

an air supply device for generating ion airflow comprises a cavity body, a fan, a radiating fin, a semiconductor refrigerating sheet, a negative electrode, an insulating piece and a positive electrode, wherein the semiconductor refrigerating sheet comprises a heating surface and a refrigerating surface, the cavity body is a cavity body with at least 2 ends open, a mounting plate is arranged in the cavity body, the semiconductor refrigerating sheet is fixed in the middle of the mounting plate, the mounting plate is transversely fixed on the inner wall of the cavity body, the mounting plate separates the cavity body into an air inlet duct and an air outlet duct, holes allowing airflow to pass are formed around the semiconductor refrigerating sheet on the mounting plate, the heating surface of the semiconductor refrigerating sheet faces the air inlet duct, the refrigerating surface of the semiconductor refrigerating sheet faces the air outlet duct, one end of the negative electrode is fixed on the refrigerating surface of the semiconductor refrigerating sheet, the insulating piece is arranged on the refrigerating surface of the semiconductor refrigerating sheet, and a flow guide gap, the positive pole is fixed on the insulating part, and positive pole, insulating part are cavity form, and the cavity of positive pole, insulating part constitutes the discharge chamber, and the negative pole other end is located cooling discharge chamber central axis on, and the internal fan that is equipped with of cavity.

Preferably, the mounting plate is provided with at least more than 2 fixing columns with external threads, the insulating part is provided with fixing holes, the number of the fixing columns and the number of the fixing holes are the same, the positions of the fixing columns and the fixing holes are corresponding, the insulating part is fixed on the mounting plate through the fixing holes, the fixing columns and nuts, and the gap size of the diversion gap and the depth of the cathode extending into the discharge cavity can be adjusted by adjusting the rotating nuts.

Preferably, the heating surface of the semiconductor refrigeration piece is provided with a cooling fin.

Preferably, the fan is located above the heat sink, or the fan is located in the air inlet duct, or the fan is located in the air outlet duct.

Preferably, the fan is a vortex fan, or the fan is a shaft fan, or the fan is a tower fan, or the fan is a blade fan, or the fan is a booster fan.

A further measure includes the following steps that firstly, the fan is utilized to blow gas to the heating surface of the semiconductor refrigeration piece, so that the heat of the heating surface of the semiconductor refrigeration piece is taken away by the blown gas flow to generate hot gas flow, secondly, the hot gas flow generated in the first step enters the air outlet channel from the hole, one part of the hot gas flow entering the air outlet channel enters the discharge cavity through the diversion gap of the insulating part, the gas flow of the discharge cavity meets the cold cathode to generate condensed water, and simultaneously the anode and the cathode in the discharge cavity discharge to generate discharge action of air molecules in the discharge cavity and condensed water molecules on the surface of the cathode to generate various charged ions such as air ions and nano water ions to form ion gas flow, the ion gas flow is mixed with the other part of the gas flow under the action of the fan to supply air and discharge air outwards, the size of the clearance of the diversion gap and the depth of the cathode extending into the cavity can be adjusted by adjusting the rotating nut, the air flow entering the discharge cavity can be adjusted, and the depth of the cathode extending into the discharge cavity can be adjusted to adjust the ionization effect of discharge so as to achieve the amount required by generating the ion gas flow.

Compared with the prior art, the invention has the following beneficial effects:

1. a part of air flow in the air duct is guided into a discharge cavity with an anode and a cathode, water molecules in the discharge cavity are liquefied and condensed into liquid water when meeting the cold cathode, the anode and the cathode discharge to ionize the water molecules on the surface of the cathode to generate nano water ions, meanwhile, gas molecules are ionized under the discharge action of air in the discharge cavity to generate air ions, the nano water ions and the air ions are mixed to form ion flow, and ion-rich air flow containing energy and purified air is discharged outwards under the driving of a fan.

2. The airflow flowing in the air outlet duct is divided into discharge chambers with positive and negative electrodes for ionization by the diversion gaps arranged on the insulating part in the cavity body.

3. The size of the air flow entering the discharge cavity can be adjusted by adjusting the size of the gap of the diversion gap and the depth of the cathode extending into the discharge cavity, and the ionization effect of the cathode extending into the depth of the discharge cavity can be adjusted to adjust the discharge so as to achieve the appropriate amount required by generating the ion gas flow.

