CN211178508U - Connecting device, inertia measurement unit and mobile platform - Google Patents
Connecting device, inertia measurement unit and mobile platform Download PDFInfo
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- CN211178508U CN211178508U CN201922499334.9U CN201922499334U CN211178508U CN 211178508 U CN211178508 U CN 211178508U CN 201922499334 U CN201922499334 U CN 201922499334U CN 211178508 U CN211178508 U CN 211178508U
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- circuit board
- sensor chip
- installation department
- flexible circuit
- connection
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- 238000005259 measurement Methods 0.000 title claims abstract description 27
- 238000009434 installation Methods 0.000 claims abstract description 36
- 238000013016 damping Methods 0.000 claims abstract description 11
- 230000035939 shock Effects 0.000 claims description 30
- 239000006260 foam Substances 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
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Abstract
A connecting device, an inertia measurement unit and a mobile platform are provided. The connecting device is used for connecting the sensor chip and the circuit board and comprises a damping structure, wherein the damping structure comprises a first surface and a second surface used for being connected with the circuit board. The flexible circuit board, the flexible circuit board includes the installation department and is used for the connecting portion of connecting circuit board, connecting portion with the installation department is connected, the installation department includes the third surface and is used for installing the fourth surface of sensor chip, the third surface of installation department with shock-absorbing structure's first surface fixed connection. The sensor chip is connected with the circuit board through the flexible circuit board, and the damping structure is arranged between the flexible circuit board and the circuit board, so that the sensor chip can be buffered and damped, the body for installing the circuit board receives external impact, the influence of the impact on the sensor chip can be reduced, the problem that the sensor chip is lost or damaged due to the impact is prevented, and the normal work of the sensor chip is ensured.
Description
Technical Field
The application relates to the technical field of robot competition, in particular to a connecting device, an inertia measuring unit and a mobile platform.
Background
The robot technology is the mainstream top-grade science and technology in the world today, and after years of development, a brand new era is met. The robot competition is gradually heated, and the competition form is that both parties of the competition respectively manufacture a plurality of robot equipment such as combat vehicles, unmanned aerial vehicles and the like, and the robot equipment are mutually compared in a complex field.
The robot usually can set up sensors such as gyroscope, accelerometer for carry out gesture monitoring to the robot, and the competitor often will be used for installing the control module (being the circuit board) of sensor such as gyroscope, accelerometer with whole robot through rigid connection fixed to whole robot in the robot match at present, is equivalent to sensor such as inside gyroscope, accelerometer also be rigid connection with the robot. However, in a match, the robot is often hit (for example, hit by a golf shot), the impact is transmitted to sensors such as an accelerometer, and a resonance structure inside the sensors such as a gyroscope and an accelerometer may fail after being greatly impacted, and the resonance is restored after a certain time, so that data of the sensors such as the gyroscope and the accelerometer, which are rigidly connected with the robot, are lost in a certain short time, and the robot is further uncontrollable in a short time.
SUMMERY OF THE UTILITY MODEL
The application provides a connecting device, an inertia measurement unit and a mobile platform, which are used for solving all or at least part of problems in the prior art.
According to a first aspect of embodiments of the present application, there is provided a connection device for connecting a sensor chip and a circuit board, comprising:
a shock absorbing structure comprising a first surface and a second surface for connection to a circuit board;
the flexible circuit board, the flexible circuit board includes the installation department and is used for the connecting portion of connecting circuit board, connecting portion with the installation department is connected, the installation department includes the third surface and is used for installing the fourth surface of sensor chip, the third surface of installation department with shock-absorbing structure's first surface fixed connection.
Further, the flexible circuit board further comprises an extension portion connected between the mounting portion and the connecting portion.
Further, the damping structure further comprises a reinforcing plate connected between the third surface of the mounting portion and the first surface of the damping structure.
Further, the shock-absorbing structure is made of foam.
Furthermore, two sides of the connecting part are provided with connecting terminals for connecting with a circuit board.
According to a second aspect of embodiments of the present application, there is provided an inertial measurement unit comprising: the sensor comprises a circuit board, a sensor chip and a connecting device for connecting the circuit board and the sensor chip;
wherein the connecting device comprises:
the shock absorption structure comprises a first surface and a second surface which are oppositely arranged, and the second surface of the shock absorption structure is fixedly connected with the circuit board;
the flexible circuit board, the flexible circuit board include the installation department and with the connecting portion that the installation department is connected, connecting portion with the circuit board is connected, the installation department is including the relative third surface and the fourth surface that sets up, the third surface of installation department with shock-absorbing structure's first fixed surface is connected, the sensor chip install in the fourth surface of installation department.
Further, the flexible circuit board further comprises an extension part, and the extension part is connected between the mounting part and the connecting part;
the second surface of the damping structure is connected to the front surface of the circuit board, the back surface of the circuit board is provided with a connecting seat, the circuit board is provided with a through hole part, the extending part bends and penetrates through the through hole part, and the connecting part is connected with the connecting seat.
Furthermore, connecting terminals for connecting with the connecting seat are arranged on two sides of the connecting part.
Further, the connecting device further comprises a reinforcing plate connected between the third surface of the mounting portion and the first surface of the shock-absorbing structure.
Further, the shock-absorbing structure is made of foam.
According to a third aspect of embodiments of the present application, there is provided a mobile platform, comprising: a body and an inertial measurement unit as described in any of the above embodiments, the inertial measurement unit being disposed within the body.
The connecting device of this application is connected sensor chip and circuit board through flexible circuit board to set up shock-absorbing structure between flexible circuit board and the circuit board, can play the absorbing effect of buffering to sensor chip, receive external impact when the body that is used for installing the circuit board, can reduce the impact and bring the influence to sensor chip, prevent that sensor chip from leading to the problem that data lost or damaged because of assaulting, guarantee sensor chip's normal work.
Drawings
Fig. 1 is a perspective view of a connection device according to an embodiment of the present disclosure.
Fig. 2 is a front perspective view of an inertial measurement unit according to an embodiment of the present application.
Fig. 3 is a rear perspective view of an inertial measurement unit according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
The application provides a connecting device, inertia measurement unit and moving platform to solve the problem that sensors such as gyroscope, accelerometer commonly used in the robot match receive the data loss or damage that vibration or impact brought. The connecting device, the inertial measurement unit and the mobile platform of the present application will be described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.
The embodiment of the application provides a connecting device for connecting sensor chip and circuit board, sensor chip can be sensors such as gyroscope, accelerometer, installs and can regard as inertial measurement unit on the circuit board, is arranged in the robot match to carry out gesture monitoring to the robot. Install sensor chip on the circuit board through this connecting device, can be arranged in the robot match as moving platform's inertial measurement unit, moving platform can be robots such as chariot, unmanned aerial vehicle, cloud platform.
Referring to fig. 1 to 3, a connection device according to an embodiment of the present application, for connecting a sensor chip 80 and a circuit board 90, includes a shock absorbing structure 10 and a flexible circuit board 20. The shock-absorbing structure 10 includes a first surface (shown in fig. 1 as the upper surface of the shock-absorbing structure 10) and a second surface (shown in fig. 1 as the lower surface of the shock-absorbing structure 10) for connection to a circuit board 90. The flexible circuit board 20 includes an installation portion 21 and a connection portion 22 for connecting the circuit board 90, the connection portion 22 with the installation portion 21 is connected, the installation portion 21 includes a third surface (shown as the lower surface of the flexible circuit board 20 in fig. 1) and a fourth surface (shown as the upper surface of the flexible circuit board 20 in fig. 1) for installing the sensor chip 80, the third surface of the installation portion 21 and the first surface fixed connection of the shock-absorbing structure 10.
With reference to fig. 2, in practical applications, in the connecting device of the present application, the sensor chip 80 is mounted on the fourth surface (i.e., the upper surface) of the flexible circuit board 20, the second surface (i.e., the lower surface) of the shock-absorbing structure 10 is connected to the circuit board 90, the sensor chip 80 is connected to the circuit board 90 through the flexible circuit board 20, and the shock-absorbing structure 10 is disposed between the flexible circuit board 20 and the circuit board 90, so as to buffer and absorb shock to the sensor chip 80, when the robot body for mounting the circuit board 90 is subjected to external impact, the impact on the sensor chip 80 can be reduced, the problem that the sensor chip 80 is lost or damaged due to the impact is prevented, and the normal operation of the sensor chip 80 is ensured.
In some alternative embodiments, the flexible circuit board 20 further includes an extension portion 23, and the extension portion 23 is connected between the mounting portion 21 and the connection portion 22. The length of the flexible circuit board 20 is lengthened through the extension portion 23, in some cases, when the distance between the connection portion 22 and the connection position on the circuit board 90 is long, the connection portion 22 can still be ensured to be normally connected with the circuit board 90 through the extension portion 23, the connection of the flexible circuit board 20 and circuit boards 90 of different models can be ensured, and the adaptability of the flexible circuit board is improved.
As shown in fig. 3, in the present embodiment, the Flexible circuit board 20 is made of an FPC (Flexible printed circuit) Flexible board material, that is, the mounting portion 21, the extension portion 23, and the connecting portion 22 are made of an FPC Flexible board material and can be bent as appropriate. The second surface (i.e., the lower surface) of the shock-absorbing structure 10 is connected to the front surface of the circuit board 90, the back surface of the circuit board 90 is provided with a connecting seat 91 for connecting the connecting portion 22 of the flexible circuit board 20, and two sides of the connecting portion 22 are provided with connecting terminals 24 for connecting the circuit board 90. The circuit board 90 is provided with a through hole 92, the extension portion 23 is bent and passes through the through hole 92, and the connecting portion 22 is connected with the connecting seat 91 from the back of the circuit board 90. The extension 23 is bent at a large bending angle, and the strength of the flexible circuit board 20 can be ensured.
In some alternative embodiments, the connecting device of the present application further includes a reinforcing plate 30, and the reinforcing plate 30 is connected between the third surface (i.e., the lower surface) of the mounting portion 21 and the first surface (i.e., the upper surface) of the shock absorbing structure 10. The sensor chip 80 can adopt a BMI088 chip with better anti-seismic performance, the sensor chip 80 can be welded with the installation part 21 of the flexible circuit board 20, the size of the reinforcing plate 30 can be matched with the size of the damping structure 10 and the installation part 21 of the flexible circuit board 20, the reinforcing plate 30 can enhance the strength of the installation part 21 of the flexible circuit board 20, and the reliability of the sensor chip 80 is further ensured. Alternatively, the reinforcing plate 30 may be an FR4 hard plate reinforcing plate, and the reinforcing plate 30 may be adhesively connected to the shock absorbing structure 10 and the flexible circuit board 20 by using an adhesive. In the present embodiment, the reinforcing plate 30, the shock absorbing structure 10, and the mounting portion 21 of the flexible circuit board 20 are all rectangular structures.
In some alternative embodiments, the shock absorbing structure 10 is foam. Alternatively, the shock absorbing structure 10 employs 3M foam. The shock absorbing structure 10 is attached to the circuit board 90 by adhesive. Shock-absorbing structure 10 adopts the bubble cotton, can reach better shock attenuation effect.
In the robot competition, taking the moving platform as a pan-tilt as an example, when a friction wheel of the pan-tilt rotates at a certain speed, the whole pan-tilt can swing at a certain frequency and a small amplitude. Tests show that the MPU6600 chip originally used has no output of short-time data when being subjected to large impact, but the BMI088 chip is used in the application and is matched with 3M rubber foam cotton to be used as a damping structure, so that the problem is not caused. In addition, in the test, the scheme that the BMI088 chip is integrated on the single plate originally is that the chip is rigidly connected with the circuit board, and the chip resonates when the friction wheel rotates, but the scheme that the flexible circuit board is matched with the damping structure is used in the application, and no resonant oscillation is found in the full frequency band (the speed is controlled from 0-1400) of the friction wheel.
Referring to fig. 1 to 3, an inertial measurement unit is further provided in an embodiment of the present application, and is suitable for performing attitude monitoring on a mobile platform in a robot race. The mobile platform may be, for example, a combat tank, a drone, a robot, a pan-tilt, etc. The inertial measurement unit includes: a circuit board 90, a sensor chip 80 and a connecting means for connecting said circuit board 90 and said sensor chip 80. The sensor chip may be a gyroscope, an accelerometer, or the like. It should be noted that the description of the connection device in the above embodiments and embodiments is also applicable to the inertial measurement unit of the present application.
Wherein the connecting device comprises a shock absorbing structure 10 and a flexible circuit board 20. The shock absorbing structure 10 includes a first surface (an upper surface of the shock absorbing structure 10 is shown in fig. 1) and a second surface (a lower surface of the shock absorbing structure 10 is shown in fig. 1) which are oppositely disposed, and the second surface of the shock absorbing structure 10 is fixedly connected to the circuit board 90. The flexible circuit board 20 includes a mounting portion 21 and a connecting portion 22 connected to the mounting portion 21, and the connecting portion 22 is connected to the circuit board 90. Connecting portion 22 with installation department 21 connects, installation department 21 includes relative third surface (shown as the lower surface of flexible circuit board 20 in fig. 1) and the fourth surface (shown as the upper surface of flexible circuit board 20 in fig. 1) that sets up, the third surface of installation department 21 with shock-absorbing structure 10's first surface fixed connection, sensor chip 80 install in the fourth surface of installation department 21.
The utility model provides an inertia measurement unit is connected sensor chip 80 and circuit board 90 through flexible circuit board 20, and set up shock-absorbing structure 10 between flexible circuit board 20 and the circuit board 90, can play the absorbing effect of buffering to sensor chip 80, receive external impact when the robot body that is used for installing circuit board 90, can reduce the impact and take the influence to sensor chip 80, prevent that sensor chip 80 from leading to the problem that data lost or damaged because of assaulting, guarantee sensor chip 80's normal work.
In some alternative embodiments, the flexible circuit board 20 further includes an extension portion 23, and the extension portion 23 is connected between the mounting portion 21 and the connection portion 22. The length of the flexible circuit board 20 is lengthened through the extension portion 23, in some cases, when the distance between the connection portion 22 and the connection position on the circuit board 90 is long, the connection portion 22 can still be ensured to be normally connected with the circuit board 90 through the extension portion 23, the connection of the flexible circuit board 20 and circuit boards 90 of different models can be ensured, and the adaptability of the flexible circuit board is improved.
As shown in fig. 3, in the present embodiment, the Flexible circuit board 20 is made of an FPC (Flexible printed circuit) Flexible board material, that is, the mounting portion 21, the extension portion 23, and the connecting portion 22 are made of an FPC Flexible board material and can be bent as appropriate. The second surface (i.e., the lower surface) of the shock-absorbing structure 10 is connected to the front surface of the circuit board 90, the back surface of the circuit board 90 is provided with a connecting seat 91 for connecting the connecting portion 22 of the flexible circuit board 20, and two sides of the connecting portion 22 are provided with connecting terminals 24 for connecting the circuit board 90. The circuit board 90 is provided with a through hole 92, the extension portion 23 is bent and passes through the through hole 92, and the connecting portion 22 is connected with the connecting seat 91 from the back of the circuit board 90. The extension 23 is bent at a large bending angle, and the strength of the flexible circuit board 20 can be ensured.
In some alternative embodiments, the connecting device of the present application further includes a reinforcing plate 30, and the reinforcing plate 30 is connected between the third surface (i.e., the lower surface) of the mounting portion 21 and the first surface (i.e., the upper surface) of the shock absorbing structure 10. The sensor chip 80 can adopt a BMI088 chip with better anti-seismic performance, the sensor chip 80 can be welded with the installation part 21 of the flexible circuit board 20, the size of the reinforcing plate 30 can be matched with the size of the damping structure 10 and the installation part 21 of the flexible circuit board 20, the reinforcing plate 30 can enhance the strength of the installation part 21 of the flexible circuit board 20, and the reliability of the sensor chip 80 is further ensured. Alternatively, the reinforcing plate 30 may be an FR4 hard plate reinforcing plate, and the reinforcing plate 30 may be adhesively connected to the shock absorbing structure 10 and the flexible circuit board 20 by using an adhesive. In the present embodiment, the reinforcing plate 30, the shock absorbing structure 10, and the mounting portion 21 of the flexible circuit board 20 are all rectangular structures.
In some alternative embodiments, the shock absorbing structure 10 is foam. Alternatively, the shock absorbing structure 10 employs 3M foam. The shock absorbing structure 10 is attached to the circuit board 90 by adhesive. Shock-absorbing structure 10 adopts the bubble cotton, can reach better shock attenuation effect.
The embodiment of the application further provides a mobile platform, which is suitable for robot competition, and the mobile platform can be robots such as a chariot, an unmanned aerial vehicle and a holder. The mobile platform comprises a body and an inertia measurement unit, wherein the inertia measurement unit is arranged on the body. It should be noted that the description of the inertial measurement unit in the above embodiments and implementation modes is also applicable to the mobile platform of the present application.
The utility model provides a moving platform, inertial measurement unit's flexible circuit board is connected sensor chip and circuit board to set up shock-absorbing structure between flexible circuit board and the circuit board, can play the absorbing effect of buffering to the sensor chip, receive external impact when moving platform's body, can reduce the impact and lead to the influence that the sensor chip brought, prevent that the sensor chip leads to the problem that data lost or damaged because of assaulting, guarantee the normal work of sensor chip.
Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application, and all changes, substitutions and alterations that fall within the spirit and scope of the application are to be understood as being covered by the following claims.
The disclosure of this patent document contains material which is subject to copyright protection. The copyright is owned by the copyright owner. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the patent and trademark office official records and records.
Claims (11)
1. A connecting device for connecting a sensor chip and a circuit board, comprising:
a shock absorbing structure comprising a first surface and a second surface for connection to a circuit board;
the flexible circuit board, the flexible circuit board includes the installation department and is used for the connecting portion of connecting circuit board, connecting portion with the installation department is connected, the installation department includes the third surface and is used for installing the fourth surface of sensor chip, the third surface of installation department with shock-absorbing structure's first surface fixed connection.
2. The connection device recited in claim 1, wherein the flexible circuit board further comprises an extension portion connected between the mounting portion and the connection portion.
3. The connecting device of claim 1, further comprising a stiffening plate connected between the third surface of the mounting portion and the first surface of the shock absorbing structure.
4. The connection device of claim 1, wherein the shock absorbing structure is foam.
5. The connecting device according to claim 1, wherein the connecting portion is provided at both sides thereof with connecting terminals for connection with a circuit board.
6. An inertial measurement unit, comprising: the sensor comprises a circuit board, a sensor chip and a connecting device for connecting the circuit board and the sensor chip;
wherein the connecting device comprises:
the shock absorption structure comprises a first surface and a second surface which are oppositely arranged, and the second surface of the shock absorption structure is fixedly connected with the circuit board;
the flexible circuit board, the flexible circuit board include the installation department and with the connecting portion that the installation department is connected, connecting portion with the circuit board is connected, the installation department is including the relative third surface and the fourth surface that sets up, the third surface of installation department with shock-absorbing structure's first fixed surface is connected, the sensor chip install in the fourth surface of installation department.
7. The inertial measurement unit of claim 6, wherein the flexible circuit board further comprises an extension portion connected between the mounting portion and the connection portion;
the second surface of the damping structure is connected to the front surface of the circuit board, the back surface of the circuit board is provided with a connecting seat, the circuit board is provided with a through hole part, the extending part bends and penetrates through the through hole part, and the connecting part is connected with the connecting seat.
8. The inertial measurement unit of claim 7, wherein connection terminals for connection with the connection socket are provided on both sides of the connection part.
9. The inertial measurement unit of claim 6, wherein the connection device further comprises a stiffening plate connected between the third surface of the mounting portion and the first surface of the shock-absorbing structure.
10. The inertial measurement unit of claim 6, wherein the shock absorbing structure is foam.
11. A mobile platform, comprising: a body and an inertial measurement unit according to any one of claims 6 to 10 disposed within the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922499334.9U CN211178508U (en) | 2019-12-31 | 2019-12-31 | Connecting device, inertia measurement unit and mobile platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922499334.9U CN211178508U (en) | 2019-12-31 | 2019-12-31 | Connecting device, inertia measurement unit and mobile platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211178508U true CN211178508U (en) | 2020-08-04 |
Family
ID=71809427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922499334.9U Expired - Fee Related CN211178508U (en) | 2019-12-31 | 2019-12-31 | Connecting device, inertia measurement unit and mobile platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211178508U (en) |
-
2019
- 2019-12-31 CN CN201922499334.9U patent/CN211178508U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200804 |