CN210986849U

CN210986849U - Solid-state microwave power amplifier module heat abstractor

Info

Publication number: CN210986849U
Application number: CN201922126284.XU
Authority: CN
Inventors: 苏闰龙
Original assignee: Chengdu Tuobo Technology Co ltd
Current assignee: Chengdu Tuobo Technology Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-07-10
Anticipated expiration: 2029-12-02

Abstract

The utility model belongs to the heat abstractor field, especially, solid-state microwave power amplifier module heat abstractor can be infected with the jam that the dust caused the dust guard to the long-time back surface that uses of current dust guard to influence the normal heat dissipation problem of solid-state microwave power amplifier module, the following scheme is put forward now, and it includes power amplifier module main part, the louvre has all been seted up to the both sides of power amplifier module main part, has placed the dust guard in the louvre, has all seted up the kerve on the both sides inner wall of power amplifier module main part, and slidable mounting has same bottom plate in two kerves, and first spring has all been welded to the bottom both sides of bottom plate, and the bottom welding of first spring is on the bottom inner wall of kerve, and the bottom welding of bottom plate has the iron plate, fixedly. The utility model discloses the practicality is good, conveniently takes off the dust guard and clears away the dust on the dust guard, guarantees the heat dissipation that power amplifier module main part can be normal.

Description

Solid-state microwave power amplifier module heat abstractor

Technical Field

The utility model relates to a heat abstractor technical field especially relates to a solid-state microwave power amplifier module heat abstractor.

Background

The transmitter is a key device of a radar and a remote measuring system, and the solid-state power amplifier is a core component of the transmitter.

Current solid-state microwave power amplifier module all dispels the heat through setting up the louvre, sets up the dust guard in the louvre and carries out dustproof processing, but the dust guard uses the back surface for a long time and can be infected with the jam that the dust caused the dust guard to influence the normal heat dissipation of solid-state microwave power amplifier module.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving and having the dust guard to use the rear surface for a long time among the prior art and can be infected with the jam that the dust guard caused to influence the normal heat dissipation shortcoming of solid-state microwave power amplifier module, and the solid-state microwave power amplifier module heat abstractor who proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a solid-state microwave power amplifier module heat dissipation device comprises a power amplifier module main body, heat dissipation holes are formed in two sides of the power amplifier module main body, dustproof plates are placed in the heat dissipation holes, bottom grooves are formed in two inner walls of the two sides of the power amplifier module main body, the same bottom plate is arranged in the two bottom grooves in a sliding mode, first springs are welded on two sides of the bottom plate, the bottom ends of the first springs are welded on the inner walls of the bottoms of the bottom grooves, iron blocks are welded at the bottom of the bottom plate, electromagnets are fixedly connected to the inner walls of the bottom of the power amplifier module main body, first plates are welded on two sides of the top of the bottom plate, a first groove is formed in the bottom of each dustproof plate, the first plates are clamped with the first grooves, displacement grooves are formed in the two inner walls of the two sides of the power amplifier module main body, displacement plates are arranged in the displacement grooves in a sliding mode, the top welding of displacement plate has the second spring, and the top of second spring welds on the top inner wall of displacement groove, the one end of the top fixedly connected with lifting rope of displacement plate, the other end fixed connection of lifting rope in the top of bottom plate.

Preferably, the top of the power amplifier module main body is provided with a mounting hole, and a thermometer is arranged in the mounting hole and used for detecting the power amplifier module main body.

Preferably, the bottom of one side of the power amplifier module main body is fixedly connected with a switch, the switch is electrically connected with the electromagnet, and the electromagnet is started through the switch.

Preferably, the inner walls of the two sides of the power amplifier module body are fixedly connected with reels, and the lifting ropes are in contact with the outer sides of the reels.

Preferably, a first hole is formed in the inner wall of the top of the bottom groove, and the first plate is slidably mounted in the first hole.

Preferably, a second hole is formed in the inner wall of the bottom of the displacement groove, and the second plate is slidably mounted in the second hole.

The utility model discloses in, a solid-state microwave power amplifier module heat abstractor, when the heat in the power amplifier module main part can not be timely when effluvium, press the switch, it has the adsorption affinity to the iron plate to start behind the electro-magnet circular telegram of electro-magnet, it removes downwards to drive the iron plate, bottom plate extrusion first spring, the bottom plate drives the first board and removes, make the first board shift out the first groove, the bottom plate drives the lifting rope and removes, the lifting rope drives the displacement board and removes, the displacement board drives the second board and removes, make the second board shift out the second groove, remove the fixed to the dust guard this moment, take off the dust guard this moment and wash the dust guard, install the dust guard after the washing is accomplished, dispose the dust on the dust guard, guarantee the heat dissipation that the power amplifier module main part can be normal.

The utility model discloses the practicality is good, conveniently takes off the dust guard and clears away the dust on the dust guard, guarantees the heat dissipation that power amplifier module main part can be normal.

Drawings

Fig. 1 is a schematic structural diagram of a solid-state microwave power amplifier module heat dissipation device provided by the present invention;

fig. 2 is a schematic structural diagram of a portion a of a solid-state microwave power amplifier module heat dissipation device provided by the present invention;

fig. 3 is a schematic structural diagram of a part B of the heat dissipation device of the solid-state microwave power amplifier module according to the present invention.

