CN210986845U - Laser circuit board heat radiation structure - Google Patents
Laser circuit board heat radiation structure Download PDFInfo
- Publication number
- CN210986845U CN210986845U CN201922095478.8U CN201922095478U CN210986845U CN 210986845 U CN210986845 U CN 210986845U CN 201922095478 U CN201922095478 U CN 201922095478U CN 210986845 U CN210986845 U CN 210986845U
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- cooling
- groove
- circuit board
- cooling pipe
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a laser circuit board heat radiation structure, which comprises a power supply board, wherein the surface of the power supply board is provided with a groove, a cooling pipe is embedded in the groove, the side wall of the power supply board is provided with an inlet and an outlet which are communicated with the groove, the inlet is provided with a water inlet joint communicated with the cooling pipe, and the outlet is provided with a water outlet joint communicated with the cooling pipe; a cover plate is embedded in the notch of the groove. Cooling water is injected into the cooling pipe from the water inlet joint by means of a water pump or the like, flows in the cooling pipe, and is discharged from the water outlet joint. During the use, the heat that the laser instrument circuit board produced can transmit to the power strip in, the heat in the power strip can transmit to the cooling water, and the heat that flows can take the production from for the heat that the laser instrument circuit board produced is difficult for gathering in the use, makes the life of laser instrument circuit board be difficult for receiving the influence, makes the normal use that is equipped with this laser instrument circuit board be difficult for receiving the influence.
Description
Technical Field
The utility model relates to a laser instrument, in particular, relate to a laser instrument circuit board heat radiation structure.
Background
At present, a conventional laser circuit board, as shown in fig. 1, includes a power board 1, a laser power supply 12, a filter 13, and a switching power supply 14; a power supply mounting area 15 and an accessory mounting area 16 are formed on the power supply board 1, and the power supply mounting area 15 and the accessory mounting area 16 are arranged side by side; the laser power supplies 12 are arranged in the power supply installation area 15, and two laser power supplies 12 are arranged side by side; the filter 13 and the switching power supply 14 are both disposed in the accessory mounting area 16, and the filter 13 and the switching power supply 14 are arranged along the length direction of the laser power supply 12. When in use, the laser power supply 12, the filter 13 and the switching power supply 14 all generate heat, and the heat generated by the laser power supply 12 is greater than the heat generated by the filter 13 and greater than the heat generated by the switching power supply 14. The temperature of the laser circuit board is continuously increased after the heat generated by the laser circuit board is accumulated, the service life of the laser circuit board is influenced, and the normal use of a laser provided with the laser circuit board is influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a laser circuit board heat radiation structure, it can dispel the heat to the laser circuit board for the heat that produces in the laser circuit board use is difficult for gathering, makes the life of laser circuit board be difficult for receiving the influence, makes the normal use that is equipped with this laser circuit board be difficult for receiving the influence.
In order to solve the technical problem, the technical scheme of the utility model is that: a heat dissipation structure of a laser circuit board comprises a power panel, wherein a groove is formed in the surface of the power panel, a cooling pipe is embedded in the groove and is contained in the groove, an inlet communicated with one end of the groove and an outlet communicated with the other end of the groove are formed in the side wall of the power panel, a water inlet joint is arranged at the inlet and is communicated with one end of the cooling pipe, a water outlet joint is arranged at the outlet and is communicated with the other end of the cooling pipe; and a cover plate is embedded in the notch of the groove and tightly presses the cooling pipe on the inner groove wall of the groove.
Through above-mentioned technical scheme, through tools such as water pump with cooling water from the water supply connector continuously pour into the cooling tube inside, cooling water flows in the cooling tube inside, and the cooling water of cooling tube inside is discharged from water outlet connector finally. During the use, the heat that the laser instrument circuit board produced can transmit to the power strip in, the heat in the power strip can transmit to the cooling water, and the heat that flows can take the production from for the heat that the laser instrument circuit board produced is difficult for gathering in the use, makes the life of laser instrument circuit board be difficult for receiving the influence, makes the normal use that is equipped with this laser instrument circuit board be difficult for receiving the influence. The cover plate can cover the notch of the groove, so that the cooling pipe in the groove is not easy to deviate from the groove.
Preferably, the cooling tube is including the section of intaking, cooling segment and the play water section that connect gradually, the section of intaking is connected the water supply connector department, the cooling segment is buckled and is the wave, it connects to go out the water section the water connection department.
Through above-mentioned technical scheme, the cooling section is buckled and is the wave for the length that the cooling water flowed through is longer, and the cooling tube can carry out comparatively abundant cooling to the laser instrument circuit board, and the cooling water can take away more heat from the circuit board.
Preferably, a power supply mounting area and an accessory mounting area are formed on the power supply board, the cooling section comprises an accessory cooling portion and a power supply cooling portion, the accessory cooling portion is located in the accessory mounting area, the power supply cooling portion is located in the power supply mounting area, and the distance between two adjacent bending points in the accessory cooling portion is smaller than the distance between two adjacent bending points in the power supply cooling portion.
