CN211038609U - Impact drilling tool - Google Patents
Impact drilling tool Download PDFInfo
- Publication number
- CN211038609U CN211038609U CN201890000504.5U CN201890000504U CN211038609U CN 211038609 U CN211038609 U CN 211038609U CN 201890000504 U CN201890000504 U CN 201890000504U CN 211038609 U CN211038609 U CN 211038609U
- Authority
- CN
- China
- Prior art keywords
- protective layer
- circuit board
- drilling tool
- elastic modulus
- percussion drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 45
- 239000011241 protective layer Substances 0.000 claims abstract description 78
- 238000009527 percussion Methods 0.000 claims description 10
- 238000013016 damping Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 229920003052 natural elastomer Polymers 0.000 claims description 2
- 229920001194 natural rubber Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000011010 flushing procedure Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
- E21B47/017—Protecting measuring instruments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Fluid Mechanics (AREA)
- Environmental & Geological Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Geophysics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Mechanical Engineering (AREA)
- Operation Control Of Excavators (AREA)
Abstract
The utility model relates to an impact drilling tool, it includes: a circuit board (11) having an elastic modulus; a first protective layer (12) for surrounding the circuit board (11), the first protective layer (12) having an elastic modulus; a second protective layer (13) which at least partially surrounds the first protective layer (12), the second protective layer (13) having an elastic modulus; the elastic modulus of the first protective layer (12) is different from the elastic modulus of the second protective layer (13); the circuit board (11) is supported by the first protective layer (12); the first protective layer (12) is supported by the second protective layer (13). The utility model discloses still relate to a drilling tool (2), it includes: a cavity (21) for receiving the circuit board (11) within the drilling tool (2); and a circuit board arrangement (1) as described above, which circuit board arrangement (1) is arranged in the cavity (21).
Description
Technical Field
The present invention relates to a circuit board device, and more particularly, to a circuit board device for protecting a circuit board from mechanical stress generated during drilling. The invention also relates to an impact drilling tool.
Background
Document WO2014/037619a2 discloses a method for measuring a borehole and a drilling device and a borehole measurement assembly. The method comprises the following steps: a first providing step for providing a drilling tool comprising at least one drill rod and a drill bit assembly; and a second providing step for providing an aperture measuring tool comprising a sensor device for measuring an aperture. In the method, a drilling tool is used that includes a central flushing channel for conducting flushing fluid to the drill bit assembly, and an aperture measuring tool is arranged in an arrangement step in the central flushing channel, so that flushing fluid can flow through the aperture measuring tool in the central flushing channel.
The problem with arranging an aperture measuring tool comprising a circuit board in a drilling tool is: the circuit board may be damaged during the drilling process due to mechanical stresses generated during the drilling process.
Document US5878824A discloses a drilling tool with thermal protection for electrical component assemblies. In particular, the operating power supply of the electrical component assembly is disconnected when the detected temperature reaches a maximum operating temperature. Document EP3056657a2 discloses a drilling tool with a hole measuring tool arranged in a first central flushing channel portion of a drill bit assembly. Document WO 2015/148826 a1 discloses an apparatus for protecting modules used in eyelets having a plurality of impact protection elements associated with said modules. Document US 2006/003137 a1 discloses a system and method for packaging and protecting an element assembly. The barrier system includes a first layer having a first set of physical properties and a second layer having a second set of physical properties, the system being adapted to protectively surround the component assembly.
Disclosure of Invention
It is an object of the present invention to provide a circuit board arrangement and a drilling tool in order to solve the above mentioned problems.
The object of the invention is achieved by a circuit board arrangement and a drilling tool, the features of which are disclosed below.
The invention is based on the idea of enclosing a circuit board in a first protective layer and then at least partially enclosing the first protective layer in a second protective layer, wherein the elastic modulus of the first protective layer differs from the elastic modulus of the second protective layer. The enclosed circuit board can then be placed within a drilling tool, such as a drill bit or drill rod.
An advantage of the circuit board arrangement and the drilling tool of the invention is that it provides more protection for the circuit board against mechanical stresses occurring during drilling.
Drawings
The invention will be described in more detail below by means of preferred embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a schematic cross-sectional view of a circuit board arrangement according to an embodiment of the invention; and
Fig. 2 is a schematic longitudinal section of a part of a drilling tool according to an embodiment of the invention.
Detailed Description
The invention relates to a circuit board arrangement 1 for protecting a circuit board 11 against mechanical stresses occurring during drilling. For example, the drilling is percussion drilling or rotary drilling.
The circuit board arrangement 1 comprises a circuit board 11. The circuit board 11 has an elastic modulus.
The circuit board arrangement 1 comprises a first protective layer 12, which first protective layer 12 is arranged to surround the circuit board 11. The circuit board 11 is supported by a first protective layer 12.
The circuit board arrangement 1 comprises a second protective layer 13, the second protective layer 13 being arranged to at least partly surround the first protective layer 12. The first protective layer 12 is supported by the second protective layer 13.
The first protective layer 12 has an elastic modulus. In other words, the material of the first protective layer 12 has an elastic modulus. The second protective layer 13 has an elastic modulus. In other words, the material of the second protective layer 13 has an elastic modulus. The elastic modulus of the first protective layer 12 is different from that of the second protective layer 13.
According to the embodiment, the elastic modulus of the first protective layer 12 is at least 10% of the elastic modulus of the circuit board 11. Thus, the mechanical strength of the circuit board assembly including the circuit board 11, the components on the circuit board 11, and the first protective layer 12 is increased as compared to a circuit board assembly without the first protective layer 12. In other words, the internal strain caused by the mechanical stress acting on the circuit board 11 is uniformly distributed among the components on the circuit board 11, the first protective layer 12, and the circuit board 11 itself. According to an embodiment, the elastic modulus of the first protective layer 12 is at least 0.1GPa, such as 1-5 GPa.
As the stiffness of the structure increases, the stress also increases. At higher mechanical stresses, the breaking or yield point will be exceeded and the structure deformed. According to the embodiment, the elastic modulus of the first protective layer 12 is higher than that of the second protective layer 13. In other words, the first protective layer 12 is at least partially surrounded by the second protective layer 13, which second protective layer 13 is softer than the first protective layer 12.
The second protective layer 13 does not necessarily completely surround the first protective layer 12 and the circuit board 11, and it is sufficient that the second protective layer 13 is a member that supports the structures (i.e., the circuit board 11 and the first protective layer 12). In other words, the second protective layer 13 is intended to be in contact with other objects that transmit mechanical forces to the circuit board arrangement 1. The soft material of the second protective layer 12 will deform in an elastic manner without breaking, thus reducing the mechanical stress peaks transmitted to the first protective layer 12 and the circuit board 11. According to an embodiment, the elastic modulus of the second protective layer 13 is 0.005-0.06 GPa.
According to an embodiment, first protective layer 12 is made of a radio wave transparent material, such as epoxy, polyurethane elastomer, or a ceramic material. According to an embodiment, the second protective layer 13 is made of a radio wave-transparent material, such as polyurethane elastomer, silicone or natural or synthetic rubber. In this way, wireless communication can be performed through the circuit board. The second protective layer 13 may also be made of a material that is not transparent to radio waves, when the first protective layer 12 is not completely surrounded by the second protective layer 13. The radio waves are, for example, radio waves having a frequency within the ISM radio band. According to an embodiment, the radio waves have a frequency of 2 to 6 GHz.
The invention also relates to a drilling tool 2. The drilling tool 2 is, for example, an impact drilling tool or a rotary drilling tool. The drilling tool 2 is, for example, a drill bit or a drill rod. Alternatively, the boring tool 2 is an adapter for use between a drill bit and a drill rod, or for use between two drill rods. The boring tool 2 includes a cavity 21 for receiving the circuit board 11 within the boring tool 2. The drilling tool 2 further comprises a circuit board arrangement 1 as described above, which circuit board arrangement 1 is arranged in the cavity 21.
According to an embodiment, the circuit board arrangement 1 is supported by a second protective layer 13, which second protective layer 13 contacts the drilling tool 2, i.e. the walls of the cavity 21. The circuit-board arrangement 1 may furthermore be supported by one or more damping means 22, which damping means 22 are connected to the walls of the cavity 21 and to the circuit-board arrangement 1.
Claims (9)
1. An impact drilling tool comprising
A cavity (21) for receiving the circuit board (11) within the drilling tool (2); and
-a circuit board arrangement (1) for protecting the circuit board (11) against mechanical stresses generated during percussion drilling, the circuit board arrangement (1) being arranged in the cavity (21),
Wherein the circuit board arrangement (1) is supported in the longitudinal direction by one or more damping means (22), which damping means (22) are connected with the wall of the cavity (21) and the circuit board arrangement (1);
It is characterized in that the preparation method is characterized in that,
The circuit board device (1) comprises:
-a circuit board (11), said circuit board (11) having an elastic modulus;
-a first protective layer (12), said first protective layer (12) being arranged to surround said circuit board (11), said first protective layer (12) having an elastic modulus; and
-a second protective layer (13), the second protective layer (13) being arranged to at least partially surround the first protective layer (12), the second protective layer (13) having an elastic modulus;
The elastic modulus of the first protective layer (12) is different from the elastic modulus of the second protective layer (13);
The circuit board (11) is supported by the first protective layer (12);
The first protective layer (12) is supported by the second protective layer (13); and
The circuit board arrangement (1) is laterally supported by the second protective layer (13), the second protective layer (13) being in contact with the walls of the cavity (21),
The elastic modulus of the first protective layer (12) is higher than the elastic modulus of the second protective layer (13), wherein the elastic modulus of the first protective layer (12) is at least 0.1GPa, and the elastic modulus of the second protective layer (13) is 0.005-0.06 GPa.