4. The structure is simple, the cavity internal fan is utilized, firstly, the gas fluid takes away the heat generated on the hot end face of the semiconductor refrigerating sheet, then the original power is utilized to shunt the gas fluid, part of gas enters the discharge cavity from the diversion gap to be ionized, and a fan is not needed to be additionally arranged to exhaust. This saves energy, reduces the number of fans and the installation of independent channels, and reduces production costs.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of an air blower for generating an ion airflow according to the present invention;

FIG. 2 is a schematic cross-sectional view of the fixing state of the insulating member (9) and the fixing post (16) of the air blowing device for generating ion airflow according to the present invention;

description of reference numerals: 1. a cavity body; 2. an air inlet duct; 3. an air outlet duct; 4. a fan; 5. a heat sink; 6. mounting a plate; 7. a semiconductor refrigeration sheet; 8. a negative electrode; 9. an insulating member; 10. a positive electrode; 11. a pore; 12. a discharge chamber; 13. a flow guide gap; 14. heating surface; 15. refrigerating noodles; 16. fixing a column; 17. a fixing hole; 18. and a nut.

Detailed Description

The invention is further illustrated by the following examples and figures:

embodiment 1, as shown in fig. 1-2, an air supply device for generating ion airflow comprises a cavity body (1), a fan (4), a heat sink (5), a semiconductor refrigerating sheet (7), a cathode (8), an insulating member (9) and an anode (10), wherein the semiconductor refrigerating sheet (7) comprises a heating surface (14) and a refrigerating surface (15), the cavity body (1) is a cavity body with two open ends, a mounting plate (6) is arranged in the cavity body, the semiconductor refrigerating sheet (7) is fixed in the middle of the mounting plate (6), the mounting plate (6) is transversely fixed on the inner wall of the cavity body (1), the mounting plate (6) divides the cavity in the cavity body (1) into an air inlet duct (2) and an air outlet duct (3), holes (11) allowing airflow to pass through are arranged around the semiconductor refrigerating sheet (7) on the mounting plate (6), the heating surface (14) of the semiconductor refrigerating sheet (7) faces the air inlet duct (2), the refrigerating surface (15) of the semiconductor refrigerating piece (7) faces the air outlet duct (3), one end of the negative electrode (8) is fixed on the refrigerating surface (15) of the semiconductor refrigerating piece (7), the insulating piece (9) is arranged on the refrigerating surface (15) of the semiconductor refrigerating piece (7), at least more than 2 fixing columns (16) with external threads are arranged on the mounting plate (6), at least more than 3 fixing holes (17) are formed in the insulating piece (9), the positions of the fixing columns (16) and the fixing holes (17) are corresponding, the quantity of the fixing columns is the same, the insulating piece (9) passes through the fixing holes (17), the fixing columns (16) and the nuts (18) are fixed on the mounting plate (6), a flow guide gap (13) is formed between the insulating piece (9) and the mounting plate (6), the positive electrode (10) is fixed on the insulating piece (9), the positive electrode (10) and the insulating piece (9) are hollow, the positive electrode (, The hollow cavity of the insulating part (9) forms a discharge cavity (12), the other end of the negative electrode (8) is positioned on the same central axis of the cooling discharge cavity (12), the gap size of the diversion gap (13) and the depth of the negative electrode (8) extending into the discharge cavity (12) can be adjusted by adjusting the rotating nut (18), the fan (4) is arranged in the cavity body (1), the positive electrode (10) is connected with the positive electrode of an external power supply, the negative electrode (8) is connected with the negative electrode of an external current, the semiconductor refrigeration sheet (7) and the fan (4) are respectively connected with the external power supply, when the air-cooling device works, the fan (4) is utilized to blow air to the heating surface (14) of the semiconductor refrigeration sheet (7) so that the heat of the heating surface (14) of the semiconductor refrigeration sheet (7) is taken away by the blown air flow to generate hot air flow, the hot air flow enters the air outlet air channel (3) from the pore (11), and a part of the air outlet air channel (3) enters the discharge cavity (12 The air flow of the discharge cavity (12) generates condensed water when meeting the cold cathode (8), meanwhile, the anode (10) and the cathode (8) in the discharge cavity (12) discharge, so that air molecules in the discharge cavity (12) and condensed water molecules on the surface of the cathode (8) generate a discharge effect, various charged ions such as air ions and nano water ions are generated, ion air flow is formed, the ion air flow is mixed with the other part of air flow under the effect of the fan (4), air is supplied outwards for discharge, the gap size of the diversion gap (13) and the depth of the cathode (8) extending into the discharge cavity (12) can be adjusted by adjusting the rotating nut (18), the air flow size of the air flowing into the discharge cavity (12) can be adjusted, the ionization effect of discharge can be adjusted by adjusting the depth of the cathode (8) extending into the discharge cavity (12), and the appropriate amount of the generated ion gas flow can be achieved.

Embodiment 2 in this embodiment, based on the above embodiment, further limitation is that a fan (4), a mounting plate (6), a semiconductor chilling plate (7), a negative electrode (8), an insulating member (9), and a positive electrode (10) are sequentially disposed in the cavity (1) from bottom to top along the airflow direction, and other parts of this embodiment are the same as those of the above embodiment and are not described again.

Embodiment 3 in this embodiment, based on embodiment 1, it is further defined that a heat sink (5), a mounting plate (6), a semiconductor cooling plate (7), a negative electrode (8), an insulating member (9), a positive electrode (10), and a fan (4) are sequentially disposed in the cavity (1) from bottom to top along the airflow direction, and the fan (4) is located in the air outlet duct, and other portions of this embodiment 1 are the same as those of embodiment 1, and are not described again.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims

1. The utility model provides a produce air supply arrangement of ionic air current, includes cavity body (1), fan (4), fin (5), semiconductor refrigeration piece (7), negative pole (8), insulating part (9), anodal (10), semiconductor refrigeration piece (7) are including heating face (14), refrigeration face (15), its characterized in that: the cavity body (1) is a cavity body with at least 2 ends opened, a mounting plate (6) is arranged in the cavity body, a semiconductor refrigerating sheet (7) is fixed in the middle of the mounting plate (6), the mounting plate (6) is transversely fixed on the inner wall of the cavity body (1), the mounting plate (6) separates the cavity in the cavity body (1) into an air inlet duct (2) and an air outlet duct (3), holes (11) allowing air flow to pass through are formed in the periphery of the semiconductor refrigerating sheet (7) on the mounting plate (6), a heating surface (14) of the semiconductor refrigerating sheet (7) faces the air inlet duct (2), a refrigerating surface (15) of the semiconductor refrigerating sheet (7) faces the air outlet duct (3), one end of a negative electrode (8) is fixed on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), an insulating piece (9) is arranged on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), and a flow guide gap (13) is arranged, the positive electrode (10) is fixed on the insulating part (9), the positive electrode (10) and the insulating part (9) are hollow, the hollow cavities of the positive electrode (10) and the insulating part (9) form a discharge cavity (12), the other end of the negative electrode (8) is positioned on a central coaxial line of the discharge cavity (12), and a fan (4) is arranged in the cavity body (1).

2. An air supply device for generating an ionic air flow according to claim 1, characterized in that: the fixed column (16) of taking the external screw thread that mounting panel (6) was equipped with is more than 2 at least, is equipped with fixed orifices (17) on insulating part (9), and fixed column (16), fixed orifices (17) quantity are the same, and the position is corresponding, and insulating part (9) are fixed at mounting panel (6) through fixed orifices (17), fixed column (16), nut (18), can adjust the degree of depth that the clearance size and negative pole (8) of water conservancy diversion clearance (13) stretched into discharge chamber (12) through adjusting swivel nut (18).

3. An air supply device for generating an ionic air flow according to claim 2, characterized in that: and the heating surface (14) of the semiconductor refrigerating sheet (7) is provided with a radiating fin (5).

4. An air supply device for generating an ionic air flow according to any one of claims 1 to 3, characterized in that: the fan (4) is positioned above the radiating fins (5), or the fan (4) is positioned in the air inlet duct (2), or the fan (4) is positioned in the air outlet duct (3).

5. An air supply device for generating an ionic air flow according to claim 4, characterized in that: the fan (4) is a vortex fan, or the fan (4) is a shaft fan, or the fan (4) is a tower fan, or the fan (4) is a blade fan, or the fan (4) is a booster fan.