Through the technical scheme, as more components are distributed at the junction of the accessory mounting area and the power supply mounting area, such as a laser power supply, a filter and a switching power supply, and the generated heat is more, the distance between two adjacent bending points in the accessory cooling part is controlled to be smaller than the distance between two adjacent bending points in the power supply cooling part, so that the junction of the accessory mounting area and the power supply mounting area can be sufficiently cooled.
Preferably, the inlet and the outlet are arranged on the same side of the power panel.
Through the technical scheme, the inlet and the outlet are arranged on the same side of the power panel, so that the later installation process becomes more convenient and quicker.
Preferably, the side wall of the power panel adjacent to the inlet is a positioning wall, and the distance between the water inlet section and the positioning wall is greater than the minimum distance between the cooling pipe and the positioning wall.
Through above-mentioned technical scheme, because the length of laser instrument power is greater than the total length of wave filter and switching power supply, so control the interval of intaking between section and the location wall and be greater than the minimum interval between cooling tube and the location wall to this under the prerequisite of guaranteeing the cooling effect, shorten the length of cooling tube, reduce this heat radiation structure's manufacturing cost.
Preferably, the water outlet section is obliquely arranged, and the distance between the water outlet section and the cooling pipe is gradually reduced towards one side of the outlet.
Through above-mentioned technical scheme, the play water section that the slope set up is compared in the play water section length that the bending set up shorter, helps reducing this heat radiation structure's manufacturing cost.
Preferably, heat-conducting silicone grease is filled between the inner wall of the groove and the outer wall of the cooling pipe.
Through above-mentioned technical scheme, fill heat conduction silicone grease between recess and cooling tube for the cooling tube is difficult for taking place to remove in the recess is inside in the use, makes the cooling tube difficult for taking place to buckle and damage.
Preferably, one side of the cover plate facing the cooling pipe is provided with a limit groove for the cooling pipe to extend into, and when the cooling pipe is positioned in the limit groove, the outer wall of the cooling pipe is attached to the inner groove wall of the limit groove.
Through above-mentioned technical scheme, when embedding apron to recess inside, the cooling tube enters into the spacing inslot portion, and the outer wall of cooling tube laminates in the inner tank wall of spacing groove for the cooling tube is difficult to be squeezed by the apron and is deformed.
Drawings
FIG. 1 is a schematic structural diagram of a conventional laser circuit board;
FIG. 2 is a schematic structural diagram of an embodiment;
fig. 3 is a partial sectional view of the embodiment.
Reference numerals: 1. a power panel; 2. a groove; 3. a cooling tube; 31. a water inlet section; 32. a cooling section; 321. an accessory cooling section; 322. a power supply cooling section; 33. a water outlet section; 4. an inlet; 5. an outlet; 6. a water inlet joint; 7. a water outlet joint; 8. a cover plate; 9. a positioning wall; 10. heat-conducting silicone grease; 11. a limiting groove; 12. a laser power supply; 13. a filter; 14. a switching power supply; 15. a power supply installation area; 16. an accessory mounting area.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and grasped.
A heat dissipation structure of a laser circuit board, as shown in fig. 2 and 3, includes a power board 1, a power mounting area 15 and an accessory mounting area 16 are formed on the power board 1, and an area of the power mounting area 15 is larger than an area of the accessory mounting area 16. The surface of the power panel 1 is provided with a bent groove 2, one side of the power panel 1 is provided with an inlet 4 and an outlet 5 side by side, and the inlet 4 and the outlet 5 are close to one side of the accessory mounting area 16. Import 4 and recess 2's one end intercommunication, import 4 department is provided with water supply connector 6, export 5 and recess 2's the other end intercommunication, and export 5 department is provided with water connectors 7.
The cooling pipe 3 is embedded in the groove 2, and the top of the cooling pipe 3 is accommodated in the groove 2. The cooling pipe 3 comprises a water inlet section 31, a cooling section 32 and a water outlet section 33 which are connected in sequence. The section 31 of intaking is horizontal setting, and the tip that the section 31 of intaking is kept away from cooling segment 32 communicates with water supply connector 6. The cooling section 32 is bent into a wave shape, the cooling section 32 comprises an accessory cooling part 321 located in the accessory mounting area 16 and a power supply cooling part 322 located in the power supply mounting area 15, and the distance a between two bending points in the accessory cooling part 321 is smaller than the distance b between two bending points in the power supply cooling part 322. The water outlet section 33 is inclined and inclined, and the distance between the water outlet section 33 and the cooling section 32 gradually decreases towards the outlet 5 side.
The side wall of the power panel 1 adjacent to the inlet 4 is a positioning wall 9, and the distance c between the water inlet section 31 and the positioning wall 9 is larger than the minimum distance d between the cooling pipe 3 and the positioning wall 9.
The notch of the groove 2 is embedded with a cover plate 8, and the cover plate 8 is used for pressing the cooling pipe 3 on the inner groove wall of the groove 2. The lateral wall of the cover plate 8 close to the cooling pipe 3 is provided with a limit groove 11, when the cover plate 8 covers the notch of the groove 2, one side of the cooling pipe 3 is positioned in the limit groove 11, and the outer wall of the cooling pipe 3 is attached to the inner groove wall of the limit groove 11.
Heat conduction silicone grease 10 is filled between the inner wall of the groove 2 and the outer wall of the cooling pipe 3, and the heat conduction silicone grease 10 fills the gap between the groove 2 and the cooling pipe 3, so that the cooling pipe 3 is not easy to move in the groove 2.
Of course, the above is only a typical example of the present invention, and besides, the present invention can also have other various specific embodiments, and all technical solutions adopting equivalent replacement or equivalent transformation are all within the scope of the present invention as claimed.
Claims (8)
1. The utility model provides a laser instrument circuit board heat radiation structure, includes power strip (1), characterized by: the surface of the power panel (1) is provided with a groove (2), a cooling pipe (3) is embedded in the groove (2), the cooling pipe (3) is accommodated in the groove (2), the side wall of the power panel (1) is provided with an inlet (4) communicated with one end of the groove (2) and an outlet (5) communicated with the other end of the groove (2), the inlet (4) is provided with a water inlet joint (6), the water inlet joint (6) is communicated with one end of the cooling pipe (3), the outlet (5) is provided with a water outlet joint (7), and the water outlet joint (7) is communicated with the other end of the cooling pipe (3); a cover plate (8) is embedded in the notch of the groove (2), and the cooling pipe (3) is tightly pressed on the inner groove wall of the groove (2) through the cover plate (8).
2. The heat dissipation structure of the laser circuit board of claim 1, wherein: cooling tube (3) are including the section of intaking (31), cooling section (32) and play water section (33) that connect gradually, it connects to intake section (31) water supply connector (6) department, cooling section (32) are buckled and are the wave, it connects to go out water section (33) water supply connector (7) department.
3. The heat dissipation structure of the laser circuit board as claimed in claim 2, wherein: be formed with power supply installing zone (15) and annex installing zone (16) on power strip (1), cooling section (32) are including annex cooling portion (321) and power cooling portion (322), annex cooling portion (321) are located in annex installing zone (16), power cooling portion (322) are located in power supply installing zone (15), just the interval between two adjacent buckling points in annex cooling portion (321) is less than the interval between two adjacent buckling points in power cooling portion (322).
4. The heat dissipation structure of the laser circuit board as claimed in claim 2, wherein: the inlet (4) and the outlet (5) are arranged on the same side of the power panel (1).
5. The heat dissipation structure of the laser circuit board as claimed in claim 4, wherein: the power panel (1) and the lateral wall adjacent to the inlet (4) are positioning walls (9), and the distance between the water inlet section (31) and the positioning walls (9) is larger than the minimum distance between the cooling pipe (3) and the positioning walls (9).
6. The heat dissipation structure of the laser circuit board of claim 5, wherein: the water outlet section (33) is obliquely arranged, and the distance between the water outlet section (33) and the cooling pipe (3) is gradually reduced towards one side of the outlet (5).
7. The heat dissipation structure of the laser circuit board of claim 1, wherein: and heat-conducting silicone grease (10) is filled between the inner wall of the groove (2) and the outer wall of the cooling pipe (3).
8. The heat dissipation structure of the laser circuit board of claim 1, wherein: the cover plate (8) faces one side of the cooling pipe (3) and is provided with a limiting groove (11) for the cooling pipe (3) to extend into, and when the cooling pipe (3) is located inside the limiting groove (11), the outer wall of the cooling pipe (3) is attached to the inner groove wall of the limiting groove (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922095478.8U CN210986845U (en) | 2019-11-28 | 2019-11-28 | Laser circuit board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922095478.8U CN210986845U (en) | 2019-11-28 | 2019-11-28 | Laser circuit board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986845U true CN210986845U (en) | 2020-07-10 |
Family
ID=71460041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922095478.8U Expired - Fee Related CN210986845U (en) | 2019-11-28 | 2019-11-28 | Laser circuit board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131042A (en) * | 2021-03-22 | 2021-07-16 | 中国航空制造技术研究院 | Novel portable laser |
-
2019
- 2019-11-28 CN CN201922095478.8U patent/CN210986845U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131042A (en) * | 2021-03-22 | 2021-07-16 | 中国航空制造技术研究院 | Novel portable laser |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200710 Termination date: 20211128 |
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| CF01 | Termination of patent right due to non-payment of annual fee |