CN211243009U

CN211243009U - Food preparation machine with long service life

Info

Publication number: CN211243009U
Application number: CN201921070823.6U
Authority: CN
Inventors: 王旭宁; 刘同亮
Original assignee: Joyoung Co Ltd
Current assignee: Joyoung Co Ltd
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2020-08-14
Anticipated expiration: 2029-07-09

Abstract

The utility model discloses a long service life's food preparation machine belongs to food preparation machine technical field, including built-in motor's frame and locate the stirring cup on the frame, the stirring cup includes the cup, the bowl cover, blade disc and crushing sword, the bottom of cup is located to the blade disc, crushing sword passes through the bearing assembly rotatable locate on the blade disc and by motor drive, the below of blade disc is equipped with the heat abstractor that is located the bearing assembly outside, heat abstractor is including contacting in the semiconductor refrigeration piece of bearing assembly, the semiconductor refrigeration piece is including locating inboard cold junction and locating the hot junction in the outside dorsad bearing assembly towards the bearing assembly. When the semiconductor refrigerating piece is powered on, the refrigerating temperature of the cold end is reduced, the heat of the bearing assembly is transferred to the semiconductor refrigerating piece through heat exchange, the bearing assembly effectively dissipates heat, the temperature of the bearing assembly when the motor drives the crushing knife to rotate is greatly reduced, the performance of the bearing assembly is guaranteed, the service life of the bearing assembly is prolonged, and therefore the service life of the whole machine is prolonged.

Description

Food preparation machine with long service life

Technical Field

The utility model relates to a food preparation machine technical field especially relates to a long service life's food preparation machine.

Background

At present, food cooking by using a food processing machine becomes a popular life style, and on one hand, the food cooking machine can meet the requirement of nutrient intake and on the other hand, the food cooking machine can also meet the requirement of people advocating individual taste at present. The existing food processor generally comprises a main machine and a stirring cup, wherein the stirring cup generally comprises a cup body, a cup cover, a crushing cutter, a cutter disc and other components, and the crushing cutter is rotatably arranged on the cutter disc through a bearing assembly. Because the bearing assembly made of hardware is generally directly pressed in the mounting hole on the cutter head through interference fit, when the motor drives the crushing cutter to rotate at high speed, the temperature of the bearing assembly is high, the service life of the bearing assembly can be seriously influenced, and the reliability of a machine body is reduced. Particularly, when processing dry food materials such as dry grinding of soybeans and rice, a large amount of heat is generated by the crushed food materials themselves, and particularly, heat is focused at the bearing assembly. Meanwhile, the performance of the inner sealing ring is reduced due to the high temperature of the bearing assembly, and the sealing ring can be loosened due to the high temperature after being used for a period of time, so that the potential water leakage hazard exists, and the normal use of the machine body can be influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects and deficiencies existing in the prior art, the utility model provides a food processor which can effectively reduce the temperature of a bearing assembly and effectively prolong the service life.

In order to realize above-mentioned technical purpose, the utility model provides a pair of long service life's food preparation machine, including built-in motor's frame and locate the stirring cup on the frame, the stirring cup includes cup, bowl cover, blade disc and crushing sword, and the bottom of cup is located to the blade disc, smashes the sword and passes through the rotatable locating blade disc of bearing assembly and by motor drive, the below of blade disc is equipped with the heat abstractor that is located the bearing assembly outside, and heat abstractor includes the semiconductor refrigeration piece that contacts in bearing assembly, and the semiconductor refrigeration piece is including locating inboard cold junction and the hot junction in the outside is located to bearing assembly dorsad towards the bearing assembly.

Preferably, the semiconductor chilling element comprises a plurality of semiconductor chilling plates connected together in series and arranged circumferentially around the bearing assembly.

Preferably, the heat dissipation device further comprises a heat dissipation sheet, and the heat dissipation sheet is arranged to be tightly attached to the outer wall of the hot end of the semiconductor refrigerating element.

Preferably, a plurality of radiating fins arranged at intervals are arranged on the side wall of the radiating fin, which faces away from the semiconductor refrigerating piece.

