CN211102231U - Laser precision punching device - Google Patents
Laser precision punching device Download PDFInfo
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- CN211102231U CN211102231U CN201921889657.2U CN201921889657U CN211102231U CN 211102231 U CN211102231 U CN 211102231U CN 201921889657 U CN201921889657 U CN 201921889657U CN 211102231 U CN211102231 U CN 211102231U
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- heat dissipation
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- refrigeration
- puncher
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Abstract
A laser precision punching device comprises a supporting table, a host, a workbench, an air supply device and an air jet pipe; the lower end of the supporting platform is provided with a plurality of upright posts, and the supporting platform is provided with an installation frame; the mounting rack is provided with a height adjusting component for driving the support frame to move towards or away from the support table; the support frame is provided with a laser generator and a puncher; the workbench is positioned right below the puncher; the bottom surface of the mounting groove on the workbench is provided with a blanking hole; a collecting box is arranged right below the blanking hole; the projection of the gas ejector is annular and is arranged in the mounting groove, and a plurality of gas ejecting holes are uniformly arranged on the gas ejector; the air outlet end of the air supply device is connected with an air inlet of a refrigeration assembly for refrigerating air sprayed by the air supply device; the air outlet port of the refrigeration component is connected with an air inlet hole arranged on the air injection pipe; the microcontroller arranged in the host is respectively connected with the laser generator, the puncher and the air supply device through wires. The utility model discloses it can improve sheet metal's the precision and the product quality of punching to handle.
Description
Technical Field
The utility model relates to a laser drilling technical field especially relates to a laser precision punching device.
Background
The laser perforating device can perforate various metals and non-metals, and particularly can perforate materials with high hardness, high brittleness and high melting point. The influence on the workpiece in the punching process is small; the laser punching device has the advantages of high punching speed, no noise and no pollution; the laser drilling process is a thermophysical process of interaction of laser and a substance and is determined by laser beam characteristics including wavelength, pulse width, beam divergence angle, focusing state and the like of the laser and a plurality of thermophysical characteristics of the substance; when the laser drilling device is used for drilling the metal plate, heat energy generated in the laser drilling process is transferred to the metal plate, so that the metal plate is easily heated unevenly, the metal plate is uneven, the quality of the drilled metal plate is poor, and the production benefit is greatly reduced; therefore, the application provides a laser precision punching device.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem that exists among the background art, the utility model provides a laser precision punching device can carry out the precision to sheet metal and punch, improves sheet metal's the accuracy of punching, can reduce workman working strength and improve the quality of punching back product.
(II) technical scheme
In order to solve the problems, the utility model provides a laser precision punching device, which comprises a collecting box, a supporting table, a host machine, a mounting frame, a supporting frame, a laser generator, a puncher, a workbench, a refrigeration component, an air supply device and an air injection pipe;
a plurality of upright posts are uniformly arranged on the lower end surface of the supporting platform; the mounting frame is arranged at the upper end of the support platform, and a height adjusting assembly for driving the support frame to move towards or away from the support platform is arranged on the mounting frame; the laser generator and the puncher are both arranged on the support frame, wherein the laser generator is arranged above the puncher;
the workbench is positioned right below the puncher, and a heat conducting plate is arranged on the workbench; the workbench is provided with a mounting groove along the central axis of the puncher towards the direction of the support table; the bottom surface of the mounting groove is provided with a blanking hole; the collecting box is positioned right below the blanking hole;
the projection of the gas ejector is annular, the gas ejector is arranged in the mounting groove, and the gas ejector is uniformly provided with a plurality of gas ejecting holes along the circumferential direction; the plurality of gas injection holes are uniformly distributed on the outer surface of the gas injection pipe away from the bottom surface of the mounting groove; the air outlet end of the air supply device is connected with an air inlet of a refrigeration assembly for refrigerating air sprayed by the air supply device; the air outlet port of the refrigeration component is connected with an air inlet hole arranged on the air injection pipe;
the host is arranged on the support table, and a microcontroller is arranged in the host; the microcontroller is respectively connected with the laser generator, the puncher and the air supply device through wires.
Preferably, the included angle between the central axis of a plurality of air injection holes and the central axis of the mounting groove is 30-60 degrees.
Preferably, the height adjusting assembly comprises a plurality of guide rods, a plurality of fixing plates, a threaded rod, a handle and a threaded barrel;
the threaded cylinder is arranged on the mounting frame; one end of the threaded rod is connected with the handle, and the other end of the threaded rod penetrates through the threaded cylinder and is rotatably connected with the support frame;
a plurality of fixed plates set up respectively on the support frame, and a plurality of guide bars are a plurality of fixed plates of sliding connection one by one respectively, and a plurality of guide bars all set up perpendicularly on the mounting bracket.
Preferably, a plurality of through holes for the plurality of guide rods to pass through are formed in the plurality of fixing plates.
Preferably, the refrigeration assembly comprises a refrigeration box, a plurality of semiconductor refrigeration pieces, a conduction plate and a heat dissipation plate;
the conduction plate is arranged in the refrigeration box to divide the interior of the refrigeration box into a heat dissipation bin and a refrigeration bin which is communicated with the air supply device and the air injection pipe;
the cooling bin is uniformly provided with cooling holes on the refrigeration box; the plurality of semiconductor refrigerating sheets are positioned in the heat dissipation bin, and the cold ends of the plurality of semiconductor refrigerating sheets are pressed tightly at the end surface of the conducting plate of the heat dissipation bin; the end face of the conducting plate positioned in the heat dissipation bin is provided with a heat insulation layer for isolating the cold ends and the hot ends of the plurality of semiconductor refrigeration sheets; the heat dissipation plate is arranged in the heat dissipation bin and compresses the hot ends of the plurality of semiconductor refrigeration pieces; the plurality of semiconductor refrigeration pieces are connected with the microcontroller through wires.
Preferably, the temperature of the air outlet port of the refrigerating bin is 10-25 ℃.
Preferably, a temperature sensor is arranged in the refrigerating bin; the temperature sensor is in signal connection with the microcontroller.
Preferably, a plurality of radiating fins are uniformly arranged on the radiating plate; the cooling box is provided with a plurality of cooling fins, wherein the cooling fins are arranged on the cooling box; the mounting holes correspond to the radiating fins one by one.
Preferably, the device comprises a display screen and a key module; the display screen and the key module are arranged on the end face of the host side by side; the display screen and the key module are connected with the microcontroller through wires
The above technical scheme of the utility model has following profitable technological effect:
when the punching device is used, a metal plate to be punched is placed on the heat conducting plate, and the part of the metal plate to be punched is placed under the puncher; the distance between the puncher and the metal plate to be punched is adjusted through the arranged height adjusting assembly; then, a laser generator is matched with a puncher for precise punching, so that the punching accuracy is improved, and the working intensity of workers is reduced; when punching is performed, the air supply device is started, and the air supply device filters outside air and then conveys the filtered air into the refrigeration assembly for cooling; the low-temperature air is sprayed to the metal plate which is being punched at the mounting groove from the air injection hole of the air injection pipe, and the high temperature applied to the metal plate in the punching process is quickly radiated, so that the metal plate is prevented from being deformed when being drilled due to uneven heating caused by the high temperature, and the product quality is reduced; the waste material that punches the production drops to the collecting box in from the blanking hole and collects, and is more convenient.
Drawings
Fig. 1 is a schematic structural view of the laser precision drilling device provided by the present invention.
Fig. 2 is a schematic structural diagram of a local enlargement at a position in the laser precision drilling device provided by the present invention.
Fig. 3 is a schematic view of a three-dimensional structure of an air-jet tube in the laser precision drilling device provided by the present invention.
Fig. 4 is the utility model provides a structural schematic diagram of refrigeration case in laser precision drilling device.
Fig. 5 is a schematic block diagram of the laser precision drilling device provided by the present invention.
Reference numerals: 1. a collection box; 2. a column; 3. a support table; 4. a host; 5. a display screen; 6. a mounting frame; 7. a guide bar; 8. a fixing plate; 9. a threaded rod; 10. a handle; 11. a threaded barrel; 12. a support frame; 13. a laser generator; 14. a hole puncher; 15. a heat conducting plate; 16. a work table; 17. a refrigeration case; 18. an air supply device; 19. a gas ejector tube; 20. a gas injection hole; 21. an air inlet; 22. a microcontroller; 23. a semiconductor refrigeration sheet; 24. a temperature sensor; 25. a conductive plate; 26. a thermal insulation layer; 27. a heat dissipation bin; 28. a refrigeration bin; 29. a baffle plate; 30. a heat dissipation plate; 31. a heat sink; 32. and (4) heat dissipation holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-5, the laser precision drilling device provided by the present invention comprises a collecting box 1, a supporting table 3, a main machine 4, a mounting frame 6, a supporting frame 12, a laser generator 13, a hole puncher 14, a workbench 16, a refrigeration assembly, an air supply device 18 and an air injection pipe 19;
a plurality of upright posts 2 are uniformly arranged on the lower end surface of the support table 3; the mounting frame 6 is arranged at the upper end of the support platform 3, and a height adjusting component for driving the support frame 12 to move towards or away from the support platform 3 is arranged on the mounting frame 6; the laser generator 13 and the hole puncher 14 are both arranged on the support frame 12, wherein the laser generator 13 is arranged above the hole puncher 14;
the workbench 16 is positioned right below the puncher 14, and a heat conducting plate 15 is arranged on the workbench 16; the workbench 16 is provided with a mounting groove along the central axis of the puncher 14 towards the direction of the support table 3; the bottom surface of the mounting groove is provided with a blanking hole; the collecting box 1 is positioned right below the blanking hole; it should be noted that, a clamping device for fixing the plate to be punched placed on the worktable 16 is arranged on the worktable 16; the clamping devices are numerous and not described in detail by the applicant;
the projection of the gas ejector 19 is annular, the gas ejector 19 is arranged in the mounting groove, and the gas ejector 19 is uniformly provided with a plurality of gas ejecting holes 20 along the circumferential direction; a plurality of air injection holes 20 are uniformly distributed on the outer surface of the air injection pipe 19 away from the bottom surface of the mounting groove; the air outlet end of the air supply device 18 is connected with an air inlet of a refrigeration component for refrigerating air sprayed by the air supply device 18; the air outlet port of the refrigeration component is connected with an air inlet 21 arranged on the air injection pipe 19; further, the air inlet end of the air supply device 18 is provided with a filter for filtering impurities in the air;
the host 4 is arranged on the support table 3, and a microcontroller 22 is arranged in the host 4; the microcontroller 22 is connected with the laser generator 13, the hole puncher 14 and the air supply device 18 through wires respectively.
In the utility model, when in use, a metal plate to be punched is placed on the heat conducting plate 15, and the part of the metal plate to be punched is placed under the puncher 14; the distance between the puncher 14 and the metal plate to be punched is adjusted through the arranged height adjusting assembly; then, the laser generator 13 is matched with the puncher 14 to perform precise punching, so that the punching accuracy is improved, and the working intensity of workers is reduced; when punching, the air supply device 18 is started, and the air supply device 18 filters outside air and then conveys the air into the refrigeration assembly for cooling; low-temperature air is sprayed to the metal plate which is being punched at the mounting groove from the air spraying holes 20 of the air spraying pipe 19, and the high temperature applied in the punching process of the metal plate is quickly radiated, so that the metal plate is prevented from being deformed when being drilled due to uneven heating caused by high temperature, and the product quality is reduced; the waste material produced by punching falls from the blanking hole into the collection box 1 for collection.
In an alternative embodiment, an included angle between the central axis of the plurality of air injection holes 20 and the central axis of the mounting groove is 30-60 °.
In an alternative embodiment, the height adjustment assembly comprises a plurality of guide rods 7, a plurality of fixing plates 8, a threaded rod 9, a handle 10 and a threaded barrel 11;
the threaded cylinder 11 is arranged on the mounting frame 6; one end of the threaded rod 9 is connected with a handle 10, and the other end of the threaded rod 9 penetrates through the threaded cylinder 11 and is rotatably connected with a support frame 12;
the fixed plates 8 are respectively arranged on the support frame 12, the guide rods 7 are respectively connected with the fixed plates 8 in a one-to-one sliding mode, and the guide rods 7 are vertically arranged on the mounting frame 6; the threaded rod 9 is driven to rotate by rotating the handle 10; the threaded rod 9 moves up and down in the threaded cylinder 11, so that the support frame 12 is driven to move up and down along the length direction of the guide rod 7, and the distance between the support frame 12 and the workbench 16 is adjusted.
In an alternative embodiment, through holes are formed in the fixing plates 8 for the guide rods 7 to pass through, the guide rods 7 pass through the through holes one by one, and the guide rods 7 are slidably connected with the fixing plates 8.
