CN211108640U - Chip packing box - Google Patents

Abstract

The application discloses chip packaging box, this chip packaging box include the box body, be provided with the holding chamber in the box body, the holding chamber is used for acceping the chip, the bottom in holding chamber be provided with along what the lateral part in holding chamber upwards extended is used for acceping the pin groove of chip pin, the quantity in pin groove with the quantity correspondence of chip pin equals for place the chip pin. The utility model provides a packing carton is provided with the pin groove through the holding intracavity at the box body, and the quantity in pin groove equals with the pin quantity of chip, when placing the chip into the cavity, makes each pin of chip accept respectively in each pin inslot. When the packaging box with the chips is transported, even under the influence of uncontrollable factors such as external force, the pins of the chips can still be staggered, so that the pins of each chip are protected from being damaged.

Description

Chip packing box

Technical Field

The application relates to the technical field of chip packaging, in particular to a chip packaging box.

Technical Field

Currently, when a factory or an agent provides a few samples to a customer, the general MCU (micro controller Unit) has a variety of common packaging methods, such as an antistatic bag package, a braid package, a Tray package, and the like. The common packaging mode with lower cost mainly comprises the following steps: and (3) a packaging mode of anti-static sponge embedded in the paper box. The chip packaging box comprises a box body and a cover body, the box body further comprises a sponge with the size equal to that of the box body, the chip is placed into the box body and attached to the sponge, the cover body is closed, and chip packaging is completed. However, due to external forces during transportation, such as human loss, the chip in the case and the leads of the chip contact each other, which eventually causes the leads of the chip to be distorted and damaged, and the chip product is finally unusable.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects existing in the prior art, the main object of the present application is to provide a packaging box capable of preventing chip pins from being damaged.

In order to achieve the above purpose, the following technical solutions are specifically adopted in the present application:

the application provides a chip packaging box, this chip packaging box includes the box body, be provided with the holding chamber in the box body, the holding chamber is used for acceping the chip, the bottom in holding chamber be provided with along what the lateral part in holding chamber upwards extended is used for acceping the pin groove of chip pin, the quantity in pin groove with the quantity correspondence of chip pin equals.

Preferably, the box body comprises a bottom shell, an upper cover and a carrier, the carrier is detachably arranged in the bottom shell, the accommodating cavity is formed in the carrier, and the upper cover covers the bottom shell.

Preferably, the box body further comprises a cover body, the cover body comprises a body and a protruding portion, the protruding portion is arranged on one side face of the body and is correspondingly matched with the containing cavity, and when the cover body covers the upper surface of the carrier, the protruding portion is contained in the containing cavity.

Preferably, the accommodating cavities are distributed on the carrier in a two-dimensional array.

Preferably, the protruding portion is provided with a plurality of protruding portions, and the positions of the plurality of protruding portions and the positions of the plurality of accommodating cavities are respectively arranged correspondingly.

Preferably, the upper cover is rotatably connected with the bottom case.

Preferably, the carrier is made of a material with adsorptivity and antistatic property.

Preferably, the carrier is made of sponge.

Preferably, the length of the pin slot is less than or equal to the length of the chip pin.

Preferably, the depth of the pin groove is smaller than that of the accommodating cavity.

Compared with the prior art, the packaging box is provided with the pin grooves in the containing cavity for containing the chip, the number of the pin grooves is equal to that of the pins of the chip, and when the chip is placed in the containing cavity, the pins of the chip are contained in the pin grooves respectively. When the packaging box with the chips is transported, even under the influence of uncontrollable factors such as external force, the pins of the chips can still be staggered, and the pins of each chip are protected from being damaged.

Drawings

Fig. 1 is a perspective view of a cassette including an embodiment of the present application.

Fig. 2 is a perspective view of a carrier according to an embodiment of the present application.

Fig. 3 is a perspective view of a cover according to an embodiment of the present application.

The attached drawings are as follows:

1-box body;

11-a bottom shell;

110-a cavity;

12-upper cover;

121-a cover plate;

122-a first side panel;

123-a second side plate;

124-third side plate;

13-a carrier;

131-an accommodating cavity;

132-a pin slot;

133-channel;

134-a stop;

14-a cover body;

141-a body;

142-a boss.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

As shown in fig. 1 and 2, the present application discloses a chip packaging box, which includes a box body 1, wherein a plurality of accommodating cavities 131 are provided in the box body 1, the shapes of the accommodating cavities 131 are matched with the shapes of the chips, the sizes of the accommodating cavities 131 are slightly larger than the sizes of the chips for accommodating the chips, a plurality of pin grooves 132 extending upwards along the side portions of the accommodating cavities 131 for accommodating the pins of the chips are provided at the bottom of the accommodating cavities 131, and the pin grooves 132 are formed by a plurality of stoppers 134 at intervals. The number of the lead slots 132 is equal to the number of the chip leads, and is used for accommodating the chip leads. When the chip is placed in the accommodating cavity 131, the leads of the chip are respectively accommodated in the corresponding lead grooves 132, so that the leads of the chip are separated from each other. And then make this packing carton of being equipped with the chip in the in-process of transporting, even receive under the influence of uncontrollable factors such as external force, each pin of chip still can stagger each other, and then the pin of protection each chip self is not impaired.

Specifically, the length of the pin slot 132 is less than or equal to the length of the chip pin, the depth of the pin slot 132 is less than the depth of the accommodating cavity 131, the depth of the pin slot 132 is the vertical distance from the top of the stopper 134 to the bottom of the pin slot 132, the depth of the accommodating cavity 131 is the vertical distance from the upper surface of the carrier 13 to the bottom of the accommodating cavity 131, and the bottom of the pin slot 132 and the bottom of the accommodating cavity 131 are in the same horizontal plane; the width of the lead slot 132 is slightly larger than the width of the chip lead, and is used for accommodating the lead of the chip. This application is through the length that makes the length of pin groove 132 be less than or equal to the chip pin, is in order to make things convenient for the chip to put into holding chamber 131, avoids withholding the chip body because of pin groove 132 overlength, and then leads to the pin of chip to get into smoothly in the corresponding pin groove 132. The reason why the depth of the pin groove 132 is smaller than the depth of the receiving cavity 131 is that if the depth of the pin groove 132 is equal to or greater than the depth of the receiving cavity 131, the protrusion 142 of the cover 14 cannot be engaged with the receiving cavity 131. By making the width of the lead slot 132 slightly larger than the width of the chip lead, the lead slot 132 is conveniently accommodated in the lead slot 132, or the chip lead is taken out from the lead slot 132.

Specifically, the cartridge 1 includes a bottom case 11, an upper cover 12, and a carrier 13. The bottom case 11 has a cavity 110, a plurality of accommodating cavities 131 are arranged on the upper surface of the carrier 13 in a two-dimensional array, a channel 133 is formed between two adjacent accommodating cavities 131, and the width of the channel 133 is smaller than that of the chip. During assembly, the carrier 13 is detachably disposed in the cavity 110 of the bottom housing 11, and one side of the upper cover 12 is rotatably connected to the bottom housing 11, so that the upper cover 12 can be opened or closed on the bottom housing 11.

In order to close the upper cover 12 and the bottom case 11 more tightly, the upper cover 12 includes a cover plate 121, a first side plate 122, a second side plate 123 and a third side plate 124, one side of the cover plate 121 is rotatably connected to one side of the bottom case 11, so that the cover plate 121 can be folded on the top of the bottom case 11, the first side plate 122 and the second side plate 123 are disposed at two opposite sides of the cover plate 121, and the third side plate 124 is disposed at an opposite side of the cover plate 121 rotatably connected to the bottom case 11. When the upper cover 12 is covered on the bottom case 11, the lower surface of the cover plate 121 is in close contact with the top of the bottom case 11, and the first side plate 122, the second side plate 123 and the third side plate 124 are in close contact with the side of the bottom case 11.

As shown in fig. 3, the box 1 further includes a cover 14, the cover 14 includes a body 141 and a plurality of protrusions 142, the plurality of protrusions 142 are disposed on a side of the body 141, and the shapes and positions of the plurality of protrusions 142 are respectively matched with the shapes and positions of the plurality of accommodating cavities 131, the size of the protrusion 142 is slightly smaller than the size of the accommodating cavity 131, so that the protrusion 142 can enter the accommodating cavity 131, and meanwhile, the thickness of the protrusion 142 plus the thickness of the chip is just equal to the depth of the accommodating cavity. When the chip is packaged, the chip is placed in the accommodating cavity 131 in the carrier 13, so that each pin of the chip is respectively accommodated in the corresponding pin slot 132, and then the cover 14 is placed on the upper surface of the carrier 13, so that each protruding portion 142 is accommodated in each accommodating cavity 131, and at this time, the distance between the protruding portion 142 and the upper surface of the chip is zero. Then the upper cover 12 is covered. This application makes the chip be located between carrier 13 and the lid 14 through the setting of lid 14, makes the chip unable slide at will, prevents that box body 1 from making the chip rock and receive the damage because of receiving external force.

In order to further ensure the safety of the chip package, the carrier 13 and the cover 14 are made of adsorptive and antistatic materials, and preferably, the carrier 13 is made of sponge to prevent the chips from sliding in the accommodating cavities 131.

The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The chip packaging box is characterized by comprising a box body, wherein a containing cavity is formed in the box body and used for containing chips, pin grooves which extend upwards along the side portions of the containing cavity and are used for containing chip pins are formed in the bottom of the containing cavity, and the number of the pin grooves is equal to that of the chip pins correspondingly.

2. The chip packaging box according to claim 1, wherein the box body comprises a bottom shell, an upper cover and a carrier, the carrier is detachably arranged in the bottom shell, the accommodating cavity is arranged in the carrier, and the upper cover covers the bottom shell.

3. The chip packaging box according to claim 2, wherein the box body further comprises a cover body, the cover body comprises a body and a protrusion portion, the protrusion portion is arranged on one side face of the body and correspondingly matched with the accommodating cavity, and when the cover body covers the upper surface of the carrier, the protrusion portion is accommodated in the accommodating cavity.

4. The chip packaging box according to claim 3, wherein the accommodating cavities are provided in plurality, and the accommodating cavities are distributed on the carrier in a two-dimensional array.

5. The chip packaging box according to claim 4, wherein the protruding portion is provided in a plurality, and the positions of the plurality of protruding portions and the positions of the plurality of accommodating cavities are respectively arranged correspondingly.

6. The chip package of claim 2, wherein the upper cover is rotatably coupled to the bottom case.

7. The chip packaging box of claim 2, wherein the carrier is made of a material having adsorptivity and antistatic property.

8. The chip packaging box according to claim 7, wherein the carrier is made of sponge.

9. The chip packaging case of claim 1, wherein the length of the lead slot is less than or equal to the length of the chip lead.

10. The chip package of claim 1, wherein the depth of the pin slot is less than the depth of the receiving cavity.

Images