CN211227424U - Electroplating solution inlet device with filtering system - Google Patents
Electroplating solution inlet device with filtering system Download PDFInfo
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- CN211227424U CN211227424U CN202020057230.2U CN202020057230U CN211227424U CN 211227424 U CN211227424 U CN 211227424U CN 202020057230 U CN202020057230 U CN 202020057230U CN 211227424 U CN211227424 U CN 211227424U
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Abstract
The utility model relates to the technical field of electroplating, in particular to an electroplating solution inlet device with a filtering system, which comprises a base frame, a ball float valve, a stop valve, an electroplating solution tank and a filtering component; the electroplating liquid box is placed on the base frame, a liquid inlet is formed in the upper end of the electroplating liquid, a liquid outlet is formed in the side wall of the electroplating liquid box, the liquid outlet is communicated with a water pipe, and the electroplating liquid box stores the electroplating liquid; the filtering component is arranged on the water pipe and is used for filtering impurities in the electroplating solution; the ball-cock assembly is located the water pipe is kept away from the one end of electroplating liquid case, the stop valve is located on the water pipe and be located ball-cock assembly with between the filtering component. The utility model discloses the effect that has is: when the liquid level of the electroplating solution in the electroplating bath descends, the electroplating solution can be automatically supplemented, and the electroplating solution supplemented into the electroplating bath is filtered.
Description
Technical Field
The utility model belongs to the technical field of the electroplating technique and specifically relates to a take filtration system's plating solution inlet means is related to.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electroplating, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electroplating, thereby playing roles of preventing metal oxidation, improving the wear resistance, conductivity, light reflection, corrosion resistance, enhancing the appearance and the like of the plated workpiece.
In the course of performing electroplating, an electroplating solution is indispensable. The existing electroplating device is generally characterized in that electroplating solution is added into an electroplating bath manually, whether feeding is needed or not is judged by observing the liquid level height of the electroplating solution through an operator, whether feeding is needed or not is judged by observing the liquid level height of the electroplating solution through the operator, the operation is inconvenient, and misoperation is easy to occur; meanwhile, because of the work of the production line, a plurality of impurities are often mixed in the electroplating solution, the quality and the equipment of the thin steel plate are damaged in different degrees, and along with the progress of the processing technology, people have higher requirements on the cleanliness of the electroplating solution.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims at providing a take filtration system's plating solution inlet means, its effect that has is: when the liquid level of the electroplating solution in the electroplating bath descends, the electroplating solution can be automatically supplemented, and the electroplating solution supplemented into the electroplating bath is filtered.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
an electroplating liquid inlet device with a filtering system comprises a base frame, a ball float valve, a stop valve, an electroplating liquid tank and a filtering assembly;
the electroplating liquid box is placed on the base frame, a liquid inlet is formed in the upper end of the electroplating liquid, a liquid outlet is formed in the side wall of the electroplating liquid box, the liquid outlet is communicated with a water pipe, and the electroplating liquid box stores the electroplating liquid;
the filtering component is arranged on the water pipe and is used for filtering impurities in the electroplating solution;
the ball-cock assembly is located the water pipe is kept away from the one end of electroplating liquid case, the stop valve is located on the water pipe and be located ball-cock assembly with between the filtering component.
By adopting the technical scheme, when the electroplating solution inlet device with the filtering system is used, the floating ball valve is placed above the electroplating bath, the floating ball is positioned in the electroplating bath, then the stop valve is opened, after the liquid level of the electroplating solution in the electroplating solution descends, the floating ball valve is opened, the electroplating solution in the electroplating solution tank is supplemented into the electroplating bath, after the electroplating solution in the electroplating bath ascends, the floating ball valve is closed, and when the electroplating solution flows through the filtering component, impurities in the electroplating solution are filtered; in summary, when the liquid level of the plating liquid in the plating tank is lowered, the plating liquid can be automatically replenished and the plating liquid replenished into the plating tank can be filtered.