2. The percussion drilling tool of claim 1, wherein: the first protective layer (12) is made of a polymer or ceramic material.
3. The percussion drilling tool of claim 2, wherein: the first protective layer (12) is made of epoxy resin or polyurethane elastomer.
4. A percussion drilling tool according to any one of claims 1-3, characterized in that: the second protective layer (13) is made of an elastomer.
5. The percussion drilling tool of claim 4, wherein: the second protective layer (13) is made of polyurethane, silicone or natural or synthetic rubber.
6. A percussion drilling tool according to any one of claims 1-3, characterized in that: the first protective layer (12) is made of a material that is transparent to radio waves.
7. A percussion drilling tool according to any one of claims 1-3, characterized in that: the drilling tool (2) is a drill bit.
8. A percussion drilling tool according to any one of claims 1-3, characterized in that: the boring tool (2) is a drill rod.
9. A percussion drilling tool according to any one of claims 1-3, characterized in that: the drilling tool (2) is an adapter between a drill bit and a drill rod, or an adapter between two drill rods.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20175017 | 2017-01-11 | ||
| FI20175017A FI20175017L (en) | 2017-01-11 | 2017-01-11 | A circuit board arrangement for protecting a circuit board against mechanical stress occurring during drilling and a drill tool |
| PCT/FI2018/050012 WO2018130746A1 (en) | 2017-01-11 | 2018-01-09 | A circuit board arrangement for protecting a circuit board against mechanical stress occurring during drilling and a drill tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211038609U true CN211038609U (en) | 2020-07-17 |
Family
ID=61005839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201890000504.5U Active CN211038609U (en) | 2017-01-11 | 2018-01-09 | Impact drilling tool |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP3224673U (en) |
| KR (1) | KR200496269Y1 (en) |
| CN (1) | CN211038609U (en) |
| DE (1) | DE212018000121U1 (en) |
| FI (1) | FI20175017L (en) |
| PL (1) | PL128650U1 (en) |
| SE (1) | SE544095C2 (en) |
| WO (1) | WO2018130746A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4990987A (en) * | 1986-12-18 | 1991-02-05 | Gte Products Corporation | Over-temperature sensor and protector for semiconductor devices |
| US5337002A (en) * | 1991-03-01 | 1994-08-09 | Mercer John E | Locator device for continuously locating a dipole magnetic field transmitter and its method of operation |
| US5878824A (en) * | 1996-11-27 | 1999-03-09 | Digital Control Incorporated | Boring tool or other device including thermal protection for an electronic component assembly and method |
| US7390551B2 (en) | 2004-07-02 | 2008-06-24 | Caterpillar Inc. | System and method for encapsulation and protection of components |
| US8286475B2 (en) * | 2008-07-04 | 2012-10-16 | Schlumberger Technology Corporation | Transducer assemblies for downhole tools |
| FI123928B (en) | 2012-09-06 | 2013-12-31 | Robit Rocktools Ltd | Procedure for exploring boreholes, bore arrangements, and borehole survey composition |
| US9879520B2 (en) * | 2014-03-28 | 2018-01-30 | Baker Hughes, A Ge Company, Llc | Packaging structures and materials for vibration and shock energy attenuation and dissipation and related methods |
| FI126949B (en) * | 2015-02-11 | 2017-08-31 | Oy Robit Rocktools Ltd | Drilling Tools |
-
2017
- 2017-01-11 FI FI20175017A patent/FI20175017L/en not_active Application Discontinuation
-
2018
- 2018-01-09 JP JP2019600101U patent/JP3224673U/en active Active
- 2018-01-09 DE DE212018000121.9U patent/DE212018000121U1/en active Active
- 2018-01-09 KR KR2020197000063U patent/KR200496269Y1/en active IP Right Grant
- 2018-01-09 PL PL128650U patent/PL128650U1/en unknown
- 2018-01-09 WO PCT/FI2018/050012 patent/WO2018130746A1/en active Application Filing
- 2018-01-09 SE SE1950919A patent/SE544095C2/en unknown
- 2018-01-09 CN CN201890000504.5U patent/CN211038609U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP3224673U (en) | 2020-01-16 |
| KR20190002752U (en) | 2019-11-04 |
| FI20175017L (en) | 2018-07-12 |
| WO2018130746A1 (en) | 2018-07-19 |
| SE1950919A1 (en) | 2019-08-08 |
| DE212018000121U1 (en) | 2019-08-21 |
| SE544095C2 (en) | 2021-12-21 |
| KR200496269Y1 (en) | 2022-12-14 |
| PL128650U1 (en) | 2020-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |