CN211128721U

CN211128721U - Power supply box and L ED box

Info

Publication number: CN211128721U
Application number: CN201921317896.0U
Authority: CN
Inventors: 金重星; 何昆鹏; 吴振志; 吴涵渠
Original assignee: Shenzhen Aoto Electronics Co Ltd
Current assignee: Shenzhen Aoto Electronics Co Ltd
Priority date: 2019-08-14
Filing date: 2019-08-14
Publication date: 2020-07-28
Anticipated expiration: 2029-08-14

Abstract

The application relates to a power supply box and an L ED box body, wherein the power supply box comprises a box body frame, a cover plate, a piezoelectric ceramic fan and a drive plate, the box body frame is of a hollow structure and is internally provided with a cavity used for arranging electronic components, the cover plate covers the cavity and is fixedly connected to the box body frame, one side of the cover plate, which is far away from the cavity, is provided with heat dissipation fins, the piezoelectric ceramic fan is arranged on one side of the cover plate, which is far away from the cavity, and is arranged corresponding to the heat dissipation fins, the drive plate is electrically connected to the piezoelectric ceramic fan and is used for driving the piezoelectric ceramic fan to work, the L ED box body comprises the power supply box, and the piezoelectric ceramic fan is arranged on the cover plate, so that when the piezoelectric ceramic fan works, the.

Description

Power supply box and L ED box

Technical Field

The application relates to L ED shows the field, especially relates to a power pack and L ED box.

Background

L ED display screen usually has power box, to be when L ED display screen work for L ED display screen power supply, power box during work, give off a large amount of heat, usually, the area near power box is L ED display screen temperature high area, therefore, power box needs good heat dispersion, traditional heat dispersion is generally accomplished through setting up the heat radiation fin, the heat radiation fin has better radiating effect, but more lie in passive heat dispersion, can only realize the adjustment through the overall arrangement of the heat radiation fin, once the product is stereotyped, the heat dispersion ability of power box is also more or less definite, have limited the heat dispersion ability of power box to promote to a certain extent.

SUMMERY OF THE UTILITY MODEL

In view of this, it is necessary to provide a power supply box and L ED box body to solve the problem that the heat dissipation capability of the existing power supply box is limited.

The first aspect of the application provides a power supply box, which comprises a box body frame, a cover plate, a piezoelectric ceramic fan and a driving plate, wherein,

the box body frame is of a hollow structure, a cavity is formed in the box body frame, and the cavity is used for distributing electronic components;

the cover plate covers the cavity and is fixedly connected to the box body frame, and one side of the cover plate, which is far away from the cavity, is provided with heat dissipation fins;

the piezoelectric ceramic fan is arranged on one side of the cover plate, which is far away from the cavity, and corresponds to the radiating fins;

the driving board is electrically connected with the piezoelectric ceramic fan and used for driving the piezoelectric ceramic fan to work.

In one embodiment, the piezoelectric ceramic fan further comprises a mounting frame, the piezoelectric ceramic fan is detachably mounted on the mounting frame, and the mounting frame is fixed on the cover plate.

In one embodiment, the mounting bracket comprises a bottom plate and side plates, the side plates are fixedly connected to the bottom plate, a groove is formed by the bottom plate and the side plates in a surrounding mode, the piezoelectric ceramic fan is arranged in the groove, at least one side plate is provided with a ventilation hole, and the ventilation hole communicates the groove with gaps among the radiating fins.

In one embodiment, the bottom plate is provided with a positioning column and a fixing buckle, the positioning column is provided with a positioning groove, the piezoelectric ceramic fan is at least partially embedded into the positioning groove, the fixing buckle is provided with a groove, and when the piezoelectric ceramic fan is embedded into the positioning groove, at least part of the piezoelectric ceramic fan is accommodated in the groove.

In one embodiment, the piezoceramic fan is arranged in the gap between two adjacent radiating fins.

In one embodiment, a driving circuit is disposed on the driving board, and the driving circuit includes a controller, a first switching tube Q1, a second switching tube Q2, a third switching tube Q3, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, and a fifth resistor R5;

the base electrode of the first switching tube Q1 is connected to the controller through a first resistor R1, the controller outputs a high-low level signal to control the on-off of the first switching tube Q1, the collector electrode of the first switching tube Q1 is connected with a power input Vin through a second resistor R2, and the emitter electrode is grounded through a third resistor R3;

one end of the fourth resistor R4 is connected to the common connection point of the first switch tube Q1 and the second resistor R2;

the base electrode of the second switching tube Q2 is connected to the other end of the fourth resistor R4, the collector electrode is connected with the power input Vin, and the emitter electrode is connected to the piezoceramic fan through the fifth resistor R5;

the base of the third switch tube Q3 is connected to the other end of the fourth resistor R4, the collector is grounded, and the emitter is connected to the piezoceramic fan through the fifth resistor R5.

In one embodiment, the fan further comprises a temperature sensor, the temperature sensor is arranged in the cavity and electrically connected to a driving circuit on the driving plate, and the temperature sensor controls the operation of the piezoelectric ceramic fan through the driving circuit.

In one embodiment, the switch power supply further comprises a switch power supply and a heat-conducting adhesive layer, wherein the switch power supply is arranged on the inner side wall of the cover plate, the heat-conducting adhesive layer is arranged around the switch power supply, and the switch power supply is packaged on the inner side wall of the cover plate.

In one embodiment, the switching power supply further comprises a heat insulation plate, wherein the heat insulation plate is arranged in the cavity and used for isolating the switching power supply from electronic components in the cavity.

According to the power supply box, the radiating fins and the piezoelectric ceramic fan are arranged on one side of the cover plate, which is far away from the cavity, the radiating fins ensure that the power supply box has high basic radiating capacity, the piezoelectric ceramic fan is arranged corresponding to the radiating fins, the driving plate drives the piezoelectric ceramic fan to work, and the piezoelectric ceramic fan vibrates to enable air between the radiating fins to flow, heat between the radiating fins is taken away by the air flow, so that the radiating effect can be enhanced, the radiating capacity can be enhanced to a certain extent on the basis that the radiating capacity of the power supply box is determined, and the problem that the radiating capacity is limited is solved.

The utility model provides an L ED box is provided to this application second aspect, including display module assembly, box frame and power pack, display module assembly is fixed in box frame's display surface, the power pack is fixed in box frame's back, the power pack be above-mentioned arbitrary power pack.

Because the L ED box is provided with the power supply box, the L ED box is correspondingly provided with the beneficial effects of the power supply box.

Drawings

Fig. 1 is an exploded view of a power pack according to an embodiment of the present application;

fig. 2 is a schematic partial structure diagram of a power supply box according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a cover plate of a power supply box according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a partial structure of a power supply box according to another embodiment of the present application;

FIG. 5 is a schematic view of a fitting structure of a mounting frame and a piezo-ceramic fan of a power supply box according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a mounting rack of a power supply box according to an embodiment of the present application;

fig. 7 is a schematic cross-sectional view of a power supply box according to an embodiment of the present application;

fig. 8 is a driving circuit diagram of a driving board of a power supply box according to an embodiment of the present application.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The power pack and L ED box of each embodiment of this application, through set up piezoceramics fan on the apron, through piezoceramics fan during operation, the air flow in the gap between the reinforcing heat radiation fins to reinforcing radiating effect.

The power supply box and the L ED box of the embodiments of the present application are described in detail below with reference to the attached drawings.

Referring to fig. 1 and fig. 2, a schematic structural diagram of a power supply box 10 according to an embodiment of the present application is exemplarily shown, where the power supply box 10 includes a box body frame 110, a cover plate 120, a piezoelectric ceramic fan 130, and a driving plate 140, where the box body frame 110 is a hollow structure and is provided with a cavity 110a, and the cavity 110a is used for laying electronic components; the cover plate 120 covers the cavity 110a and is fixedly connected to the box body frame 110, and a heat dissipation fin 121 is arranged on one side of the cover plate 120, which is far away from the cavity 110 a; the piezoceramic fan 130 is disposed on a side of the cover plate 120 away from the cavity 110a, and is disposed corresponding to the heat dissipation fins 121; the driving board 140 is electrically connected to the piezoceramic fan 130 and is used for driving the piezoceramic fan 130 to operate.

The radiating fins 121 and the piezoelectric ceramic fan 130 are arranged on one side of the cover plate 120, which is far away from the cavity 110a, the radiating fins 121 ensure that the power supply box 10 has high basic radiating capacity, the piezoelectric ceramic fan 130 is arranged corresponding to the radiating fins 121, the driving plate 140 drives the piezoelectric ceramic fan 130 to work, and the piezoelectric ceramic fan 130 vibrates, so that air between the radiating fins 121 flows, heat between the radiating fins 121 is taken away by the flow of the air, a radiating effect can be enhanced, the radiating capacity can be enhanced to a certain extent through adjustment of the piezoelectric ceramic fan 130 on the basis of determination of the radiating capacity of the power supply box 10, and the problem that the radiating capacity is limited is solved.

The piezoelectric ceramic fan 130 may be any one of piezoelectric ceramic fans on the market, and may include a piezoelectric ceramic sheet, an electrode plate, and a circuit board, where the piezoelectric ceramic sheet is connected to the circuit board through the electrode plate, the circuit board is connected to the driving board 140, and after receiving a signal from the driving board 140, the circuit board vibrates to drive the piezoelectric ceramic sheet to vibrate through the electrode plate.

Referring to FIG. 2, in one or more embodiments, piezo-ceramic fan 130 is removably secured to cover plate 120, thereby allowing piezo-ceramic fan 130 to be assembled when needed, disassembled when not needed, and facilitating maintenance when piezo-ceramic fan 130 is damaged. With the piezoelectric ceramic fan 130, on one hand, the piezoelectric ceramic fan 130 drives the airflow to flow through the vibration of one piezoelectric ceramic piece, which is more suitable for the strip-shaped space between the plurality of heat dissipation fins 121, and on the other hand, the required installation space is smaller than that of a fan blade type fan.

Referring to fig. 1, 4 to 6, in one embodiment, the power supply box 10 may further include a mounting frame 150, the piezoceramic fan 130 is detachably mounted on the mounting frame 150, and the mounting frame 150 is fixed on the cover plate 120. Therefore, the piezoceramic fan 130 is fixed by the mounting frame 150, and the direct assembly of the piezoceramic fan 130 on the cover plate 120 is avoided, and no additional fixing mechanism is required to be processed on the cover plate 120. Specifically, when the mounting frame 150 is detachably fixed to the cover plate 120, the detachable mounting of the piezoceramic fan 130 is achieved.

It can be understood that the heat dissipation fins 121 are not disposed on the region of the cover plate 120 corresponding to the mounting frame 150, so as to fix the mounting frame 150, the mounting frame 150 may be made of a heat conductive metal, for example, a drawn aluminum profile, and when the mounting frame 150 is fixed, at least a portion of the cover plate 120 is attached to the mounting frame 150 and contacts with the cover plate 120, so that heat dissipation may be achieved through the mounting frame 150, and the influence of the mounting frame 150 on heat dissipation may be reduced. The mounting frame can also be provided with heat dissipation fins corresponding to the heat dissipation fins 121, so that the mounting frame 150 can be shielded to be integrated into the cover plate 120 in appearance, and the heat dissipation of the mounting frame 150 can be improved.

Referring to fig. 5 and 6, in a specific embodiment, the mounting frame 150 includes a bottom plate 151 and side plates 153, the side plates 153 are fixedly connected to the bottom plate 151, and a groove 150a is formed by the bottom plate 151 and the side plates 153 in an enclosing manner, the piezoelectric ceramic fan 130 is disposed in the groove 150a, at least one side plate 153 is provided with a vent hole, and the vent hole communicates the groove 150a with a gap between the heat dissipation fins 121, so that when the piezoelectric ceramic fan 130 works, air in the gap between the heat dissipation fins 121 can be driven to flow, and heat dissipation is further improved. For example, two opposing side plates 153 may be provided with vent holes, and the piezoceramic fan 130 is disposed in the recess 150a, and in operation, an air flow enters the recess 150a from the vent hole on one side plate 153 and exits from the vent hole on the other side plate 153, thereby achieving air flow.

The bottom plate 151 is provided with a positioning column 155 and a fixing buckle 157, the positioning column 155 is provided with a positioning groove 155a, the piezoceramic fan 130 is at least partially embedded into the positioning groove 155a, the fixing buckle 157 is provided with a groove 157a, and when the piezoceramic fan 130 is embedded into the positioning groove 155a, at least part of the piezoceramic fan is accommodated in the groove 157 a. Therefore, the piezoelectric ceramic fan 130 can be detachably connected with the mounting frame 150 through the positioning column 155 and the fixing buckle 157. In a specific embodiment, two positioning posts 155 are provided, the two positioning posts 155 are disposed opposite to each other, two ends of the piezoceramic fan 130 are respectively embedded into the positioning grooves 155a of the two positioning posts 155, and the middle portion of the piezoceramic fan passes through the groove 157a of the fixing buckle 157, so that the piezoceramic fan is fixed on the bottom plate 151 by the fixing buckle 157. Therefore, on one hand, the assembly of the piezoceramic fan 130 and the mounting buckle is facilitated, and the arrangement of the fixing buckle 157 can also prevent the piezoceramic fan 130 from being separated from the positioning groove 155a and falling off when the mounting rack 150 is buckled on the cover plate 120.

In other embodiments, the piezoceramic fan 130 is directly disposed in the gap between two adjacent heat dissipation fins 121, and the amplitude of the oscillation of the piezoceramic fan 130 is controlled by controlling the magnitude of the signal output by the driving board 140, so as to prevent the piezoceramic sheet from touching the heat dissipation fins 121 during the vibration process. When the piezoelectric ceramic fans 130 are uniformly arranged among the heat dissipation fins 121 at a certain density, the piezoelectric ceramic fans 130 work together to perform a strong air convection effect, thereby promoting heat dissipation from the gaps among the heat dissipation fins 121.

The driving board 140 may be directly disposed on the cover plate 120, so as to be electrically connected to the piezoceramic fan 130, and avoid messy wiring.

Referring to fig. 7, the driving board 140 is provided with a driving circuit 141, and the driving circuit 141 includes a controller MCU, a first switch Q1, a second switch Q2, a third switch Q3, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, and a fifth resistor R5. The base electrode of the first switch tube Q1 is connected to the controller MCU through a first resistor R1, the controller MCU outputs high and low level signals to control the on and off of the first switch tube Q1, the collector electrode of the first switch tube Q1 is connected with a power input Vin through a second resistor R2, and the emitter electrode is grounded through a third resistor R3; one end of the fourth resistor R4 is connected to the common connection point of the first switch tube Q1 and the second resistor R2; the base electrode of the second switching tube Q2 is connected to the other end of the fourth resistor R4, the collector electrode is connected with the power input Vin, and the emitter electrode is connected to the piezoceramic fan 130 through the fifth resistor R5; the base of the third switch tube Q3 is connected to the other end of the fourth resistor R4, the collector is grounded, and the emitter is connected to the piezoceramic fan 130 through the fifth resistor R5.

When the controller MCU outputs a low level signal, the first switch Q1 is turned off, the power input Vin outputs a 12V voltage, the voltage across the fourth resistor R4 is pulled high, the base of the second switch Q2 receives a high voltage and is turned on, the third switch Q3 is turned off, the voltage across the fifth resistor R5 is pulled high, and a high level is output to the piezoceramic fan 130. When the controller MCU outputs a high level signal, the first switch Q1 is turned on, the voltage of the fourth resistor R4 is pulled low, the base of the third switch Q3 receives a low voltage and is turned on, the second switch Q2 is turned off, the voltage of the fifth resistor R5 is pulled low, and a low level is output to the piezoceramic fan 130. The piezo fan 130 vibrates the piezo by receiving the high and low levels, thereby enhancing the heat exchange between the air between the heat dissipation fins 121 and the external air.

Referring to fig. 7, in one or more embodiments, the power supply box 10 further includes a temperature sensor 160, the temperature sensor 160 is disposed in the cavity 110a and electrically connected to the driving circuit 141 on the driving board 140, and the temperature sensor 160 controls the operation of the piezoceramic fan 130 through the driving circuit 141. For example, the controller MCU is electrically connected to the controller, and controls the output of the high/low level signal according to the temperature sensing signal of the temperature sensor 160, so as to control the operation of the piezoceramic fan 130. For example, the controller MCU may output a high/low level signal only when the temperature exceeds a preset value. The temperature sensor 160 may sense the temperature of the air in the cavity 110a to control the high and low level signal output of the controller, and may also sense the temperature of the box frame 110 or the cover 120 to control the high and low level signal output of the controller.

Referring to fig. 3, in one or more embodiments, the power box 10 further includes a switching power supply 170, and the switching power supply 170 is directly disposed on an inner sidewall of the cover plate 120. When the power supply box 10 works, the switching power supply 170 is a main heating component, and the switching power supply 170 is directly arranged on the inner side wall of the cover plate 120, so that heat emitted by the switching power supply 170 is directly conducted to the cover plate 120, and the temperature in the power supply box 10 is favorably reduced.

Referring to fig. 8, in some embodiments, the power box 10 may further include a thermal conductive adhesive layer 180, the thermal conductive adhesive layer 180 is disposed around the switching power supply 170, and the switching power supply 170 is encapsulated in the inner sidewall of the cover plate 120. Through setting up heat-conducting glue layer 180 to encapsulate switching power supply 170 to the inside wall of apron 120 through heat-conducting glue layer 180, switching power supply 170's heat can be conducted on apron 120 through heat-conducting glue, increased the area of contact between switching power supply 170 and the heat-conducting component, be favorable to switching power supply 170's heat dissipation itself, simultaneously, also increased the area of apron 120 contact heat source, be favorable to apron 120's heat dissipation. Therefore, heat generated by the switching power supply 170 is hardly dissipated into the power supply box 10 and is almost conducted to the cover plate 120 through the heat-conducting adhesive layer 180, so that the phenomenon that the temperature in the power supply box 10 is too high to influence the work of other electronic components is avoided.

Referring to fig. 8, in one or more embodiments, the power supply box 10 further includes a heat insulation board 190, and the heat insulation board 190 is disposed in the cavity 110a and used for isolating the switching power supply 170 from other electronic components in the cavity 110 a. By providing the heat shield 190, the heat transfer from the switching power supply 170 to other electronic components can be reduced, and the temperature of the operating environment of other electronic components can be reduced as much as possible. In a laboratory test environment, the temperature of the side of the thermal shield 190 facing away from the switching power supply 170 may be reduced by about 5 ℃ as compared to the side without the thermal shield 190.

In the power supply box 10, the heat dissipation fins 121 and the piezoelectric ceramic fan 130 are arranged on the side of the cover plate 120 away from the cavity 110a, the heat dissipation fins 121 ensure that the power supply box 10 has high basic heat dissipation capacity, the piezoelectric ceramic fan 130 is arranged corresponding to the heat dissipation fins 121, the drive board 140 drives the piezoelectric ceramic fan 130 to work, and the piezoelectric ceramic fan 130 vibrates, so that air between the heat dissipation fins 121 flows, heat between the heat dissipation fins 121 is taken away by the air flow, a heat dissipation effect can be enhanced, the heat dissipation capacity can be enhanced to a certain extent on the basis of determining the heat dissipation capacity of the power supply box 10 through adjustment of the piezoelectric ceramic fan 130, and the problem that the heat dissipation capacity is limited is solved.

An embodiment of the present application still provides an L ED box, and L ED box includes display module assembly, box frame and power pack, and display module assembly is fixed in the display surface of box frame, and the power pack is fixed in the back of box frame, and the power pack can be the power pack 10 of any above-mentioned embodiment.

Because L ED box possesses the power pack, therefore, the beneficial effect that the power pack possessed, L ED box also possesses correspondingly.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A power supply box is characterized by comprising a box body frame, a cover plate, a piezoelectric ceramic fan and a driving plate, wherein,

2. The power pack of claim 1, further comprising a mounting bracket, wherein the piezo ceramic fan is removably mounted to the mounting bracket, and wherein the mounting bracket is secured to the cover plate.

3. The power pack of claim 2, wherein the mounting bracket comprises a bottom plate and side plates, the side plates are fixedly connected to the bottom plate and surrounded by the bottom plate and the side plates to form a groove, the piezoceramic fan is arranged in the groove, at least one side plate is provided with a vent hole, and the vent hole communicates the groove with a gap between the heat dissipation fins.

4. The power pack of claim 3, wherein the bottom plate has a positioning post and a retaining buckle, the positioning post has a positioning groove, the piezo-ceramic fan is at least partially inserted into the positioning groove, the retaining buckle has a groove, and the piezo-ceramic fan is at least partially received in the groove when inserted into the positioning groove.

5. The power pack of claim 1, wherein the piezo ceramic fan is disposed in a gap between two adjacent heat sink fins.

6. The power pack of claim 1, wherein the driving board is provided with a driving circuit, and the driving circuit comprises a controller, a first switch tube Q1, a second switch tube Q2, a third switch tube Q3, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a fifth resistor R5;

7. The power pack of claim 6, further comprising a temperature sensor disposed in said cavity and electrically connected to a drive circuit on said drive board, said temperature sensor controlling operation of said piezo ceramic fan via said drive circuit.

8. The power pack of claim 1, further comprising a switching power supply and a heat conductive adhesive layer, wherein the switching power supply is disposed on the inner sidewall of the cover plate, and the heat conductive adhesive layer is disposed around the switching power supply and encapsulates the switching power supply on the inner sidewall of the cover plate.

9. The power pack of claim 8, further comprising a heat shield disposed within the cavity for isolating the switching power supply from electronic components within the cavity.

10. An L ED case comprising a display module, a case frame, and a power supply box, wherein the display module is fixed on the display surface of the case frame, and the power supply box is fixed on the back surface of the case frame, and the power supply box is the power supply box of any one of claims 1-9.