CN211127125U - Electronic assembly - Google Patents

Electronic assembly Download PDF

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Publication number
CN211127125U
CN211127125U CN201922489495.XU CN201922489495U CN211127125U CN 211127125 U CN211127125 U CN 211127125U CN 201922489495 U CN201922489495 U CN 201922489495U CN 211127125 U CN211127125 U CN 211127125U
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China
Prior art keywords
metal plate
circuit board
pin
short
circuit
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CN201922489495.XU
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Chinese (zh)
Inventor
张志超
秦中杰
黄炜
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Shanghai Chuanggong Telecom Technology Co Ltd
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Shanghai Chuanggong Telecom Technology Co Ltd
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Priority to CN201922489495.XU priority Critical patent/CN211127125U/en
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Abstract

The utility model relates to a mobile terminal field discloses an electronic component. The utility model comprises a circuit board, a first metal plate, a second metal plate, a first short circuit pin and a second short circuit pin; the first short circuit pin is used for short-circuiting the circuit board, the first metal plate and the second metal plate; the second shorting pin shorts any two of the circuit board, the first metal plate, and the second metal plate. An object of the utility model is to provide an electronic component for can solve the too big problem of local electric current on circuit board or the metal sheet among the solution mobile terminal.

Description

Electronic assembly
Technical Field
The utility model relates to a mobile terminal field, in particular to electronic component.
Background
At present, the popularization of mobile terminals is higher and higher, the design of antennas is gradually becoming a mainstream design scheme through the matching of circuit boards and metal plates in the mobile terminals, however, some key devices and wires in the antennas have higher requirements on the currents of the circuit boards and the metal plates, higher local currents cannot occur, and some key devices and wires in the antennas have higher electromagnetic compatibility, so that the electromagnetic interference on the wires and the key devices in the antennas is increased. The local current is large, which reduces the quality of the mobile terminal and affects the normal operation of the whole mobile terminal, so it is important to effectively suppress the local excessive current value.
The inventor finds that at least the following problems exist in the prior art: a circuit board and a metal plate in the conventional mobile terminal sometimes have a series of problems of excessive local current value, heat generation and the like, and the service life of a battery and other devices of the terminal is shortened.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic component for can solve the too big problem of local electric current on circuit board or the metal sheet among the solution mobile terminal.
In order to solve the above technical problem, an embodiment of the present invention provides an electronic component, including a circuit board, a first metal plate, a second metal plate, a first shorting pin, and a second shorting pin; the first short circuit pin is used for short-circuiting the circuit board, the first metal plate and the second metal plate; the second shorting pin shorts any two of the circuit board, the first metal plate, and the second metal plate.
The utility model discloses embodiment is through adding and establishing the second short circuit needle for prior art, makes arbitrary both in second short circuit needle short circuit board, first metal sheet and the second metal sheet, with the first metal sheet or the second metal sheet of the too big electric current drainage to ground connection on circuit board, first metal sheet and the second metal sheet to reduce the local electric current on circuit board, first metal sheet or the second metal sheet.
In addition, the second metal plate is sandwiched between the circuit board and the first metal plate.
In addition, the second short-circuit pin short-circuits the circuit board and the first metal plate. When the local current on the circuit board is too large, the second short circuit pin is used for short-circuiting the circuit board and the first metal plate, and the too large local current on the circuit board is drained to the first metal plate so as to reduce the too large local current on the circuit board.
In addition, the second short-circuit pin short-circuits the circuit board and the second metal plate. When the local current on the circuit board is too large, the second short circuit pin is used for short-circuiting the circuit board and the second metal plate, and the too large local current on the circuit board is drained to the second metal plate so as to reduce the too large local current on the circuit board.
In addition, the second short-circuit pin short-circuits the first metal plate and the second metal plate. When the local current of one of the first metal plate and the second metal plate is overlarge, the second short circuit pin is used for short-circuiting the first metal plate and the second metal plate, and the overlarge local current is drained to the other metal plate so as to reduce the local current.
In addition, a second shorting pin is provided at a position 1 to 10mm from the first shorting pin. And a second short-circuit needle is arranged at a preset position, so that the local current reduction effect is better.
In addition, the second shorting pin is a plurality of. And a plurality of second short-circuit pins are additionally arranged, so that the effect of reducing local current is improved.
In addition, the second shorting pin has a lower resistance than the first shorting pin. The second short circuit pin with lower resistance is used to improve the reduction effect of local current.
Drawings
Fig. 1 is a schematic structural view of an electronic module according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of an electronic module according to a first embodiment of the present invention;
fig. 3 is a schematic structural view of an electronic module according to a first embodiment of the present invention;
fig. 4 is a schematic structural view of an electronic assembly according to a second embodiment of the present invention;
fig. 5 is a schematic structural view of an electronic module according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic component according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following will explain in detail each embodiment of the present invention with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to an electronic component. The core of the embodiment is that the circuit board comprises a circuit board 1, a first metal plate 2, a second metal plate 3, a first short circuit pin 4 and a second short circuit pin 5; the first short-circuit pin 4 is used for short-circuiting the circuit board 1, the first metal plate 2 and the second metal plate 3; the second shorting pin 5 shorts any two of the circuit board 1, the first metal plate 2, and the second metal plate 3. Through additionally arranging the second short circuit pin 5, the second short circuit pin is enabled to be in short circuit with any two of the circuit board 1, the first metal plate 2 and the second metal plate 3, and overlarge current on the circuit board 1, the first metal plate 2 and the second metal plate 3 is led to the first metal plate 2 or the second metal plate 3 which is grounded, so that local current on the circuit board 1, the first metal plate 2 or the second metal plate 3 is reduced. The following detailed description of the present embodiments is provided for ease of understanding and is not intended to limit the scope of the present embodiments.
The first metal plate 2 and the second metal plate 3 are both grounded.
As shown in fig. 1, the second metal plate 3 is sandwiched between the circuit board 1 and the first metal plate 2. It should be noted that, for convenience of understanding and description, the second metal plate 3 is sandwiched between the circuit board 1 and the first metal plate 2 in this embodiment as an example, and the positional relationship between the circuit board 1, the first metal plate 2, and the second metal plate 3 is not specifically limited in this embodiment. The first shorting pin 4 is in contact with the circuit board 1, the first metal plate 2, and the second metal plate 3, respectively, and short-circuits the circuit board 1, the first metal plate 2, and the second metal plate 3. When the local current on the circuit board 1 is too large, the second short-circuit pin 5 is used for short-circuiting the circuit board 1 and the first metal plate 2, and the too large local current on the circuit board 1 is drained to the first metal plate 2 so as to reduce the too large local current on the circuit board 1. The second shorting pin 5 is in contact with only the circuit board 1 and the first metal plate 2 to prevent local current from being conducted to the second metal plate 3.
As shown in fig. 2, when the local current on the circuit board 1 is too large, the second shorting pin 5 can also be used to short the circuit board 1 and the second metal plate 3 to drain the too large local current on the circuit board 1 to the second metal plate 3, so as to reduce the too large local current on the circuit board. The second shorting pin 5 is only in contact with the circuit board 1 and the second metal plate 3 to prevent local current from being conducted to the first metal plate 2.
As shown in fig. 3, when the local current of one of the first metal plate 2 and the second metal plate 3 is too large, the second shorting pin 5 is used to short-circuit the first metal plate 2 and the second metal plate 3, so as to conduct the too large local current to the other metal plate, thereby reducing the local current. The second shorting pin 5 is only in contact with the first and second metal plates 2, 3 to prevent local current from being conducted to the circuit board 1.
Preferably, the second shorting pin 5 is provided at a position 1 to 10mm from the first shorting pin 4. Through repeated experiments, the second short-circuit pin is arranged at a position 1-10 mm away from the first short-circuit pin 4, and the effect of reducing the local current is better.
Preferably, the second shorting pin 5 has a lower electrical resistance than the first shorting pin 4. The smaller the resistance of the second shorting pin 5, the better the effect of draining local excess current. The effect of reducing the local current is improved by using the second shorting pin 5 having a lower resistance.
A second embodiment of the present invention relates to an electronic component. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: in the third embodiment of the present invention, the second shorting pin 5 is provided in plurality.
It should be noted that, for convenience of understanding and explanation, the embodiment takes the case of providing two second shorting pins 5 as an example, and the embodiment does not specifically limit the number of the plurality of second shorting pins 5.
As shown in fig. 4, when the local current on the circuit board 1 is too large, two second shorting pins 5 arranged side by side are used to short-circuit the circuit board 1 and the first metal plate 2, so as to conduct the too large local current on the circuit board 1 to the first metal plate 2, thereby reducing the too large local current on the circuit board 1. The second shorting pin 5 is in contact with only the circuit board 1 and the first metal plate 2 to prevent local current from being conducted to the second metal plate 3.
As shown in fig. 5, when the local current on the circuit board 1 is too large, the circuit board 1 and the second metal plate 3 may be shorted by using two second shorting pins 5, so that the too large local current on the circuit board 1 is drained to the second metal plate 3, so as to reduce the too large local current on the circuit board. The second shorting pin 5 is only in contact with the circuit board 1 and the second metal plate 3 to prevent local current from being conducted to the first metal plate 2.
As shown in fig. 6, when the local current of one of the first metal plate 2 and the second metal plate 3 is too large, the first metal plate 2 and the second metal plate 3 are shorted by using two second shorting pins 4, and the too large local current is drained to the other metal plate to reduce the local current. The second shorting pin 5 is only in contact with the first and second metal plates 2, 3 to prevent local current from being conducted to the circuit board 1.
In this embodiment, the effect of reducing the local current is improved by additionally providing a plurality of second shorting pins 5.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application.

Claims (10)

1. An electronic assembly, comprising: the circuit board, the first metal plate, the second metal plate, the first short-circuit pin and the second short-circuit pin;
the first short circuit pin is used for short-circuiting the circuit board, the first metal plate and the second metal plate;
the second shorting pin shorts any two of the circuit board, the first metal plate, and the second metal plate.
2. The electronic assembly of claim 1, wherein the second metal plate is sandwiched between the circuit board and the first metal plate.
3. The electronic assembly of claim 2, wherein the second shorting pin shorts the circuit board to the first metal plate.
4. The electronic assembly of claim 2, wherein the second shorting pin shorts the circuit board to the second metal plate.
5. The electronic assembly of claim 2, wherein the second shorting pin shorts the first metal plate to the second metal plate.
6. The electronic assembly of claim 1, wherein the second shorting pin is disposed at a distance of 1 to 10mm from the first shorting pin.
7. The electronic component according to any one of claims 1 to 5, wherein the second shorting pin is plural.
8. The electronic assembly of any of claims 1 to 6, wherein the first shorting pin and the second shorting pin are each cylindrical shorting probes.
9. The electronic component of claim 1, wherein the first metal plate and the second metal plate are grounded.
10. The electronic assembly of claim 1, wherein the second shorting pin has a lower resistance than the first shorting pin.
CN201922489495.XU 2019-12-30 2019-12-30 Electronic assembly Active CN211127125U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922489495.XU CN211127125U (en) 2019-12-30 2019-12-30 Electronic assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922489495.XU CN211127125U (en) 2019-12-30 2019-12-30 Electronic assembly

Publications (1)

Publication Number Publication Date
CN211127125U true CN211127125U (en) 2020-07-28

Family

ID=71705577

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922489495.XU Active CN211127125U (en) 2019-12-30 2019-12-30 Electronic assembly

Country Status (1)

Country Link
CN (1) CN211127125U (en)

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