Preferably, the width of the gap between the adjacent radiating fins is W, and W is more than or equal to 1.5mm and less than or equal to 4 mm.

Preferably, the smoothness Ra of the side wall of the radiating fin facing the semiconductor refrigerating element and/or the side wall of the semiconductor refrigerating element facing the radiating fin is less than 0.3 μm.

Preferably, the bearing assembly comprises a bearing and a bearing sleeve for supporting the bearing, the heat sink further comprises a fixed seat sleeved outside the bearing sleeve, and the semiconductor refrigeration piece is arranged on the fixed seat.

Preferably, the fixing seat is sleeved outside the bearing sleeve in an interference fit manner, and/or a fastening agent is arranged between the fixing seat and the bearing sleeve.

Preferably, the bearing sleeve comprises a rigid inner ring and a rigid outer ring which are arranged inside and outside, and an elastic layer is arranged between the rigid inner ring and the rigid outer ring.

Preferably, the cutter head is provided with a boss protruding upwards, the top wall of the boss is provided with a through hole for the crushing cutter to pass through, the boss is provided with an accommodating cavity with an opening at the bottom, the bearing assembly is arranged in the accommodating cavity, the lower end of the bearing assembly extends out of the accommodating cavity, and the semiconductor refrigerating piece is in contact with the lower end of the bearing assembly; or the cutter head is provided with a mounting hole, the bearing assembly is inserted into the mounting hole from top to bottom and is fixed on the cutter head through a fixing nut, the lower end of the bearing assembly protrudes out of the fixing nut downwards, and the semiconductor refrigerating piece is in contact with the lower end of the bearing assembly.

After the technical scheme is adopted, the utility model has the advantages of as follows:

1. the utility model provides a food preparation machine improves the concrete structure of stirring cup, has added in the outside of bearing assembly and has established heat abstractor, and heat abstractor's semiconductor refrigeration spare contacts in bearing assembly. When the semiconductor refrigeration piece circular telegram, the cold junction refrigerates under the Peltier effect, the temperature reduces, the heat of bearing subassembly can transmit for the semiconductor refrigeration piece through the heat exchange, utilize the heat exchange between semiconductor refrigeration piece and the bearing subassembly to make the bearing subassembly effectively dispel the heat, greatly reduced bearing subassembly is at the temperature of motor drive when smashing the sword and rotating, be favorable to guaranteeing the performance of bearing subassembly and prolong the life of bearing subassembly, thereby be favorable to prolonging the life of complete machine. Adopt semiconductor refrigeration piece to carry out radiating mode fine the little space installation requirement on satisfying the stirring cup, effectively avoid adopting noise problem and the limited problem of structure etc. that traditional fan cooling method brought. The semiconductor refrigeration piece can meet the temperature regulation requirement of customization, can adjust according to the condition of generating heat of bearing subassembly to better satisfy the heat dissipation requirement. In addition, the adverse effect of high temperature on the sealing ring in the bearing assembly can be effectively reduced through heat dissipation, the abrasion of the sealing ring is greatly reduced, the performance and the sealing performance of the sealing ring are favorably ensured, and the performance stability of the whole machine is favorably improved.

2. A plurality of semiconductor refrigeration pieces that establish ties together arrange around the circumference of bearing assembly, rationally sets up the concrete arrangement mode of semiconductor refrigeration piece, and area of contact between reasonable increase semiconductor refrigeration piece and the bearing assembly to be favorable to improving the bearing assembly and utilize the semiconductor refrigeration piece to carry out radiating effect.

3. Set up the fin on the outer wall of semiconductor refrigeration spare hot junction, it is further, the fin sets up the radiating fin that a plurality of intervals set up on the lateral wall of fin dorsad semiconductor refrigeration spare, rationally improves radiating rate through increase heat radiating area's mode, is favorable to improving bearing assembly's radiating effect.

4. The gap width between two adjacent radiating fins is reasonably set, so that the radiating requirement is better met. If W is less than 1.5mm, the gap between two adjacent radiating fins is small, which is not beneficial to effective heat radiation. If W is larger than 4mm, the gap between two adjacent radiating fins is larger, which is not beneficial to increase the number of the radiating fins reasonably.

