CN211106645U - Steel seal processing device - Google Patents

Steel seal processing device Download PDF

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Publication number
CN211106645U
CN211106645U CN201921637438.5U CN201921637438U CN211106645U CN 211106645 U CN211106645 U CN 211106645U CN 201921637438 U CN201921637438 U CN 201921637438U CN 211106645 U CN211106645 U CN 211106645U
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China
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hole
upright
upright post
seal
abutting
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CN201921637438.5U
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Chinese (zh)
Inventor
罗伟民
李�荣
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Unimos Microelectronics(shanghai) Ltd
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Unimos Microelectronics(shanghai) Ltd
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Abstract

The embodiment of the utility model discloses embossed seal processingequipment, the device, include: the device comprises a mounting frame, a steel printing mechanism and a plurality of auxiliary positioning mechanisms. The mounting bracket is provided with an accommodating space for placing the chip ring. The fixed setting of embossed seal mechanism is on the mounting bracket, and embossed seal mechanism includes: first telescoping device and embossed seal pressure head, first telescoping device are used for driving the embossed seal pressure head and are close to or keep away from the chip ring of placing in the accommodation space, process the embossed seal to the chip ring. A plurality of auxiliary positioning mechanism are all fixed to be set up on the mounting bracket, and a plurality of auxiliary positioning mechanism include: the second telescopic devices are used for driving the fixing modules to be close to or far away from the chip ring in the accommodating space, and are used for fixing the chip ring to ensure that the processed steel seal is clear and complete. The utility model provides a steel seal processingequipment can process clear distinguishable steel seal to the chip ring.

Description

Steel seal processing device
Technical Field
The utility model relates to a product processing equipment technical field, concretely relates to embossed seal processingequipment.
Background
In the packaging process of the chip, the chip is placed in a chip ring to carry out a series of processing procedures, a part of the chip needs to use UV adhesive cloth in the processing process, the viscosity of the UV adhesive cloth is strong to ensure the stability and the quality during the operation of a cutting station, and the viscosity of the UV adhesive cloth needs to be reduced before the chip flows to the next station after the operation of the cutting station is finished.
At present, in the packaging process of the chip, no equipment for marking a chip ring exists. So that once the product to be irradiated with UV has been irradiated, it flows to the next station without being irradiated, in which case the direct machining of the product to be irradiated without irradiation leads to the failure of the product and even more so to the breakage of the product.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a embossed seal processingequipment installs clear distinguishable embossed seal additional for the chip ring to realize the function of mark chip ring.
The embodiment of the utility model provides an embossed seal processingequipment for to chip ring processing embossed seal, include: the device comprises a mounting frame, a steel printing mechanism and a plurality of auxiliary positioning mechanisms;
the embossed seal mechanism comprises: the first telescopic device and the steel seal press head;
each auxiliary positioning mechanism comprises: the second telescopic device and the fixed module;
the mounting bracket includes: a top plate, a bottom plate and a plurality of upright posts;
one end of each upright post is fixedly connected with the top plate, the other end of each upright post is fixedly connected with the bottom plate, and the top plate, the bottom plate and the upright posts form an accommodating space for accommodating a chip ring;
the first telescopic device is fixed on the top plate and used for driving the steel seal pressing head to be close to or far away from the chip ring in the accommodating space;
each second telescopic device is fixed on the top plate and used for driving each fixing module to be close to or far away from the chip ring of the accommodating space.
In one possible embodiment, each of the columns includes: the first upright column, the second upright column and the two first connecting pieces;
a plurality of first connecting holes are uniformly formed in the first upright column in the vertical direction;
the second upright post is sleeved outside the first upright post, so that the second upright post can move up and down relative to the first upright post, and the second upright post is provided with a second connecting hole;
the two first connecting pieces respectively penetrate through any two first connecting holes and the second connecting hole, so that the first upright post is fixedly connected with the second upright post.