In an alternative embodiment, the refrigeration assembly comprises a refrigeration cassette 17, a plurality of semiconductor refrigeration fins 23, a conductive plate 25 and a heat dissipation plate 30;
the conduction plate 25 is arranged in the refrigeration box 17 to divide the interior of the refrigeration box 17 into a heat dissipation bin 27 and a refrigeration bin 28 for communicating with the air supply device 18 and the air injection pipe 19;
the heat dissipation chamber 27 is uniformly provided with heat dissipation holes 32 on the refrigeration box 17; the plurality of semiconductor refrigerating sheets 23 are positioned in the heat dissipation bin 27, and the cold ends of the plurality of semiconductor refrigerating sheets 23 are pressed tightly and uniformly on the end surface of the conducting plate 25 of the heat dissipation bin 27; the end face of the conducting plate 25 positioned in the heat dissipation bin 27 is provided with a heat insulation layer 26 for isolating the cold ends and the hot ends of the plurality of semiconductor refrigeration sheets 23; the heat dissipation plate 30 is arranged in the heat dissipation bin 27, and the heat dissipation plate 30 compresses the hot ends of the plurality of semiconductor refrigeration pieces 23; the plurality of semiconductor refrigerating pieces 23 are connected with the microcontroller 22 through leads; the conduction plate 25 is refrigerated through the plurality of semiconductor refrigerating sheets 23, so that the temperature in the refrigerating bin 28 is reduced, and the air entering the refrigerating bin 28 is refrigerated; the high temperature of the hot ends of the semiconductor chilling plates 23 is transmitted to the heat dissipation plate 30, and the hot ends of the semiconductor chilling plates 23 are cooled through the heat dissipation plate 30;
further, a plurality of baffles 29 are arranged in the refrigerating chamber 28 side by side along the gas flow direction of the refrigerating chamber 28; the plurality of baffles 29 form gas circulation channels in the refrigeration compartment 28, thereby increasing the residence time of the gas in the refrigeration compartment 28; the plurality of baffles 29 are selected from, but not limited to, copper or copper alloy.
In an alternative embodiment, the temperature of the air outlet of the refrigeration chamber 28 is 10-25 ℃.
In an alternative embodiment, a temperature sensor 24 is provided within the refrigerated compartment 28; the temperature sensor 24 is in signal connection with the microcontroller 22; the temperature in the refrigerated compartment 28 is monitored by the temperature sensor 24 provided.
In an alternative embodiment, a plurality of heat dissipation fins 31 are uniformly disposed on the heat dissipation plate 30; the heat dissipation bin 27 is provided with a plurality of mounting holes for the plurality of heat dissipation fins 31 to penetrate through on the refrigeration box 17; the mounting holes correspond to the radiating fins one by one; the plurality of radiating fins 31 are arranged to further improve the hot end cooling efficiency of the plurality of semiconductor cooling fins 23.
In an alternative embodiment, the display screen 5 and the key module are included; the display screen 5 and the key module are arranged on the end face of the host 4 side by side; the display screen 5 and the key module are connected with the microcontroller 22 through wires.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. A laser precision punching device is characterized by comprising a collecting box (1), a supporting table (3), a host (4), a mounting rack (6), a supporting frame (12), a laser generator (13), a puncher (14), a workbench (16), a refrigerating assembly, an air supply device (18) and an air injection pipe (19);
a plurality of upright posts (2) are uniformly arranged on the lower end surface of the support table (3); the mounting rack (6) is arranged at the upper end of the support platform (3), and a height adjusting component for driving the support frame (12) to move towards or away from the support platform (3) is arranged on the mounting rack (6); the laser generator (13) and the hole puncher (14) are both arranged on the support frame (12), wherein the laser generator (13) is arranged above the hole puncher (14);
the workbench (16) is positioned right below the puncher (14), and a heat conducting plate (15) is arranged on the workbench (16); the workbench (16) is provided with a mounting groove along the central axis of the puncher (14) towards the direction of the support table (3); the bottom surface of the mounting groove is provided with a blanking hole; the collecting box (1) is positioned right below the blanking hole;
the projection of the gas injection pipe (19) is annular, the gas injection pipe (19) is arranged in the mounting groove, and the gas injection pipe (19) is uniformly provided with a plurality of gas injection holes (20) along the circumferential direction; the plurality of gas injection holes (20) are uniformly distributed on the outer surface of the gas injection pipe (19) far away from the bottom surface of the mounting groove; the air outlet end of the air supply device (18) is connected with an air inlet of a refrigeration component for refrigerating air sprayed by the air supply device (18); the air outlet port of the refrigeration component is connected with an air inlet (21) arranged on the air injection pipe (19);
the host (4) is arranged on the support table (3), and a microcontroller (22) is arranged in the host (4); the microcontroller (22) is respectively connected with the laser generator (13), the hole puncher (14) and the air supply device (18) through leads.
2. The laser precision drilling device according to claim 1, wherein an included angle between a central axis of the plurality of air injection holes (20) and a central axis of the mounting groove is 30-60 °.
3. The laser precision drilling device according to claim 1, characterized in that the height adjusting assembly comprises a plurality of guide rods (7), a plurality of fixing plates (8), a threaded rod (9), a handle (10) and a threaded cylinder (11);
the threaded cylinder (11) is arranged on the mounting rack (6); one end of the threaded rod (9) is connected with the handle (10), and the other end of the threaded rod (9) penetrates through the threaded cylinder (11) and is rotatably connected with the support frame (12);
a plurality of fixed plates (8) are respectively arranged on the support frame (12), a plurality of guide rods (7) are respectively connected with the fixed plates (8) in a one-to-one sliding mode, and the guide rods (7) are perpendicularly arranged on the mounting frame (6).
4. The laser precision drilling device according to claim 3, characterized in that the plurality of fixing plates (8) are provided with through holes for the plurality of guide rods (7) to pass through.
5. The laser precision drilling device according to claim 1, characterized in that the refrigeration assembly comprises a refrigeration box (17), a plurality of semiconductor refrigeration sheets (23), a conduction plate (25) and a heat dissipation plate (30);
the conduction plate (25) is arranged in the refrigeration box (17) to divide the interior of the refrigeration box (17) into a heat dissipation bin (27) and a refrigeration bin (28) which is communicated with the air supply device (18) and the air injection pipe (19);
the heat dissipation bin (27) is uniformly provided with heat dissipation holes (32) on the refrigeration box (17); the plurality of semiconductor refrigerating sheets (23) are positioned in the heat dissipation bin (27), and the cold ends of the plurality of semiconductor refrigerating sheets (23) are pressed tightly at the end surface of the conducting plate (25) of the heat dissipation bin (27); wherein, the end surface of the conduction plate (25) positioned in the heat dissipation bin (27) is provided with a heat insulation layer (26) for isolating the cold ends and the hot ends of the plurality of semiconductor refrigeration sheets (23); the heat dissipation plate (30) is arranged in the heat dissipation bin (27), and the heat dissipation plate (30) compresses the hot ends of the semiconductor refrigeration sheets (23); the plurality of semiconductor refrigeration pieces (23) are connected with the microcontroller (22) through wires.
6. The laser precision drilling device according to claim 5, characterized in that the temperature of the air outlet of the refrigerating bin (28) is 10-25 ℃.
7. The laser precision drilling device according to claim 5, characterized in that a temperature sensor (24) is arranged in the refrigerating chamber (28); the temperature sensor (24) is in signal connection with the microcontroller (22).
8. The laser precision drilling device according to claim 5, characterized in that a plurality of heat dissipation fins (31) are uniformly arranged on the heat dissipation plate (30); wherein, the heat dissipation bin (27) is provided with a plurality of mounting holes for the plurality of heat dissipation fins (31) to penetrate out on the refrigeration box (17); the mounting holes correspond to the radiating fins one by one.
9. The laser precision drilling device according to claim 1, characterized by comprising a display screen (5) and a key module; the display screen (5) and the key module are arranged on the end face of the host (4) side by side; the display screen (5) and the key module are both connected with the microcontroller (22) through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921889657.2U CN211102231U (en) | 2019-11-05 | 2019-11-05 | Laser precision punching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921889657.2U CN211102231U (en) | 2019-11-05 | 2019-11-05 | Laser precision punching device |
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| Publication Number | Publication Date |
|---|---|
| CN211102231U true CN211102231U (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921889657.2U Active CN211102231U (en) | 2019-11-05 | 2019-11-05 | Laser precision punching device |
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| CN (1) | CN211102231U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112743240A (en) * | 2020-12-29 | 2021-05-04 | 诸暨市迅翔云科技有限公司 | Laser cutting device for mechanical parts |
-
2019
- 2019-11-05 CN CN201921889657.2U patent/CN211102231U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112743240A (en) * | 2020-12-29 | 2021-05-04 | 诸暨市迅翔云科技有限公司 | Laser cutting device for mechanical parts |
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