5. The smooth finish Ra of the contact surface between the radiating fin and the semiconductor refrigerating piece is smaller than 0.3 mu m, the radiating fin and the semiconductor refrigerating piece are attached more tightly in a reasonable smooth finish reducing mode, the effective contact area between the radiating fin and the semiconductor refrigerating piece is favorably improved, and therefore the radiating effect is favorably improved.

6. The fixing seat of the heat dissipation device is sleeved outside the bearing sleeve, and the semiconductor refrigeration piece is arranged on the fixing seat, so that the specific installation structure of the semiconductor refrigeration piece is reasonably arranged, and the semiconductor refrigeration piece is convenient to install while the use requirement is met.

7. The fixing base can be sleeved outside the bearing sleeve through interference fit, a fastening agent can be additionally arranged between the fixing base and the bearing sleeve, a specific matching structure between the fixing base and the bearing sleeve is reasonably arranged, and the fixing base can be effectively fixedly sleeved outside the bearing sleeve.

8. The elastic layer is additionally arranged between the rigid inner ring and the rigid outer ring of the bearing sleeve, the specific structure of the bearing sleeve is reasonably arranged, and when the bearing sleeve meets the use requirement, the vibration generated by the bearing sleeve when the crushing cutter rotates is effectively absorbed and buffered through the additionally arranged elastic layer, so that the transmission of the vibration between the bearing assembly and the cutter head is favorably reduced, and the abrasion and the noise volume of the bearing assembly are favorably reduced.

9. The bearing assembly can be directly installed in the containing cavity of the boss through interference fit, and also can be fixed at the mounting hole on the cutter head through matching with the fixing nut, the lower end of the bearing assembly extends out of the containing cavity or protrudes out of the fixing nut, and the semiconductor refrigerating piece is in contact with the lower end of the bearing assembly. The concrete mounting structure of the bearing assembly is reasonably arranged, so that the semiconductor refrigerating piece can be fully and effectively contacted with the bearing assembly, and the effectiveness of heat dissipation of the bearing assembly through the semiconductor refrigerating piece is guaranteed.

Drawings

FIG. 1 is a schematic view of a food processor according to an embodiment of the present invention;

FIG. 2 is a schematic view of a partial structure of a food processor according to an embodiment of the present invention;

FIG. 3 is an exploded view of the components of FIG. 2;

FIG. 4 is a schematic view of a bearing assembly and heat sink assembly of a food processor according to an embodiment of the present invention;

FIG. 5 is an exploded view of a portion of a food processor according to an embodiment of the present invention;

FIG. 6 is a schematic view of a heat dissipation device of a food processor according to an embodiment of the present invention;

FIG. 7 is an exploded view of a portion of a food processor according to a second embodiment of the present invention;

fig. 8 is a schematic view of a comminuting blade and bearing assembly of a three-food processor in accordance with an embodiment of the present invention.

In the figure, 100-machine base, 200-stirring cup, 210-cup body, 220-cup cover, 230-crushing cutter, 231-cutter shaft, 232-cutter blade, 240-cutter head, 241-boss, 242-through hole, 243-containing cavity, 244-mounting hole, 250-cup base, 300-motor, 400-bearing assembly, 410-bearing, 420-bearing sleeve, 421-rigid inner ring, 422-rigid outer ring, 423-elastic layer, 424-lower turning edge, 425-upper turning edge, 426-shaft hole, 427-annular clamping groove, 430-sealing ring, 440-fixing nut, 450-gasket, 460-clamping spring, 500-heat dissipation device, 510-semiconductor refrigeration component, 510 a-cold end, 510 b-hot end, 511-semiconductor refrigeration piece, 520-a fixed seat, 521-a mounting port, 522-a fixed hole, 530-a heat radiating fin, 531-a connecting hole, 532-a heat radiating fin and 600-an upper transmission joint.

Detailed Description

The invention will be further explained with reference to the drawings and the specific embodiments. It is to be understood that the following terms "upper," "lower," "left," "right," "longitudinal," "lateral," "inner," "outer," "vertical," "horizontal," "top," "bottom," and the like are used in an orientation or positional relationship relative to one another only as illustrated in the accompanying drawings and are used merely for convenience in describing and simplifying the invention, and do not indicate or imply that the device/component so referred to must have a particular orientation or be constructed and operated in a particular orientation and therefore should not be considered as limiting the invention.

Example one

As shown in fig. 1 to 6, a food processor with a long service life provided by the embodiment of the present invention includes a base 100 with an internal motor 300 and a stirring cup 200 disposed on the base, wherein the stirring cup 200 includes a cup body 210, a cup cover 220, a cutter head 240 and a crushing knife 230, the cutter head 240 is disposed at the bottom of the cup body 210, and the crushing knife 230 is rotatably disposed on the cutter head 240 through a bearing assembly 400 and is driven by the motor 300. A heat sink 500 positioned outside the bearing assembly 400 is arranged below the cutter head 240, the heat sink 500 comprises a semiconductor refrigerating member 510 contacting the bearing assembly 400, the semiconductor refrigerating member 510 comprises a cold end 510a arranged at the inner side facing the bearing assembly 400 and a hot end 510b arranged at the outer side opposite to the bearing assembly 400.

When the semiconductor refrigerating element is electrified, the cold end refrigerates under the Peltier effect, the temperature is reduced, the cold end can absorb heat, and the hot end can release heat. The heat of the bearing assembly can be transferred to the cold end of the semiconductor refrigerating piece through heat exchange and then released through the hot end, the heat exchange between the semiconductor refrigerating piece and the bearing assembly is utilized to effectively dissipate heat of the bearing assembly, the temperature of the bearing assembly is greatly reduced when the motor drives the crushing knife to rotate, and the performance of the bearing assembly is guaranteed and the service life of the bearing assembly is prolonged. Adopt semiconductor refrigeration piece to carry out radiating mode fine the little space installation requirement on satisfying the stirring cup, effectively avoid adopting noise problem and the limited problem of structure etc. that traditional fan cooling method brought. The semiconductor refrigeration piece can meet the temperature regulation requirement of customization, can adjust according to the condition of generating heat of bearing subassembly to better satisfy the heat dissipation requirement.

In this embodiment, the cup holder 250 is further disposed at the bottom of the cup body 210, the cutter disc 240 is fixed on the cup holder 250, and the bottom end of the cup body 210 is fixedly connected to the cup holder 250. The crushing cutter 230 comprises a cutter shaft 231 and a blade 232 fixed at the top end of the cutter shaft, the bearing assembly 400 comprises two bearings 410, a bearing sleeve 420 and a sealing ring 430, the two bearings 410 are arranged side by side up and down, the two bearings 410 are sleeved on the cutter shaft 231 and located in the bearing sleeve 420, a gasket 450 is arranged at the bottom of each bearing 410, and a clamp spring 460 used for limiting the bearings and the gasket is arranged at the lower end of the cutter shaft 231. The lower end of the cutter shaft 231 extends downwards to form a bearing assembly 400, the lower end of the cutter shaft 231 is fixedly sleeved with an upper transmission joint 600, a motor shaft of the motor 300 is fixedly sleeved with a lower transmission joint matched with the upper transmission joint 600, and when the stirring cup 200 is connected to the base 100, the cutter shaft 231 is in transmission connection with the motor shaft through the upper and lower transmission joints, so that the purpose that the motor 300 can drive the crushing cutter 230 to rotate is achieved. The sealing ring 430 is sleeved on the cutter shaft 231, and the sealing ring 430 is arranged at the top end in the bearing sleeve 420 and above the bearing 410, so as to prevent water in the cup body 210 from leaking downwards.

In order to install the bearing assembly 400, a boss 241 formed in an upward protruding manner is provided on the cutter head 240, a through hole 242 through which the cutter shaft 231 of the crushing cutter 230 passes is provided on the top wall of the boss 241, an accommodating cavity 243 with an open bottom is formed at the boss 241, the bearing assembly 400 is provided in the accommodating cavity 243, the lower end of the bearing assembly 400 extends downward out of the accommodating cavity 243, and the semiconductor refrigerating element 510 is in contact with the lower end of the bearing assembly 400 extending out of the accommodating cavity.

