CN211045399U - Semiconductor silicon ring etching and cleaning device - Google Patents

Semiconductor silicon ring etching and cleaning device Download PDF

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Publication number
CN211045399U
CN211045399U CN201921994907.9U CN201921994907U CN211045399U CN 211045399 U CN211045399 U CN 211045399U CN 201921994907 U CN201921994907 U CN 201921994907U CN 211045399 U CN211045399 U CN 211045399U
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CN
China
Prior art keywords
etching
silicon ring
connecting rod
cleaning device
tank
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Active
Application number
CN201921994907.9U
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Chinese (zh)
Inventor
范明明
韩颖超
陈荣贵
李长苏
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Hangzhou dunyuan poly core semiconductor technology Co., Ltd
Original Assignee
Hangzhou Dahe Thermo Magnetics Co Ltd
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Priority to CN201921994907.9U priority Critical patent/CN211045399U/en
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Abstract

The utility model discloses a semiconductor silicon ring sculpture cleaning device, including the fuselage, be equipped with sculpture groove, rack and a driving motor on the fuselage, the rack includes the connecting rod and is used for the rotating turret of fixed silicon ring, and the connecting rod is connected with the fuselage, and the rotating turret rotates with the connecting rod to be connected, and a driving motor passes through drive mechanism and drives the rotating turret rotation. The utility model provides a semiconductor silicon ring sculpture cleaning device, the cleaning process rotating turret drives the product and rotates, makes the etching of product surface more even.

