CN211061972U - Computer heat dissipation cold drawing and chip surface laminating mechanism - Google Patents
Computer heat dissipation cold drawing and chip surface laminating mechanism Download PDFInfo
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- CN211061972U CN211061972U CN202020123968.4U CN202020123968U CN211061972U CN 211061972 U CN211061972 U CN 211061972U CN 202020123968 U CN202020123968 U CN 202020123968U CN 211061972 U CN211061972 U CN 211061972U
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Abstract
The utility model provides a computer heat dissipation cold drawing and chip surface laminating mechanism, include: a frame plate, a chip and a cold plate; the bottom surface of the first section of the elastic sheet is connected with the upper surface of the upper step of the second-stage trapezoidal table; the bottom surface of the second section of the elastic sheet is connected with the upper surface of the frame plate; one end of the frame plate is in adaptive connection with the upper surface of a lower step of the second-stage trapezoidal table; the first section and the second section of the elastic sheet are elastically connected; the chip is attached to the lower end face of the cold plate. Adopt elastic mechanism, under the condition that cold drawing and mainboard produce certain deformation or displacement, guarantee the design of cold drawing and the effective laminating of chip. The cold plate and the chip can still be effectively attached after being used for a long time and generating certain deformation rate or displacement. The elastic sheet is arranged between the cold plate and the chip, and the bonding force between the cold plate and the chip is kept stable under a certain stroke. The mechanism has compact structure and saves space; the mechanism has the advantages of single action and long service life.
Description
Technical Field
The utility model relates to a rack-type computer ventilation cooling field, concretely relates to computer heat dissipation cold drawing and chip surface laminating mechanism.
Background
The rack-mounted computer is composed of common CPU, internal memory, mainboard, hard disk, case, display device, keyboard and mouse, and has the greatest characteristic of good expansibility, and generally supports a plurality of high-performance processors and a large number of standard hot plug components. The centralized use of multiple components and processors generates a large amount of heat. Chips such as processors are most sensitive to temperature. When the temperature exceeds the threshold value of the temperature that the chip can bear, the efficiency and accuracy of computer processing can not be guaranteed.
The heat dissipation of the rack-mounted computer generally adopts a combination of a chassis and a fan and a combination of chips and a cold plate. The heat dissipation mode of current chip + cold board, by the boss and the chip surface laminating of cold board, the clearance in the middle of is filled by the silicone grease and is accomplished: the thermal conductivity of silicone grease is much smaller than that of common metals such as aluminum, magnesium, copper and the like. Theoretically, the smaller the fit clearance, the better. When the clearance is larger, the filling amount of silicone grease is increased, the heat conductivity is reduced, the current fit clearance is mainly determined by the flatness of the cold plate, and the flatness is closely related to the strength, stress deformation, part machining precision and the like of materials.
With the trend of light and thin products, the weight of a large-sized rack-mounted computer is getting lighter and lighter. The challenge brought by the method is that the heat dissipation cold plate is thinner and thinner, certain designs reach less than or equal to 1.8mm, and the strength of the cold plate is reduced; however, along with the increase of the service time, in the internal and external environments such as temperature, humidity and vibration, the cold plate generates stress deformation due to insufficient strength, the cold plate and the PCB board can generate certain displacement, and the fit clearance is continuously increased. Once the gap exceeds a certain amount, the silicone grease reacts with air, and hardens to lose its heat-conducting function.
If the original heat dissipation structure is still adopted, the stable fit clearance and the heat dissipation requirement of the chip are difficult to guarantee. Therefore, how to realize that the cold plate and the chip are still effectively attached after being used for a long time and generating a certain deformation rate or displacement is a technical problem.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough among the above-mentioned prior art, the utility model provides a computer heat dissipation cold drawing and chip surface laminating mechanism, include: a frame plate, a chip and a cold plate;
the frame plate is arranged around the cold plate; the edge of the cold plate is provided with a secondary trapezoidal table; the edge of the cold plate is connected with at least two spring plates; the bottom surface of the first section of the elastic sheet is connected with the upper surface of the upper step of the second-stage trapezoidal table; the bottom surface of the second section of the elastic sheet is connected with the upper surface of the frame plate; one end of the frame plate is in adaptive connection with the upper surface of a lower step of the second-stage trapezoidal table; the first section and the second section of the elastic sheet are elastically connected; the chip is attached to the lower end face of the cold plate.