The utility model discloses further set up to: the filtering component comprises a static part, a liquid outlet part and a connecting part for communicating the static part and the liquid outlet part;
the static part is communicated with the electroplating solution tank, and the lower end of the side wall of the liquid outlet part is communicated to the stop valve;
the connecting portion are located the portion lateral wall upper end of stewing, be provided with filter screen and filter paper on the connecting portion inner wall, the filter screen is located connecting portion with the portion junction of stewing.
Through adopting above-mentioned technical scheme, the plating solution flows to the portion of stewing from the plating solution incasement, flows to a play liquid portion from connecting portion, then reentrant plating bath, when the plating solution flows to the portion of stewing from the plating solution incasement, partial impurity can precipitate, then when flowing through the filter screen, filter the great impurity of partial granule once more, when flowing through filter paper, most impurity is filtered, then flow out from a play liquid portion again, accomplish filterable process.
The utility model discloses further set up to: the filtering component is arranged on the water pipe through a flange.
Through adopting above-mentioned technical scheme for filter component can dismantle and connect on the water pipe, is convenient for change filter component.
The utility model discloses further set up to: and a drainage tube is arranged at an opening on the floating ball valve.
By adopting the technical scheme, after the ball float valve is opened, the electroplating solution flows into the electroplating bath along the drainage tube, so that the electroplating solution is not easy to splash.
The utility model discloses further set up to: an adjusting component for adjusting the height of the electroplating liquid tank is arranged between the electroplating liquid tank and the base frame; the adjusting assembly comprises a supporting plate for supporting the electroplating liquid tank, a bottom plate abutted against the base frame and a lifting assembly;
the lifting assembly comprises two groups of supporting pieces, two connecting rods, two driving blocks and a driving rod; two sets of support piece set up respectively in between backup pad and the bottom plate, support piece include two set up respectively in the last hinge bar of the mutual parallel of backup pad both sides to and two set up respectively in the lower hinge bar of the mutual parallel of bottom plate both sides, go up the hinge bar with the bottom plate is articulated, down the hinge bar with the bottom plate is articulated, the connecting rod respectively fixed connection in drive block both sides, the connecting rod runs through go up the hinge bar lower extreme with make down the hinge bar upper end go up the hinge bar lower extreme with the hinge bar upper end is articulated down, the drive block side runs through and is provided with the screw hole, the actuating lever with drive block threaded connection, two the rotation of threaded hole internal thread line is opposite on the drive block, the axis direction of actuating lever with the length direction of bottom plate is parallel.
Through adopting above-mentioned technical scheme, when the height of electroplating solution case is adjusted to needs, rotatory actuating lever, actuating lever drive two drive blocks and are close to each other or keep away from, drive hinge bar and lower hinge bar through the connecting rod and remove, and then promote backup pad upward movement or downstream.
The utility model discloses further set up to: one end of the driving rod is fixedly connected with a handle.
Through adopting above-mentioned technical scheme, drive the actuating lever through rotating the handle and rotate, the operating personnel of being convenient for rotates the operation.
The utility model discloses further set up to: the supporting plate is provided with a matching groove, and the electroplating liquid box is embedded with the matching groove.
Through adopting above-mentioned technical scheme, when placing the plating solution case, with plating solution case and cooperation groove gomphosis for the plating solution case is difficult for rocking.
The utility model discloses further set up to: and a rubber pad is arranged on the upper end surface of the matching groove.
Through adopting above-mentioned technical scheme, the difficult wearing and tearing of rubber pad protection plating solution bottom of the case portion increases the friction simultaneously for it is difficult for sliding.
The utility model discloses further set up to: the liquid inlet is hinged with a through door, and a handle for holding is arranged on the upper end face of the through door.
Through adopting above-mentioned technical scheme, when not adding the plating bath operation to the plating solution case, close to lead to the door, avoid pollutants such as impurity to drop to the plating solution case in, set up the handle and make things convenient for the operation to open and close to lead to the door.
To sum up, the utility model discloses a following at least one useful technological effect:
1. when the liquid level of the electroplating solution in the electroplating bath descends, the electroplating solution can be automatically supplemented, and the electroplating solution supplemented into the electroplating bath is filtered;
2. through setting up adjusting part, the height of plating solution case is adjustable.
