CN110542170A - Air supply device and method for generating ion airflow - Google Patents
Air supply device and method for generating ion airflow Download PDFInfo
- Publication number
- CN110542170A CN110542170A CN201910932851.2A CN201910932851A CN110542170A CN 110542170 A CN110542170 A CN 110542170A CN 201910932851 A CN201910932851 A CN 201910932851A CN 110542170 A CN110542170 A CN 110542170A
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- Prior art keywords
- air
- fan
- cavity
- discharge
- insulating part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 150000002500 ions Chemical class 0.000 claims abstract description 47
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000746 purification Methods 0.000 abstract description 2
- -1 ozone ions Chemical class 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 238000004887 air purification Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RECVMTHOQWMYFX-UHFFFAOYSA-N oxygen(1+) dihydride Chemical compound [OH2+] RECVMTHOQWMYFX-UHFFFAOYSA-N 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 230000004071 biological effect Effects 0.000 description 1
- 239000002781 deodorant agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/007—Ventilation with forced flow
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
Abstract
The invention discloses an air supply device and method capable of generating ion airflow, which comprises a cavity body, a fan, a radiating fin, a semiconductor refrigerating fin, a negative electrode, an insulating part and a positive electrode, and is characterized in that: the cavity is internal to be equipped with the mounting panel, and the mounting panel separates into the air duct that admits air, gives vent to anger the air duct to the cavity body, is equipped with the hole on the mounting panel, and the negative pole is fixed on the refrigerating surface of semiconductor refrigeration piece, and the insulating part is equipped with the water conservancy diversion clearance of adjustable clearance size, and the positive pole is fixed on the insulating part, and positive pole, insulating part are cavity form, and the cavity of positive pole, insulating part constitutes the discharge chamber, and the negative pole other end is located the cooling and discharges on the coaxial line in chamber. The invention has the beneficial effects that: guiding a part of air flow in the air duct to enter a discharge cavity, liquefying water molecules in the discharge cavity when meeting cold negative poles, and generating ozone ions, nano water ions, air positive and negative ions and plasma by utilizing the discharge effect to form ion air flow purification air supply; the fan in the cavity body is utilized, and the fan is not additionally arranged for exhausting air, so that the energy is saved, and the cost is reduced.
Description
Technical Field
The invention relates to an air treatment method and device, belongs to the field of air treatment and the field of air duct design, and particularly relates to an air supply device and method for generating ion airflow.
background
For the hazard of air pollution, people pay more and more attention to improving the environment of a relatively closed space, such as a household indoor environment, a supermarket, a factory workshop, a corridor, a tunnel, an elevator room, an interior of a car and the like, and need to purify and supply air to the environment, the air circulation purification system is also called a fresh air system, and generally comprises an air supply system and an air exhaust system, and is divided into a pipeline type fresh air system and a pipeline-free fresh air system, wherein the pipeline type fresh air system comprises a fresh air fan and pipeline accessories, outdoor air is purified by the fresh air fan and is led into a room, and indoor air is exhausted by a pipeline; the ductless fresh air system is composed of a fresh air fan, and the fresh air fan is used for purifying outdoor air and guiding the outdoor air into a room. At present, air purification in the market mainly adopts the mode of blowing outside air in through a fan and supplying air in a gas replacement mode, or introduces outdoor air into a room through filtration and then discharges the indoor air out of the room, but the two modes do not effectively purify the air, cannot solve harmful microorganism pollutants such as bacteria, viruses and the like in the air, and cannot treat organic pollutants and sulfur and nitrogen pollutants; the device also has the advantages that the ion discharge device is used for discharging and purifying ozone and the like, or the cathode is used for generating nano water ions for purifying, but no air supply combination for simultaneously generating ozone and nano water ions is available, the nano water ion discharge needs to provide a device or combine the discharge cathode with a refrigeration semiconductor, water molecules in the air are discharged on the cold cathode to generate the nano water ions, the refrigeration of the semiconductor needs a refrigeration fan for heat dissipation, and in addition, a fan is required to be prepared, so that the device has a complex structure and high production and maintenance cost.
Because the nano water ions have the advantages of biological activity, small particle size, stable performance, weak acidity, sterilization, peculiar smell removal and the like, the nano water ion technology is more and more concerned by people and is gradually applied to products such as air purifiers, hair dryers, air conditioners, deodorants and the like. However, the water source required for producing nano water ions often needs to be added continuously and artificially, which brings inconvenience to the use. The research content of the invention is how to prepare nano water ions and generate air negative ions simultaneously under the condition of not adding water from the outside to form purified ion airflow for air purification.
disclosure of Invention
the present invention aims at solving the above problems, and provides a method and a device with simple structure, which can provide large air volume air supply, generate ion airflow at the same time, and mix the ion airflow into the air flow to purify the air and improve the air quality.
The invention realizes the purpose through the following technical scheme:
an air supply device for generating ion airflow comprises a cavity body, a fan, a radiating fin, a semiconductor refrigerating sheet, a negative electrode, an insulating piece and a positive electrode, wherein the semiconductor refrigerating sheet comprises a heating surface and a refrigerating surface, the cavity body is a cavity body with at least 2 ends open, a mounting plate is arranged in the cavity body, the semiconductor refrigerating sheet is fixed in the middle of the mounting plate, the mounting plate is transversely fixed on the inner wall of the cavity body, the mounting plate separates the cavity body into an air inlet duct and an air outlet duct, holes allowing airflow to pass are formed around the semiconductor refrigerating sheet on the mounting plate, the heating surface of the semiconductor refrigerating sheet faces the air inlet duct, the refrigerating surface of the semiconductor refrigerating sheet faces the air outlet duct, one end of the negative electrode is fixed on the refrigerating surface of the semiconductor refrigerating sheet, the insulating piece is arranged on the refrigerating surface of the semiconductor refrigerating sheet, and a flow guide gap, the positive pole is fixed on the insulating part, and positive pole, insulating part are cavity form, and the cavity of positive pole, insulating part constitutes the discharge chamber, and the negative pole other end is located cooling discharge chamber central axis on, and the internal fan that is equipped with of cavity.
Preferably, the mounting plate is provided with at least more than 2 fixing columns with external threads, the insulating part is provided with fixing holes, the number of the fixing columns and the number of the fixing holes are the same, the positions of the fixing columns and the fixing holes are corresponding, the insulating part is fixed on the mounting plate through the fixing holes, the fixing columns and nuts, the gap size of the diversion gap and the depth of the cathode extending into the discharge cavity can be adjusted by adjusting the rotating nuts,
Preferably, the heating surface of the semiconductor refrigeration piece is provided with a cooling fin.
Preferably, the fan can be located above the heat sink, and can also be located at any position in the air inlet duct or the air outlet duct.
Preferably, the fan may be a vortex fan, a shaft fan, a tower fan, a vane fan, a booster fan.
A further measure includes the following steps that firstly, the fan is utilized to blow gas to the heating surface of the semiconductor refrigeration piece, so that the heat of the heating surface of the semiconductor refrigeration piece is taken away by the blown gas flow to generate hot gas flow, secondly, the hot gas flow generated in the first step enters the air outlet channel from the hole, one part of the hot gas flow entering the air outlet channel enters the discharge cavity through the diversion gap of the insulating part, the gas flow of the discharge cavity meets the cold cathode to generate condensed water, and simultaneously the anode and the cathode in the discharge cavity discharge to generate discharge action of air molecules in the discharge cavity and condensed water molecules on the surface of the cathode to generate various charged ions such as air ions and nano water ions to form ion gas flow, the ion gas flow is mixed with the other part of the gas flow under the action of the fan to supply air and discharge air outwards, the size of the clearance of the diversion gap and the depth of the cathode extending into the cavity can be adjusted by adjusting the rotating nut, the air flow entering the discharge cavity can be adjusted, and the depth of the cathode extending into the discharge cavity can be adjusted to adjust the ionization effect of discharge so as to achieve the amount required by generating the ion gas flow.
Compared with the prior art, the invention has the following beneficial effects:
1. A part of air flow in the air duct is guided into a discharge cavity with an anode and a cathode, water molecules in the discharge cavity are liquefied and condensed into liquid water when meeting the cold cathode, the anode and the cathode discharge to ionize the water molecules on the surface of the cathode to generate nano water ions, meanwhile, gas molecules are ionized under the discharge action of air in the discharge cavity to generate air ions, the nano water ions and the air ions are mixed to form ion flow, and ion-rich air flow containing energy and purified air is discharged outwards under the driving of a fan.
2. The airflow flowing in the air outlet duct is divided into discharge chambers with positive and negative electrodes for ionization by the diversion gaps arranged on the insulating part in the cavity body.
3. The size of the air flow entering the discharge cavity can be adjusted by adjusting the size of the gap of the diversion gap and the depth of the cathode extending into the discharge cavity, and the ionization effect of the cathode extending into the depth of the discharge cavity can be adjusted to adjust the discharge so as to achieve the appropriate amount required by generating the ion gas flow.
4. the structure is simple, the cavity internal fan is utilized, firstly, the gas fluid takes away the heat generated on the hot end face of the semiconductor refrigerating sheet, then the original power is utilized to shunt the gas fluid, part of gas enters the discharge cavity from the diversion gap to be ionized, and a fan is not needed to be additionally arranged to exhaust. This saves energy, reduces the number of fans and the installation of independent channels, and reduces production costs.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an air blower for generating an ion airflow according to the present invention;
FIG. 2 is a schematic cross-sectional view of the fixing state of the insulating member (9) and the fixing post (16) of the air blowing device for generating ion airflow according to the present invention;
Description of reference numerals: 1. a cavity body; 2. an air inlet duct; 3. an air outlet duct; 4. a fan; 5. a heat sink; 6. mounting a plate; 7. a semiconductor refrigeration sheet; 8. a negative electrode; 9. an insulating member; 10. a positive electrode; 11. a pore; 12. a discharge chamber; 13. a flow guide gap; 14. heating surface; 15. a refrigerating surface; 16. fixing a column; 17. a fixing hole; 18. and a nut.
Detailed Description
The invention is further illustrated by the following examples and figures:
Embodiment 1, as shown in fig. 1-2, an air supply device for generating ion airflow comprises a cavity body (1), a fan (4), a heat sink (5), a semiconductor refrigerating sheet (7), a cathode (8), an insulating member (9), and an anode (10), wherein the semiconductor refrigerating sheet (7) comprises a heating surface (14) and a refrigerating surface (15), the cavity body (1) is a cavity body with two open ends, a mounting plate (6) is arranged in the cavity body, the semiconductor refrigerating sheet (7) is fixed in the middle of the mounting plate (6), the mounting plate (6) is transversely fixed on the inner wall of the cavity body (1), the mounting plate (6) divides the cavity in the cavity body (1) into an air inlet duct (2) and an air outlet duct (3), a hole (11) for allowing airflow to pass through is arranged around the semiconductor refrigerating sheet (7) on the mounting plate (6), the heating surface (14) of the semiconductor refrigerating sheet (7) faces the air inlet duct (2), the refrigerating surface (15) of the semiconductor refrigerating sheet (7) faces the air outlet duct (3), one end of the negative electrode (8) is fixed on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), the insulating piece (9) is arranged on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), at least more than 2 fixing columns (16) with external threads are arranged on the mounting plate (6), at least more than 2 fixing holes (17) are formed in the insulating piece (9), the positions of the fixing columns (16) and the fixing holes (17) are corresponding, the number of the fixing columns is the same, the insulating piece (9) passes through the fixing holes (17), the fixing columns (16) and the nuts (18) are fixed on the mounting plate (6), a flow guide gap (13) is formed between the insulating piece (9) and the mounting plate (6), the positive electrode (10) is fixed on the insulating piece (9), the positive electrode (10) and the insulating piece (9) are hollow, the positive electrode, The hollow cavity of the insulating part (9) forms a discharge cavity (12), the other end of the negative electrode (8) is positioned on the same central axis of the cooling discharge cavity (12), the gap size of the diversion gap (13) and the depth of the negative electrode (8) extending into the discharge cavity (12) can be adjusted by adjusting the rotating nut (18), the fan (4) is arranged in the cavity body (1), the positive electrode (10) is connected with the positive electrode of an external power supply, the negative electrode (8) is connected with the negative electrode of an external current, the semiconductor refrigeration sheet (7) and the fan (4) are respectively connected with the external power supply, when the air-cooling device works, the fan (4) is utilized to blow air to the heating surface (14) of the semiconductor refrigeration sheet (7) so that the heat of the heating surface (14) of the semiconductor refrigeration sheet (7) is taken away by the blown air flow to generate hot air flow, the hot air flow enters the air outlet air channel (3) from the pore (11), and a part of the air outlet air channel (3) enters the discharge cavity (12 The air flow of the discharge cavity (12) generates condensed water when meeting the cold cathode (8), meanwhile, the anode (10) and the cathode (8) in the discharge cavity (12) discharge, so that air molecules in the discharge cavity (12) and condensed water molecules on the surface of the cathode (8) generate a discharge effect, various charged ions such as air ions and nano water ions are generated, ion air flow is formed, the ion air flow is mixed with the other part of air flow under the effect of the fan (4), air is supplied outwards for discharge, the gap size of the diversion gap (13) and the depth of the cathode (8) extending into the discharge cavity (12) can be adjusted by adjusting the rotating nut (18), the air flow size of the air flowing into the discharge cavity (12) can be adjusted, the ionization effect of discharge can be adjusted by adjusting the depth of the cathode (8) extending into the discharge cavity (12), and the appropriate amount of the generated ion gas flow can be achieved.
Embodiment 2 in this embodiment, based on the above embodiment, further limitation is that a fan (4), a mounting plate (6), a semiconductor chilling plate (7), a negative electrode (8), an insulating member (9), and a positive electrode (10) are sequentially disposed in the cavity (1) from bottom to top along the airflow direction, and other parts of this embodiment are the same as those of the above embodiment and are not described again.
Embodiment 3 in this embodiment, based on embodiment 1, it is further defined that a heat sink (5), a mounting plate (6), a semiconductor cooling plate (7), a negative electrode (8), an insulating member (9), a positive electrode (10), and a fan (4) are sequentially disposed in the cavity (1) from bottom to top along the airflow direction, and the fan (4) is located in the air outlet duct, and other portions of this embodiment 1 are the same as those of embodiment 1, and are not described again.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (6)
1. The utility model provides an air supply arrangement who produces ionic air current, includes the cavity body (1), fan (4), fin (5), semiconductor refrigeration piece (7), negative pole (8), insulating part (9), anodal (10), semiconductor refrigeration piece (7) are including heating surface (14), refrigeration surface (15), its characterized in that: the cavity body (1) is a cavity body with at least 2 openings, a mounting plate (6) is arranged in the cavity body, a semiconductor refrigerating sheet (7) is fixed in the middle of the mounting plate (6), the mounting plate (6) is transversely fixed on the inner wall of the cavity body (1), the mounting plate (6) separates the cavity in the cavity body (1) into an air inlet duct (2) and an air outlet duct (3), holes (11) allowing air flow to pass through are formed in the periphery of the semiconductor refrigerating sheet (7) on the mounting plate (6), a heating surface (14) of the semiconductor refrigerating sheet (7) faces the air inlet duct (2), a refrigerating surface (15) of the semiconductor refrigerating sheet (7) faces the air outlet duct (3), one end of a negative electrode (8) is fixed on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), an insulating piece (9) is arranged on the refrigerating surface (15) of the semiconductor refrigerating sheet (7), and a flow guide gap (13) is arranged on, the positive electrode (10) is fixed on the insulating part (9), the positive electrode (10) and the insulating part (9) are hollow, the hollow cavities of the positive electrode (10) and the insulating part (9) form a discharge cavity (12), the other end of the negative electrode (8) is positioned on a central coaxial line of the discharge cavity (12), and a fan (4) is arranged in the cavity body (1).
2. An air supply device for generating an ionic air flow according to claim 1, characterized in that: be equipped with fixed column (16) of outband screw thread more than 2 at least on mounting panel (6), be equipped with fixed orifices (17) on insulating part (9), fixed column (16), the quantity of fixed orifices (17) is the same, and the position is corresponding, and insulating part (9) are fixed at mounting panel (6) through fixed orifices (17), fixed column (16), nut (18), can adjust the degree of depth that the clearance size and negative pole (8) of water conservancy diversion clearance (13) stretched into discharge chamber (12) through adjusting swivel nut (18).
3. An air supply device for generating an ionic air flow according to claim 2, characterized in that: and the heating surface (14) of the semiconductor refrigerating sheet (7) is provided with a radiating fin (5).
4. An air supply device for generating an ionic air flow according to any one of claims 1 to 3, characterized in that: the fan (4) can be positioned on the radiating fins (5) and can also be positioned at any position in the air inlet duct (2) or the air outlet duct (3).
5. an air supply device for generating an ionic air flow according to claim 4, characterized in that: the fan (4) can be a vortex fan, a shaft fan, a tower fan, a blade fan or a booster fan.
6. An air supply method of an air supply device for generating an ion airflow according to claim 1, characterized in that: the method comprises the following steps that firstly, a fan (4) is utilized to blow gas to a heating surface (14) of a semiconductor refrigerating sheet (7), heat of the heating surface (14) of the semiconductor refrigerating sheet (7) is taken away by the blown gas flow to generate hot gas flow, secondly, the hot gas flow generated in the first step enters an air outlet channel (3) through a pore (11), part of the hot gas flow entering the air outlet channel (3) enters a discharge cavity (12) through a flow guide gap (13) of an insulating part (9), the gas flow of the discharge cavity (12) meets a cold cathode (8) to generate condensed water, meanwhile, an anode (10) and a cathode (8) in the discharge cavity (12) discharge to enable air molecules in the discharge cavity (12) and condensed water molecules on the surface of the cathode (8) to generate discharge action, and generate various charged ions such as air ions and nano water ions to form ion gas flow, the ion air current mixes with another part of air current under the effect of fan (4), and outside air supply is discharged, can adjust the clearance size of water conservancy diversion clearance (13) and the degree of depth that negative pole (8) stretched into discharge chamber (12) through adjusting swivel nut (18), can adjust the air flow size that gets into discharge chamber (12), can adjust the degree of depth that negative pole (8) stretched into discharge chamber (12) and adjust the ionization effect of discharging to reach the volume that produces the ion gas flow and need.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910932851.2A CN110542170A (en) | 2019-09-29 | 2019-09-29 | Air supply device and method for generating ion airflow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910932851.2A CN110542170A (en) | 2019-09-29 | 2019-09-29 | Air supply device and method for generating ion airflow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110542170A true CN110542170A (en) | 2019-12-06 |
Family
ID=68715038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910932851.2A Pending CN110542170A (en) | 2019-09-29 | 2019-09-29 | Air supply device and method for generating ion airflow |
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| Country | Link |
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| CN (1) | CN110542170A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111547818A (en) * | 2020-06-08 | 2020-08-18 | 平流层复合水离子(深圳)有限公司 | Water quality tip charge transfer device and method |
| CN111585175A (en) * | 2020-06-08 | 2020-08-25 | 平流层复合水离子(深圳)有限公司 | Device and method for generating forced dew-accumulating nano water ions |
| CN112361461A (en) * | 2020-10-14 | 2021-02-12 | 珠海格力电器股份有限公司 | Air conditioning indoor unit with air purification function and air conditioner |
| CN113418325A (en) * | 2021-07-08 | 2021-09-21 | 平流层复合水离子(深圳)有限公司 | High-pressure ionized water molecule self-cleaning evaporator |
| CN113660761A (en) * | 2021-07-16 | 2021-11-16 | 平流层复合水离子(深圳)有限公司 | Assembly for generating nano water ions and method thereof |
-
2019
- 2019-09-29 CN CN201910932851.2A patent/CN110542170A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111547818A (en) * | 2020-06-08 | 2020-08-18 | 平流层复合水离子(深圳)有限公司 | Water quality tip charge transfer device and method |
| CN111585175A (en) * | 2020-06-08 | 2020-08-25 | 平流层复合水离子(深圳)有限公司 | Device and method for generating forced dew-accumulating nano water ions |
| CN112361461A (en) * | 2020-10-14 | 2021-02-12 | 珠海格力电器股份有限公司 | Air conditioning indoor unit with air purification function and air conditioner |
| CN113418325A (en) * | 2021-07-08 | 2021-09-21 | 平流层复合水离子(深圳)有限公司 | High-pressure ionized water molecule self-cleaning evaporator |
| CN113660761A (en) * | 2021-07-16 | 2021-11-16 | 平流层复合水离子(深圳)有限公司 | Assembly for generating nano water ions and method thereof |
| CN113660761B (en) * | 2021-07-16 | 2024-05-07 | 平流层复合水离子(深圳)有限公司 | Assembly for generating nano water ions and method thereof |
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Effective date of registration: 20210624 Address after: 518052 NO.201, Tongfu Road, Pingdong community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Applicant after: Stratospheric composite water ions (Shenzhen) Co., Ltd Address before: No.28, group 2, Gaodong village, Xiangshi Town, Longchang County, Neijiang City, Sichuan Province Applicant before: Qiu Qingbin Applicant before: Chen Qianzhi |
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