In the figure: 1. a power amplifier module main body; 2. heat dissipation holes; 3. a dust-proof plate; 4. a base plate; 5. an iron block; 6. an electromagnet; 7. a first spring; 8. a first plate; 9. a displacement plate; 10. a second plate; 11. a second spring; 12. a lifting rope; 13. a reel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a solid-state microwave power amplifier module heat dissipation device comprises a power amplifier module body 1, heat dissipation holes 2 are formed in both sides of the power amplifier module body 1, dust-proof plates 3 are placed in the heat dissipation holes 2, bottom grooves are formed in both side inner walls of the power amplifier module body 1, the same bottom plate 4 is slidably mounted in the two bottom grooves, first springs 7 are welded on both sides of the bottom plate 4, the bottom ends of the first springs 7 are welded on the bottom inner walls of the bottom grooves, iron blocks 5 are welded on the bottom of the bottom plate 4, electromagnets 6 are fixedly connected on the bottom inner walls of the power amplifier module body 1, first plates 8 are welded on both sides of the top of the bottom plate 4, first grooves are formed in the bottom of the dust-proof plates 3, the first plates 8 are clamped with the first grooves, displacement grooves are formed in both side inner walls of the power amplifier module body 1, displacement plates 9 are slidably mounted in the displacement, the second groove has been seted up at the top of dust guard 3, and second board 10 is installed with the second groove mutually, and the top welding of displacement board 9 has second spring 11, and the top of second spring 11 welds on the top inner wall of displacement groove, and the top fixedly connected with lifting rope 12's of displacement board 9 one end, the other end fixed connection of lifting rope 12 in the top of bottom plate 4.

In this embodiment, the top of the power amplifier module main body 1 is provided with a mounting hole, and a thermometer is arranged in the mounting hole to detect the power amplifier module main body 1.

In this embodiment, the bottom of one side of the power amplifier module main body 1 is fixedly connected with a switch, the switch is electrically connected with the electromagnet 6, and the electromagnet 6 is started through the switch.

In this embodiment, the power amplifier module body 1 is fixedly connected with a winding wheel 13 on the inner wall of both sides, and the lifting rope 12 contacts with the outer side of the winding wheel 13.

In this embodiment, a first hole is formed in the inner wall of the top of the bottom groove, and the first plate 8 is slidably mounted in the first hole.

In this embodiment, a second hole is formed on the inner wall of the bottom of the displacement slot, and the second plate 10 is slidably mounted in the second hole.

In the utility model, when in use, when the heat in the power amplifier module main body 1 can not be dissipated in time, the switch is pressed to start the electromagnet 6, the electromagnet 6 is powered by the storage battery, the electromagnet 6 has adsorption force on the iron block 5 after being powered on, the iron block 5 is driven to move downwards, the iron block 5 drives the bottom plate 4 to move, the bottom plate 4 extrudes the first spring 7, the bottom plate 4 drives the first plate 8 to move, the first plate 8 moves out of the first groove, the bottom plate 4 drives the lifting rope 12 to move, the lifting rope 12 drives the displacement plate 9 to move, the displacement plate 9 extrudes the second spring 11, the displacement plate 9 drives the second plate 10 to move, the second plate 10 moves out of the second groove, the fixation of the dustproof plate 3 is released at the moment, the dustproof plate 3 is taken down to clean the dustproof plate 3 at the moment, the dustproof plate 3 is installed after the cleaning is finished, the dust on the dustproof plate 3 is removed, the normal heat dissipation of the power amplifier module main body 1 is ensured.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A solid-state microwave power amplifier module heat dissipation device comprises a power amplifier module main body (1) and is characterized in that heat dissipation holes (2) are formed in two sides of the power amplifier module main body (1), dust-proof plates (3) are placed in the heat dissipation holes (2), bottom grooves are formed in inner walls of two sides of the power amplifier module main body (1), the same bottom plate (4) is arranged in the two bottom grooves in a sliding mode, first springs (7) are welded on two sides of the bottom plate (4), the bottom ends of the first springs (7) are welded on the inner wall of the bottom groove, iron blocks (5) are welded at the bottom of the bottom plate (4), an electromagnet (6) is fixedly connected onto the inner wall of the bottom of the power amplifier module main body (1), first plates (8) are welded on two sides of the top of the bottom plate (4), first grooves are formed in the bottoms of the dust-proof plates, all seted up the displacement groove on the both sides inner wall of power amplifier module main part (1), sliding mounting has displacement board (9) in the displacement groove, the bottom welding of displacement board (9) has second board (10), the second groove has been seted up at the top of dust guard (3), second board (10) are installed with the second groove mutually, the top welding of displacement board (9) has second spring (11), the top of second spring (11) welds on the top inner wall in displacement groove, the one end of the top fixedly connected with lifting rope (12) of displacement board (9), the other end fixed connection of lifting rope (12) is in the top of bottom plate (4).

2. The heat dissipation device of a solid-state microwave power amplifier module according to claim 1, wherein a mounting hole is formed at the top of the power amplifier module body (1), and a thermometer is disposed in the mounting hole.

3. The heat dissipation device of a solid-state microwave power amplifier module according to claim 1, wherein a switch is fixedly connected to the bottom of one side of the power amplifier module body (1), and the switch is electrically connected to the electromagnet (6).

4. The heat dissipation device for the solid-state microwave power amplifier module according to claim 1, wherein a winding wheel (13) is fixedly connected to the inner walls of both sides of the power amplifier module body (1), and the lifting rope (12) contacts with the outer side of the winding wheel (13).

5. The heat sink for solid-state microwave power amplifier module according to claim 1, wherein the top inner wall of the bottom slot has a first hole, and the first plate (8) is slidably mounted in the first hole.

6. The heat dissipation device of a solid-state microwave power amplifier module as claimed in claim 1, wherein the inner wall of the bottom of the displacement slot is provided with a second hole, and the second plate (10) is slidably mounted in the second hole.