It should be further noted that the bottom surface of the first section of the elastic sheet is connected with the upper surface of the upper stage of the second-stage trapezoidal table through a firm screw.
It should be further noted that the bottom surface of the second section of the elastic sheet is connected with the frame plate through a pressure regulating screw;
the pressure regulating screw penetrates through the frame plate to be connected with the main board fixedly provided with the chip.
It is further noted that the lower end surface of the cold plate is provided with a groove; the groove is internally connected with a guide post which penetrates through the bottom of the groove and is connected with one end of the frame plate, so that a gap is formed between one end of the frame plate and the lower-level upper surface of the second-level trapezoidal table.
According to the technical scheme, the utility model has the advantages of it is following:
the utility model provides a computer heat dissipation cold drawing adopts elastic mechanism with chip surface laminating mechanism, produces under the condition of certain deformation or displacement at cold drawing and mainboard, guarantees the design of cold drawing and the effective laminating of chip. The cold plate and the chip can still be effectively attached after being used for a long time and generating certain deformation rate or displacement.
The elastic sheet is arranged between the cold plate and the chip, and the bonding force between the cold plate and the chip is kept stable under a certain stroke. The mechanism has compact structure and saves space; the mechanism has the advantages of single action and long service life.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a computer heat dissipation cold plate and chip surface bonding mechanism;
FIG. 2 is a schematic diagram of an embodiment of a computer heat sink cold plate and die surface attachment mechanism.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.
It will be understood that when an element or layer is referred to as being "on," connected to, "or" coupled to "another element or layer, it can be directly on, connected or coupled to the other element or layer, and intervening elements or layers may also be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Spatially relative terms such as "under …", "below", "lower", "above", "over", and the like, as may be used herein for ease of description, describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.
The utility model provides a computer heat dissipation cold drawing and chip surface laminating mechanism, as shown in figure 1 and figure 2, include: a frame plate 7, a chip 1 and a cold plate 2; the cold plate 2 can here be a metal plate made of a copper material, or a metal plate made of an aluminum material, or a metal plate made of a stainless steel material.
The chip 1 may be a processor, or a single chip, etc. The frame plate 7 may be a metal plate made of a copper material, or a metal plate made of an aluminum material, or a metal plate made of a stainless material. The frame plate 7 is arranged around the cold plate 2; namely, the frame plate 7 is sleeved on the periphery of the cold plate 2;
the edge of the cold plate 2 is provided with a secondary trapezoidal table; the edge of the cold plate 2 is connected with at least two spring plates 3; preferably, four spring pieces 3 are uniformly distributed on the edge of the cold plate 2. The bottom surface of the first section of the elastic sheet 3 is connected with the upper surface of the upper step of the second-stage trapezoidal table;
for the convenience of installation and use, the bottom surface of the first section of the elastic sheet 3 is connected with the upper surface of the upper stage of the second-stage trapezoidal table through a firm screw 4.
The bottom surface of the second section of the elastic sheet 3 is connected with the upper surface of the frame plate 7;
for the convenience of installation and use, the bottom surface of the second section of the elastic sheet 3 is connected with a frame plate 7 through a pressure regulating screw 5; the pressure regulating screw 5 passes through the frame plate 7 to be connected with the main board fixedly provided with the chip 1.
One end of the frame plate 7 is in adaptive connection with the upper surface of a lower step of the second-stage trapezoidal table; wherein, the lower end surface of the cold plate 2 is provided with a groove 11; the guide post 9 is connected with the inner part of the groove 11, the guide post 9 penetrates through the bottom of the groove 11 and is connected with one end of the frame plate 7, and a gap 8 is formed between one end of the frame plate 7 and the lower-level upper surface of the second-level trapezoid table. The first section and the second section of the elastic sheet 3 are elastically connected; this facilitates adjustment of the elastic deformation of the spring plate 3.
