CN211076504U - Feeding mechanism for wafer packaging machine - Google Patents
Feeding mechanism for wafer packaging machine Download PDFInfo
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- CN211076504U CN211076504U CN201922079485.9U CN201922079485U CN211076504U CN 211076504 U CN211076504 U CN 211076504U CN 201922079485 U CN201922079485 U CN 201922079485U CN 211076504 U CN211076504 U CN 211076504U
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- seat
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- contained side
- via hole
- vibrator
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Abstract
The utility model relates to a feeding mechanism for wafer packaging machine, including hopper, supporting component and damper. The bottom of the hopper is provided with a discharge pipe; the supporting assembly comprises a mounting seat, a feeding chute, a vibrator, a mounting shaft, a connecting seat and a supporting seat, the mounting shaft is vertically arranged, one end of the mounting seat is detachably fixed on the mounting shaft, the other end of the mounting seat is provided with a second through hole, the hopper is positioned above the mounting seat, and the discharging pipe penetrates through the second through hole; the supporting seat is positioned below the mounting seat, one end of the supporting seat is detachably fixed on the mounting shaft, the vibrator is arranged above the supporting seat, the connecting seat is arranged above the vibrator and provided with a fixing groove, the feeding groove is fixed in the fixing groove, and at least part of the feeding groove is positioned below the mounting seat; the damping assembly comprises a mounting bottom plate, damping blocks and a connecting bottom plate, the mounting bottom plate is fixed at the bottom of the mounting shaft, the damping blocks are fixed on the mounting bottom plate and are distributed on the periphery of the mounting shaft at equal intervals, and the connecting bottom plate is sleeved on the mounting shaft and fixed above the damping blocks.
Description
Technical Field
The utility model relates to a wafer packing field especially relates to a feeding mechanism for wafer packaging machine.
Background
The chip is widely used in cameras, digital cameras, video cameras, electric eyes, mobile phones, etc. requiring precise microscopic effect, so as to obtain good image quality and enable users to obtain good quality effect. Because the wafer is smaller, the manual feeding mode is unrealistic, the working efficiency is low, and the working quality is difficult to ensure.
At present, the material is fed in a vibration mode, but a vibrator has large vibration frequency and large noise, so that the impact force received by a wafer is large, and the service lives of some parts are short easily. Meanwhile, the existing feeding mechanism is complex in installation, high in cost and complex in installation and disassembly, and the maintenance cost is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a good, easy installation dismantlement of stability, absorbing feed mechanism for wafer packagine machine.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a feeding mechanism for wafer packaging machine, include:
the bottom of the hopper is provided with a discharge pipe;
the support assembly comprises a mounting seat, a feeding chute, a vibrator, a mounting shaft, a connecting seat and a supporting seat, the mounting shaft is vertically arranged, one end of the mounting seat is detachably fixed on the mounting shaft, the other end of the mounting seat is provided with a second through hole, the hopper is positioned above the mounting seat, and the discharging pipe penetrates through the second through hole; the support seat is positioned below the mounting seat, one end of the support seat is detachably fixed on the mounting shaft, the vibrator is arranged above the support seat in a threaded manner, the connecting seat is arranged above the vibrator in a threaded manner and is provided with a fixing groove, the feeding groove is horizontally and threadedly fixed in the fixing groove, at least part of the feeding groove is positioned below the mounting seat, and the discharge pipe is arranged corresponding to the feeding groove;
damping component, damping component includes mounting plate, snubber block and connecting plate, mounting plate fixes installation axle bottom, the snubber block is fixed mounting plate is last and equidistant distribution is in the periphery of installation axle, the connecting plate cover is established install epaxial and fix the snubber block top.
Further, the one end of mount pad has first via hole, the mount pad passes through first via hole cover is established install epaxial, the both ends of mount pad all are provided with first contained side and second contained side, be formed with first centre gripping space with adjustable size between first contained side and the second contained side, two first centre gripping space respectively with first via hole and second via hole are linked together, first contained side with be connected through first bolt between the outer end of second contained side.
Further, supporting seat one end has the third via hole, the supporting seat passes through the third via hole cover is established install epaxial, the one end of supporting seat is provided with third contained side and fourth contained side, be formed with size adjustable second centre gripping space between third contained side and the fourth contained side, second centre gripping space is linked together with the third via hole, the third contained side with be connected through the second bolt between the outer end of fourth contained side.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the feeding mechanism for the wafer packaging machine of the utility model reduces the noise of the feeding mechanism and plays a role of shock absorption due to the arrangement of the shock absorption block;
furthermore, one end of the mounting seat is detachably connected with the mounting shaft, one end of the supporting seat is detachably connected with the mounting shaft, the vibrator is in threaded connection with the supporting seat, and the connecting seat is in threaded connection with the vibrator, so that all the parts can be more easily mounted and dismounted;
further, chute feeder threaded connection is in the recess of connecting seat, not only installs easily and dismantles, has improved the stability of chute feeder simultaneously, avoids it because of long-time vibrations off tracking.
Drawings
Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic view of a feeding mechanism for a wafer packaging machine according to an embodiment of the present invention.
Wherein the reference numerals are as follows:
1. a hopper; 2. a discharge pipe; 3. a mounting seat; 4. a feed chute; 5. a vibrator; 6. installing a shaft; 7. a connecting seat; 8. a supporting seat; 9. mounting a bottom plate; 10. a damper block; 11. and connecting the bottom plate.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
A feeding mechanism for a wafer packaging machine as shown in fig. 1 comprises a hopper 1, a support member and a damper member.
The bottom of the hopper 1 is provided with a discharge pipe 2;
the supporting assembly comprises an installation seat 3, a feeding chute 4, a vibrator 5, an installation shaft 6, a connecting seat 7 and a supporting seat 8, wherein the installation shaft 6 is vertically arranged, one horizontal end of the installation seat 3 is detachably fixed on the installation shaft 6, the other horizontal end of the installation seat is provided with a second through hole, the hopper 1 is positioned above the installation seat 3, and the discharging pipe 2 penetrates through the second through hole; the supporting seat 8 is horizontally positioned below the mounting seat 3, one end of the supporting seat 8 is detachably fixed on the mounting shaft 6, the vibrator 5 is arranged above the supporting seat 8 in a threaded manner, the connecting seat 7 is arranged above the vibrator 5 in a threaded manner, the connecting seat 7 is provided with a fixing groove, the feeding groove 4 is horizontally and threadedly fixed in the fixing groove, at least part of the feeding groove 4 is positioned below the mounting seat 3, and the discharge pipe 2 is arranged corresponding to the feeding groove 4;
damping component includes mounting plate 9, snubber block 10 and connecting plate 11, mounting plate 9 fixes installation axle 6 bottom, snubber block 10 is fixed mounting plate 9 is last and equidistant distribution is in installation axle 6's periphery, connecting plate 11 cover is established install the axle 6 is last and fix snubber block 10 top.
One end of the mounting seat 3 is provided with a first through hole, the mounting seat 3 is sleeved on the mounting shaft 6 through the first through hole, a first clamping edge and a second clamping edge are arranged at two end parts of the mounting seat 3, a first clamping space with adjustable size is formed between the first clamping edge and the second clamping edge, the two first clamping spaces are respectively communicated with the first through hole and the second through hole, and the outer ends of the first clamping edge and the second clamping edge are connected through a first bolt; the installation and the disassembly of the installation seat 3 are more convenient.
A third through hole is formed in one end of the supporting seat 8, the supporting seat 8 is sleeved on the mounting shaft 6 through the third through hole, a third clamping edge and a fourth clamping edge are arranged at the end of one end of the supporting seat 8, a second clamping space with adjustable size is formed between the third clamping edge and the fourth clamping edge, the second clamping space is communicated with the third through hole, and the outer ends of the third clamping edge and the fourth clamping edge are connected through a second bolt; so that the mounting and dismounting of the supporting seat 8 are more convenient.
The installation bottom plate 9 of the embodiment is provided with a plurality of installation screw holes for installing the material mechanism on the case of the wafer packaging machine in a threaded manner, and the shock absorption block 10 is arranged on the installation bottom plate 9, so that the noise of the whole feeding mechanism is reduced, the influence of the vibration of the feeding mechanism on the case of the wafer packaging machine is reduced, and the shock absorption effect is realized;
furthermore, the mounting seat 3 and the supporting seat 8 are more convenient to mount and dismount, the vibrator 5 is in threaded connection with the supporting seat 8, and the connecting seat 7 is in threaded connection with the vibrator, so that all the parts can be mounted and dismounted more easily;
further, horizontal threaded connection of chute feeder 4 is in the recess of connecting seat 7, not only installs easily and dismantles, has improved the stability of chute feeder 4 simultaneously, avoids it because of long-time vibrations off tracking.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (3)
1. A feeding mechanism for a wafer packaging machine is characterized by comprising:
the bottom of the hopper is provided with a discharge pipe;
the support assembly comprises a mounting seat, a feeding chute, a vibrator, a mounting shaft, a connecting seat and a supporting seat, the mounting shaft is vertically arranged, one end of the mounting seat is detachably fixed on the mounting shaft, the other end of the mounting seat is provided with a second through hole, the hopper is positioned above the mounting seat, and the discharging pipe penetrates through the second through hole; the support seat is positioned below the mounting seat, one end of the support seat is detachably fixed on the mounting shaft, the vibrator is arranged above the support seat in a threaded manner, the connecting seat is arranged above the vibrator in a threaded manner and is provided with a fixing groove, the feeding groove is horizontally and threadedly fixed in the fixing groove, at least part of the feeding groove is positioned below the mounting seat, and the discharge pipe is arranged corresponding to the feeding groove;
damping component, damping component includes mounting plate, snubber block and connecting plate, mounting plate fixes installation axle bottom, the snubber block is fixed mounting plate is last and equidistant distribution is in the periphery of installation axle, the connecting plate cover is established install epaxial and fix the snubber block top.
2. The supply mechanism for wafer packaging machine as claimed in claim 1, wherein: the one end of mount pad has first via hole, the mount pad passes through first via hole cover is established install epaxial, the both ends of mount pad all are provided with first contained side and second contained side, be formed with first centre gripping space with adjustable size between first contained side and the second contained side, two first centre gripping space respectively with first via hole and second via hole are linked together, first contained side with be connected through first bolt between the outer end of second contained side.
3. The supply mechanism for wafer packaging machine according to claim 1 or 2, characterized in that: supporting seat one end has the third via hole, the supporting seat passes through the third via hole cover is established install epaxial, the one end of supporting seat is provided with third contained side and fourth contained side, be formed with size adjustable second centre gripping space between third contained side and the fourth contained side, second centre gripping space is linked together with the third via hole, the third contained side with be connected through the second bolt between the outer end of fourth contained side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922079485.9U CN211076504U (en) | 2019-11-27 | 2019-11-27 | Feeding mechanism for wafer packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922079485.9U CN211076504U (en) | 2019-11-27 | 2019-11-27 | Feeding mechanism for wafer packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211076504U true CN211076504U (en) | 2020-07-24 |
Family
ID=71647226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922079485.9U Active CN211076504U (en) | 2019-11-27 | 2019-11-27 | Feeding mechanism for wafer packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211076504U (en) |
-
2019
- 2019-11-27 CN CN201922079485.9U patent/CN211076504U/en active Active
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