In a possible solution, the first upright is provided with two sliding grooves, and the second upright is provided with two sliding blocks;
the two sliding blocks are slidably arranged in the two sliding grooves, so that the second upright post can slide up and down relative to the first upright post.
In one possible solution, the fixing module comprises: the first abutting part, the second abutting part, the first pin shaft, the second pin shaft and the second connecting part are arranged on the base;
the first abutting piece is provided with a first mounting hole, the second abutting piece is provided with a second mounting hole, the second connecting piece sequentially penetrates through the second mounting hole and the first mounting hole and is fixed at the bottom end of the telescopic rod of the second telescopic device, and the first abutting piece and the second abutting piece rotate by taking the second connecting piece as an axis; the bottom surface of the first abutting piece is flush with the bottom surface of the second abutting piece;
the first abutting piece is provided with two rows of first through holes at two sides of the first mounting hole, the second abutting piece is provided with two rows of second through holes at two sides of the second mounting hole respectively, and the positions of the two rows of first through holes correspond to the positions of the two rows of second through holes;
the first pin shaft is inserted into any one first through hole on one side and the second through hole corresponding to the first through hole, and the second pin shaft is inserted into any one first through hole on the other side and the second through hole corresponding to the first through hole, so that the first abutting piece and the second abutting piece are fixed.
In a possible solution, the first abutting member and the second abutting member are provided with a cushion pad on the bottom surface.
In one possible embodiment, the steel seal head is a five-pointed star steel seal head.
According to the above technical scheme, the utility model discloses a design an embossed seal processingequipment for to chip ring processing embossed seal, this embossed seal processingequipment includes: the device comprises a mounting frame, a steel printing mechanism and a plurality of auxiliary positioning mechanisms. The mounting bracket is provided with an accommodating space for placing the chip ring. The fixed setting of embossed seal mechanism is on the mounting bracket, and embossed seal mechanism includes: first telescoping device and embossed seal pressure head, first telescoping device are arranged in driving the embossed seal pressure head and are close to or keep away from the chip ring in the accommodation space, process the embossed seal to the chip ring. A plurality of auxiliary positioning mechanism are all fixed to be set up on the mounting bracket, and a plurality of auxiliary positioning mechanism include: the second telescopic devices are used for driving the fixing modules to be close to or far away from the chip ring in the accommodating space, and are used for fixing the chip ring to ensure that the processed steel seal is clear and complete. The utility model discloses a device that suitably processes embossed seal for chip ring has solved among the present chip packaging technology product and has not had any mark after shining the UV, and the product that leads to gets into the unable operation in the next post, and more the person can lead to the cracked problem of product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a front view of a steel seal processing device according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of a steel seal processing device according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a pillar according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fixing module according to a first embodiment of the present invention.
Reference numbers in the figures:
1. a mounting frame; 11. a top plate; 12. a base plate; 13. a column; 131. a first upright post; 1311. a first connection hole; 1312. a chute; 132. a second upright post; 1322. a slider; 1321. a second connection hole; 133. a first connecting member; 2. a steel printing mechanism; 21. a first telescoping device; 22. a steel seal press head; 3. an auxiliary positioning mechanism; 31. a second telescoping device; 32. a fixed module; 321. a first abutting member; 3211. a first mounting hole; 3212. a first through hole; 322. a second abutting member; 3221. a second mounting hole; 3222. a second through hole; 323. a first pin shaft; 324. a second pin shaft; 325. a second connecting member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The technical solution of the present invention will be described in detail with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Fig. 1 is the utility model provides an in the first elevation view of embossed seal processingequipment, fig. 2 is the utility model provides an in the first structural schematic diagram of embossed seal processingequipment, fig. 3 is the utility model provides a structural schematic diagram of stand in the first, fig. 4 is the utility model provides a in the first structural schematic diagram of fixed module. As shown in fig. 1 and 2, the steel seal processing device includes: the device comprises a mounting frame 1, a steel stamping mechanism 2 and a plurality of auxiliary positioning mechanisms 3.
The steel stamping mechanism 2 includes: a first telescoping device 21 and a stamp press 22. In this embodiment, the first telescoping device 21 can select telescopic cylinder, and embossed seal pressure head 22 can be dismantled with the catch bar bottom end of cylinder and be connected to embossed seal pressure head 22 can change as required the size, the shape of the sign of suppression.
Each auxiliary positioning mechanism 3 includes: a second telescopic device 31 and a fixed module 32. In this embodiment, the auxiliary positioning mechanism 3 is provided with two symmetrical positioning mechanisms, the bottom surface of the fixing module 32 is smooth, the chip ring is not physically damaged during fixing the chip ring, and the chip ring can be fixed more stably, so that the pressed mark is clear and complete.
The mounting bracket 1 includes: a top plate 11, a bottom plate 12 and a plurality of uprights 13. One end of each upright column 13 is fixedly connected with the top plate 11, the other end of each upright column is fixedly connected with the bottom plate 12, and the top plate 11, the bottom plate 12 and the upright columns 13 form an accommodating space for accommodating a chip ring. In this embodiment, the quantity of stand 13 is four, and even setting makes the mounting bracket easily take and make to place more stably between roof 11 and bottom plate 12.
The first telescopic device 21 is fixed on the top plate 11, and the first telescopic device 21 is used for driving the steel seal press head 22 to be close to or far away from the chip ring in the accommodating space. Each second expansion device 31 is fixed on the top plate 11, and each second expansion device 31 is used for driving each fixing module 32 to approach or leave the chip ring of the accommodating space. Specific speaking, first telescoping device and two second telescoping device are on same circumference, and evenly set up for steel seal processingequipment places stably, and two second telescoping device that the symmetry set up can more stable fixed chip ring, thereby make the mark of suppression clear, complete.
Through the content discovery that does not difficultly exist, the utility model discloses a design embossed seal processingequipment for to chip ring processing embossed seal, this embossed seal processingequipment includes: the device comprises a mounting frame, a steel printing mechanism and a plurality of auxiliary positioning mechanisms. The mounting bracket is equipped with the accommodation space that is used for placing the chip ring, and embossed seal mechanism is fixed to be set up on the mounting bracket, and embossed seal mechanism includes: first telescoping device and embossed seal pressure head, first telescoping device are used for driving the embossed seal pressure head and are close to or keep away from the chip ring, process the embossed seal to the chip ring. A plurality of auxiliary positioning mechanism are all fixed to be set up on the mounting bracket, and a plurality of auxiliary positioning mechanism include: the second telescopic devices are used for driving the fixing modules to be close to or far away from the chip ring of the accommodating space, and are used for fixing the chip ring to ensure that the processed steel seal is clear and complete. The utility model discloses a device that suitably processes embossed seal for chip ring has solved among the present chip packaging technology product and has not had any mark after shining the UV, and the product that leads to gets into the unable operation in the next post, and more the person can lead to the cracked problem of product.
Optionally, as shown in fig. 3, in the present embodiment, each of the columns 13 includes: a first upright 131, a second upright 132 and two first connectors 133. The terminal surface of first stand 131 and second stand 132 is the rectangle, and first stand 131 vertical direction evenly is equipped with a plurality of first connecting holes 1311, and first connecting hole here is the waist hole, and is easier when adjusting the upper and lower distance of first stand and second stand. The second upright 132 is sleeved outside the first upright 131, so that the second upright 132 can move up and down relative to the first upright 131, and the second upright 132 is provided with a second connecting hole 1321, where the second connecting hole is a long waist hole.
The two first connecting members 133 pass through any two of the first connecting holes 1311 and the second connecting holes 1321, respectively, to fixedly connect the first upright 131 with the second upright 132. More specifically, the two first connecting members 133 are both bolts and nuts, and when the height of the upright needs to be adjusted during use, the bolts are taken out, the first upright 131 is adjusted to a proper position, the bolts are inserted, and the nuts are screwed for fixing. Can adjust a plurality of stands to different heights simultaneously to make embossed seal processingequipment's accommodation space can adjust, make the embossed seal processingequipment of this embodiment can adapt to the different demands of processing station to the accommodation space size.
Optionally, in this embodiment, the first upright 131 is provided with two sliding grooves 1312, and the second upright 132 is provided with two sliding blocks 1322. The two slide blocks 1322 are slidably disposed in the two slide grooves 1312, so that the second vertical column 132 can slide up and down relative to the first vertical column 131. Two sliding grooves 1312 and two sliding blocks 1322 are symmetrically arranged, and the sliding grooves and the sliding blocks are both polished smoothly, so that the sliding blocks can conveniently slide in the sliding grooves, namely, the first upright column 131 can conveniently slide up and down relative to the second upright column 132 to adjust the height.
Optionally, as shown in fig. 4, in this embodiment, the fixing module 32 includes: a first abutting piece 321, a second abutting piece 322, a first pin 323, a second pin 324 and a second connecting piece 325. Wherein the front projections of the first and second supporting members are crescent, and the second connecting member 325 is a bolt.
The first abutting member 321 is provided with a first mounting hole 3211, the second abutting member 322 is provided with a second mounting hole 3221, and the second connecting member 325 sequentially passes through the second mounting hole 3221 and the first mounting hole 3211 and is fixed at the bottom end of the telescopic rod of the second telescopic device 31, so that the first abutting member 321 and the second abutting member 322 rotate around the second connecting member 325 as an axis. The first mounting hole 3211 and the second mounting hole 3221 are through holes, and the second connecting member 325 passes through the two mounting holes and fixes the first abutting member and the second abutting member at the bottom end of the telescopic rod, so that the first abutting member and the second abutting member can rotate to adjust the angle, and can move up and down along with the telescopic rod.
The bottom surface of the first supporting member 321 is flush with the bottom surface of the second supporting member 322, so as to ensure that the chip ring is uniformly stressed when the chip ring is pressed down.
The first abutting piece 321 is provided with two rows of first through holes 3212 on two sides of the first mounting hole 3211, the second abutting piece 322 is provided with two rows of second through holes 3222 on two sides of the second mounting hole 3221, and the positions of the two rows of first through holes 3212 correspond to the positions of the two rows of second through holes 3222;
the first pin 323 is inserted into any one of the first through holes 3212 on one side and the second through hole 3222 corresponding to the first through hole 3212, and the second pin 324 is inserted into any one of the first through holes 3212 on the other side and the second through hole 3222 corresponding to the first through hole 3212, so as to fix the first abutting member 321 and the second abutting member 322.
Specifically, in this embodiment, as shown in fig. 4, the first through holes 3212 are two rows, each row includes five through holes, one row is uniformly distributed on the left side of the first mounting hole 3211, and the other row is uniformly distributed on the right side of the first mounting hole 3211. Similarly, the second through holes 3222 are two rows, each row is five, one row is uniformly distributed on the left side of the second mounting hole 3221, the position of the first through hole on the left side of the first mounting hole 3211 corresponds to the position of each second through hole, the other row is uniformly distributed on the right side of the second mounting hole 3221, and the position of the first through hole on the right side of the first mounting hole 3211 corresponds to the position of each second through hole. After the first supporting member 321 and the second supporting member 322 are rotated to align the different first through holes and second through holes, the first pin 323 and the second pin 324 are inserted to fix the first supporting member 321 and the second supporting member 322 to a fixed angle.
Optionally, in this embodiment, the bottom surfaces of the first abutting member 321 and the second abutting member 322 are provided with a cushion (not shown in the drawings). The bottoms of the first abutting piece 321 and the second abutting piece 322 are respectively provided with two cushion pad installation grooves, and the cushion pads are installed in the cushion pad installation grooves to play a role in protecting the chip rings.
Optionally, in this embodiment, the stamp 22 is a five-pointed star stamp for easy identification.
In the present application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first feature or the second feature or indirectly contacting the first feature or the second feature through an intermediate.
Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (6)

1. The utility model provides an embossed seal processingequipment for to chip ring processing embossed seal, its characterized in that includes: the device comprises a mounting frame, a steel printing mechanism and a plurality of auxiliary positioning mechanisms;
the embossed seal mechanism comprises: the first telescopic device and the steel seal press head;
each of the auxiliary positioning mechanisms includes: the second telescopic device and the fixed module;
the mounting bracket includes: a top plate, a bottom plate and a plurality of upright posts;
one end of each upright post is fixedly connected with the top plate, the other end of each upright post is fixedly connected with the bottom plate, and the top plate, the bottom plate and the upright posts form an accommodating space for accommodating a chip ring;
the first telescopic device is fixed on the top plate and used for driving the steel seal pressing head to be close to or far away from the chip ring in the accommodating space;
each second telescopic device is fixed on the top plate and used for driving each fixing module to be close to or far away from the chip ring of the accommodating space.
2. The steel seal processing device according to claim 1, wherein each of the columns comprises: the first upright column, the second upright column and the two first connecting pieces;
a plurality of first connecting holes are uniformly formed in the first upright column in the vertical direction;
the second upright post is sleeved outside the first upright post, so that the second upright post can move up and down relative to the first upright post, and the second upright post is provided with a second connecting hole;
the two first connecting pieces respectively penetrate through any two first connecting holes and the second connecting hole, so that the first upright post is fixedly connected with the second upright post.
3. The steel seal processing device according to claim 2, wherein the first upright is provided with two sliding grooves, and the second upright is provided with two sliding blocks;
the two sliding blocks are slidably arranged in the two sliding grooves, so that the second upright post can slide up and down relative to the first upright post.
4. The steel seal processing apparatus of claim 2, wherein the fixing module comprises: the first abutting part, the second abutting part, the first pin shaft, the second pin shaft and the second connecting part are arranged on the base;
the first abutting piece is provided with a first mounting hole, the second abutting piece is provided with a second mounting hole, the second connecting piece sequentially penetrates through the second mounting hole and the first mounting hole and is fixed at the bottom end of the telescopic rod of the second telescopic device, and the first abutting piece and the second abutting piece rotate by taking the second connecting piece as an axis;
the bottom surface of the first abutting piece is flush with the bottom surface of the second abutting piece;
the first abutting piece is provided with two rows of first through holes at two sides of the first mounting hole, the second abutting piece is provided with two rows of second through holes at two sides of the second mounting hole respectively, and the positions of the two rows of first through holes correspond to the positions of the two rows of second through holes;
the first pin shaft is inserted into any one first through hole on one side and the second through hole corresponding to the first through hole, and the second pin shaft is inserted into any one first through hole on the other side and the second through hole corresponding to the first through hole, so that the first abutting piece and the second abutting piece are fixed.
5. The steel seal processing device according to claim 4, wherein the first abutting member and the second abutting member are provided with cushion pads on bottom surfaces thereof.
6. The embossed seal processing apparatus of claim 1, wherein the embossed seal indenter is a five-pointed star embossed seal head.
CN201921637438.5U 2019-09-29 2019-09-29 Steel seal processing device Active CN211106645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921637438.5U CN211106645U (en) 2019-09-29 2019-09-29 Steel seal processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921637438.5U CN211106645U (en) 2019-09-29 2019-09-29 Steel seal processing device

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CN211106645U true CN211106645U (en) 2020-07-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976903A (en) * 2021-01-20 2021-06-18 东风柳州汽车有限公司 Balanced type steel seal machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976903A (en) * 2021-01-20 2021-06-18 东风柳州汽车有限公司 Balanced type steel seal machine

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