The chip 1 is attached to the lower end face of the cold plate 2. And silicone grease is coated between the chip 1 and the lower end surface of the cold plate 2. And a plurality of radiating fins 12 are arranged on the upper end surface of the cold plate 2 side by side, which is beneficial to radiating.
The installation process of the heat dissipation cold plate and the chip surface laminating mechanism of the computer can be that the cold plate and the guide post are riveted and installed;
the cold plate is matched with the elastic sheet through a firm screw to be firmly installed;
mounting the cold plate and the frame plate through a pressure regulating screw;
after the installation is finished, the cold plate is matched with the chip, and a certain elastic sheet deformation is adjusted through the pressure adjusting screw, so that the cold plate is attached to the chip and a certain pressure can be maintained;
fig. 2 shows the working state of the computer cooling cold plate and chip surface attaching mechanism after being applied to the cold plate assembly.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The utility model provides a computer heat dissipation cold drawing and chip surface laminating mechanism which characterized in that includes: a frame plate (7), a chip (1) and a cold plate (2);
the frame plate (7) is arranged around the cold plate (2);
the edge part of the cold plate (2) is provided with a secondary trapezoidal table;
the edge part of the cold plate (2) is connected with at least two elastic sheets (3);
the bottom surface of the first section of the elastic sheet (3) is connected with the upper surface of the upper step of the second-stage trapezoidal table;
the bottom surface of the second section of the elastic sheet (3) is connected with the upper surface of the frame plate (7);
one end of the frame plate (7) is in adaptive connection with the upper surface of a lower stage of the second-stage trapezoidal table;
the first section and the second section of the elastic sheet (3) are elastically connected;
the chip (1) is attached to the lower end surface of the cold plate (2).
2. The mechanism of claim 1,
the bottom surface of the first section of the elastic sheet (3) is connected with the upper surface of the upper stage of the second-stage trapezoidal table through a firm screw (4).
3. Mechanism according to claim 1 or 2,
the bottom surface of the second section of the elastic sheet (3) is connected with the frame plate (7) through a pressure regulating screw (5);
the pressure regulating screw (5) penetrates through the frame plate (7) to be connected with the main board fixedly provided with the chip (1).
4. Mechanism according to claim 1 or 2,
the lower end surface of the cold plate (2) is provided with a groove (11);
the guide post (9) is connected with the inner part of the groove (11), the guide post (9) penetrates through the bottom of the groove (11) and is connected with one end of the frame plate (7), and a gap (8) is formed between one end of the frame plate (7) and the lower-level upper surface of the second-level trapezoidal table.
5. Mechanism according to claim 1 or 2,
the upper end surface of the cold plate (2) is provided with a plurality of radiating fins (12) side by side.
6. Mechanism according to claim 1 or 2,
four elastic sheets (3) are uniformly distributed on the edge of the cold plate (2).
7. Mechanism according to claim 1 or 2,
silicone grease is coated between the chip (1) and the lower end face of the cold plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020123968.4U CN211061972U (en) | 2020-01-19 | 2020-01-19 | Computer heat dissipation cold drawing and chip surface laminating mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020123968.4U CN211061972U (en) | 2020-01-19 | 2020-01-19 | Computer heat dissipation cold drawing and chip surface laminating mechanism |
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| CN211061972U true CN211061972U (en) | 2020-07-21 |
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| CN202020123968.4U Active CN211061972U (en) | 2020-01-19 | 2020-01-19 | Computer heat dissipation cold drawing and chip surface laminating mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805673A (en) * | 2021-08-24 | 2021-12-17 | 中航光电科技股份有限公司 | Split type liquid cooling cold drawing fixed knot of CPU or GPU constructs |
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2020
- 2020-01-19 CN CN202020123968.4U patent/CN211061972U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805673A (en) * | 2021-08-24 | 2021-12-17 | 中航光电科技股份有限公司 | Split type liquid cooling cold drawing fixed knot of CPU or GPU constructs |
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