Description

Semiconductor silicon ring etching and cleaning device
Technical Field
The utility model belongs to the technical field of the semiconductor silicon material manufacture technique and specifically relates to a semiconductor silicon ring sculpture cleaning device is related to.
Background
The etching of the semiconductor is to dip the semiconductor into the etching solution to remove the unwanted substances attached to the surface of the semiconductor, and ensure the cleanness and purity of the semiconductor. And the suspended tooling has the risk of falling, and is not favorable for batch etching of silicon rings.
The liquid used for silicon ring etching cleaning is a special chemical liquid, the traditional cleaning equipment is generally an open single-groove container, when the silicon ring is cleaned in a cleaning groove, harmful gas is generated along with the cleaning, so that the working environment is polluted, and residual liquid is attached to the surface of the silicon ring after the silicon ring is cleaned, so that potential safety hazards are generated, and the normal work of cleaning etching is hindered.
Chinese patent application publication No. CN207651451U, published as 24.07.2018, entitled "silicon wafer single-sided etching device", discloses a silicon wafer single-sided etching device, which comprises an etching chamber, a circulating pump and a liquid medicine pipeline; a rotary worktable for bearing the silicon wafer is arranged in the etching chamber, and a spraying device is arranged above the rotary worktable; the spraying device is communicated with the liquid medicine pipeline, the bottom of the etching chamber is provided with a water outlet, and the water outlet is communicated with the circulating pump through the liquid medicine pipeline; the rotary worktable comprises a rotary driving device, a vacuumizing device and a supporting plate, wherein the supporting plate is connected with a rotating shaft of the rotary driving device so that the supporting plate rotates along with the rotation of the rotating shaft, the supporting plate comprises a supporting plate body, a cavity and a vacuum adsorption hole, the cavity is located inside the supporting plate body, the vacuum adsorption hole is connected with the cavity, the vacuum adsorption hole penetrates through the upper surface of the supporting plate body, and the cavity is communicated with the vacuumizing device. However, the above-mentioned technique still has the problem of non-uniform etching and is not suitable for double-sided etching of silicon rings.
Disclosure of Invention
The utility model discloses an overcome among the prior art silicon ring each part because the pressure action of the etching solution that receives is different, causes the inhomogeneous problem of ring product surface etching, provides a semiconductor silicon ring sculpture cleaning device, and the cleaning process rotating turret drives the product and rotates, makes product surface etching more even.
The second invention of the utility model aims to: the residual of the etching liquid on the silicon ring after etching is removed, so that the cleanliness of the surface of the silicon ring after etching treatment is ensured, and the personal injury of the subsequent staff to the staff caused by the etching liquid in the process of drying the silicon ring is prevented.
The third invention of the utility model aims to: harmful gas generated after etching is collected, and the influence of the harmful gas on the workshop environment and the health of operators is prevented.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor silicon ring sculpture cleaning device, includes the fuselage, is equipped with sculpture groove, rack and a driving motor on the fuselage, and the rack includes connecting rod and the rotating turret that is used for fixed silicon ring, and the connecting rod is connected with the fuselage, and the rotating turret rotates with the connecting rod to be connected, and a driving motor passes through drive mechanism and drives the rotating turret rotation.
According to the technical scheme, etching liquid is filled in the etching groove, the semiconductor silicon ring is fixed on the rotating frame and is immersed under the etching liquid, and the first driving motor drives the rotating frame to rotate, so that the surface of a product is etched more uniformly. Be equipped with control panel on the fuselage, all operating procedure of the clean device of sculpture are controlled through unified control panel, clean the device of sculpture through unified control panel and control, reduce staff's operation degree of difficulty, make things convenient for staff independent operation.
Preferably, a pure water tank and a second driving motor are arranged on the machine body, the pure water tank is arranged beside the etching tank, the connecting rod is rotatably connected with the machine body, and the second driving motor drives the connecting rod to rotate. In the structure, the second driving motor enables the connecting rod to rotate, so that the rotating frame can be switched between the etching groove and the pure water groove. The etching liquid is placed in the etching groove, the silicon ring etching treatment is carried out, unnecessary substances attached to the surface of the silicon ring are removed, pure water is placed in the pure water groove, the pure water after the silicon ring etching is cleaned, the two steps of silicon ring cleaning are carried out through the two grooves, the etching liquid remained on the surface of the silicon ring can be removed under the condition that the silicon ring is fully etched, the personal injury of workers caused by the etching liquid in the drying process of the silicon ring by subsequent workers is prevented, and the working safety of the operators is guaranteed.
Preferably, the transmission mechanism comprises a plurality of gears which are meshed in sequence, and the gears are rotationally connected with the connecting rod. The transmission mechanism can ensure the stability of the transmission mechanism, so that the power of the first driving motor can be transmitted to the rotating frame, and meanwhile, the gear can be made of the same corrosion-resistant material as the rotating frame. And a plurality of rotating frames can be arranged as required, each rotating frame is connected with a gear, and the plurality of rotating frames can be driven to rotate through one set of motor and transmission mechanism.
Preferably, the etching groove is provided with a water inlet and a water outlet, the water inlet is arranged at the upper part of the etching groove, and the water outlet is arranged at the lower part of the etching groove. The new liquid is poured into the etching groove through the water inlet, the waste liquid is discharged out of the etching groove through the water outlet, and the new liquid is collected and treated through a uniform waste liquid pipeline. The water inlet and outlet structure of the pure water tank is the same as that of the etching tank.
Preferably, an overflow groove is arranged on the inner side wall of the etching groove and close to the upper end of the etching groove, and the overflow groove is communicated with the water outlet. By adopting the structure, the phenomenon that the liquid overflows from the etching groove to pollute the external environment after being too much in the etching groove is avoided, and the overflow groove is connected with the water outlet, so that the processing and the collection are convenient. The overflow groove structure of the pure water groove is the same as that of the etching groove.
Preferably, the bottom of the etching tank is provided with a bubbling device for generating bubbles. The bubbling device is used for continuously generating bubbling during the silicon ring etching and cleaning, promoting the self-circulation of the etching solution in the tank, ensuring the uniform concentration of the etching solution from top to bottom, removing impurities attached to the surface of the silicon ring through bubbling from bottom to top, and ensuring the cleanliness of the surface of the etched silicon ring. The bubbling device air supply can be connected with the outside factory building air supply, also can provide the air supply through inside setting up the air pump, and gaseous needs filter.