In order to facilitate the installation of the semiconductor refrigeration element 510, the heat dissipation device 500 further includes a fixing seat 520, a mounting opening 521 matched with the bearing sleeve 420 is disposed on the fixing seat 520, and the fixing seat 520 is sleeved on the lower end of the bearing sleeve 420 extending out of the accommodating cavity 243 through the matching of the mounting opening 521 and the bearing sleeve 420. In order to fix the fixing seat 520 on the bearing sleeve 420, a fastening agent is disposed between the inner wall of the mounting opening 521 and the outer wall of the bearing sleeve 420, specifically, the fastening agent may be a screw fastening agent, so as to achieve a locking effect.

To enhance the heat transfer effect between the bearing assembly 400 and the semiconductor chilling element 510, the semiconductor chilling element 510 includes a plurality of semiconductor chilling plates 511 arranged in series and circumferentially about the bearing assembly 400. In order to increase the heat dissipation speed of the hot end 510b of the semiconductor cooling device 510, the heat dissipation device 500 further includes a heat dissipation plate 530, and the heat dissipation plate 530 is disposed closely to the outer wall of the hot end 510b of the semiconductor cooling device 510.

In this embodiment, the circumference of the fixing base 520 is square, four semiconductor chilling plates 511 and four heat dissipation plates 530 are provided and are arranged corresponding to four side walls of the fixing base 520 one by one, the heat dissipation plates 530 are fixedly connected to the fixing base 520 through screws, the heat dissipation plates 530 are provided with connection holes 531, the side walls of the fixing base 520 are provided with fixing holes 522, the screws penetrate through the connection holes 531 and are screwed in the fixing holes 522, the semiconductor chilling plates 511 are clamped between the side walls of the fixing base 520 and the heat dissipation plates 530, the outer walls of the cold ends 510a of the semiconductor chilling plates 511 are tightly attached to the side walls of the fixing base 520, and the outer walls of the hot ends 510b of the semiconductor chilling plates.

In order to improve the heat transfer efficiency between the bearing assembly 400 and the semiconductor cooling element 510 and the heat dissipation efficiency of the heat dissipation fins 530, the fixing base 520 and the heat dissipation fins 530 are made of a material with a good heat conduction effect, preferably, the fixing base 520 may be an aluminum fixing base, and the heat dissipation fins 530 may be aluminum heat dissipation fins. In addition, in order to improve the heat transfer efficiency between the hot side 510b and the heat sink 530, the finish Ra of both the side wall of the heat sink 530 facing the semiconductor cooling member 510 and the outer wall of the hot side 510b of the semiconductor cooling member 510 is set to be less than 0.3 μm. The radiating fins and the semiconductor refrigerating piece are attached more tightly in a reasonable smooth finish reducing mode, the effective contact area between the radiating fins and the semiconductor refrigerating piece is increased, and the radiating effect is improved. In this embodiment, the roughness Ra of both the side wall of the heat sink 530 facing the semiconductor cooling device 510 and the outer wall of the hot end 510b may be set to 0.25 μm to 0.27 μm.

In order to increase the heat dissipation area of the heat sink 530 and improve the heat dissipation effect, a plurality of spaced heat dissipation fins 532 are disposed on the side wall of the heat sink 530 facing away from the semiconductor chilling plate 511. The width of the gap between two adjacent heat dissipation fins 532 is W, W is greater than or equal to 1.5mm and less than or equal to 4mm, and in the embodiment, the width of the gap between two adjacent heat dissipation fins 532 is preferably set to be 3 mm.

In order to enable the semiconductor cooling member 510 to be electrically operated when the body is in operation, an upper coupler is provided at the bottom of the cup holder 250, and the semiconductor cooling member 510 is electrically connected to the upper coupler. The top of the base 100 is provided with a lower coupler matched with the upper coupler, a control board is arranged in the base, and the lower coupler and the motor 300 are electrically connected to the control board. When the mixing cup 200 is disposed on the base 100, the upper and lower couplers are coupled, and the semiconductor cooling device 510 is electrically connected to the control board through the upper and lower couplers.

When the machine body works, the motor 300 drives the crushing cutter 230 to rotate, the semiconductor refrigerating piece 510 is electrified, the cold end 510a refrigerates, heat of the bearing assembly 400 is transmitted to the cold end 510a through the fixing seat 520, and then the heat is dissipated outwards through the hot end 510b and the heat dissipation fins 530, so that the heat dissipation purpose of the bearing assembly 400 is achieved, and the performance and the service life of the bearing assembly are guaranteed.

It should be understood that the specific shape of the fixing seat 520 is not limited to the square shape described above or shown in the drawings, and other shapes, such as a triangle, a pentagon, a hexagon, etc., may be provided. Accordingly, the number of the semiconductor cooling fins 511 and the heat dissipation fins 530 is adapted to the specific shape of the fixing base 520.

It can be understood that, on the premise of meeting the strength requirement, the fixing seat 520 may also be directly fixed and sleeved outside the bearing sleeve 420 through interference fit or screw fit.

It is understood that other existing fastening agents may be used as the fastening agent to meet the requirement of fixing and matching between the fixing seat 520 and the bearing sleeve 420.

It is understood that the fixing base 520 may be made of other materials with good heat conduction effect, and the heat sink 530 may also be made of other materials with good heat conduction effect. It is understood that the gap width W between two adjacent heat dissipation fins 532 may also be set to other reasonable width values such as 1.5mm, 2mm, 2.5mm, 2.9mm, 3.1mm, 3.5mm, 4mm, etc.

It is understood that the roughness Ra of both the side wall of the heat sink 530 facing the semiconductor cooling member 510 and the outer wall of the hot end 510b may be set to a reasonable surface roughness value of 0.05 μm, 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.27 μm, 0.29 μm, or the like.

Example two

The second embodiment of the present invention is an equivalent embodiment of the first embodiment, and is different from the first embodiment in that the fixing structure of the bearing assembly 400 is different.

As shown in fig. 7, the cutter head 240 is provided with a mounting hole 244 which is matched with the bearing assembly 400, the bearing assembly 400 is inserted into the mounting hole 244 from top to bottom and is fixed on the cutter head 240 through a fixing nut 440, the lower end of the bearing assembly 400 protrudes downwards from the fixing nut 440, and the semiconductor refrigeration piece 510 is in contact with the lower end of the bearing assembly 400.

Specifically, the top end of the bearing sleeve 420 is provided with a shaft hole 426 for the cutter shaft 231 to pass through, the circumferential outer wall of the bearing sleeve 420 is provided with an annular clamping groove 427, and a C-shaped sealing ring is arranged in the annular clamping groove 427. When the bearing assembly 400 is inserted into the mounting hole 244 from top to bottom, a part of the cutter disc 240 located in the circumferential direction of the mounting hole 244 is clamped in the C-shaped sealing ring. The lower end of the bearing housing 420 is provided with external threads, and the fixing nut 440 is screwed to the lower end of the bearing housing 420 by being engaged with the external threads, thereby fixing the bearing assembly 400 to the cutter head 240. The lower end of the bearing sleeve 420 protrudes downwards from the fixing nut 440, and the fixing seat 520 is fixedly sleeved on the lower end of the bearing sleeve 420 and is located below the fixing nut 440.

The other structures of the second embodiment are the same as those of the first embodiment, and are not described in detail here.

EXAMPLE III

As shown in fig. 8, a third embodiment of the present invention is a modified embodiment of the first embodiment, which is modified from the first embodiment in that the bearing sleeve 420 adopts a split structure, and includes a rigid inner ring 421 and a rigid outer ring 422 that are arranged inside and outside, and an elastic layer 423 is arranged between the rigid inner ring 421 and the rigid outer ring 422.

While the bearing sleeve 420 meets the use requirements, the added elastic layer 423 can effectively absorb and buffer the vibration generated by the bearing sleeve 420 when the crushing knife 230 rotates, and is beneficial to reducing the transmission of the vibration between the bearing assembly 400 and the cutter head 240, thereby being beneficial to reducing the abrasion and noise volume of the bearing assembly.

In order to improve the stability between the components, the bottom end of the rigid inner ring 421 is provided with a downward turned edge 424 which is embedded into the bottom end of the elastic layer 423 in an outward turning manner, and the top end of the rigid outer ring 422 is provided with an upward turned edge 425 which is embedded into the top end of the elastic layer 423 in an inward turning manner. In this embodiment, the rigid inner ring 421 and the rigid outer ring 422 are preferably stainless steel rings, and the elastic layer 423 is preferably a rubber layer.

The other structures of the third embodiment are the same as those of the first embodiment, and are not described again.

It is understood that the fixing manner between the rigid inner ring 421 and the elastic layer 423 and the fixing manner between the rigid outer ring 422 and the elastic layer 423 are not limited to the above description or the drawings, and other reasonable fixing and matching structures may be adopted.

It is understood that the elastic layer 423 may also be a silicone layer, and the rigid inner ring 421 and the rigid outer ring 422 may also be made of other suitable materials.

It is understood that the improved structure of the third embodiment with respect to the first embodiment is also applicable to the second embodiment.

In addition to the above preferred embodiments, the present invention has other embodiments, and those skilled in the art can make various changes and modifications according to the present invention without departing from the spirit of the present invention, which should fall within the scope defined by the appended claims.

Claims

1. The utility model provides a long service life's food preparation machine, includes built-in motor's frame and locates the stirring cup on the frame, and the stirring cup includes cup, bowl cover, blade disc and crushing sword, and the bottom of cup is located to the blade disc, and crushing sword passes through the rotatable blade disc of locating of bearing assembly and by motor drive, its characterized in that, the below of blade disc is equipped with the heat abstractor who is located the bearing assembly outside, and heat abstractor is including contacting in the semiconductor refrigeration piece of bearing assembly, and the semiconductor refrigeration piece is including locating inboard cold junction and the hot junction in the outside is located to bearing assembly dorsad towards the bearing assembly.

2. The food processor of claim 1, wherein the semiconductor chilling element comprises a plurality of semiconductor chilling plates arranged in series and circumferentially about the bearing assembly.

3. The food processor of claim 1, wherein the heat sink further comprises a heat sink disposed against an outer wall of the hot end of the semiconductor chilling element.

4. A food processor as claimed in claim 3, wherein the side of the heat sink facing away from the semiconductor cooling member is provided with a plurality of spaced apart heat sink fins.

5. The food processor as defined in claim 4, wherein the width of the gap between adjacent heat dissipating fins is W, and W is 1.5 mm. ltoreq.W.ltoreq.4 mm.

6. A food processor as claimed in claim 3, wherein the side wall of the heat sink facing the semiconductor chilling element and/or the finish Ra of the side wall of the semiconductor chilling element facing the heat sink is less than 0.3 μm.

7. The food processor of claim 1, wherein the bearing assembly includes a bearing and a bearing housing for supporting the bearing, the heat sink further includes a mounting base disposed outside the bearing housing, and the semiconductor cooling element is disposed on the mounting base.

8. The food processor of claim 7, wherein the holder is disposed outside the bearing housing by interference fit, and/or a fastening agent is disposed between the holder and the bearing housing.

9. The food processor of claim 7, wherein the bearing housing includes an inner rigid ring and an outer rigid ring disposed therebetween, and wherein the elastomeric layer is disposed between the inner rigid ring and the outer rigid ring.

10. A food processor as claimed in claim 1, 2, 3, 4, 5, 7 or 9, wherein the cutter head is provided with a boss which is convexly formed, the top wall of the boss is provided with a through hole for the crushing knife to pass through, the boss is provided with an accommodating cavity with an opening at the bottom, the bearing assembly is arranged in the accommodating cavity, the lower end of the bearing assembly extends out of the accommodating cavity, and the semiconductor refrigerating piece is contacted with the lower end of the bearing assembly; or the cutter head is provided with a mounting hole, the bearing assembly is inserted into the mounting hole from top to bottom and is fixed on the cutter head through a fixing nut, the lower end of the bearing assembly protrudes out of the fixing nut downwards, and the semiconductor refrigerating piece is in contact with the lower end of the bearing assembly.