Drawings
Fig. 1 is a schematic view of the overall structure of an embodiment of the present invention;
FIG. 2 is a schematic structural view of a filter assembly according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of an electroplating solution tank and an adjusting assembly according to an embodiment of the present invention.
In the figure, 1, a base frame; 2. a float valve; 21. a drainage tube; 3. a stop valve; 4. an electroplating solution tank; 41. a liquid inlet; 42. opening and closing the door; 421. a handle; 5. a filter assembly; 51. a stationary part; 52. a liquid outlet part; 53. a connecting portion; 54. a filter screen; 55. filtering paper; 6. an adjustment assembly; 61. a support plate; 611. a rubber pad; 612. a mating groove; 62. a base plate; 63. a lifting assembly; 631. a support member; 6311. an upper hinge rod; 6312. a lower hinge rod; 632. a drive block; 633. a drive rod; 6331. a grip; 634. a connecting rod; 7. a water pipe; 8. and (4) electroplating bath.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the electroplating solution inlet device with a filtering system disclosed by the utility model comprises a base frame 1, a ball float valve 2, a stop valve 3, an electroplating solution tank 4 and a filtering component 5; the electroplating solution box 4 is placed on the base frame 1, a liquid inlet 41 is formed in the upper end of electroplating solution, a liquid outlet is formed in the side wall of the electroplating solution box 4 and communicated with a water pipe 7, and the electroplating solution box 4 stores the electroplating solution; the filtering component 5 is arranged on the water pipe 7, and the filtering component 5 is used for filtering impurities in the electroplating solution; the ball float valve 2 is arranged at one end of the water pipe 7 far away from the electroplating liquid tank 4, and the stop valve 3 is arranged on the water pipe 7 and is positioned between the ball float valve 2 and the filtering component 5.
A drainage tube 21 is arranged at the opening of the float valve 2. After the float valve 2 is opened, the plating solution flows into the plating tank along the drainage tube 21, so that the plating solution is not easy to splash.
Referring to fig. 2, specifically, the filter assembly 5 includes a stationary portion 51, a liquid outlet portion 52, and a connecting portion 53 communicating the stationary portion 51 and the liquid outlet portion 52; the static part 51 is communicated with the electroplating liquid tank 4, and the lower end of the side wall of the liquid outlet part 52 is communicated with the stop valve 3; the connecting part 53 is positioned at the upper end of the side wall of the static part 51, a filter screen 54 and filter paper 55 are arranged on the inner wall of the connecting part 53, and the filter screen is positioned at the connecting part of the connecting part 53 and the static part 51. The plating solution flows to the portion 51 that stews from the plating solution case 4, flows to the play liquid portion 52 from connecting portion 53, then reentries the plating bath, and when the plating solution flowed to the portion 51 that stews from the plating solution case 4, some impurity can precipitate, then when flowing through filter screen 54, filter some great impurity of granule once more, when flowing through filter paper 55, most impurity was filtered, then flow out from play liquid portion 52 again, accomplishes filterable process.
Referring to fig. 1 and 2, after the filter assembly 5 is used for a period of time and the impurities are more remained, the filter assembly 5 needs to be replaced, and further, the filter assembly 5 is mounted on the water pipe 7 through a flange, so that the filter assembly 5 is detachably connected to the water pipe 7, and the filter assembly 5 is convenient to replace.
Referring to fig. 1 and 3, an adjusting component 6 for adjusting the height of the electroplating liquid tank 4 is arranged between the electroplating liquid tank 4 and the base frame 1; the adjusting assembly 6 comprises a supporting plate 61 for supporting the electroplating liquid box 4, a bottom plate 62 abutted against the base frame 1 and a lifting assembly 63; specifically, the lifting assembly 63 includes two sets of supporting members 631, two connecting rods 634, two driving blocks 632, and a driving rod 633; two sets of supports 631 are respectively disposed between the support plate 61 and the bottom plate 62, each support 631 includes two upper hinge bars 6311 disposed on two sides of the support plate 61 and parallel to each other, and two lower hinge bars 6312 disposed on two sides of the bottom plate 62 and parallel to each other, each upper hinge bar 6311 is hinged to the bottom plate 62, each lower hinge bar 6312 is hinged to the bottom plate 62, each connecting rod 634 is respectively fixedly connected to two sides of the driving block 632, each connecting rod 634 penetrates through the lower end of each upper hinge bar 6311 and the upper end of each lower hinge bar 6312 so that the lower end of each upper hinge bar 6311 is hinged to the upper end of each lower hinge bar 6312, a threaded hole is formed in the side surface of each driving block 632, each driving rod 633 is in threaded connection with each driving block 632, the rotation directions of threaded holes in the two driving blocks 632.