Preferably, the air outlet end of the bubbling device is provided with an air outlet pipe, the air outlet pipe surrounds the bottom of the etching tank, and the air outlet pipe is provided with a plurality of air outlets. The air outlet pipe can enable bubbles to be more uniformly emitted from the bottom of the etching tank, and the cleaning effect is guaranteed. The structure of the bubbling device of the pure water tank is the same as that of the etching tank.
Preferably, an upper cover is arranged on the machine body and comprises an operating door plate, a left gas collecting device and a right gas collecting device, the left gas collecting device is arranged right above the etching tank, and the right gas collecting device is arranged right above the pure water tank. The operation door plant is arranged in the operating panel top, places the operation window of washing tank as the silicon ring, need close the use during daily production, places harmful gas and spills over, controls the gas collecting device and respectively directly over sculpture groove and pure water groove for absorb the harmful gas after the silicon ring sculpture, control the gas collecting device can communicate with the unified discharge pipe of factory building, carry out unified collection processing to gas.
The utility model has the advantages that: (1) the rotating frame drives the product to rotate in the cleaning process, so that the surface of the product is etched more uniformly; (2) the silicon ring dry cleaning device is provided with the etching groove and the pure water groove respectively, so that the residue of etching liquid on the silicon ring after etching is effectively removed, the cleanliness of the surface of the etched silicon ring is ensured, and the personal injury of the etching liquid to workers in the process of drying the silicon ring by subsequent workers is prevented; (3) harmful gas after the sculpture is produced is collected through the gas collection device, prevents that harmful gas from influencing the workshop environment and operating personnel is healthy.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural view of the upper cover of the present invention;
fig. 3 is a bottom view of the upper cover of the present invention.
In the figure: the device comprises a machine body 1, an etching groove 2, a placing frame 3, a connecting rod 3.1, a rotating frame 3.2, a first driving motor 4, a pure water groove 5, a second driving motor 6, a gear 7, a water inlet 8, a water outlet 9, an overflow groove 10, a bubbling device 11, an air outlet pipe 11.1, an upper cover 12, an operation door plate 12.1, a left air collecting device 12.2, a right air collecting device 12.3 and a control panel 13.
Detailed Description
The invention is further described with reference to the accompanying drawings and specific embodiments.
Example 1:
as shown in the figure, the semiconductor silicon ring etching and cleaning device comprises a machine body 1, wherein an etching groove 2, a pure water groove 5, a placing frame 3, a first driving motor 4, a second driving motor 6 and a control panel 13 are arranged on the machine body 1, the pure water groove 5 is arranged beside the etching groove 2, the placing frame 3 is arranged between the etching groove 2 and the pure water groove 5, the placing frame 3 comprises a connecting rod 3.1 and a rotating frame 3.2 for fixing a silicon ring, the connecting rod 3.1 is rotatably connected with the machine body 1, the rotating frame 3.2 is rotatably connected with the connecting rod 3.1, and the first driving motor 4 drives the rotating frame 3.2 to rotate through a transmission mechanism; the second driving motor 6 drives the connecting rod 3.1 to rotate; the transmission mechanism comprises a plurality of gears 7 which are meshed in sequence, and the gears 7 are rotationally connected with the connecting rod 3.1.
A water inlet 8 and a water outlet 9 are arranged on the etching groove 2, the water inlet 8 is arranged at the upper part of the etching groove 2, and the water outlet 9 is arranged at the lower part of the etching groove 2; an overflow groove 10 is arranged on the inner side wall of the etching groove 2 and close to the upper end, the overflow groove 10 is communicated with a water outlet 9, and the water outlet 9 is communicated with a factory waste liquid pipeline. The bottom of the etching groove 2 is provided with a bubbling device 11 for generating bubbles; an air outlet pipe 11.1 is arranged at the air outlet end of the bubbling device 11, the air outlet pipe 11.1 surrounds the bottom of the etching groove 2, and a plurality of air outlets are arranged on the air outlet pipe 11.1. The air source of the bubbling device 11 is connected with the external plant air source.
An upper cover 12 is arranged on the machine body 1, the upper cover 12 comprises an operation door panel 12.1, a left gas collecting device 12.2 and a right gas collecting device 12.3, the left gas collecting device 12.2 is arranged right above the etching tank 2, and the right gas collecting device 12.3 is arranged right above the pure water tank 5; the left and right gas collecting devices 12.3 are communicated with a unified gas collecting pipe of a factory building.
According to the technical scheme, etching liquid is filled in the etching groove 2, the semiconductor silicon ring is fixed on the rotating frame 3.2 and is immersed under the etching liquid, and the rotating frame 3.2 is driven to rotate by the first driving motor 4, so that the surface of a product is etched more uniformly. Be equipped with control panel on the fuselage 1, all operating procedure of the clean device of sculpture are controlled through unified control panel, clean the device of sculpture through unified control panel and control, reduce staff's operation degree of difficulty, make things convenient for staff independent operation. The second drive motor 6 rotates the connecting rod 3.1 so that the turret 3.2 can be switched between the etching tank 2 and the pure water tank 5. The etching liquid is placed in the etching groove 2 and used for etching the silicon ring and removing unnecessary substances attached to the surface of the silicon ring, the pure water is placed in the pure water groove 5 and used for cleaning the pure water etched by the silicon ring, and the etching liquid remained on the surface of the silicon ring can be removed under the condition of ensuring the full etching of the silicon ring through the two-step cleaning of the silicon ring by the two grooves. The bubbling device 11 is used for uninterruptedly generating bubbling during the silicon ring etching and cleaning, promoting the self-circulation of the etching solution in the tank, ensuring the uniform concentration of the etching solution from top to bottom, removing impurities attached to the surface of the silicon ring through bubbling from bottom to top, and ensuring the cleanliness of the surface of the etched silicon ring. The air source of the bubbling device 11 is connected with the external plant air source.
The beneficial effects of the utility model are that: the rotating frame drives the product to rotate in the cleaning process, so that the surface of the product is etched more uniformly; the silicon ring dry cleaning device is provided with the etching groove and the pure water groove respectively, so that the residue of etching liquid on the silicon ring after etching is effectively removed, the cleanliness of the surface of the etched silicon ring is ensured, and the personal injury of the etching liquid to workers in the process of drying the silicon ring by subsequent workers is prevented; harmful gas after the sculpture is produced is collected through the gas collection device, prevents that harmful gas from influencing the workshop environment and operating personnel is healthy.

Claims (8)

1. The utility model provides a semiconductor silicon ring sculpture cleaning device, characterized by includes the fuselage, is equipped with sculpture groove, rack and a driving motor on the fuselage, and the rack includes connecting rod and the rotating turret that is used for fixed silicon ring, and the connecting rod is connected with the fuselage, and the rotating turret rotates with the connecting rod to be connected, and a driving motor passes through drive mechanism and drives the rotating turret rotation.
2. The apparatus as claimed in claim 1, wherein the body is provided with a pure water tank and a second driving motor, the pure water tank is disposed beside the etching tank, the connecting rod is rotatably connected to the body, and the second driving motor drives the connecting rod to rotate.
3. The semiconductor silicon ring etching and cleaning device as claimed in claim 1, wherein the transmission mechanism comprises a plurality of gears which are meshed in sequence, and the gears are rotatably connected with the connecting rod.
4. The semiconductor silicon ring etching and cleaning device as claimed in claim 1, 2 or 3, wherein the etching tank is provided with a water inlet and a water outlet, the water inlet is arranged at the upper part of the etching tank, and the water outlet is arranged at the lower part of the etching tank.
5. The apparatus as claimed in claim 4, wherein an overflow groove is provided on the inner sidewall of the etching chamber near the upper end, and the overflow groove is connected to the water outlet.
6. The semiconductor silicon ring etching and cleaning device as claimed in claim 1, 2 or 3, wherein a bubbling device for generating bubbles is arranged at the bottom of the etching tank.
7. The etching and cleaning device for the semiconductor silicon ring as claimed in claim 6, wherein the outlet end of the bubbling device is provided with an outlet pipe, the outlet pipe surrounds the bottom of the etching tank, and the outlet pipe is provided with a plurality of outlets.
8. The semiconductor silicon ring etching and cleaning device as claimed in claim 2, wherein the body is provided with an upper cover, the upper cover comprises an operating door plate, a left gas collecting device and a right gas collecting device, the left gas collecting device is arranged right above the etching tank, and the right gas collecting device is arranged right above the pure water tank.
CN201921994907.9U 2019-11-18 2019-11-18 Semiconductor silicon ring etching and cleaning device Active CN211045399U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921994907.9U CN211045399U (en) 2019-11-18 2019-11-18 Semiconductor silicon ring etching and cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921994907.9U CN211045399U (en) 2019-11-18 2019-11-18 Semiconductor silicon ring etching and cleaning device

Publications (1)

Publication Number Publication Date
CN211045399U true CN211045399U (en) 2020-07-17

Family

ID=71537095

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921994907.9U Active CN211045399U (en) 2019-11-18 2019-11-18 Semiconductor silicon ring etching and cleaning device

Country Status (1)

Country Link
CN (1) CN211045399U (en)

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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20201222

Address after: Building C, no.668 BINKANG Road, Binjiang District, Hangzhou City, Zhejiang Province

Patentee after: Hangzhou dunyuan poly core semiconductor technology Co., Ltd

Address before: 310053 668, 777, BINKANG Road, Binjiang District, Hangzhou, Zhejiang.

Patentee before: HANGZHOU DAHE THERMO-MAGNETICS Co.,Ltd.