CN211088214U

CN211088214U - Wafer packaging protection paster device

Info

Publication number: CN211088214U
Application number: CN201921850848.8U
Authority: CN
Inventors: 王岳峰
Original assignee: Shenzhen Yingfushi Technology Co ltd
Current assignee: Shenzhen Yingfushi Technology Co ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-07-24
Anticipated expiration: 2029-10-31

Abstract

The utility model discloses a wafer packaging protection paster device in the technical field of wafer production equipment, which comprises a paster workbench, wherein the top of the paster workbench is rotationally connected with a film coating roller, the top of the paster workbench is fixedly connected with a guide plate, the side wall of the guide plate is fixedly connected with a limiting arc sheet, the top of the paster workbench is fixedly connected with a cutting frame, a cutting cylinder is fixedly arranged in the middle of the cutting frame, the bottom of the cutting cylinder is fixedly connected with a cutting circular knife, the cutting rotary hole is rotationally connected with a cutting bottom plate, a floating roller is slidably connected in a film coating through groove, and a discharging conveyor belt is arranged below the paster workbench, meanwhile, the front side and the back side of the film are automatically pasted, bubbles are effectively removed, the quality of the pasted film is improved, the edge burrs are prevented from being irregular through one-step cutting by the cutting circular knife, automatic blanking is achieved after cutting, and the film pasting machine is safe and efficient.

Description

Wafer packaging protection paster device

Technical Field

The utility model relates to a wafer production facility technical field specifically is a wafer encapsulation protection paster device.

Background

The existing wafer paster is obtained by firstly testing an operation station clean by using alcohol-stained dust-free cloth, then flatly placing a wafer flow sheet on the operation station, unfolding and attaching a glue cloth roll on the wafer flow sheet, then manually rolling the glue cloth by using a roller until no bubble exists between the glue cloth and the surface of a wafer, and finally manually cutting the glue cloth at the edge of the wafer by using a hob cutter; in use, the supporting stability of the roller is poor, the roller is directly operated manually to roll the adhesive tape, the number of human factors is large, the roller cannot be guaranteed to be in horizontal contact with the contact surface of the top end of the adhesive tape, the rolling effect is poor, the rolling force of the roller is not easy to master, and the use reliability is low; and the manual work uses the hobbing cutter to cut by oneself, makes the proof fabric perk and produce the burr easily in the cutting process, and the cutting effect is relatively poor, and the while operation is slow, and cutting efficiency is lower, leads to its practicality relatively poor.

Based on this, the utility model designs a wafer encapsulation protection paster device to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer encapsulation protection paster device to the support stability who solves the cylinder that proposes in the above-mentioned background art is relatively poor, can not guarantee cylinder and adhesive tape top contact surface horizontal contact, and the manual work uses the hobbing cutter to cut by oneself, makes the adhesive tape perk and produces the burr easily in the cutting process, and the cutting effect is relatively poor, and the simultaneous operation is slow, the lower problem of cutting efficiency.

In order to achieve the above object, the utility model provides a following technical scheme:

a wafer packaging protection paster device comprises a paster workbench, wherein a cutting rotary hole and a laminating through groove are fixedly formed in the top of the paster workbench, the top of the paster workbench is rotatably connected with a laminating roller, the top of the paster workbench is rotatably connected with an upper-layer discharging roller, an upper-layer receiving roller, an upper-layer transition roller, a lower-layer discharging roller, a lower-layer receiving roller and a lower-layer transition roller, the upper-layer discharging roller, the lower-layer discharging roller, the upper-layer receiving roller and the lower-layer receiving roller are located at two ends of the paster workbench, a guide plate is fixedly connected to the top of the paster workbench, limiting arc pieces are fixedly connected to the side wall of the guide plate, a cutting frame is fixedly connected to the top of the paster workbench, a cutting cylinder is fixedly mounted in the middle of the cutting frame, a cutting circular knife is fixedly connected to the bottom of the cutting cylinder, a cutting bottom plate is rotatably connected in the cutting rotary hole, a floating, and a discharge conveyor belt is arranged below the paster workbench.

Preferably, the upper transition roller is tangent to the patch workbench, and the lower transition roller is tangent to the upper top surface of the patch workbench.

Preferably, the equal fixedly connected with mounting panel in paster workstation both ends, rotate in the middle of the mounting panel and be connected with upper blowing roller, upper strata receipts material roller, upper transition roller, lower floor's blowing roller, lower floor receive material roller and lower floor's transition roller.

Preferably, the film laminating roller is tangent to the floating roller, the two side walls of the film laminating through groove are fixedly connected with floating frames, floating springs are fixedly installed in the floating frames, and the tops of the floating springs are fixedly connected with the floating roller.

Preferably, the guide plate is located above the chip mounting workbench, and the distance between the guide plate and the chip mounting workbench is smaller than the thickness of the chip to be mounted.

Preferably, the limiting arc piece and the cutting circular knife are concentric arcs, the bottom of the paster workbench is fixedly connected with a hanging frame, and the middle of the hanging frame is rotatably connected with a rotating shaft of a discharging conveyor belt.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses after wearing the protection film, place the wafer along the deflector, the driving motor who receives the material roller on switch-on upper strata and lower floor drives the two and rotates, the wafer that will be located lower floor's protection film removes between tectorial membrane roller and the floating roll, switch-on tectorial membrane roller motor drives its rotation, compress tightly upper and lower layer protection film at the positive and negative of wafer, accomplish the pad pasting, the tectorial membrane roller is with the tangent extrusion pad pasting of floating roll, effectively get rid of the bubble, improve the paster quality, and the floating roll receives the pressure when too big, act on floating spring, the floating roll moves down along the floating frame, avoid crushing the wafer.

2. And when the wafer reaches the position of the limiting arc piece and stops, the wafer is just positioned under the cutting circular knife, the cutting cylinder is switched on, the cutting circular knife falls down and cuts off the upper and lower protective films, then the driving motor of the cutting bottom plate is switched on to drive the cutting bottom plate to rotate in the opposite direction of the limiting arc piece, the wafer which is pasted and cut completely falls on a discharging conveyor belt below, and the wafer is conveyed out through the discharging conveyor belt and artificially received to be packaged on the next step. The utility model discloses a tectorial membrane roller and the tangent extrusion pad pasting of floating roll, the automatic pad pasting of positive and negative simultaneously effectively gets rid of the bubble, improves the paster quality, through the one-step cutting of cutting circular knife, avoids marginal burr untidy, automatic blanking after the cutting, and is safe high-efficient.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a first viewing angle structure of the present invention;

fig. 2 is a schematic view of the depression structure of the present invention;

fig. 3 is a schematic view of the side view structure of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1-a patch workbench, 2-a laminating through groove, 3-a laminating roller, 4-an upper discharging roller, 5-an upper receiving roller, 6-an upper transition roller, 7-a lower discharging roller, 8-a lower receiving roller, 9-a lower transition roller, 10-a guide plate, 11-a limiting arc sheet, 12-a cutting frame, 13-a cutting cylinder, 14-a cutting circular knife, 15-a cutting bottom plate, 16-a floating roller, 17-a discharging conveyor belt, 18-a mounting plate, 19-a floating frame, 20-a floating spring and 21-a hanging frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a wafer packaging protection paster device comprises a paster workbench 1, wherein the top of the paster workbench 1 is fixedly provided with a cutting rotary hole and a film coating through groove 2, the top of the paster workbench 1 is rotatably connected with a film coating roller 3, the top of the paster workbench 1 is rotatably connected with an upper layer discharging roller 4, an upper layer receiving roller 5, an upper layer transition roller 6, a lower layer discharging roller 7, a lower layer receiving roller 8 and a lower layer transition roller 9, the upper layer discharging roller 4, the lower layer discharging roller 7, the upper layer receiving roller 5 and the lower layer receiving roller 8 are positioned at two ends of the paster workbench 1, the top of the paster workbench 1 is fixedly connected with a guide plate 10, the side wall of the guide plate 10 is fixedly connected with a limiting arc piece 11, the top of the paster workbench 1 is fixedly connected with a cutting frame 12, the middle of the cutting frame 12 is fixedly provided with a cutting cylinder 13, the bottom of the cutting cylinder 13 is fixedly connected with a cutting circular knife 14, the cutting rotary hole is rotatably, the tectorial membrane leads to groove 2 sliding connection has the floating roll 16, and the below of paster workstation 1 is equipped with ejection of compact conveyer belt 17.

Wherein, the transition roller 6 of upper strata is tangent with paster workstation 1, and the transition roller 9 of lower floor is tangent with paster workstation 1 top surface. The equal fixedly connected with mounting panel 18 in paster workstation 1 both ends, the rotation is connected with upper strata blowing roller 4, upper strata receipts material roller 5, upper transition roller 6, lower floor blowing roller 7, lower floor receipts material roller 8 and lower floor transition roller 9 in the middle of the mounting panel 18. The film coating roller 3 is tangent to the floating roller 16, the two side walls of the film coating through groove 2 are fixedly connected with floating frames 19, floating springs 20 are fixedly installed in the floating frames 19, and the tops of the floating springs 20 are fixedly connected with the floating roller 16. The guide plate 10 is located above the chip mounting workbench 1, and the thickness of the guide plate 10 away from the chip mounting workbench 1 is smaller than that of a chip to be mounted. The limiting arc piece 11 and the cutting circular knife 14 are concentric arcs, the bottom of the surface mounting workbench 1 is fixedly connected with a hanging rack 21, and the middle of the hanging rack 21 is rotatably connected with a rotating shaft of a discharging conveyor belt 17.

One specific application of this embodiment is: the utility model discloses an upper protection film is gone up to upper blowing roller 4 facial make-up, lower protection film about 7 facial make-up of lower blowing roller, upper protection film passes upper transition roller 6 and is located deflector 10 top, the tip winding is on upper receipts material roller 5, lower floor's protection film passes lower floor's transition roller 9, pass deflector 10 below, the tip winding is on lower floor receives material roller 8, upper transition roller 6 that is close to 3 one ends of tectorial membrane roller is a little higher than paster workstation 1 surface, conveniently send into the wafer. After the protective film is penetrated, the wafer is placed along the guide plate 10, the distance between the guide plates 10 is equal to the diameter of the wafer, the two inner walls of the guide plate 10 are smooth to avoid damaging the wafer, the wafer is convenient to move, the upper layer material receiving roller 5 and the lower layer material receiving roller 8 are switched on, the driving motors of the upper layer material receiving roller 5 and the lower layer material receiving roller 8 are driven to rotate, the wafer positioned on the lower layer protective film is moved to a position between the film covering roller 3 and the floating roller 16, the motor of the film covering roller 3 is switched on to drive the film covering roller to rotate, the upper layer protective film and the lower layer protective film are tightly pressed on the front surface and the back surface of the wafer, the film covering roller 3 and the floating roller 16 tangentially extrude the film, bubbles are effectively removed, the quality of the film is improved, when the pressure of the floating roller 16 is too large, the floating spring 20 is acted, the floating roller 16 moves downwards along the floating frame 19 to avoid, and (3) dropping the cutting circular knife 14, cutting off the upper and lower protective films, switching on a driving motor of the cutting bottom plate 15, driving the cutting bottom plate 15 to rotate in the opposite direction of the limiting arc piece 11, dropping the adhered and cut wafer on a discharge conveyor belt 17 below, conveying the wafer out through the discharge conveyor belt 17, manually receiving the wafer, and packaging the wafer in the next step. The utility model discloses a

tectorial membrane roller

3 and 16 tangent extrusion pad pasting of floating roll, the automatic pad pasting of positive and negative simultaneously effectively gets rid of the bubble, improves the paster quality, through 14 one step cutting of cutting circular knife, avoids marginal burr untidy, automatic blanking after the cutting, and is safe high-efficient.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer packaging protection paster device which characterized in that: the cutting and film-covering device comprises a patch workbench (1), wherein the top of the patch workbench (1) is fixedly provided with a cutting and rotating hole and a film-covering through groove (2), the top of the patch workbench (1) is rotatably connected with a film-covering roller (3), the top of the patch workbench (1) is rotatably connected with an upper layer emptying roller (4), an upper layer receiving roller (5), an upper layer transition roller (6), a lower layer emptying roller (7), a lower layer receiving roller (8) and a lower layer transition roller (9), the upper layer emptying roller (4), the lower layer emptying roller (7), the upper layer receiving roller (5) and the lower layer receiving roller (8) are positioned at two ends of the patch workbench (1), the top of the patch workbench (1) is fixedly connected with a guide plate (10), the side wall of the guide plate (10) is fixedly connected with a limiting arc sheet (11), the top of the patch workbench (1) is fixedly connected with a cutting frame (12), fixed mounting has cutting cylinder (13) in the middle of cutting frame (12), cutting cylinder (13) bottom fixedly connected with cutting circular knife (14), it has cutting bottom plate (15) to cut the downthehole rotation of commentaries on classics, the laminating leads to groove (2) sliding connection has floating roll (16), paster workstation (1) below is equipped with exit conveyor (17).

2. The wafer packaging protection patch device of claim 1, wherein: the upper transition roller (6) is tangent to the patch workbench (1), and the lower transition roller (9) is tangent to the upper top surface of the patch workbench (1).

3. The wafer packaging protection patch device of claim 1, wherein: the patch working table is characterized in that mounting plates (18) are fixedly connected to two ends of the patch working table (1), and an upper-layer discharging roller (4), an upper-layer receiving roller (5), an upper-layer transition roller (6), a lower-layer discharging roller (7), a lower-layer receiving roller (8) and a lower-layer transition roller (9) are connected to the middle of each mounting plate (18) in a rotating mode.

4. The wafer packaging protection patch device of claim 1, wherein: the laminating roller (3) is tangent to the floating roller (16), two side walls of the laminating through groove (2) are fixedly connected with floating frames (19), floating springs (20) are fixedly mounted in the floating frames (19), and the tops of the floating springs (20) are fixedly connected with the floating roller (16).

5. The wafer packaging protection patch device of claim 1, wherein: the guide plate (10) is located above the chip mounting workbench (1), and the distance between the guide plate (10) and the chip mounting workbench (1) is smaller than the thickness of a chip to be mounted.

6. The wafer packaging protection patch device of claim 1, wherein: spacing arc piece (11) and cutting circular knife (14) are concentric circular arcs, paster workstation (1) bottom fixedly connected with stores pylon (21), rotate in the middle of stores pylon (21) and be connected with the pivot of exit conveyor (17).