When the height of the electroplating solution tank 4 needs to be adjusted, the driving rod 633 is rotated, the driving rod 633 drives the two driving blocks 632 to approach or separate from each other, the connecting rod 634 drives the upper hinge bar 6311 and the lower hinge bar 6312 to move, and then the supporting plate 61 is pushed to move upwards or downwards.
Referring to fig. 3, in order to facilitate the operation of the driving rod 633 by the operator, a grip 6331 is further fixedly connected to one end of the driving rod 633. The driving rod 633 is driven to rotate by rotating the grip 6331, so that the operator can conveniently rotate the driving rod.
Referring to fig. 3, in order to stably place the plating solution tank 4, a fitting groove 612 is formed in the support plate 61, the plating solution tank 4 is fitted into the fitting groove 612, and a rubber pad 611 is fixedly connected to an upper end surface of the fitting groove 612. When the electroplating liquid box 4 is placed, the electroplating liquid box 4 is embedded with the matching groove 612, so that the electroplating liquid box 4 is not easy to shake; meanwhile, the rubber pad 611 protects the bottom of the electroplating solution tank 4 from being worn easily, and meanwhile friction is increased, so that the electroplating solution tank is not easy to slide.
Referring to fig. 3, the liquid inlet 41 is hinged to a through-closed door 42, and a handle 421 for holding is fixedly connected to an upper end surface of the through-closed door 42. When the plating solution operation is not performed on the plating solution tank 4, the through-and-close door 42 is closed to prevent contaminants such as impurities from falling into the plating solution tank 4, and the handle 421 is arranged to facilitate the operation of opening and closing the through-and-close door 42.
The implementation principle of the embodiment is as follows:
when the electroplating solution inlet device with the filtering system is used, the floating ball valve 2 is placed above the electroplating bath, the floating ball is positioned in the electroplating bath, then the stop valve 3 is opened, after the liquid level of the electroplating solution in the electroplating solution descends, the floating ball valve 2 is opened, the electroplating solution in the electroplating solution tank 4 is supplemented into the electroplating bath, after the electroplating solution in the electroplating bath ascends, the floating ball valve 2 is closed, and when the electroplating solution flows through the filtering component 5, impurities in the electroplating solution are filtered; in summary, when the liquid level of the plating liquid in the plating tank is lowered, the plating liquid can be automatically replenished and the plating liquid replenished into the plating tank can be filtered.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (9)
1. The utility model provides a take filtration system's plating solution inlet means which characterized in that: comprises a pedestal (1), a float valve (2), a stop valve (3), an electroplating liquid tank (4) and a filtering component (5);
the electroplating solution box (4) is placed on the base frame (1), a liquid inlet (41) is formed in the upper end of the electroplating solution, a liquid outlet is formed in the side wall of the electroplating solution box (4), the liquid outlet is communicated with a water pipe (7), and the electroplating solution box (4) stores the electroplating solution;
the filtering assembly (5) is arranged on the water pipe (7), and the filtering assembly (5) is used for filtering impurities in electroplating solution;
the floating ball valve (2) is arranged at one end of the water pipe (7) far away from the electroplating liquid tank (4), the floating ball valve (2) comprises a floating ball, and the stop valve (3) is arranged on the water pipe (7) and located between the floating ball valve (2) and the filtering component (5).
2. The plating solution inlet device with a filtering system as set forth in claim 1, wherein: the filter assembly (5) comprises a static part (51), a liquid outlet part (52) and a connecting part (53) which is communicated with the static part (51) and the liquid outlet part (52);
the static part (51) is communicated with the electroplating liquid tank (4), and the lower end of the side wall of the liquid outlet part (52) is communicated with the stop valve (3);
the connecting portion (53) is located the upper end of the side wall of the static portion (51), a filter screen (54) and filter paper (55) are arranged on the inner wall of the connecting portion (53), and the filter screen is located at the connecting position of the connecting portion (53) and the static portion (51).
3. The plating solution inlet device with a filtering system as set forth in claim 2, wherein: the filtering component (5) is arranged on the water pipe (7) through a flange.
4. The plating solution inlet device with a filtering system as set forth in claim 1, wherein: and a drainage tube (21) is arranged at an opening on the float valve (2).
5. The plating solution inlet device with a filtering system as set forth in any one of claims 1 to 4, wherein: an adjusting component (6) for adjusting the height of the electroplating liquid tank (4) is arranged between the electroplating liquid tank (4) and the base frame (1); the adjusting assembly (6) comprises a supporting plate (61) for supporting the electroplating liquid tank (4), a bottom plate (62) abutted to the base frame (1) and a lifting assembly (63);
the lifting assembly (63) comprises two groups of supporting pieces (631), two connecting rods (634), two driving blocks (632) and a driving rod (633); two sets of support pieces (631) set up respectively in between backup pad (61) and bottom plate (62), support piece (631) include two set up respectively in the last hinge bar (6311) of the mutual parallel of backup pad (61) both sides to and two set up respectively in the lower hinge bar (6312) of the mutual parallel of bottom plate (62) both sides, go up hinge bar (6311) with bottom plate (62) are articulated, lower hinge bar (6312) with bottom plate (62) are articulated, connecting rod (634) fixed connection respectively in drive block (632) both sides, connecting rod (634) run through go up hinge bar (6311) lower extreme with lower hinge bar (6312) upper end makes go up hinge bar (6311) lower extreme with lower hinge bar (6312) upper end is articulated, drive block (632) side runs through and is provided with the screw hole, drive lever (633) with movable block threaded connection, the rotation directions of the thread lines in the thread holes on the two driving blocks (632) are opposite, and the axial direction of the driving rod (633) is parallel to the length direction of the bottom plate (62).
6. The plating solution inlet device with a filtering system as set forth in claim 5, wherein: one end of the driving rod (633) is fixedly connected with a handle (6331).
7. The plating solution inlet device with a filtering system as set forth in claim 5, wherein: the supporting plate (61) is provided with a matching groove (612), and the electroplating solution box (4) is embedded with the matching groove (612).
8. The plating solution inlet device with a filtering system as set forth in claim 7, wherein: and a rubber pad (611) is arranged on the upper end surface of the matching groove (612).
9. The plating solution inlet device with a filtering system as set forth in claim 5, wherein: the liquid inlet (41) is hinged with a through and closed door (42), and a handle (421) for holding is arranged on the upper end face of the through and closed door (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020057230.2U CN211227424U (en) | 2020-01-11 | 2020-01-11 | Electroplating solution inlet device with filtering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020057230.2U CN211227424U (en) | 2020-01-11 | 2020-01-11 | Electroplating solution inlet device with filtering system |
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| Publication Number | Publication Date |
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| CN211227424U true CN211227424U (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020057230.2U Active CN211227424U (en) | 2020-01-11 | 2020-01-11 | Electroplating solution inlet device with filtering system |
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| CN (1) | CN211227424U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111962135A (en) * | 2020-08-19 | 2020-11-20 | 饶胜 | Self-balancing electroplating liquid storage equipment and use method |
-
2020
- 2020-01-11 CN CN202020057230.2U patent/CN211227424U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111962135A (en) * | 2020-08-19 | 2020-11-20 | 饶胜 | Self-balancing electroplating liquid storage equipment and use method |
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Address after: 516100 Shentian (earth name), group 2, Xialiao village, Longxi Town, BOLUO County, Huizhou City, Guangdong Province Patentee after: Huizhou Yingbang Hardware Surface Treatment Technology Co.,Ltd. Address before: 516100 Shentian (earth name), group 2, Xialiao village, Longxi Town, BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou Ruiji Environmental Protection Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |