CN211063858U

CN211063858U - Double-layer circuit board for lamp

Info

Publication number: CN211063858U
Application number: CN201922082393.6U
Authority: CN
Inventors: 陈方; 胡荣昌; 李铁军; 王超全; 李龙俊; 丁传娣
Original assignee: Zhejiang Junhao Electronics Co ltd
Current assignee: Zhejiang Junhao Electronics Co ltd
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-07-21
Anticipated expiration: 2029-11-27

Abstract

The utility model discloses a double-deck circuit board that lamps and lanterns were used, including circuit board main part and the L ED lamp pearl of setting in the circuit board main part, be equipped with first heat-conducting layer in the circuit board main part, be equipped with the heat conduction hole of a plurality of intercommunication circuit board both sides face in the circuit board main part, the heat conduction hole is downthehole to be inserted and is equipped with the heat conduction portion unanimous with the heat conduction hole inner wall shape, the outer wall and the first heat-conducting layer of heat conduction portion contact, two ends of heat conduction portion all are equipped with the heat dissipation frame that stretches out the heat conduction hole, first heat-conducting layer can follow inside heat conduction, and through the air contact of heat conduction portion.

Description

Double-layer circuit board for lamp

Technical Field

The utility model belongs to the technical field of the circuit board, concretely relates to double-deck circuit board that lamps and lanterns were used.

Background

The circuit board has the advantages that the wiring is arranged on the two sides of the double-layer circuit board, the wires on the two sides are connected through the guide holes, the guide holes are small holes filled with or coated with metal on the circuit board and can be connected with the wires on the two sides, the area of the double-layer board is doubled compared with that of a single-face board, the difficulty of wiring in the single-face board due to the fact that the wiring is staggered is solved, and compared with a single-layer circuit board, the wiring of the double-layer circuit board is convenient and concise, the wiring labor intensity is lower.

Double-deck circuit board that current lamps and lanterns were used, L ED lamp pearls are all installed to general needs on the two sides of circuit board, but L ED lamp pearl can give off a large amount of heat energy when luminous, because the circuit board both sides receive the heat that L ED lamp pearl gived off simultaneously, then can influence the performance of L ED lamp pearl and circuit board, the individual layer circuit board is another side-mounting heat abstractor at installation L ED, but two-sided difficult installation heat abstractor, the radiating effect is relatively poor.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides a double-layer circuit board for lamp with good heat dissipation effect

In order to achieve the purpose, the utility model adopts the technical scheme that the double-layer circuit board for the lamp comprises a circuit board main body and L ED lamp beads arranged on the circuit board main body, a first heat conduction layer is arranged in the circuit board main body, a plurality of heat conduction holes communicated with the two side surfaces of the circuit board are arranged on the circuit board main body, heat conduction parts with the shapes consistent with the shapes of the inner walls of the heat conduction holes are inserted in the heat conduction holes, the outer walls of the heat conduction parts are in contact with the first heat conduction layer, and two ends of the heat conduction parts are respectively provided with a heat dissipation frame extending out of the heat.

Among the above-mentioned technical scheme, first heat-conducting layer can follow inside heat conduction to through the air contact of heat-conducting part with the external world, the heat dissipation frame increase with the area of contact of air, accelerate the radiating rate.

As a further configuration of the present invention, the two ends of the heat conduction portion are respectively flush with the two orifices of the heat conduction hole or protrude from the two orifices of the heat conduction hole.

Among the above-mentioned technical scheme, the length of heat-conducting portion is greater than or equal to the height of heat-conducting hole, makes things convenient for the installation of heat dissipation frame.

As the utility model discloses a further setting, the array orientation of heat dissipation frame is unanimous with the array orientation of L ED lamp pearl, the heat dissipation frame includes the base of being connected with the heat-conducting part and sets up the fin on the base, one the heat dissipation frame includes a fin at least, fin and circuit board mainboard mutually perpendicular, the orientation of fin is unanimous.

Among the above-mentioned technical scheme, base connection fin and heat conduction portion, the fin increase with the area of contact of air for the heat dissipation.

As the utility model discloses a further setting, be equipped with the second heat-conducting layer on the lateral surface of circuit board main part, the second heat-conducting layer covers in the periphery side of L ED lamp pearl, the second heat-conducting layer is connected with the base.

Among the above-mentioned technical scheme, the second heat-conducting layer dispels the heat with higher speed to can with L ED lamp pearl heat conduction that produces add the piece radiating rate on the heat dissipation frame.

As a further setting of the utility model, be equipped with the fan on the lateral surface of circuit board, the air current direction of fan is parallel with the fin.

In the technical scheme, the fan accelerates the heat dissipation speed of the heat dissipation fins.

As the utility model discloses a further setting, first heat-conducting layer is heat conduction silicone grease, the second heat-conducting layer is heat-conducting glue, the material of heat conduction portion and fin is copper or copper alloy.

Among the above-mentioned technical scheme, heat conduction silicone grease, heat conduction glue and copper all have good heat conductivility and heat dispersion, can accelerate the heat dissipation of circuit board, guarantee L ED lamp pearl and double-deck circuit board's performance.

The present invention will be further described with reference to the accompanying drawings.

Drawings

FIG. 1 is a top view of an embodiment of the present invention;

FIG. 2 is a cross-sectional view A-A of FIG. 1;

fig. 3 is a sectional view B-B of fig. 1.

Detailed Description

When terms such as "upper" and "lower", "right" and "left" or similar relative expressions are used in the present embodiment, these refer only to the accompanying drawings and are not necessarily actual usage.

The utility model discloses a specific implementation of the utility model is shown in fig. 1-3, a double-deck circuit board that lamps and lanterns used, including circuit board main part 01 and L ED lamp pearl 02 that sets up on circuit board main part 01, be equipped with the guide hole 03 of connecting two-sided wire on circuit board main part 01, be equipped with first heat-conducting layer 011 in the circuit board main part 01, be equipped with the heat-conducting hole 012 of a plurality of intercommunication circuit board both sides on the circuit board main part 01, the interpolation of heat-conducting hole 012 is equipped with the heat-conducting part 013 unanimous with the inner wall shape of heat-conducting hole 012, the outer wall of heat-conducting part 013 contacts with first heat-conducting layer 011, the both ends of heat-conducting part 013 keep the same level with two drill way of heat-conducting hole 012 or bulge from two drill way of heat-conducting hole 012 respectively, both ends of heat-conducting layer 013 all are equipped with heat dissipation frame 014, in this embodiment, in the heat-conducting layer 013 both ends of heat-conducting layer, make things convenient for the installation of heat dissipation frame 014, first heat-conducting layer 011 can follow inside heat conduction, and through the air contact area of heat-conducting part 014 with the outside air contact of heat-conducting layer 014, accelerate heat-radiating fin 014 with the heat-radiating fin 014, accelerate heat-radiating fin 014, heat-radiating fin 014 of circuit board 014 heat-radiating fin 014, it is the heat-radiating fin 014 and the heat-radiating fin inboard heat-radiating fin 014 of this embodiment, it is the heat-radiating fin 015, the heat-radiating fin inboard heat-radiating fin 014 of this embodiment, the heat-radiating fin 015, the heat-radiating fin inboard of this embodiment, the heat-radiating fin inboard stable pole 015, the heat-radiating fin inboard of this embodiment is including the heat-radiating fin inboard of this embodiment does not only, the heat-radiating fin 014, this embodiment, this patent specification of this patent specification, this embodiment, this patent specification is the heat-radiating fin.

The utility model discloses do not confine the above-mentioned embodiment to, the general technical personnel in this field can adopt other multiple embodiments to implement according to the utility model discloses a, perhaps all adopt the utility model discloses a design structure and thinking do simple change or change, all fall into the utility model discloses a protection scope.

Claims

1. A double-layer circuit board for a lamp comprises a circuit board main body and L ED lamp beads arranged on the circuit board main body, and is characterized in that a first heat conduction layer is arranged in the circuit board main body, a plurality of heat conduction holes communicated with two side faces of the circuit board are formed in the circuit board main body, heat conduction parts with the shapes consistent with those of the inner walls of the heat conduction holes are inserted in the heat conduction holes, the outer walls of the heat conduction parts are in contact with the first heat conduction layer, and two ends of each heat conduction part are respectively provided with a heat dissipation frame extending out of the heat conduction hole.

2. The double-layer circuit board for the lamp according to claim 1, wherein: two ends of the heat conduction part are respectively flush with the two orifices of the heat conduction hole or protrude from the two orifices of the heat conduction hole.

3. The double-layer circuit board for the lamp according to claim 2, wherein the arrangement direction of the heat dissipation frame is consistent with that of L ED lamp beads, the heat dissipation frame comprises a base connected with the heat conducting part and heat dissipation fins arranged on the base, one heat dissipation frame at least comprises one heat dissipation fin, the heat dissipation fins are perpendicular to the main board of the circuit board, and the orientation of the heat dissipation fins is consistent.

4. The double-layer circuit board for the lamp according to claim 3, wherein a second heat conduction layer is arranged on the outer side face of the circuit board main body, the second heat conduction layer covers the outer peripheral side of the L ED lamp bead, and the second heat conduction layer is connected with the base.

5. The double-layer circuit board for the lamp according to claim 4, wherein: the fan is arranged on the outer side face of the circuit board, and the airflow direction of the fan is parallel to the radiating fins.

6. The double-layer circuit board for the lamp according to claim 5, wherein: the first heat conduction layer is heat conduction silicone grease, the second heat conduction layer is heat conduction glue, and the heat conduction part and the radiating fins are made of copper or copper alloy.